TPS65233
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SLVSC22A – AUGUST 2013 – REVISED SEPTEMBER 2013
LNB VOLTAGE REGULATOR WITH I2C INTERFACE
Check for Samples: TPS65233
FEATURES
1
•
•
•
•
•
•
•
•
•
Complete Integration Solution for LNB and I2C
DiSEqC 1.x Compatible
Supports 5-V and 12-V Power Bus
Up to 1000-mA Accurate Output Current Limit
Adjustable by External Resistor and I2C
Boost Converter With Low Rdson Internal
Power Switch
Dedicated Enable Pin for Non-I2C Application
Low Noise, Low Drop Output With Push-Pull
Output Stage
Built-In Accurate 22-kHz Tone Generator or
External Pin
Adjustable Soft-Start and 13-V/18-V Voltage
Transition Time
•
•
•
•
•
Compliant with main satellite receiver systems
Specifications
LNB Short Circuit Dynamic Pprotection
Diagnostics for Output Voltage Level, Input
Supply UVLO, and DiSEqC Tone Output
Cable Disconnect Diagnostic
Available in a 16-Pin QFN 3-mm x 3-mm (RTE)
Package
APPLICATIONS
•
•
•
Set Top Box Satellite Receiver
TV Satellite Receiver
PC Card Satellite Receiver
DESCRIPTION/ORDERING INFORMATION
Designed for analog and digital satellite receivers, the TPS65233 is a monolithic voltage regulator with I2C
interface, specifically to provide the 13-V/18-V power supply and the 22-kHz tone signaling to the LNB downconverter in the antenna dish or to the multi-switch box. It offers a complete solution with very low component
count, low power dissipation together with simple design and I2C standard interfacing.
TPS65233 features high power efficiency. The boost converter integrates a 120-mΩ power MOSFET running at
500-kHz switching frequency. Drop out voltage at the linear regulator is 0.8 V to minimize power loss. TPS65233
provides multiple ways to generate the 22-kHz signal. Integrated linear regulator with push-pull output stage
generates clean 22-kHz tone signal superimposed at the output even at zero loading. Current limit of linear
regulator can be programmed by external resistor with ±10% accuracy. Full range of diagnostic read by I2C is
available for system monitoring.
The part is available in a 16-pin QFN 3-mm x 3-mm (RTE) package.
ORDERING INFORMATION (1)
TA
-40°C to 85°C
(1)
(2)
PACKAGE (2)
16-Pin (QFN) - RTE
Reel of 2500
PART NUMBER
TOP-SIDE MARKING
TPS65233RTE
TPS65233RTE
For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
TPS65233
SLVSC22A – AUGUST 2013 – REVISED SEPTEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
FUNCTIONAL BLOCK DIAGRAM
VIN
VIN
LX
VCC
EN
REF_Boost
Internal
Regulator
PWM
Controller
PGND
REF_Boost
TCAP
VCTRL
REF
BOOST
REF_LDO
Charge
Pump
VCP
SDA
SCL
I2C Interface
EN/ADDR
TGATE
Fault
Diagnose
OCP
OTP
UVL
FAULT
2
REF_LDO
I2C EN
TGATE
22kHz
Tone
Generator
VLNB
ISEL
EXTM
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AGND
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10
9
SDA
SCL/
VADJ
14 VCP
FAULT
8
13 VLNB
EN/ADDR
7
100nF
11
VCTRL
VOUT
12
EXTM
13V/18V
TYPICAL APPLICATION
VCC
AGND
6
VIN
TCAP
1
2
3
4
22nF
1uF
22uH
1uF
VIN
22uF
(25V)
16 PGND
LX
2x22uF
(25V)
ISEL
5
130k Ohm
15 BOOST
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PIN OUT
11
10
9
VCTRL
SDA
SCL/
VADJ
FAULT
EN/ADDR
7
15 BOOST
ISEL
6
16 PGND
TCAP
5
13 VLNB
8
12
EXTM
RTE PACKAGE
(TOP VIEW)
14 VCP
LX
VIN
VCC
AGND
Thermal Pad
1
2
3
4
Exposed pad must be soldered to PCB for optimal thermal performance.
