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TPS76718QDG4

TPS76718QDG4

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOIC8_150MIL

  • 描述:

    IC REG LDO 1.8V 1A 8SOIC

  • 数据手册
  • 价格&库存
TPS76718QDG4 数据手册
Sample & Buy Product Folder Support & Community Tools & Software Technical Documents TPS767 SLVS208J – MAY 1999 – REVISED AUGUST 2015 TPS767xxQ Fast-Transient-Response 1-A Low-Dropout Linear Regulators 1 Features 2 Description • • This device is designed to have a fast transient response and be stable with 10 µF low ESR capacitors. This combination provides high performance at a reasonable cost. 1 • • • • • • • 1 A Low-Dropout Voltage Regulator Available in 1.5-V, 1.8-V, 2.5-V, 2.7-V, 2.8-V, 3.0V, 3.3-V, 5.0-V Fixed Output and Adjustable Versions Dropout Voltage Down to 230 mV at 1 A (TPS76750) Ultralow 85 µA Typical Quiescent Current Fast Transient Response 2% Tolerance Over Specified Conditions for Fixed-Output Versions Open Drain Power-On Reset With 200-ms Delay (See TPS768xx for PG Option) 8-Pin SOIC and 20-Pin TSSOP PowerPAD™ (PWP) Package Thermal Shutdown Protection Because the PMOS device behaves as a low-value resistor, the dropout voltage is very low (typically 230 mV at an output current of 1 A for the TPS76750) and is directly proportional to the output current. Additionally, since the PMOS pass element is a voltage-driven device, the quiescent current is very low and independent of output loading (typically 85 µA over the full range of output current, 0 mA to 1 A). These two key specifications yield a significant improvement in operating life for battery-powered systems. This LDO family also features a sleep mode; applying a TTL high signal to EN (enable) shuts down the regulator, reducing the quiescent current to 1 µA at TJ = 25°C. Device Information(1) PART NUMBER TPS767xx PACKAGE BODY SIZE (NOM) SOIC (8) 4.90 mm × 3.91 mm HTSSOP (20) 6.50 mm x 4.40 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. TPS76733 Dropout Voltage vs Free-air Temperature 102 I O − Output Current − A 101 IO = 10 mA 100 10−1 IO = 0 Co = 10 μF 10−2 −60 −40 −20 0 20 40 60 ∆ VO − Change in Output Voltage − mV IO = 1 A VDO − Dropout Voltage − mV TPS76733 Load Transient Response 100 103 80 100 120 140 TA − Free-Air Temperature − °C 50 0 −50 1 0.5 0 0 100 200 300 400 500 600 700 800 900 1000 t − Time − μs 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS767 SLVS208J – MAY 1999 – REVISED AUGUST 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 9 Features .................................................................. Description ............................................................. Revision History..................................................... Description (Continued) ........................................ Device Options....................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 2 3 3 4 5 7.1 7.2 7.3 7.4 7.5 7.6 5 5 5 5 6 8 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Parameter Measurement Information ................ 12 Detailed Description ............................................ 13 9.1 Overview ................................................................. 13 9.2 9.3 9.4 9.5 Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ Programming .......................................................... 13 14 15 15 10 Application and Implementation........................ 16 10.1 Application Information.......................................... 16 10.2 Typical Application ............................................... 16 11 Layout................................................................... 18 11.1 Power Dissipation and Junction Temperature ...... 18 12 Device and Documentation Support ................. 19 12.1 12.2 12.3 12.4 12.5 Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 19 19 19 19 19 13 Mechanical, Packaging, and Orderable Information ........................................................... 