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TRF2436IRTBRG4

TRF2436IRTBRG4

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VFQFN40_EP

  • 描述:

    IC RF FRONT-END DUAL-BAND 40-QFN

  • 数据手册
  • 价格&库存
TRF2436IRTBRG4 数据手册
Not Recommended For New Designs TRF2436 www.ti.com SLWS176C – APRIL 2005 – REVISED MAY 2007 High-Power Dual-Band (2.4-GHz to 2.5-GHz and 4.9-GHz to 5.9-GHz) RF Front-End • FEATURES • • • • • Highly Integrated 802.16 d/e Radio Frequency Front End ASIC Fully Integrated Up/Down Converters, LNAs, PAs and T/R Switches Super Heterodyne Architecture for Superior Adjacent Channel Rejection Performance Differential LO and IF Interface for Enhanced Spurious/EMI Performance Common Frequency Plan uses a Single LO and Common IF for Single IF Filter for Both Bands • • • • • • • Integrated Temperature Compensated TX Power Detectors PA Bias Control Function Antenna Port OP1dB = +23 dBm Typical Antenna Port OIP3 = +33 dBm, Typical Frequency Range: 2.4 to 2.5 and 4.9 to 5.9 GHz Noise Figure: 4 dB ISM Band, 6 dB 5 GHz Bands Typical Typical Gain: 38 dB TX, 20 dB RX IF = 374 MHz RSVD2 V+PA1B PABCB 37 36 35 34 33 V+PA2B RFB 39 38 BCIN RXDGC 40 1 TR MXB LOADJB TXGADJB TRF2436 PACKAGE (TOP VIEW) 32 31 30 V+PA3B 28 DETN RSVD1 4 27 RFANTB LOP 5 26 V+LNABA LON 6 25 RFANTA IFP 7 24 GND IFN 8 23 GND MXA 9 22 BYPOUT 15 16 17 18 21 19 20 BYPIN BCOUT 14 V+PA2A 12 13 V+IFN 10 11 V+IF V+LOA V+PA3A 3 PABCA V+LOB V+GEN DETB V+PA1A 29 RFA 2 V+IFP ABSEL Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2007, Texas Instruments Incorporated Not Recommended For New Designs TRF2436 www.ti.com SLWS176C – APRIL 2005 – REVISED MAY 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION The TRF2436 is a fully integrated Dual Band Tri Mode Radio Frequency Front End (RFFE) designed specifically for use in 802.16 d/e applications. The TRF2436 is designed to perform RF up and down conversions in the unlicensed ISM and 4.9-5.9 GHz bands. The TRF2436 uses a common IF frequency for both bands, eliminating the need for additional IF filtering. Combined with the TI TRF2432 IF/IQ Transceiver/Synthesizer, the TRF2436 completes the TI WLAN two-chip radio. The TRF2436 incorporates all of the RF blocks for both the “b” and “a” bands except for low cost ceramic filters. The ASIC includes LNAs, PAs, mixers, bias circuitry, RX gain control, transmit coupler detectors, and T/R switches. High integration and internal RF matching enhances performance and greatly reduce external part count. The only external components needed (other than simple passives) for operation are RF filters and external low power DC switching FETs. Functional Block Diagram V+ V+ BPF PABCA MXA RFA ABSEL TR PA PA RFANTA T/R RXGC T/R T/R IF T/R 2 A/B RFANTB 2 T/R A/B LO PA PABCB RFB V+ BPF MXB DET 2 DEVICE INFORMATION TERMINAL FUNCTIONS TERMINAL NAME 2 NO. I/O TYPE DESCRIPTION MXB 1 I/O RF SE B band RF Input/Output to mixer. 50-Ω single ended. Do not apply DC. ABSEL 2 I Digital Band select pin. HIGH = A-band. LOW = B-band. V+LOB 3 I Power B band LO amplifier bias +3.3V RSVD1 4 - - LOP 5 I RF Dif. Not connected for normal operation. Leave Open. LO input (differential) Positive, AC coupled Submit Documentation Feedback Not Recommended For New Designs TRF2436 www.ti.com SLWS176C – APRIL 2005 – REVISED MAY 2007 DEVICE INFORMATION (continued) TERMINAL FUNCTIONS (continued) TERMINAL NAME NO. I/O TYPE DESCRIPTION LON 6 I RF Dif. LO input (differential) Negative, AC coupled IFP 7 I/O RF Dif. IF input/output (differential) Positive, DC coupled, typical DC Voltage is 2.6V IFN 8 I/O RF Dif. IF input/output(differential) Negative, DC coupled, typical DC Voltage is 2.6V MXA 9 I/O RF SE A band RF Input/Output to mixer. 