TERMINAL FUNCTIONS
NAME
NO.
DESCRIPTION
LX
1
Switching node of the boost converter
VIN
2
Input of internal linear regulator
VCC
3
Internal 6.5-V power supply bias. Connect a 1-µF ceramic capacitor from this pin to ground.
When VIN is 5 V, connect VCC to VIN.
AGND
4
Analog ground. Connect all ground pins and power pad together.
TCAP
5
Connect a capacitor to this pin to set the rise time and fall time of the LNB output between 13 V
and 18 V.
ISEL
6
Connect a resistor to this pin to set the LNB output current limit.
EN/ADDR
7
Enable pin to enable the whole chip; pull to ground to disable output, output will be pulled to
ground. For I2C interface, pulling this pin high or low gives different I2C addresses.
FAULT
8
This pin is an open drain output pin, it goes low if any fault flag is set.
SCL/VADJ
9
I2C compatible clock input; if I2C function is not used, connect this pin to low set output voltage
13 V/18 V, connect to high set output voltage 13.4 V/18.6 V.
SDA
10
I2C compatible bi-directional data
VCTRL
11
Logic control pin for 13-V or 18-V voltage selection at LNB output
EXTM
12
External modulation logic input pin which activates the 22-kHz tone output, feeding signal can be
22-kHz tone or logic high or low.
VLNB
13
Output of the LNB power supply connected to satellite receiver or switch
VCP
14
Gate drive supply voltage, output of charge pump, connect a capacitor between this pin to pin
BOOST.
BOOST
15
Output of the boost regulator and input voltage of the internal linear regulator
PGND
16
Power ground for Boost Converter
Thermal PAD
4
Must be soldered to PCB for optimal thermal performance. Have thermal vias on the PCB to
enhance power dissipation.
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ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted, all voltages are with respect to GND)
Voltage range at VIN, LX, BOOST, VLNB
Voltage range at VCP
–1 to 30
V
BOOST + 7V
V
Voltage at LX
–1 to 30
V
Voltage at VCC, EN, FAULT, SCL, SDA, VCTRL, ISEL, EXTM
–0.3 to 7
V
Voltage at TCAP
–0.3 to 3.6
V
Voltage at PGND, AGND
–0.3 to 0.3
V
TJ
Operating junction temperature range
–40 to 125
°C
TSTG
Storage temperature range
–55 to 150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN
Input operating voltage
4.5
20
V
TA
Junction temperature
–40
85
°C
THERMAL INFORMATION
TPS65233
THERMAL METRIC
(1)
RTE
UNITS
16 PINS
θJA
Junction-to-ambient thermal resistance (2)
43.4
θJCtop
Junction-to-case (top) thermal resistance (3)
45.6
(4)
θJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter (5)
ψJB
Junction-to-board characterization parameter (6)
15
(7)
3.3
θJCbot
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Junction-to-case (bottom) thermal resistance
15
°C/W
0.6
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
MIN
MAX
UNIT
Human body model (HBM), pin 13 (VLNB)
6000
V
Human body model (HBM), other pins
2000
V
500
V
Charge device model (CDM)
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ELECTRICAL CHARACTERISTICS
TJ = –40°C to 125°C, VIN = 12 V, fSW = 528 kHz (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
12