19 3 Revision History Changes from Revision I (January 2004) to Revision J • 2 Page Added ESD Ratings table, Overview section, Feature Description section, Device Functional Modes, Application and Implementation section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .............................................................................................................................................. 1 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated TPS767 www.ti.com SLVS208J – MAY 1999 – REVISED AUGUST 2015 4 Description (Continued) The RESET output of the TPS767xx initiates a reset in microcomputer and microprocessor systems in the event of an undervoltage condition. An internal comparator in the TPS767xx monitors the output voltage of the regulator to detect an undervoltage condition on the regulated output voltage. The TPS767xx is offered in 1.5-V, 1.8-V, 2.5-V, 2.7-V, 2.8-V, 3.0-V, 3.3-V, and 5.0-V fixed-voltage versions and in an adjustable version (programmable over the range of 1.5 V to 5.5 V). Output voltage tolerance is specified as a maximum of 2% over line, load, and temperature ranges. The TPS767xx family is available in 8-pin SOIC and 20-pin PWP packages. 5 Device Options PART NO. (1) VOLTAGE OPTIONS (V) (1) TSSOP (PWP) SOIC (D) TPS76750Q TPS76750Q 5 TPS76733Q TPS76733Q 3.3 TPS76730Q TPS76730Q 3 TPS76728Q TPS76728Q 2.8 TPS76727Q TPS76727Q 2.7 TPS76725Q TPS76725Q 2.5 TPS76718Q TPS76718Q 1.8 TPS76715Q TPS76715Q 1.5 TPS76701Q TPS76701Q Adjustable 1.5 V to 5.5 V TYP The TPS76701 is programmable using an external resistor divider (see application information). The D and PWP packages are available taped and reeled. Add an R suffix to the device type (e.g., TPS76701QDR). Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 TPS767 SLVS208J – MAY 1999 – REVISED AUGUST 2015 www.ti.com 6 Pin Configuration and Functions PWP Package 20 Pin HTSSOP Top View GND/HSINK GND/HSINK GND NC EN IN IN NC GND/HSINK GND/HSINK 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 GND/HSINK GND/HSINK NC NC RESET FB/NC OUT OUT GND/HSINK GND/HSINK NC − No internal connection D Package 8 Pin SOIC Top View GND EN IN IN 1 8 2 7 3 6 4 5 RESET FB/NC OUT OUT Pin Functions PIN NAME NO. I/O DESCRIPTION SOIC PACKAGE EN 2 I Enable input FB/NC 7 I Feedback input voltage for adjustable device (no connect for fixed options) GND 1 Regulator ground IN 3, 4 I Input voltage OUT 5, 6 O Regulated output voltage 8 O RESET output EN 5 I Enable input FB/NC 15 I Feedback input voltage for adjustable device (no connect for fixed options) GND 3 Regulator ground 1, 2, 9, 10, 11, 12, 19, 20 Ground/heatsink RESET HTSSOP PACKAGE GND/HSINK IN 6, 7 NC 4, 8, 17, 18 OUT RESET 4 I Input voltage No connect 13, 14 O Regulated output voltage 16 O RESET output Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated TPS767 www.ti.com SLVS208J – MAY 1999 – REVISED AUGUST 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) VI (1) MIN MAX UNIT Input voltage range (2) –0.3 13.5 V Voltage range at EN –0.3 VI + 0.3 V Maximum RESET voltage 16.5 Peak output current VO Internally limited Output voltage (OUT, FB) Continuous total power dissipation 7 V See Thermal Information TJ Operating junction temperature range –40 125 °C Tstg Storage temperature range −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network terminal ground. (2) 7.2 ESD Ratings V(ESD) (1) Electrostatic discharge VALUE UNIT 2000 V Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX VI (1) Input voltage 2.7 10 V VO Output voltage range 1.2 5.5 V IO (2) TJ (2) (1) (2) Output current Operating junction temperature UNIT 0 1.0 A –40 125 °C Maximum VIN = VOUT + VDO or 2.7V, whichever is greater. Continuous current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that the device operate under conditions beyond those specified in this table for extended periods of time. 7.4 Thermal Information TPS767xxQ THERMAL METRIC (1) PWP (HTSSOP) D (SOIC) (20 PINS) (8 PINS) UNIT RθJA Junction-to-ambient thermal resistance 35.8 106.