TPS62000SHKK

TPS62000-HT www.ti.com .......................................................................................................................................................... SLVS917A – MARCH 2009 – REVISED JUNE 2009 HIGH-EFFICIENCY STEP-DOWN LOW POWER DC-DC CONVERTER FEATURES 1 • • • • • • • • • • • • High-Efficiency Synchronous Step-Down Converter With Greater Than 95% Efficiency 2 V to 5.5 V Operating Input Voltage Range Adjustable Output Voltage Range From 0.8 V to VI Synchronizable to External Clock Signal up to 1 MHz Up to 300 mA Output Current Pin-Programmable Current Limit High Efficiency Over a Wide Load Current Range in Power Save Mode 100% Maximum Duty Cycle for Lowest Dropout Low-Noise Operation Antiringing Switch and PFM/PWM Operation Mode Internal Softstart 50-µA Quiescent Current (TYP) Evaluation Module Available for Commercial Temperature Range APPLICATIONS • • Down-Hole Drilling High Temperature Environments SUPPORTS EXTREME TEMPERATURE APPLICATIONS • • • • • • • • (1) Controlled Baseline One Assembly/Test Site One Fabrication Site Available in Extreme (–55°C/210°C) Temperature Range (1) Extended Product Life Cycle Extended Product-Change Notification Product Traceability Texas Instruments high temperature products utilize highly optimized silicon (die) solutions with design and process enhancements to maximize performance over extended temperatures. Custom temperature ranges available DESCRIPTION The TPS62000 device is a low-noise synchronous step-down dc-dc converter that is ideally suited for systems powered from a 1-cell Li-ion battery or from a 2- to 3-cell NiCd, NiMH, or alkaline battery. The TPS62000 operates typically down to an input voltage of 1.8 V, with a specified minimum input voltage of 2 V. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated TPS62000-HT SLVS917A – MARCH 2009 – REVISED JUNE 2009 .......................................................................................................................................................... www.ti.com EFFICIENCY vs LOAD CURRENT 10 mH VI = 2 V to 5.5 V 100 10 mF VIN L EN FB † PGND 80 70 Efficiency − % 10 mF TPS6200x 90 VO = 0.8 V to VI SYNC GND SYNC = Low FC 60 SYNC = High 50 0.1 mF 40 † 30 With VO ≥1.8 V; Co = 10 mF, VO 50 mΩ See Table 3 for recommended capacitors. If an output capacitor is selected with an ESR value ≤ 120 mΩ, its RMS ripple current rating always meets the application requirements. Just for completeness, the RMS ripple current is calculated as: V 1 - O VI 1 IRMS(CO ) = VO ´ ´ L ´ f 2´ 3 (5) The overall output ripple voltage is the sum of the voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charge and discharging the output capacitor: VO VI L ´ f 1 DVO = VO ´ æ ö 1 ´ ç + ESR ÷ è 8 ´ CO ´ f ø (6) Where the highest output voltage ripple occurs at the highest input voltage VI. 16 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS62000-HT TPS62000-HT www.ti.com .......................................................................................................................................................... SLVS917A – MARCH 2009 – REVISED JUNE 2009 Table 3. Tested Capacitors (1) CAPACITOR VALUE ESR/mΩ COMPONENT SUPPLIER 10 µF 50 Taiyo Yuden JMK316BJ106KL Ceramic 47 µF 100 Sanyo 6TPA47M POSCAP 68 µF 100 Spraque 594D686X0010C2T Tantalum (1) COMMENTS Parts are valid for –40°C to 85°C. INPUT CAPACITOR SELECTION Because of the nature of the buck converter having a pulsating input current, a low ESR input capacitor is required for best input voltage filtering and minimizing the interference with other circuits caused by high input voltage spikes. The input capacitor should have a minimum value of 10 µF and can be increased without any limit for better input voltage filtering. The input capacitor should be rated for the maximum input ripple current calculated as: VO æ VO ö ´ ç 1÷ VI è VI ø IRMS = IO(max) ´ (7) The worst case RMS ripple current occurs at D = 0.5 and is calculated as: IRMS = IO 2 Ceramic capacitor show a good performance because of their low ESR value, and they are less sensitive against voltage transients compared to tantalum capacitors. Place the input capacitor as close as possible to the input pin of the IC for best performance. LAYOUT CONSIDERATIONS As for all switching power supplies, the layout is an important step in the design especially at high peak currents and switching frequencies. If the layout is not carefully done, the regulator might show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current paths as indicted in bold in Figure 16. The input capacitor should be placed as close as possible to the IC pins as well as the inductor and output capacitor. Place the bypass capacitor, C3, as close as possible to the FC pin. The analog ground, GND, and the power ground, PGND, need to be separated. Use a common ground node as shown in Figure 16 to minimize the effects of ground noise. L1 VI VIN VO L + Ci EN FB R1 TPS62000 C(ff) + Co R2 SYNC GND PGND FC C3 Figure 16. Layout Diagram Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS62000-HT 17 TPS62000-HT SLVS917A – MARCH 2009 – REVISED JUNE 2009 .......................................................................................................................................................... www.ti.com TYPICAL APPLICATION 10 mH 3 (2) 470 kW 10 mF 47 mF 326 kW 524 kW 0.1 mF Sumida CDRH5D28-100 10 mF Ceramic Taiyo Yuden JMK316BJ106KL Sanyo 6TPA47M 0.1 mF Ceramic (1) Use a small R-C filter to filter wrong reset signals during output voltage transitions. (2) A large value is used for C(ff) to compensate for the parasitic capacitance introduced into the regulation loop by Q1. Figure 17. Dynamic Output Voltage Programming As Used in Low Power DSP Applications 18 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS62000-HT TPS62000-HT www.ti.com .......................................................................................................................................................... SLVS917A – MARCH 2009 – REVISED JUNE 2009 1000 Years of Estimated Life 100 Electromigration Fail Mode 10 1 110 130 150 170 190 210 230 Continous TJ - °C Figure 18. TPS62000SKGD1 Operating Life Derating Chart Notes: 1. See data sheet for absolute maximum and minimum recommended operating conditions. 2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life). Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS62000-HT 19 PACKAGE OPTION ADDENDUM www.ti.com 3-Jun-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TPS62000SHKK ACTIVE CFP HKK 10 25 RoHS & Green AU N / A for Pkg Type -55 to 210 TPS62000SKGD1 ACTIVE XCEPT KGD 0 100 RoHS & Green Call TI N / A for Pkg Type -55 to 210 TPS62000S HKK (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of