20
UNIT
INPUT SUPPLY
VIN
Input voltage range
VIN
IDDSDN
Shutdown supply current
EN = 0
IDDQ
Quiescent power supply current
EN = 1, IOUT = 0 A, VLNB = 18 V
UVLO
VIN under voltage lockout
4.5
µA
23
mA
Rising VIN
4.05
4.25
4.45
Falling VIN
3.6
3.8
4.1
Hysteresis
V
160
450
V
mV
OUTPUT VOLTAGE
Vctrl = 1, IOUT = 500 mA
18.2
18.6
19
Vctrl = 0, IOUT = 500 mA
13.1
13.4
13.7
VOUT
Regulated output voltage
VLINEREG
Line regulation-DC
VIN = 7.5 V to 16 V, IOUT = 500
mA
VLOADREG
Load regulation-DC
IOUT = (10-90%)*IOUTMAX
IOCP
Output short circuit current limit
RSEL = 200 kΩ, TJ = 25°C
Tr, Tf
13 V/18 V Transition rising falling time Ccap = 5.6 nF
fSW
Boost switching frequency
Ilimitsw
Switching current limit
VIN = 12 V, VOUT = 18.6 V
3.2
A
Rdson_LS
On resistance of low side FET on CH
VIN = 12 V
120
mΩ
Vdrop
Linear regulator voltage drop-out
IOUT = 500 mA
0.8
V
Irev
Reverse bias current
EN = 1, VLNB = 21 V
50
mA
Irev_dis
Disabled reverse bias current
EN = 0, VLNB = 21 V
3
mA
0.2
%/V
0.7
580
650
%/A
720
mA
570
kHz
0.33
490
528
V
ms
LOGIC SIGNALS
VEN
Enable threshold level
VENH
Enable threshold level hysterisis
VLOGICh, VLOGICl
VCTRL, EXTM Logic threshold level
VOL
FAULT Output low voltage
FAULT
1.15
High level input voltage
mV
2
Low level input voltage
0.8
FAULT open drain, IOL= 1 mA
0.4
2
fI2C
V
80
Maximum I C clock frequency
400
V
V
kHz
TONE
ftone
Tone frequency
Atone
Tone amplitude
Dtone
Tone duty cycle
IOUT = 0 mA to 500 mA, COUT =
100 nF
Trtone
Tone rise time
IOUT = 0 mA to 500 mA, COUT =
100 nF
Tftone
Tone fall time
IOUT = 0 mA to 500 mA, COUT =
100 nF
20
22
24
kHz
550
680
750
mV
45
50
55
%
10
µS
10
µS
PROTECTION
TON
Over Current Protection On Time
4
ms
TOFF
Over Current Protection Off Time
128
ms
6
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ELECTRICAL CHARACTERISTICS (continued)
TJ = –40°C to 125°C, VIN = 12 V, fSW = 528 kHz (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
THERMAL SHUTDOWN
TTRIP
Thermal shut down trip point
THYST
Thermal shut down hysteresis
Rising temperature
160
°C
20
°C
I2C READ BACK FAULT STATUS
Feedback voltage low side rising
VPGOOD
PGOOD Trip levels
Twarn
Temperature warning threshold
95.3
Feedback voltage low side falling
94.7
Feedback voltage high side rising
105.3
Feedback voltage high side falling
104.7
%
125
°C
I2C INTERFACE
VIH
SDA,SCL Input high voltage
VIL
SDA,SCL Input low voltage
2
II
Input current
SDA, SCL, VI = 0.4 V to 4.5 V
VOL
SDA Output low voltage
SDA open drain, IOL = 2 mA
f(SCL)
Maximum SCL clock frequency
400
kHz
tBUF
Bus free time between a STOP and
START condition
1.3
µs
tHD_STA
Hold time (Repeated) START
condition
0.6
µs
tSU_STO
Setup time for STOP condition
0.6
µs
tLOW
LOW Period of the SCL clock
1.3
µs
tHIGH
HIGH Period of the SCL clock
0.6
µs
tSU_STA
Setup time for a repeated START
condition
0.6
µs
tSU_DAT
Data setup time
0.1
tHD_DAT
Data hold time
-10
V
0.8
V
10
µA
0.4
V
µs
0
0.9
µs
300
ns
tRCL
Rise time of SCL signal
Capacitance of one bus line (pF)
20 +
0.1CB
tRCL1
Rise time of SCL signal after a
repeated START condition and after
an acknowledge BIT
Capacitance of one bus line (pF)