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 26.1 52.5 °C/W RθJB Junction-to-board thermal resistance 8.7 47.7 °C/W ψJT Junction-to-top characterization parameter 0.4 9.0 °C/W ψJB Junction-to-board characterization parameter 8.6 47.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.6 n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 TPS767 SLVS208J – MAY 1999 – REVISED AUGUST 2015 www.ti.com 7.5 Electrical Characteristics VI = VO(typ) + 1 V, IO = 1 mA, EN = 0 V, Co = 10 µF (over recommended operating free-air temperature range, unless otherwise noted) PARAMETER TEST CONDITIONS TPS76701 TPS76715 TPS76718 TPS76725 Output voltage (10 µA to 1 A load) TPS76727 TPS76728 TPS76730 TPS76733 TPS76750 Quiescent current (GND current) EN = 0V Output voltage line regulation (∆VO/VO) 1.5 V ≤ VO ≤ 5.5 V, TJ = 25°C 1.5 V ≤ VO ≤ 5.5 V, TJ = −40°C to 125°C TJ = 25°C, 2.7 V < VIN < 10 V TJ = −40°C to 125°C, 2.7 V < VIN < 10 V TJ = 25°C, 2.8 V < VIN < 10 V TJ = −40°C to 125°C, 2.8 V < VIN < 10 V TJ = 25°C, 3.5 V < VIN < 10 V TJ = −40°C to 125°C, 3.5 V < VIN < 10 V TJ = 25°C, 3.7 V < VIN < 10 V TJ = −40°C to 125°C, 3.7 V < VIN < 10 V TJ = 25°C, 3.8 V < VIN < 10 V TJ = −40°C to 125°C, 3.8 V < VIN < 10 V TJ = 25°C, 4.0 V < VIN < 10 V TJ = −40°C to 125°C, 4.0 V < VIN < 10 V TJ = 25°C, 4.3 V < VIN < 10 V TJ = −40°C to 125°C, 4.3 V < VIN < 10 V TJ = 25°C, 6.0 V < VIN < 10 V TJ = −40°C to 125°C, 6.0 V < VIN < 10 V 10 µA < IO < 1 A, TJ = 25°C IO = 1 A, TJ = −40°C to 125°C VO + 1 V < VI ≤ 10 V, TJ = 25°C MIN Output noise voltage TPS76718 Output current limit 0.98VO FB input current 1.5 1.530 1.8 1.7646 1.836 2.5 2.450 2.550 2.7 2.646 2.754 2.8 2.7446 2.856 3 2.9400 3.060 3.2346 4.900 125 1.2 TJ = 25°C, 2.7 V < VI < 10 V EN = VI, TJ = −40°C to 125°C, 2.7 V < VI < 10 V Reset VO decreasing Hysteresis voltage Measured at VO Output low voltage VI = 2.7 V, Leakage current V(RESET) = 5 V 6 Submit Documentation Feedback V TJ = 25°C µA mV 55 µVrms 1.7 2 A 150 °C 1 µA 2 µA nA V 60 V dB 1.1 92 98 0.5 IO(RESET) = 1 mA 0.15 0.4 1 RESET time-out delay Input current (EN) V %/V 0.9 Trip threshold voltage V 3 1.7 IO(RESET) = 300 μA V 0.01 10 FB = 1.5 V Minimum input voltage for valid RESET V 5.100 85 EN = VI, f = 1 kHz, Co = 10 µF, V 3.366 Low level enable input voltage Power supply ripple rejection V 5 IC = 1 A, TJ = 25°C High level enable input voltage UNIT 3.3 VO = 0 V TPS76701 1.02VO 1.470 Thermal shutdown junction temperature Standby current MAX VO Load regulation BW = 200 Hz to 100 kHz, Co = 10 µF, TYP 200 EN = 0 V –1 EN = VI –1 0 1 1 µA Copyright © 1999–2015, Texas Instruments Incorporated TPS767 www.ti.com SLVS208J – MAY 1999 – REVISED AUGUST 2015 Electrical Characteristics (continued) VI = VO(typ) + 1 V, IO = 1 mA, EN = 0 V, Co = 10 µF (over recommended operating free-air temperature range, unless otherwise noted) PARAMETER Dropout voltage (1) TEST CONDITIONS TPS76728 IO = 1 A TPS76730 IO = 1 A TPS76733 IO = 1 A TPS76750 IO = 1 A MIN TJ = 25°C TYP MAX TJ = −40°C to 125°C 825 TJ = 25°C 450 TJ = −40°C to 125°C (1) UNIT 500 675 TJ = 25°C 350 TJ = −40°C to 125°C 575 TJ = 25°C 230 TJ = −40°C to 125°C 380 mV mV mV mV IN voltage equals VO(typ) − 100 mV; TPS76701 output voltage set to 3.3 V nominal with external resistor divider. TPS76715, TPS76718, TPS76725, and TPS76727 dropout voltage limited by input voltage range limitations (i.e., TPS76730 input voltage needs to drop to 2.9 V for purpose of this test). VI Vres(1) Vres t VO VIT+(2) VIT+(2) Threshold Voltage VIT−(2) Less than 5% of the output voltage VIT−(2) t RESET Output 200 ms Delay 200 ms Delay