50-Ω single ended. Do not apply DC. V+LOA 10 I Power A band LO amplifier bias +3.3V V+IF 11 I Power IF amplifier bias +3.3V. V+IFP 12 I Power IFP amplifier bias +3.3V. V+IFN 13 I Power IFN amplifier bias +3.3V. RFA 14 I/O RF SE A Band RF Input/Output to PA/LNA. 50-Ω single ended. AC coupled. V+PA1A 15 I Power A band Power amplifier bias +3.3V. V+GEN 16 I Power DC Bias Control Bias +3.3V. V+PA2A 17 I Power PABCA 18 - - V+PA3A 19 - - BCOUT 20 O Analog Bias Control Output. A band Power amplifier bias +3.3V. A band PA Bias Control Input A band Power amplifier bias +3.3V. BYPIN 21 I Analog DC Bias Bypass Input BYPOUT 22 O Analog DC Bias Bypass Output 23, 24 - - RFANTA 25 I/O RF SE V+LNABA 26 I Power A and B Band LNA bias +3.3V. RFANTB 27 I/O RF SE B band RF in/out to antennas. AC coupled. DETN 28 O Analog Negative RF power detector output DETP 29 O Analog Positive RF power detector output. V+PA3B 30 I Power B band Power amplifier bias +3.3V. V+PA2B 31 I Power B band Power amplifier bias +3.3V. BCIN 32 I Analog Bias control input PABCB 33 - - V+PA1B 34 I Power RSVD2 35 - - RFB 36 I/O RF SE B band RF Input/Output to PA/LNA. 50-Ω single ended. AC coupled. RXDGC 37 I Digital Rx Gain Control. HIGH = minimum gain. LOW = maximum gain GND Connect to ground A band RF in/out to antennas. AC coupled. B band PA Bias Control Input B band Power amplifier bias +3.3V. Not Connected for normal operation. Leave Open. TR 38 I Digital LOADJB 39 - - Not connected for normal operation. Leave Open. B band LO amp bias adjust. Transmit/Receive mode control. HIGH = transmit. LOW = receive. TXGADJB 40 - - Not connected for normal operation. Leave open. PAB Amplifier bias adjust. Submit Documentation Feedback 3 Not Recommended For New Designs TRF2436 www.ti.com SLWS176C – APRIL 2005 – REVISED MAY 2007 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) VALUE UNIT VCC DC supply voltage 0 to 6.9 V ICC DC supply current 600 mA 10 dBm VID Digital input voltage TJC Junction temperature θJC Thermal resistance junction-to-case TA Operating temperature Tstg Storage temperature -40 to 105 °C 220 °C RF input power Lead temperature Any port and any mode 40 sec maximum -0.3 to 5 V 175 °C 35 °C/W -20 to 85 °C DC CHARACTERISTICS TYP ratings are at 25°C and VCC = 3.3 V, MIN and MAX ratings are over operating free-air temperature and voltage ranges (unless otherwise noted) PARAMETER VCC Supply voltage ICC Total supply current VIH High-level input voltage VIL Low-level input voltage IIH High-level input current IIL Low-level input current TEST CONDITIONS MIN TYP MAX 2.7 3.3 4.2 V B Band, RX Mode 65 105 mA A Band, RX Mode 80 120 mA 410 520 mA 450 550 mA 0.5 V 300 µA -50 µA Specification compliant B Band, TX Mode, Max PABC input A Band, TX Mode, Max PABC input 1.7 UNIT V 100 RECEIVER CHARACTERISTICS TR = Low, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25°C and VCC = 3.3 V (unless otherwise noted) PARAMETER fIRF RF input frequency fLO LO input frequency fIF IF input frequency G ∆G Gain Gain step size Noise figure 4 TEST CONDITIONS MIN TYP MAX B band 2400 2500 A band 4900 5900 B band 2774 2874 A band 2637 3137 374 B Band High Gain Mode RXGC=LOW 17 19 A Band High Gain Mode RXGC=LOW 18 23 MHz MHz MHz dB B Band Low Gain Mode RXGC=HIGH 25 A Band Low Gain Mode RXGC=HIGH 15 dB B Band. Max Gain 4 5 A Band. Max Gain 6 7.5 Submit Documentation Feedback UNIT dB Not Recommended For New Designs TRF2436 www.ti.com SLWS176C – APRIL 2005 – REVISED MAY 2007 RECEIVER CHARACTERISTICS (continued) TR = Low, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25°C and VCC = 3.3 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP -16 -13 A Band High Gain Mode RXGC=LOW -22 -18 A Band Low Gain Mode RXGC=HIGH -16 -13 B Band High Gain Mode RXGC=LOW -6 -2 B Band Low Gain Mode RXGC=HIGH 4 8 A Band High Gain Mode RXGC=LOW -12 -8 A Band Low Gain Mode RXGC=HIGH -6 -3 B Band High Gain Mode RXGC=LOW Input P-1dB Input 3rd order intercept point MAX B Band Low Gain Mode RXGC=HIGH