TPS630250EVM-553

User's Guide SLVUA24 – April 2014 TPS63025xEVM-553 This user’s guide describes the characteristics, operation, and use of the TPS63025xEVM-553 evaluation module (EVM). This EVM is designed to help the user easily evaluate and test the operation and functionality of the TPS630250, TPS630251, and TPS630252. The EVM converts a 2.5-V to 5.5-V input voltage to a regulated 3.3-V output voltage that delivers up to 2 A. This document includes setup instructions for the hardware, a schematic diagram, a bill of materials, and printed-circuit board layout drawings for the evaluation module. Throughout this document, the abbreviations EVM, TPS63025xEVM553, and the term evaluation module are synonymous with the TPS630250, TPS630251, and TPS630252, unless otherwise noted. 1 2 3 4 Contents Introduction ................................................................................................................... Setup ......................................................................................................................... Board Layout ................................................................................................................. Schematic and Bill of Materials ............................................................................................ 1 3 4 6 List of Figures 1 Assembly Layer .............................................................................................................. 4 2 Top Layer Routing ........................................................................................................... 5 3 Bottom Layer Routing ....................................................................................................... 5 4 TPS63025xEVM-553 Schematic........................................................................................... 7 List of Tables 1 2 1 ..................................................................................... TPS63025xEVM-553 Bill of Materials ..................................................................................... Performance Specification Summary 2 6 Introduction TI's TPS63025x are highly efficient, single-inductor, buck-boost converters in a 1.77 mm × 2.09 mm, 20pin WCSP package. TPS630250 is an adjustable output voltage converter. TPS630251 as well as TPS630252 are fixed output voltage converters with 2.9 V (TPS630251) and 3.3 V (TPS630252). 1.1 Background The TPS63025xEVM-553 uses the TPS630250 adjustable version that is programmed with an external feedback divider to an output voltage of 3.3 V. Alternatively, TPS630251 or TPS630252 fixed output voltage versions can be assembled. Therefore, the resistors R1 and R2 have to be disassembled and a 0Ω resistor placed at R1. SLVUA24 – April 2014 Submit Documentation Feedback TPS63025xEVM-553 Copyright © 2014, Texas Instruments Incorporated 1 Introduction 1.2 www.ti.com Performance Specification Table 1 provides a summary of the TPS63025xEVM-553 performance specifications. All specifications are given for operating in a free-air environment of an ambient temperature of 25°C. Table 1. Performance Specification Summary Specification Test Conditions Input voltage Output voltage Typ 2.5 PWM Mode Output current 2 Min 3.267 0 TPS63025xEVM-553 3.3 Max Unit 5.5 V 3.33 V 2000 mA SLVUA24 – April 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Setup www.ti.com 2 Setup This section describes how to properly use the TPS63025xEVM-553. 2.1 2.1.1 Input/Output Connector and Header Descriptions J1 – VIN This header is the positive connection to the input power supply. The power supply must be connected between J1 and J3 (GND). The leads to the input supply should be twisted and kept as short as possible. The input voltage has to be between 2.5 V and 5.5 V. 2.1.2 J2 – S+/S– Header J2 can be used to measure the input voltage directly on the input capacitor. Therefore, a 4-wire power and sense supply can be connected. The leads to the sensing connector should also be twisted. 2.1.3 J3 – GND This header is the return connection to the input power supply. Connect the power supply between J3 and J1 (VIN). The leads to the input supply should be twisted and kept as short as possible. The input voltage has to be between 2.5 V and 5.5 V. 2.1.4 J4 – VOUT This header is the positive connection of the output voltage. The load has to be connected between J4 and J6 (GND). 2.1.5 J5 – S+/S– Header J5 can be used to measure the output voltage directly on the output capacitor. 2.1.6 J6 – GND This header is the return connection of the output voltage. Connect the load between J6 and J4 (VOUT). 2.1.7 JP1 – EN This jumper enables or disables the TPS63025 on the EVM. Place the jumper across ON and EN to enable the converter. Place the jumper across OFF and EN to disable the converter. A 1-MΩ pullup resistor can be connected between VIN and EN. 2.1.8 JP4 – PFM/PWM (MODE) This jumper controls the operating mode of the TPS63025x on the EVM. Place the jumper across PWM and MODE to enable forced PWM mode with a constant switching frequency. Place the jumper across PFM and MODE to enable power-save mode with higher efficiency. 2.1.9 J10 - L1 Testpoint header This header can be placed to measure the switch pin L1 respective to ground. 2.1.10 J11 - L2 Testpoint header This header can be placed to measure the switch pin L2 respective to ground. 2.2 Setup To operate the EVM, simply connect an input supply between J1 and J3. Connect a load between J4 and J6. An input supply voltage of 2.5 V to 5.5 V is recommended. SLVUA24 – April 2014 Submit Documentation Feedback TPS63025xEVM-553 Copyright © 2014, Texas Instruments Incorporated 3 Board Layout 3 www.ti.com Board Layout This section provides the TPS63025xEVM-553 board layout and illustrations. 3.1 Layout Figure 1. Assembly Layer 4 TPS63025xEVM-553 SLVUA24 – April 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Board Layout www.ti.com Figure 2. Top Layer Routing Figure 3. Bottom Layer Routing SLVUA24 – April 2014 Submit Documentation Feedback TPS63025xEVM-553 Copyright © 2014, Texas Instruments Incorporated 5 Schematic and Bill of Materials 4 www.ti.com Schematic and Bill of Materials This section provides the TPS63025xEVM-553 schematic and bill of materials. 4.1 Bill of Materials Table 2. TPS63025xEVM-553 Bill of Materials -001 RefDes Value Description Size Part Number MFR TPS63025x Power Solution Components 2 C1, C2 10uF Capacitor, Ceramic Chip, 6.3V, ±20%, X5R 0603 GRM188R60J106ME84 MuRata 1 C3 47uF Capacitor, Ceramic Chip, 6.3V, ±20%, X5R 0805 GRM219R60J476ME44D MuRata 1 L1 1.0uH Inductor, Shielded, Composite, 8.75A, 10mOhm XAL4020 XAL4020-102MEB Coilcraft 1 R1 560k Resistor, Chip, 1/10W, 1% 0603 STD STD 1 R2 180k Resistor, Chip, 1/10W, 1% 0603 STD STD 1 U1 – IC, TPS630250 High Current, High Efficiency Single Inductor Buck-Boost Converter DSBGA (20) TPS630250YFF TI 1 R10 0 Resistor, Chip, 1/10W, 1% 0603 STD STD 0 C4 Open Capacitor, Ceramic Chip, 6.3V, ±20%, X5R 0603 1 C5 100uF Capacitor, Ceramic Chip, 6.3V, ±20%, X5R 1210 GRM32ER60J107ME20L MuRata 0 C6, C7 Open Capacitor, Ceramic Chip, 6.3V, ±20%, X5R 0603 0 R8, R9 Open Resistor, Chip, 1/10W, 1% 0603 8 J1 ... J6, J10, J11 Header, 2x1, 100 mil spacing TSW-102-07-G-S Samtec 2 JP1, JP2 Header, 3x1, 100mil spacing TSW-103-07-G-S Samtec PWR553 Evaluation Module Components 6 TPS63025xEVM-553 SLVUA24 – April 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Schematic and Bill of Materials www.ti.com 4.2 Schematic Figure 4 illustrates the schematic for this EVM. Figure 4. TPS63025xEVM-553 Schematic SLVUA24 – April 2014 Submit Documentation Feedback TPS63025xEVM-553 Copyright © 2014, Texas Instruments Incorporated 7 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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