Output Undefined Output Undefined t Figure 1. Timing Diagram Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 7 TPS767 SLVS208J – MAY 1999 – REVISED AUGUST 2015 www.ti.com 7.6 Typical Characteristics Table 1. Table of Graphs FIGURE vs Output current Figure 2, Figure 3, Figure 4 vs Free-air temperature Figure 5, Figure 6, Figure 7 Ground current vs Free-air temperature Figure 8, Figure 9 Power supply ripple rejection vs Frequency Figure 10 Output spectral noise density vs Frequency Figure 11 Input voltage (min) vs Output voltage Figure 12 Zo Output impedance vs Frequency Figure 13 VDO Dropout voltage vs Free-air temperature VO Figure 15, Figure 16 Load transient response Figure 17, Figure 18 Output voltage vs Time Dropout voltage vs Input voltage Equivalent series resistance (ESR) (1) vs Output current Figure 19 Figure 20 Figure 21–Figure 24 Equivalent series resistance (ESR) refers to the total series resistance, including the ESR of the capacitor, any series resistance added externally, and PWB trace resistance to Co. 3.2835 1.4985 3.2830 1.4980 3.2825 1.4975 1.4970 3.2820 1.4965 3.2815 1.4960 3.2810 1.4955 3.2805 1.4950 3.2800 0 VI = 4.3 V 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 IO − Output Current − A 0.9 1 TA = 25°C Figure 2. TPS76733 Output Voltage vs Output Current 8 Figure 14 Line transient response VO − Output Voltage − V (1) Output voltage VO − Output Voltage − V VO Submit Documentation Feedback 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 IO − Output Current − A VI = 2.7 V TA = 25°C Figure 3. TPS76715 Output Voltage vs Output Current Copyright © 1999–2015, Texas Instruments Incorporated TPS767 www.ti.com SLVS208J – MAY 1999 – REVISED AUGUST 2015 2.4960 3.32 2.4955 3.31 VO − Output Voltage − V VO − Output Voltage − V 2.4950 2.4945 2.4940 2.4935 2.4930 3.30 3.29 IO = 1 A 3.27 3.26 2.4925 2.4920 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 3.25 −60 −40 −20 1 IO − Output Current − A VI = 3.5 V 0 20 40 60 80 100 120 140 TA − Free-Air Temperature − °C TA = 25°C VI = 4.3 V Figure 4. TPS76725 Output Voltage vs Output Current Figure 5. TPS76733 Output Voltage vs Free-Air Temperature 1.515 2.515 2.510 VO − Output Voltage − V 1.510 VO − Output Voltage − V IO = 1 mA 3.28 1.505 1.500 IO = 1 A IO = 1 mA 1.495 1.490 2.505 2.500 IO = 1 A 2.495 IO = 1 mA 2.490 2.485 1.485 −60 −40 −20 0 20 40 60 80 2.480 −60 −40 100 120 140 TA − Free-Air Temperature − °C VI = 2.7 V −20 0 20 40 60 80 100 120 TA − Free-Air Temperature − °C VI = 3.5 V Figure 6. TPS76715 Output Voltage vs Free-Air Temperature Figure 7. TPS767125 Output Voltage vs Free-Air Temperature 100 92 90 95 86 84 82 IO = 1 mA 80 IO = 1 A 78 IO = 500 mA 76 Ground Current − μ A Ground Current − μ A 88 90 IO = 1 A IO = 1 mA 85 IO = 500 mA 80 74 72 −60 −40 −20 0 20 40 60 80 100 120 140 75 −60 −40 −20 0 20 40 60 80 100 120 140 TA − Free-Air Temperature − °C TA − Free-Air Temperature − °C VI = 4.3 V VI = 2.7 V Figure 8. TPS76733 Ground Current vs Free-Air Temperature Figure 9. TPS76715 Ground Current vs Free-Air Temperature Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 9 TPS767 SLVS208J – MAY 1999 – REVISED AUGUST 2015 www.ti.com 10−5 PSRR − Power Supply Ripple Rejection − dB 90 Output Spectral Noise Density − µV Hz 80 60 50 40 30 20 10 0 −10 10 100 1k 10k 100k IO = 7 mA 10−6 IO = 1 A 10−7 10−8 102 1M 103 f − Frequency − Hz VI = 4.3 V IO = 1 A Co = 10 µF TA = 25°C VI = 4.3 V Figure 10. TPS76733 Power Supply Ripple Rejection vs Frequency TA = 25°C TA = 125°C 3 TA = −40°C 2.7 1.75 2 2.25 2.5 3 2.75 3.25 IO = 1 mA 10−1 IO = 1 A 10−2 101 3.5 IO = 1 A 102 103 104 f − Frequency − kHz VI = 4.3 V 103 IO = 1 A 102 101 ∆ VO − Change in Output Voltage − mV IO = 10 mA 100 10−1 IO = 0 10−2 −60 −40 −20 0 20 40 60 80 100 120 140 Figure 14. TPS76733 Dropout Voltage vs Free-Air Temperature Submit Documentation Feedback 