20 +
0.1CB
300
ns
tFCL
Fall time of SCL signal
Capacitance of one bus line (pF)
20 +
0.1CB
300
ns
tRDA
Rise time of SDA signal
Capacitance of one bus line (pF)
20 +
0.1CB
300
ns
tFDA
Fall time of SDA signal
Capacitance of one bus line (pF)
20 +
0.1CB
300
ns
CB
Capacitance of one bus line (SCL and
SDA)
400
pF
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TYPICAL CHARACTERISTICS
TA = 25°C, VIN = 12 V, fSW = 528 kHz, Cboost = 2 x 22 µF (unless otherwise noted)
100.00%
13.67
98.00%
13.62
96.00%
13.57
92.00%
Vout (V)
Efficiency (%)
94.00%
90.00%
88.00%
86.00%
13.52
13.47
13.42
84.00%
13.37
82.00%
80.00%
13.32
0.00
0.20
0.40
0.60
0.80
1.00
0.00
0.20
0.40
Loading (A)
0.80
1.00
Figure 2. Load Regulation (VIN = 12 V, VLNB = 13.4 V)
100.00%
18.80
98.00%
18.78
96.00%
18.76
94.00%
18.74
92.00%
18.72
Vout (V)
Efficiency (%)
Figure 1. Efficiency (VIN = 12 V, VLNB = 13.4 V)
90.00%
88.00%
18.70
18.68
86.00%
18.66
84.00%
18.64
82.00%
18.62
18.60
80.00%
0.00
0.20
0.40
0.60
0.80
1.00
0.00
0.20
Loading (A)
8
0.60
Loading (A)
0.40
0.60
0.80
1.00
Loading (A)
Figure 3. Efficiency (VIN = 12 V, VLNB = 18.6 V)
Figure 4. Load Regulation (VIN = 12 V, VLNB = 18.6 V)
Figure 5. Boost LX Waveform at 0 A, (VIN = 12 V, VLNB = 13.4
V)
Figure 6. Boost LX Waveform at 0.5 A, (VIN = 12 V, VLNB =
13.4 V)
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TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VIN = 12 V, fSW = 528 kHz, Cboost = 2 x 22 µF (unless otherwise noted)
Figure 7. Boost LX Waveform at 0 A, (VIN = 12 V, VLNB = 18.6
V)
Figure 8. Boost LX Waveform at 0.5 A, (VIN = 12 V, VLNB =
18.6 V)
Figure 9. Boost LX Waveform at 0 A, (VIN = 5 V, VLNB = 13.4
V)
Figure 10. Boost LX Waveform at 0.5 A, (VIN = 5 V, VLNB =
13.4 V)
Figure 11. Boost LX Waveform at 0 A, (VIN = 5 V, VLNB = 18.6
V)
Figure 12. Boost LX Waveform at 0.5 A, (VIN = 5 V, VLNB =
18.6 V)
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TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VIN = 12 V, fSW = 528 kHz, Cboost = 2 x 22 µF (unless otherwise noted)
10
Figure 13. VIN = 12 V, VLNB = 13.4 V, No Loading, Soft Start
Figure 14. VIN = 12 V, VLNB = 13.4 V, 1 A, Soft Start
Figure 15. VIN = 12 V, VLNB = 18.6 V, No Loading, Soft Start
Figure 16. VIN = 12 V, VLNB = 18.6 V, 1 A, Soft Start
Figure 17. VIN = 12 V, VLNB = 13.4 V, 0 A, Shutdown
Figure 18. VIN = 12 V, VLNB = 18.6 V, 0 A, Shutdown
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TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VIN = 12 V, fSW = 528 kHz, Cboost = 2 x 22 µF (unless otherwise noted)
Figure 19. VIN = 12 V, VLNB = 13.4 V to 18.6 V, 0 A, Voltage
Transition
Figure 20. VIN = 12 V, VLNB = 13.4 V to 18.6 V, 1 A, Voltage
Transition
Figure 21. VIN = 12 V, VLNB = 18.6 V to 13.4 V, 0 A, Voltage
Transition
Figure 22. VIN = 12 V, VLNB = 18.6 V to 13.4 V, 1 A, Voltage
Transition
Figure 23. VIN = 5 V, VLNB = 13.4 V to 18.6 V, 0 A, Voltage
Transition
Figure 24. VIN = 5 V, VLNB = 13.4 V to 18.6 V, 0.5 A, Voltage
Transition
