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TPS56C231EVM

TPS56C231EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

  • 描述:

    TPS56C231 - DC/DC,步降 1,非隔离 输出评估板

  • 数据手册
  • 价格&库存
TPS56C231EVM 数据手册
www.ti.com Table of Contents User’s Guide TPS56C231 Step-Down Converter Evaluation Module User's Guide ABSTRACT This user's guide contains information for the TPS56C231 as well as support documentation for the TPS56C231EVM evaluation module. This document also includes the performance specifications, board layout, schematic, and the list of materials of the TPS56C231EVM. Table of Contents 1 Introduction.............................................................................................................................................................................3 2 Performance Specification Summary................................................................................................................................... 3 3 Modifications...........................................................................................................................................................................4 3.1 Output Voltage Setpoint..................................................................................................................................................... 4 3.2 Adjustable UVLO................................................................................................................................................................4 4 Test Setup and Results.......................................................................................................................................................... 5 4.1 Input and Output Connections........................................................................................................................................... 5 4.2 Start-Up Procedure............................................................................................................................................................ 5 4.3 Start-Up..............................................................................................................................................................................6 4.4 Shutdown........................................................................................................................................................................... 6 4.5 Output Voltage Ripple........................................................................................................................................................ 7 5 Board Layout...........................................................................................................................................................................8 5.1 Layout................................................................................................................................................................................ 8 6 Board Profile, Schematic, and List of Materials.................................................................................................................11 6.1 Board Profile.....................................................................................................................................................................11 6.2 Schematic........................................................................................................................................................................ 12 6.3 List of Materials................................................................................................................................................................ 13 7 References............................................................................................................................................................................ 14 List of Figures Figure 4-1. Start-Up Relative to EN, IOUT = 6 A (4 ms/div).......................................................................................................... 6 Figure 4-2. Shutdown Relative to EN, IOUT = 6 A (200 μs/div).................................................................................................... 6 Figure 4-3. TPS56C231 Output Voltage Ripple, IOUT = 0.01 A (80 μs/div)..................................................................................7 Figure 4-4. TPS56C231 Output Voltage Ripple, IOUT = 12 A (2 μs/div).......................................................................................7 Figure 5-1. Top Assembly............................................................................................................................................................ 