106 Co = 10 µF TA = 25°C 3.7 2.7 10 0 −10 0 20 TA − Free-Air Temperature − °C CO = 10 µF 105 Figure 13. TPS76733 Output Impedance vs Frequency VI − Input Voltage − V Figure 12. Input Voltage (MIN) vs Output Voltage VDO − Dropout Voltage − mV TA = 25°C 0 Zo − Output Impedance − Ω VI − Input Voltage (Min) − V Co = 10 µF VO − Output Voltage − V 10 105 Figure 11. TPS76733 Output Spectral Noise Density vs Frequency 4 2 1.5 104 f − Frequency − Hz CO = 10 µF 40 60 80 100 120 140 160 180 200 t − Time − μs TA = 25°C Figure 15. TPS76715 Line Transient Response Copyright © 1999–2015, Texas Instruments Incorporated TPS767 www.ti.com SLVS208J – MAY 1999 – REVISED AUGUST 2015 VI − Input Voltage − V ∆ VO − Change in Output Voltage − mV 100 50 0 −50 4.3 ∆ VO − Change in Output Voltage − mV I O − Output Current − A −100 1 0.5 0 0 −10 0 20 40 60 80 100 120 140 160 180 200 t − Time − μs TA = 25°C Figure 17. TPS76733 Line Transient Response 4 VO− Output Voltage − V 100 50 0 −50 3 2 1 −100 0 1 Enable Pulse − V ∆ VO − Change in Output Voltage − mV 0 CO = 10 µF TA = 25°C Figure 16. TPS76715 Load Transient Response I O − Output Current − A 10 100 200 300 400 500 600 700 800 900 1000 t − Time − μs CO = 10 µF 0.5 0 0 0 100 200 300 400 500 600 700 800 900 1000 t − Time − μs CO = 10 µF 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 t − Time − ms CO = 10 µF TA = 25°C Figure 18. TPS76733 Load Transient Response 0.9 1 IO = 1 A TA = 25°C Figure 19. TJPS7633 Output Voltage vs Time (At Startup) 900 ESR − Equivalent Series Resistance − Ω 10 800 VDO − Dropout Voltage − mV 5.3 700 600 500 TA = 25°C 400 TA = 125°C 300 200 TA = −40°C Region of Instability 1 Region of Stability 100 0 0.1 2.5 3 4 3.5 VI − Input Voltage − V 4.5 5 IO = 1 A Figure 20. TPS76701 Dropout Voltage vs Input Voltage Copyright © 1999–2015, Texas Instruments Incorporated 0 200 400 600 800 1000 IO − Output Current − mA VO = 3.3 V VI = 4.3 A Co = 4.7 µF TA = 25°C Figure 21. Typical Region of Stability Equivalent Series Resistance vs Output Current Submit Documentation Feedback 11 TPS767 SLVS208J – MAY 1999 – REVISED AUGUST 2015 www.ti.com 10 ESR − Equivalent Series Resistance − Ω ESR − Equivalent Series Resistance − Ω 10 Region of Instability 1 Region of Stability 0.1 Region of Instability 1 Region of Stability 0.1 0 200 400 600 800 1000 0 200 IO − Output Current − mA VO = 3.3 V VI = 4.3 A 400 600 800 1000 IO − Output Current − mA Co = 4.7 µF TA = 125°C VO = 3.3 V VI = 4.3 A Figure 22. Typical Region of Stability Equivalent Series Resistance vs Output Current Co = 22 µF TA = 25°C Figure 23. Typical Region of Stability Equivalent Series Resistance vs Output Current ESR − Equivalent Series Resistance − Ω 10 Region of Instability 1 Region of Stability 0.1 0 200 400 600 800 1000 IO − Output Current − mA VO = 3.3 V VI = 4.3 A Co = 22 µF TA = 125°C Figure 24. Typical Region of Stability Equivalent Series Resistance vs Output Current 8 Parameter Measurement Information VI To Load IN OUT + EN Co GND RL ESR Figure 25. Test Circuit for Typical Regions of Stability (Figure 21 through Figure 24) (Fixed Output Options) 12 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated TPS767 www.ti.com SLVS208J – MAY 1999 – REVISED AUGUST 2015 9 Detailed Description 9.1 Overview The TPS767xx features very low quiescent current, which remains virtually constant even with varying loads. Conventional LDO regulators use a pnp pass element, the base current of which is directly proportional to the load current through the regulator (IB = IC/β). The TPS767xx uses a PMOS transistor to pass current; because the gate of the PMOS is voltage driven, operating current is low and invariable over the full load range. Another pitfall associated with the pnp-pass element is its tendency to saturate when the device goes into dropout. The resulting drop in β forces an increase