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TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VIN = 12 V, fSW = 528 kHz, Cboost = 2 x 22 µF (unless otherwise noted)
12
Figure 25. VIN = 5 V, VLNB = 18.6 V to 13.4 V, 0 A, Voltage
Transition
Figure 26. VIN = 5 V, VLNB = 18.6 V to 13.4 V, 0.5 A, Voltage
Transition
Figure 27. VIN = 12 V, VLNB = 13.4 V, No Loading, 22-kHz
Tone
Figure 28. VIN = 12 V, VLNB = 13.4 V, 1 A, 22-kHz Tone
Figure 29. VIN = 12 V, VLNB = 18.6 V, No Loading, 22-kHz
Tone
Figure 30. VIN = 12 V, VLNB = 18.6 V, 1 A, 22-kHz Tone
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TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VIN = 12 V, fSW = 528 kHz, Cboost = 2 x 22 µF (unless otherwise noted)
Figure 31. VIN = 5 V, VLNB = 13.4 V, No Loading, 22-kHz Tone
Figure 32. VIN = 5 V, VLNB = 13.4 V, 0.5 A, 22-kHz Tone
Figure 33. VIN = 5 V, VLNB = 18.6 V, No Loading, 22-kHz Tone
Figure 34. VIN = 5 V, VLNB = 18.6 V, 0.5 A, 22-kHz Tone
Figure 35. VIN = 12 V, VLNB = 13.4 V, No Loading, 22-kHz
Tone Delay from EXTM Turns High to Output Tone, On
Figure 36. VIN = 12 V, VLNB = 13.4 V, No Loading, 22-kHz
Tone Delay from EXTM Turns High to Output Tone, On
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TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VIN = 12 V, fSW = 528 kHz, Cboost = 2 x 22 µF (unless otherwise noted)
14
Figure 37. VIN = 12 V, VLNB = 13.4 V, No Loading, 22-kHz
Tone Delay from I2C SDA to Output Tone, On
Figure 38. VIN = 12 V, VLNB = 13.4 V, No Loading, 22-kHz
Tone Delay from I2C Gated, EXTM Provides 22 kHz to
Output Tone, On
Figure 39. VIN = 12 V, VLNB = 13.4 V, No Loading, 22-kHz
Tone Delay from EXTM 22 kHz to Output Tone, Off
Figure 40. VIN = 12 V, VLNB = 13.4 V, No Loading, 22-kHz
Tone Delay from EXTM Turns High to output Tone, Off
Figure 41. VIN = 12 V, VLNB = 13.4 V, No Loading, 22-kHz
Tone Delay from I2C SDA to Output Tone, Ooff
Figure 42. VIN = 12 V, VLNB = 13.4 V, No Loading, 22-kHz
Tone Delay from I2C Ggated, EXTM Provides 22 kHz to
Output Tone, Off
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TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VIN = 12 V, fSW = 528 kHz, Cboost = 2 x 22 µF (unless otherwise noted)
Figure 43. VIN = 12 V, VLNB = 13.4 V, No Loading, Tone Burst
Figure 44. VIN = 12 V, VLNB = 13.4 V, No Loading, EXTM
Level
Figure 45. VIN = 12 V, VLNB = 13.4 V, Hard Short
Figure 46. VIN = 12 V, VLNB = 13.4 V, Hard Short
Figure 47. VIN = 12 V, VLNB = 13.4 V, Hard Short Recovery
Figure 48. VIN = 5 V, VLNB = 13.4 V, Hard Short
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TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VIN = 12 V, fSW = 528 kHz, Cboost = 2 x 22 µF (unless otherwise noted)
Figure 49. VIN = 5 V, VLNB = 13.4 V, Hard Short
16
Figure 50. VIN = 5 V, VLNB = 13.4 V, Hard Short Recovery
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TPS65233
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OVERVIEW
TPS65233 is a power management IC that integrates a boost converter, a LDO and a 22-kHz tone generator
serves as a LNB power supply. This solution compiles the DiSEqC 1.x standard with or without I2C interface.