8 Figure 5-2. Top Layer...................................................................................................................................................................9 Figure 5-3. Inner1 Layer.............................................................................................................................................................. 9 Figure 5-4. Inner2 Layer............................................................................................................................................................ 10 Figure 5-5. Bottom Layer........................................................................................................................................................... 10 Figure 6-1. Top View of TPS56C231EVM..................................................................................................................................11 Figure 6-2. Bottom View of TPS56C231EVM............................................................................................................................ 11 Figure 6-3. TPS56C231EVM Schematic Diagram.....................................................................................................................12 List of Tables Table 1-1. Input Voltage and Output Current Summary...............................................................................................................3 Table 2-1. TPS56C231EVM Performance Specifications Summary........................................................................................... 3 Table 3-1. Recommended Component Values............................................................................................................................ 4 Table 4-1. Connection and Test Points........................................................................................................................................ 5 Table 6-1. List of Materials.........................................................................................................................................................13 SLVUCA3 – AUGUST 2022 Submit Document Feedback TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 1 Trademarks www.ti.com Trademarks D-CAP3™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 2 TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated SLVUCA3 – AUGUST 2022 Submit Document Feedback www.ti.com Introduction 1 Introduction The TPS56C231 is a single, D-CAP3™ mode, synchronous buck converter requiring a very low external component count. The TPS56C231 is a high-efficiency, cost effective, low quiescent current synchronous buck converter with integrated FETs. A mode pin is used to select output current limit, switching frequency, and forced continuous conduction mode (FCCM) and discontinuous conduction mode (DCM) operation. The device uses D-CAP3 control mode to provide a fast transient response, good line, load regulation, no requirement for external compensation, and supports low ESR output capacitors. Additionally, the TPS56C231 provides adjustable soft start, undervoltage lockout inputs and a power good output. Rated input voltage and output current ranges for the evaluation module are given in Table 1-1. The TPS56C231EVM evaluation module (EVM) is a single, synchronous buck converter providing 1.2 V at 12 A from 4.5-V to 17-V input. This user’s guide describes the TPS56C231EVM performance. Table 1-1. Input Voltage and Output Current Summary EVM Input Voltage (VIN) Range Output Current (IOUT) Range TPS56C231EVM 4.5 V to 17 V 0 A to 12 A 2 Performance Specification Summary A summary of the TPS56C231EVM performance specifications is provided in Table 2-1. Specifications are given for an input voltage of 12 V and an output voltage of 1.2 V, unless otherwise noted. The ambient temperature is 25°C for all measurement, unless otherwise noted. Table 2-1. TPS56C231EVM Performance Specifications Summary Specifications VIN Test Conditions Input voltage MIN TYP MAX 4.5 12 17 Output voltage Operating frequency CH1 VIN = 12 V, IOUT = 6 A Output current range Unit V 1.2 V 800 kHz 0 12 A Overcurrent limit VIN = 12 V, LOUT = 0.68 µH 17 A Output ripple voltage VIN = 12 V, IOUT = 12 A 10 mVPP SLVUCA3 – AUGUST 2022 Submit Document Feedback TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 3 Modifications www.ti.com 3 Modifications This evaluation module is designed to provide access to the features of the TPS56C231. Some modifications can be made to this module. 