in IB to maintain the load. During power up, this translates to large start-up currents. Systems with limited supply current may fail to start up. In battery-powered systems, it means rapid battery discharge when the voltage decays below the minimum required for regulation. The TPS767xx quiescent current remains low even when the regulator drops out, eliminating both problems. The TPS767xx family also features a shutdown mode that places the output in the high-impedance state (essentially equal to the feedback-divider resistance) and reduces quiescent current to 2 µA. If the shutdown feature is not used, EN should be tied to ground. 9.2 Functional Block Diagram IN EN RESET _ + OUT + _ R1 200 ms Delay Vref = 1.1834 V FB/NC R2 GND External to the device Figure 26. Adjustable Version Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 13 TPS767 SLVS208J – MAY 1999 – REVISED AUGUST 2015 www.ti.com Functional Block Diagram (continued) IN EN RESET _ + OUT + _ 200 ms Delay R1 Vref = 1.1834 V R2 GND Figure 27. Fixed-Voltage Version 9.3 Feature Description 9.3.1 FB—Pin Connection (adjustable version only) The FB pin is an input pin to sense the output voltage and close the loop for the adjustable option . The output voltage is sensed through a resistor divider network to close the loop as shown in Figure 28. Normally, this connection should be as short as possible; however, the connection can be made near a critical circuit to improve performance at that point. Internally, FB connects to a high-impedance wide-bandwidth amplifier and noise pickup feeds through to the regulator output. Routing the FB connection to minimize/avoid noise pickup is essential. 9.3.2 Reset Indicator The TPS767xx features a RESET output that can be used to monitor the status of the regulator. The internal comparator monitors the output voltage: when the output drops to between 92% and 98% of its nominal regulated value, the RESET output transistor turns on, taking the signal low. The open-drain output requires a pullup resistor. If not used, it can be left floating. RESET can be used to drive power-on reset circuitry or as a low-battery indicator. RESET does not assert itself when the regulated output voltage falls outside the specified 2% tolerance, but instead reports an output voltage low relative to its nominal regulated value (refer to Figure 1 timing diagram for start-up sequence). 9.3.3 Regulator Protection The TPS767xx PMOS-pass transistor has a built-in back diode that conducts reverse currents when the input voltage drops below the output voltage (e.g., during power down). Current is conducted from the output to the input and is not internally limited. When extended reverse voltage is anticipated, external limiting may be appropriate. The TPS767xx also features internal current limiting and thermal protection. During normal operation, the TPS767xx limits output current to approximately 1.7 A. When current limiting engages, the output voltage scales back linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure, care should be taken not to exceed the power dissipation ratings of the package. If the temperature of the device exceeds 150°C(typ), thermal-protection circuitry shuts it down. Once the device has cooled below 130°C(typ), regulator operation resumes. 14 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated TPS767 www.ti.com SLVS208J – MAY 1999 – REVISED AUGUST 2015 9.4 Device Functional Modes 9.4.1 Minimum Load Requirements The TPS767xx family is stable even at zero load; no minimum load is required for operation. 