Output current can be precisely programmed by an external resistor. There are four ways to generate the 22-kHz
tone signal with or without I2C. Integrated boost features low Rdson MOSFET and internal compensation. Fixed
500-kHz switching frequency is designed to reduce components size.
DETAILED DESCRIPTION
Boost Converter
The TPS65233 consists of an internal compensated boost converter and linear regulator. The boost converter
tracks the output LNB voltage to within 800 mV even at loading 750 mA, to minimize power dissipation. Under
conditions where the input voltage, VBOOST, is greater than the output voltage, VLNB, the linear regulator must
drop the differential voltage. When operating in these conditions, care must be taken to ensure that the safe
operating temperature range of the TPS65233 is not exceeded. The boost converter operates at 528 kHz typical.
The TPS65233 has internal pulse-by-pulse current limiting on the boost converter and DC current limiting on the
LNB output to protect the IC against short circuits. When the LNB output is shorted, the LNB output current is
limited. The current limit is set by the external resistor. And the IC will be shut down if the overcurrent condition
lasts for more than 4 ms, the converter enters hiccup mode and will re-try startup in 128 ms. At extremely light
loads, the boost converter operates in a pulse-skipping mode.
If two or more set top box LNB outputs are connected together, one output voltage could be set higher than
others. The output with lower set voltage would be effectively turned off. Once the voltage drops to the set level,
the LNB output with lower set output voltage will return to normal conditions.
Linear Regulator and Current Limit
The linear regulator is used to generate the 22-kHz tone signal by changing the reference voltage. The linear
regulator features low drop out voltage to minimize power loss while keeps enough head room for the 0.68-V,
22-kHz tone. It also implements a tight current limit for over current protection. The current limit is set by an
external resistor connected to ISEL pin. The curve below shows the relationship between the current limit
threshold and the resistor value.
Figure 51. Linear Regulator Current Limit Versus Resistor
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RSEL (kW) = 124.11× ISEL -1.178 (A)
(1)
A 270-kΩ resistor set the current to be 0.5 A.
The current limit can also be set by I2C through register.
Charge Pump
The charge pump circuitry generates a voltage to drive the NMOS of the linear regulator. One end the charge
pump capacitor is connected to the output of the boost converter. The voltage on the charge pump capacitor is
about 6.25 V.
Slew Rate Control
When LNB output voltage transits from 13 V to 18 V or vice versa, the capacitor at pin TCAP controls the
transition time. This transition is to make sure the boost converter can follow the voltage change. Usually boost
converter has low bandwidth and can’t response fast. The voltage at TCAP acts as the reference voltage of the
linear regulator. The boost converter’s reference is also based on TCAP with additional fixed voltage to generate
0.8 V above the output.
The charging and discharging current is 10 µA, thus the transition time can be calculated as:
C (nF)
Tcad (ms) = 0.5 × ss
Iss (mA)
(2)
A 22-nF capacitor generates 1.1-ms transition time.
In light load conditions, when LNB output voltage is set from 18 V to 13 V, the voltage might drops very slow,
which might cause wrong logic detection at LNB side. TPS65233 has the integrated a pull down circuit to pull
down the output during the transition. This will ensure the voltage change can follow the voltage at TCAP.
Meanwhile, when 22-kHz tone signal is superimposing on the LNB output voltage, the pull down current can also
provide square wave instead of a distorted waveforms, which could cause another detection problem.
Capacitor Selection
TPS65233 works fine with all ceramic capacitors. Two 22-uF, 35-V capacitors can be put at the output of the
boost converter. If lower cost is demanded, a 100-µF electrolytic and a 1-µF ceramic capacitor work well also.