3.1 Output Voltage Setpoint To change the output voltage of the EVM, it is necessary to change the value of resistor R7 (RUPPER) and R9 (RLOWER). The value of R7 and R9 for a specific output voltage can be calculated using Equation 1 and refer to Table 3-1 for some recommendation values. See the TPS56C231x 3.8-V to 17-V Input , 12-A Synchronous Step-Down Converter data sheet. See Table 3-1 to set the switching frequency. VOUT 0 . 6 u (1 R UPPER ) R LOWER (1) Table 3-1. Recommended Component Values VOUT (V) 0.6 1.2 3.3 5.0 RLOWER (kΩ) 10 10 10 10 RUPPER (kΩ) 0 10 45.3 82.5 fSW (kHz) LOUT (µH) COUT(min) (µF) COUT(max) (µF) CFF (PF) 400 0.68 300 500 — 800 0.47 100 500 — 1200 0.33 88 500 — 400 1.2 100 500 — 800 0.68 88 500 — 1200 0.47 88 500 — 400 2.4 88 500 100-220 800 1.5 88 500 100-220 1200 1.2 88 500 100-220 400 3.3 88 500 100-220 800 2.4 88 500 100-220 1200 1.5 88 700 100-220 3.2 Adjustable UVLO The undervoltage lockout (UVLO) can be adjusted externally using R1 (REN(TOP)) and R2 (REN(BOT)). See the TPS56C231x 3.8-V to 17-V Input , 12-A Synchronous Step-Down Converter data sheet for detailed instructions for setting the external UVLO. 4 TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated SLVUCA3 – AUGUST 2022 Submit Document Feedback www.ti.com Test Setup and Results 4 Test Setup and Results This section describes how to properly connect, set up, and use the TPS56C231EVM. The section also includes test results typical for the evaluation modules, includes power on, power off, and voltage ripple. 4.1 Input and Output Connections The TPS56C231EVM is provided with input and output connectors and test points as shown in Table 4-1. A power supply capable of supplying 6 A must be connected to J1 through a pair of 20-AWG wires. The load must be connected to J2 through a pair of 20-AWG wires. The maximum load current capability is 12 A. Wire lengths must be minimized to reduce losses in the wires. Test point TP2 provides a place to monitor the VIN input voltages with TP4 providing a convenient ground reference. TP7 is used to monitor the output voltage with TP10 as the ground reference. Table 4-1. Connection and Test Points Reference Designator Function J1 VIN (see Table 1-1 for VIN range) J2 VOUT, 1.2 V at 12-A maximum J3 En Control. Short pin1 and pin2 to make EN low. Short pin2 and pin3 to make EN high. J4 VIN positive monitor point J5 GND monitor test point J6 GND monitor test point J7 PGOOD monitor test point J8 VREG5 monitor test point J9 MODE monitor test point J10 Soft Start test point J11 Switch node test point J12 Loop test point J13 GND monitor test point J14 VOUT positive monitor point J15 GND monitor test point J16 GND monitor test point TP2 VIN positive monitor point TP4 GND monitor test point TP7 VOUT positive monitor point TP10 GND monitor test point 4.2 Start-Up Procedure 1. Ensure that the J3 (Enable control) pins 1 and 2 are shorted to shunt EN to GND, disabling the output. 2. Apply appropriate input voltage to VIN (J1-2) or TP2 and GND (J1-1) or TP4. Note that the board cannot support hot plug-in. Connect the input lines between J1 and external power source first before turning on the power source. 3. Disconnect J3 (Enable control) pins 1 and 2 (EN and L). Ensure that pins 2 and 3 (EN and H) are shorted, then the output can be enabled. 4. Apply the loading to VOUT (J2-1) or TP7 and GND (J2-2) or TP10. SLVUCA3 – AUGUST 2022 Submit Document Feedback TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 5 Test Setup and Results www.ti.com 4.3 Start-Up The TPS56C231EVM start-up waveform relative to EN is shown in Figure 4-1. Figure 4-1. Start-Up Relative to EN, IOUT = 6 A (4 ms/div) 4.4 Shutdown The TPS56C231EVM shutdown waveform relative to EN is shown in Figure 4-2. Figure 4-2. Shutdown Relative to EN, IOUT = 6 A (200 μs/div) 6 TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated SLVUCA3 – AUGUST 2022 Submit Document Feedback www.ti.com Test Setup and Results 4.5 Output Voltage Ripple The TPS56C231EVM output voltage ripple is shown in Figure 4-3 and Figure 4-4. The output currents are as indicated. Figure 4-3. TPS56C231 Output Voltage Ripple, IOUT = 0.01 A (80 μs/div) Figure 4-4. TPS56C231 Output Voltage Ripple, IOUT = 12 A (2 μs/div) SLVUCA3 – AUGUST 2022 Submit Document Feedback TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 7 Board Layout www.ti.com 5 Board Layout This section provides a description of the TPS56C231EVM, board layout, and layer illustrations. 