9.5 Programming 9.5.1 Programming the TPS76701 Adjustable LDO Regulator The output voltage of the TPS76701 adjustable regulator is programmed using an external resistor divider as shown in Figure 28. The output voltage is calculated using: R1 ö æ VO = Vref ´ ç 1 + ÷ R2 è ø (1) Where: f = 1.1834 V typ (the internal reference voltage) Resistors R1 and R2 should be chosen for approximately 50-µA divider current. Lower value resistors can be used but offer no inherent advantage and waste more power. Higher values should be avoided as leakage currents at FB increase the output voltage error. The recommended design procedure is to choose R2 = 30.1 kΩ to set the divider current at 50 µA and then calculate R1 using: æ V ö R1 = ç O - 1÷ ´ R2 è Vref ø (2) OUTPUT VOLTAGE PROGRAMMING GUIDE TPS76701 VI IN RESET Reset Output 0.1 μF 250 kΩ ≥1.7 V EN OUT ≤0.9 V VO R1 FB / NC GND Co OUTPUT VOLTAGE R1 R2 UNIT 2.5 V 33.2 30.1 kΩ 3.3 V 53.6 30.1 kΩ 3.6 V 61.9 30.1 kΩ 4.75 V 90.8 30.1 kΩ R2 Figure 28. TPS76701 Adjustable LDO Regulator Programming Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 15 TPS767 SLVS208J – MAY 1999 – REVISED AUGUST 2015 www.ti.com 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information The TPS767xx family includes eight fixed-output voltage regulators (1.5 V, 1.8 V, 2.5 V, 2.7 V, 2.8 V, 3.0 V, 3.3 V, and 5.0 V), and an adjustable regulator, the TPS76701 (adjustable from 1.5 V to 5.5 V). 10.1.1 External Capacitor Requirements An input capacitor is not usually required; however, a ceramic bypass capacitor (0.047 µF or larger) improves load transient response and noise rejection if the TPS767xx is located more than a few inches from the power supply. A higher-capacitance electrolytic capacitor may be necessary if large (hundreds of milliamps) load transients with fast rise times are anticipated. Like all low dropout regulators, the TPS767xx requires an output capacitor connected between OUT and GND to stabilize the internal control loop. The minimum recommended capacitance value is 10 µF and the ESR (equivalent series resistance) must be between 50 mΩ and 1.5 Ω. Capacitor values 10 µF or larger are acceptable, provided the ESR is less than 1.5 Ω. Solid tantalum electrolytic, aluminum electrolytic, and multilayer ceramic capacitors are all suitable, provided they meet the requirements described above. Most of the commercially available 10 µF surface-mount ceramic capacitors, including devices from Sprague and Kemet, meet the ESR requirements stated above. 10.2 Typical Application TPS767xx 6 16 IN VI RESET RESET 7 250 kΩ IN C1 0.1μF OUT 5 14 VO 13 EN OUT GND + Co 10 μF 3 Figure 29. Typical Application Circuit (Fixed Versions) 16 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated TPS767 www.ti.com SLVS208J – MAY 1999 – REVISED AUGUST 2015 Typical Application (continued) TPS767xx VI 6 IN RESET 16 RESET 7 IN OUT 0.1 μF 5 EN OUT 14 VO 13 + GND Co(1) 10 μF 3 (1) See application information section for capacitor selection details. Figure 30. Typical Application Configuration (For Fixed Output Options) Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 17 TPS767 SLVS208J – MAY 1999 – REVISED AUGUST 2015 www.ti.com 11 Layout 11.1 Power Dissipation and Junction Temperature Specified regulator operation is assured to a junction temperature of 125°C; the maximum junction temperature should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or equal to PD(max). The maximum-power-dissipation limit is determined using the following equation: T max - TA PD(max) = J RqJA (3) Where: TJmax is the maximum allowable junction temperature. RθJA is the thermal resistance junction-to-ambient for the package, i.e., 172°C/W for the 8-terminal SOIC and RθJA 32.6°C/W for the 20-terminal PWP with no airflow. TA is the ambient temperature. The regulator dissipation is calculated using: PD = (VI - VO )´ IO (4) Power dissipation resulting from quiescent current is negligible. Excessive power dissipation will trigger the thermal protection circuit. 18 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated TPS767 www.ti.com SLVS208J – MAY 1999 – REVISED AUGUST 2015 12 Device and Documentation Support 12.