UNIT dBm dBm RF input return loss Z = 50 Ω Both Bands, Both Gain modes 8 dB LNA out return loss RF Z = 50 Ω Both Bands, Both Gain modes 9 dB dB Mixer input MX return loss Z = 50 Ω Both Bands 10 Output return loss Measured into 200 Ω differential 10 LO at MX leakage LO at IF leakage Gain flatness full band dB B band -30 A Band (5274-6274 MHz) -30 Both bands -40 B band 1 A band 2 Gain flatness / 22 MHz Both bands Gain settling time Full range to within 0.5 dB final. All bands 0.3 In Band: B Band High Gain Mode RXGC=LOW 30 In Band: B Band Low Gain Mode RXGC=HIGH 5 In Band: A Band High Gain Mode RXGC=LOW 25 In Band: A Band Low Gain Mode RXGC=HIGH 35 RF to RFANT isolation dBm dBm dB dB µs dB TRANSMITTER CHARACTERISTICS TR = High, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25°C and VCC = 3.3 V (unless otherwise noted) PARAMETER fIF fORF fLO G TEST CONDITIONS MIN IF input frequency RF output frequency LO input frequency Gain TYP MAX 374 UNIT MHz B band 2400 2500 MHz A band 4900 5900 MHz B band 2774 2874 MHz A band 2637 3137 MHz B Band 37 40 dB A Band 40 43 dB Submit Documentation Feedback 5 Not Recommended For New Designs TRF2436 www.ti.com SLWS176C – APRIL 2005 – REVISED MAY 2007 TRANSMITTER CHARACTERISTICS (continued) TR = High, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25°C and VCC = 3.3 V (unless otherwise noted) PARAMETER Output 1 dB gain compression Output 3rd order intercept llkg MIN TYP B band. max PABC input TEST CONDITIONS 22 23.5 MAX UNIT dBm A band. max PABC input 20.5 22.5 dBm 5150 – 5350 MHz Max PABC input, V+PA = 2.9 V min, Other VCC = 2.7 V min 20.5 22.5 dBm B band 32 35 dBm A band 30 32.5 dBm Noise figure Both bands IF input return loss Measured into 200 Ω differential 8 dB Mixer output return loss MX Z = 50 Ω both bands 10 dB RF input return loss RF Z = 50 Ω both bands 8 dB RFANT return loss Z = 50 Ω both bands 6 dB LO leakage at MX Gain flatness full band dB B band -35 dBm A band (5274-6274 MHz) -35 dBm B band 1 dB A band 2 dB Gain flatness / 22 MHz Both bands PA harmonics Both bands CW at P1 dB RFANT to RF isolation 8 dB -20 dBc B band 50 dB A band 50 dB PA Off Isolation RF to RFANT In band: both bands 50 PA Turn On Time To within 0.5 dB max power 0.2 dB µs PA Turn Off Time To within -20 dB max power 0.2 µs PA droop From max power after turn-on time, Maximum on duration is 200 ms PA Bias Control Input Range (PABC) Max Current corresponds to max PA bias state 0.5 dB mA COMMON ELECTRICAL CHARACTERISTICS MIN, TYP, and MAX ratings are at 25°C and VCC = 3.3 V (unless otherwise noted) PARAMETER TR_SEL switch time TEST CONDITIONS MIN Gain within 0.5dB. Not Including PA ramp time TYP MAX 0.3 1 AB_SEL switch time LO input power Reference to 100 Ω differential LO input return loss Measured to 100 Ω differential at 25°C IF port impedance Differential LO port impedance 6 Submit Documentation Feedback -1 UNIT µs 1 µs 5 dBm 6 200 Ω 100 Ω Not Recommended For New Designs TRF2436 www.ti.com SLWS176C – APRIL 2005 – REVISED MAY 2007 TYPICAL CHARACTERISTICS A Band Detector Output 1000 VDETP−VDETN (mV) 100 10 25C −25C 1 85C 0.1 0 5 10 15 20 25 Pout(dBm) Figure 1. A Band Detector Output B Band Detector Output 1000 VDETP−VDETN (mV) 100 10 25C −25C 1 85C 0.1 −10−5 0 5 10152025 Pout(dBm) Figure 2. B Band Detector Output Submit Documentation Feedback 7 PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TRF2436IRTBR OBSOLETE VQFN RTB 40 TBD Call TI Call TI TRF 2436 TRF2436IRTBRG4 OBSOLETE VQFN RTB 40 TBD Call TI Call TI TRF 2436 TRF2436IRTBT OBSOLETE VQFN RTB 40 TBD Call TI Call TI TRF 2436 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2016 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. 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With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. 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