5.1 Layout The board layout for the TPS56C231EVM is shown in Figure 5-1 to Figure 5-5. The TPS56C231EVM is with four layers. The top layer contains the main power traces for VIN, VOUT, SW, and GND. Also, on the top layer are connections for the pins of the TPS56C231 and a large area filled with ground. Most of the signal traces are also located on the top side. The input decoupling capacitors are located as close to the VIN pins and PGND pins of the IC as possible. The internal layer-1 is dedicated ground plane. The internal layer-2 contains an additional large ground copper area as well as an additional VIN and VOUT copper fill. The bottom layer is a ground plane along with 4 traces for VIN, VOUT, EN, and BOOT connection. Figure 5-1. Top Assembly 8 TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated SLVUCA3 – AUGUST 2022 Submit Document Feedback www.ti.com Board Layout Figure 5-2. Top Layer Figure 5-3. Inner1 Layer SLVUCA3 – AUGUST 2022 Submit Document Feedback TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 9 Board Layout www.ti.com Figure 5-4. Inner2 Layer Figure 5-5. Bottom Layer 10 TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated SLVUCA3 – AUGUST 2022 Submit Document Feedback www.ti.com Board Profile, Schematic, and List of Materials 6 Board Profile, Schematic, and List of Materials 6.1 Board Profile Figure 6-1 is the top view for the TPS56C231EVM. Figure 6-1. Top View of TPS56C231EVM Figure 6-2 is the bottom view for the TPS56C231EVM. Figure 6-2. Bottom View of TPS56C231EVM SLVUCA3 – AUGUST 2022 Submit Document Feedback TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 11 Board Profile, Schematic, and List of Materials www.ti.com 6.2 Schematic Figure 6-3 is the schematic for the TPS56C231EVM. Figure 6-3. TPS56C231EVM Schematic Diagram 12 TPS56C231 Step-Down Converter Evaluation Module User's Guide SLVUCA3 – AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Board Profile, Schematic, and List of Materials 6.3 List of Materials Table 6-1 displays the TPS56C231EVM list of materials. Table 6-1. List of Materials Designator Qty Description Part Number(1) Manufacturer PCB1 1 Printed Circuit Board BSR191 Any C1, C2, C9 3 Capacitor, ceramic, 0.1 µF, 25 V, ±10%, X7R, 0603 GRM188R71E104KA01D MuRata C3, C4, C5, C6 4 Capacitor, ceramic, 22 μF, 35 V, ±20%, X5R, 0805 C2012X5R1V226M125AC TDK C7 1 Capacitor, ceramic, 0.047 μF, 50 V, ±10%, X7R, 0603 GRM188R71H473KA61D MuRata C8 1 Capacitor, ceramic, 4.7 μF, 10 V, ±10%, X5R, 0805 C0603C475K8PACTU Kemet C11, C12, C13, 4 Capacitor, ceramic, 47 μF, 10 V, ±20%, X5R, 0805 GRM21BR61A476ME15L MuRata C17 1 Capacitor, ceramic, 0.01 μF, 50 V, ±20%, X7R, 0603 C1608X7R1H103K080AA TDK D1 1 Diode, Zener, 5.1 V, 500 mW, SOD-123 MMSZ5231B-7-F Diodes Inc. J1, J2 2 Terminal Block, 5.08 mm, 2 × 1, Brass, TH ED120/2DS On-Shore Technology J3 1 Header, 100mil, 3 × 1, Gold, TH HTSW-103-09-G-S Samtec J4, J5, J6, J7, J8, 13 Header, 2.54 mm, 1 × 1, Gold, TH 61300111121 Wurth Elektronik L1 1 Inductor, Shielded Drum Core, Powdered Iron, 680 nH, 15.5 A, 0.005 Ω, SMD IHLP2525CZERR68M01 Vishay-Dale LBL1 C14 J9, J10, J11, J12, J13, J14, J15, J16 1 Thermal Transfer Printable Labels, 1.250" W × 0.250" H - 10,000 per roll THT-13-457-10 Brady R1 1 Resistor, 57.6 k, 1%, 0.1 W, 0603 CRCW060357K6FKEA Vishay-Dale R2 1 Resistor, 12.1 k, 1%, 0.1 W, 0603 CRCW060312K1FKEA Vishay-Dale R3 1 Resistor, 10.0 k, 1%, 0.1 W, 0603 CRCW060310K0FKEA Vishay-Dale R4 1 Resistor, 82.0 k, 1%, 0.1 W, 0603 RC0603FR-0782KL Yageo 1 Resistor, 51.0 k, 1%, 0.1 W, 0603 RC0603FR-0751KL Yageo 1 Resistor, 0, 5%, 0.1 W, 0603 MCR03EZPJ000 Rohm 2 Resistor, 30 k, 1%, 0.1 W, 0603 RC0603FR-0730KL Yageo R10 1 Resistor, 0, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 CRCW06030000Z0EA Vishay-Dale TP2, TP4, TP7, TP10 4 Terminal, Turret, TH, Double 1502-2 Keystone U1 1 3.8-V to 17-V Input, 12-A Synchronous Step-Down Voltage Regulator TPS56C231RNNR Texas Instruments C15, C16 0 Capacitor, ceramic, 47 μF, 10 V, ±20%, X5R, 0805 GRM21BR61A476ME15L MuRata C10 0 Capacitor, ceramic, 56 pF, 50 V, ±5%, C0G/NP0, 0805 GRM1885C1H560JA01D MuRata R8 0 Resistor, 0, 5%, 0.1 W, 0603 MCR03EZPJ000 Rohm FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or mount. N/A N/A R5 R6 R7, R9 (1) Unless otherwise noted in the Alternate Part Number or Alternate Manufacturer columns, all parts may be substituted with equivalents. SLVUCA3 – AUGUST 2022 Submit Document Feedback TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 13 References www.ti.com 7 References Texas Instruments, TPS56C231 3.8 V to 17 V Input, 12-A Synchronous Step-Down Converter data sheet 14 TPS56C231 Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated SLVUCA3 – AUGUST 2022 Submit Document Feedback IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2022, Texas Instruments Incorporated
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