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TPS76715 Click here Click here Click here Click here Click here TPS76718 Click here Click here Click here Click here Click here TPS76725 Click here Click here Click here Click here Click here TPS76727 Click here Click here Click here Click here Click here TPS76728 Click here Click here Click here Click here Click here TPS76730 Click here Click here Click here Click here Click here TPS76733 Click here Click here Click here Click here Click here TPS76750 Click here Click here Click here Click here Click here TPS76701 Click here Click here Click here Click here Click here 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks PowerPAD, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 19 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TPS76701QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76701 Samples TPS76701QDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76701 Samples TPS76701QPWP ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76701 Samples TPS76701QPWPG4 ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76701 Samples TPS76701QPWPR ACTIVE HTSSOP PWP 20 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76701 Samples TPS76701QPWPRG4 ACTIVE HTSSOP PWP 20 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76701 Samples TPS76715QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76715 Samples TPS76715QDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76715 Samples TPS76715QPWP ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76715 Samples TPS76718QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76718 Samples TPS76718QDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76718 X Samples TPS76718QPWP ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76718 Samples TPS76718QPWPR ACTIVE HTSSOP PWP 20 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76718 Samples TPS76725QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76725 Samples TPS76725QPWP ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76725 Samples TPS76725QPWPG4 ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76725 Samples TPS76725QPWPR ACTIVE HTSSOP PWP 20 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76725 Samples TPS76727QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76727 Samples TPS76727QPWP ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76727 Samples TPS76728QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76728 Samples Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TPS76730QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76730 Samples TPS76730QPWP ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76730 Samples TPS76730QPWPG4 ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76730 Samples TPS76730QPWPR ACTIVE HTSSOP PWP 20 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76730 Samples TPS76733QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76733 Samples TPS76733QDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76733 Samples TPS76733QPWP ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76733 Samples TPS76733QPWPG4 ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76733 Samples TPS76733QPWPR ACTIVE HTSSOP PWP 20 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76733 Samples TPS76733QPWPRG4 ACTIVE HTSSOP PWP 20 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76733 Samples TPS76750QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76750 Samples TPS76750QDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 76750 Samples TPS76750QPWP ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76750 Samples TPS76750QPWPR ACTIVE HTSSOP PWP 20 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PT76750 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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