Short Circuit Protection, Hiccup and Over Temperature Protection
The LNB output limit can be set by an external resistor. When short circuit conditions occur, the output current is
clamped at the current limit for 4 ms. If the condition remains, the converter will shut down for 128 ms and then
try restart. This hiccup behavior prevents the IC from overheating.
The low side MOSFET of the boost converter has a current limit threshold at 3.2 A, which serves as secondary
protection. If the boost converter’s peak current limit is triggered, the peak current will clamp at 3.2 A. If loading
current continues to increase, output voltage starts to drop and output power drops.
Thermal shutdown prevents the chip from operating at exceedingly high temperatures. When the silicon die
temperature exceeds 160°C, the output shuts down. When the temperature drops below its lower threshold,
typically 140°C, the output is enabled.
When the chip is in over current protection or thermal shutdown, the I2C interface and some logic are still active.
The Fault pin is pulled down to signal the processor. The Fault pin signal will remain low unless the following
actions are taken:
1. If I2C interface is not used to control, Enable pin must be recycled in order to pull Fault pin back to high.
2. If I2C interface is used, the I2C master needs to read the OCP or OTP bit in the register, then the Fault pin
returns to high.
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Tone Generation
A 22-kHz tone signal is superimposed at the LNB output voltage as a carrier for DiSEqC command. This tone
signal can be generated by feeding an external 22-kHz clock at the EXTM pin. It can also be generated with its
internal tone generator gated by control logic. The output stage of the regulator facilitates a push-pull circuit, so
even at zero loading the 22-kHz tone at the output is still clear of distortion.
There are four ways to generate the 22-kHz tone signal at the output.
EXTM
TMODE
TGATE
TONE
VLNB(V)
Option 1, Use external tone
EXTM
TMODE
TGATE
TONE
VLNB(V)
Option 2, Use internal tone, gated by EXTM logic
EXTM
TMODE
TGATE
TONE
VLNB(V)
Option 3, Use external tone, gated by TGATE
EXTM
TMODE
TGATE
TONE
VLNB(V)
Option 4, Use internal tone, gated by TGATE
Figure 52. Four Ways to Generate 22-kHz Tone
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Serial Interface Description
I2C is a 2-wire serial interface developed by Philips Semiconductor (see I2C-Bus Specification, Version 2.1,
January 2000). The bus consists of a data line (SDA) and a clock line (SCL) with pull-up structures. When the
bus is idle, both SDA and SCL lines are pulled high. All the I2C compatible devices connect to the I2C bus
through open drain I/O pins, SDA and SCL. A master device, usually a microcontroller or a digital signal
processor, controls the bus. The master is responsible for generating the SCL signal and device addresses. The
master also generates specific conditions that indicate the START and STOP of data transfer. A slave device
receives and transmits data on the bus under control of the master device.
The TPS65233 device works as a slave and supports the following data transfer modes, as defined in the I2CBus Specification: standard mode (100 kbps), and fast mode (400 kbps). The interface adds flexibility to the
power supply solution, enabling most functions to be programmed to new values depending on the instantaneous
application requirements. Register contents remain intact as long as supply voltage remains above 4.5 V
(typical).
The data transfer protocol for standard and fast modes is exactly the same; therefore, they are referred to as
F/S-mode in this document. The TPS65233 device supports 7-bit addressing; 10-bit addressing and general call
address are not supported.
The TPS65233 device has a 7-bit address with the 2 LSB bits set by EN pin. Connecting EN to ground set the
address 0x60H, connecting to high set the address 0x61H.
Table 1. I2C Address Selection
EN/ADDR PIN
I2C ADDRESS
Connect to Ground
0x60H
Connect to High
0x61H
Figure 53. I2C Interface Timing Diagram
TPS65233 I2C Update Sequence
The TPS65233 requires a start condition, a valid I2C address, a register address byte, and a data byte for a
single update. After the receipt of each byte, TPS65233 device acknowledges by pulling the SDA line low during
the high period of a single clock pulse. TPS65233 performs an update on the falling edge of the LSB byte.
When the TPS65233 is disabled (EN pin tied to ground) the device can still be updated via the I2C interface.
S
7-Bit Slave Address
0 A
Register Address
A
Data Byte
A P
Figure 54. I2C Write Data Format
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S
0 A
7-Bit Slave Address
A Sr
Register1 Address
7-Bit Slave Address
1 A
N P
Data Byte
Figure 55. I2C Read Data Format
A: Acknowledge
N: Not Acknowledge
S: Start
System Host
P: Stop
Chip
Sr: Repeated Start
Register Description
Register descriptions are shown below tables.
Table 2. Control Register 1
NO. OF BITS
ACCESS
NAME
DEFAULT
VALUE
I2C_CON
0
1: I2C control enabled;
0: I2C control disabled
0
reserved
DESCRIPTION
Control Register
Bit 8
address: 0x00H
Bit 7
R/W
Bit 6
R/W
Bit 5
R/W
TGATE
0
Tone Gate. Allows either the internal or external
22-kHz tone signals to be gated.
1: Tone Gate on,
0: Tone gate off
Bit 4
R/W
TMODE
0
Tone mode. Select between the use of an
external 22-kHz or internal 22-kHz signal.
1: internal;
0: external
Bit 3
R/W
EN
1
LNB output voltage Enable
1: output enabled;
0: output disabled
Bit 2
R/W
VSEL2
0
VSEL1
0
Bit 1
R/W
Bit 0
See Table 3 for output voltage selection
R/W
VSEL0
0
Table 3. Voltage Selection Bits
VSEL2
VSEL1
VSEL0
0
0
0
LNB(V)
13
0
0
1
13.4
0
1
0
13.8
0
1
1
14.2
1
0
0
18
1
0
1
18.6
1
1
0
19.2
1
1
1
19.8
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Table 4. Control Register 2
NO. OF BITS
ACCESS
NAME
DEFAULT
VALUE
Control Register
Bit 8
address: 0x01H
Bit 7
R/W
Bit 6
R/W
Bit 5
R/W
Bit 4
R/W
TONE_POS1
0
Bit 3
R/W
TONE_POS0
1
Bit 2
R/W
CL1
0
Bit 1
R/W
CL0
0
Bit 0
R/W
CL_EXT
1
DESCRIPTION
00: tone above Vout;
01: tone in the middle of Vout;
10: tone below Vout
Current limit set bits
1: current limit set by external resistor;
0: current limit set by register
Some tone detection circuits in LNB is sensitive to the position of the tone on the output voltage. TPS65233
provides options to selection the position by setting the TONE_POS1 and TONE_POS0 bits, as illustrated below.
Option 1, TONE_POS1=0, TONE_POS0=0, Tone above VLNB
Option 2, TONE_POS1=0, TONE_POS0=1, Tone in the middle of VLNB
Option 2, TONE_POS1=1, TONE_POS0=0, Tone below VLNB
Figure 56. Tone Position Programmed by TONE_POS1, TONE_POS0 Bits
In addition to program the LDO’s current continuously via an external resistor, internal registers also provide
options to program the current limit. There are four options can be selected.
Table 5. Current Limit Selection Bits
CL1
CL0
CURRENT LIMIT (mA)
0
0
400
0
1
600
1
0
750
1
1
1000
TPS65233 has full range of diagnostic flags for operation and debug. If any of the flags are triggered, pin FAULT
will be pulled low, sending an interrupt signal to processor. Processor then can read the status register to check
the error conditions. Status bits are described as follow. Among these bits, TSD and OCP are different from
others. Once TSD and OCP are set to “1”, the Fault pin logic is latched to low, processor need to reset the bits in
order to release the fault conditions. Other bits will change as conditions change without latch.
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Table 6. Status Register 1
ACCESS
NAME
DEFAULT
VALUE
Bit 6
R
T125
0
1: if die temperature T>125°C;
0: if die temperature T