User's Guide
SLWU088 – October 2014
TRF37x32 EVM
The TRF37x32 EVM board enables measurements of the TRF37x32 family of wideband dual downconvert mixers with integrated intermediate frequency (IF) amplifiers. The device employs integrated
baluns for single-ended radio frequency (RF) and local oscillator (LO) inputs. The IF amplifier operates
from 30 MHz to 500 MHz in an open collector topology to support a variety of IF frequencies and
bandwidths. The TRF37x32 provides excellent mixer spurious performance and offers good isolation
between channels for operation with diverse applications. The low-power mode allows operation at
reduced power dissipation and the fast response power-down feature facilitates operation in TDD
applications. Indicator components are located on the top side of the EVM to easily identify the component
assembled on the board.
Table 1. Device Frequency Ranges
Extended
Primary
Device
MIN
MIN
TYP
MAX
MAX
Unit
TRF37A32
300
700
825
950
1400
MHz
TRF37B32
1200
1700
1950
2200
2700
MHz
TRF37C32
2000
2300
2600
2900
4000
MHz
spacer
1
2
3
Contents
Quickstart Operating Procedures .......................................................................................... 2
EVM Setup.................................................................................................................... 2
2.1
EVM Power Supply ................................................................................................. 2
2.2
EVM Control ......................................................................................................... 3
2.3
Signal Chain Setup ................................................................................................. 4
Physical Description ......................................................................................................... 5
3.1
Schematic ............................................................................................................ 5
3.2
Layout ................................................................................................................ 7
3.3
Stackup............................................................................................................... 9
3.4
Bill of Materials .................................................................................................... 10
List of Figures
1
TRF37x32 EVM Schematic (1 of 3) ....................................................................................... 5
2
FTRF37x32 EVM Schematic (2of 3) ...................................................................................... 6
3
TRF37x32 EVM Schematic (3 of 3) ....................................................................................... 6
4
Top Layer ..................................................................................................................... 7
5
Layer 2, Ground .............................................................................................................. 7
6
Layer 3, Power ............................................................................................................... 8
7
Layer 4, Power ............................................................................................................... 8
8
Layer 5, Ground .............................................................................................................. 9
9
Bottom Layer ................................................................................................................. 9
10
Stackup........................................................................................................................ 9
List of Tables
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1
Quickstart Operating Procedures
1
2
3
4
5
6
7
1
www.ti.com
................................................................................................. 1
Power Supply Configuration Options ...................................................................................... 2
Power Supply Controls and Indicators .................................................................................... 3
Low-Power Mode Controls ................................................................................................. 3
Power-Down Mode Controls ............................................................................................... 3
USB Control Configuration ................................................................................................. 4
Bill of Materials ............................................................................................................. 10
Device Frequency Ranges
Quickstart Operating Procedures
These steps describe the evaluation module setup for basic operation on an EVM with default hardware
configuration:
1. Connect the mini-USB connector. LED D2 draws power through the mini-USB connector and should
light immediately. D1 indicates 5-V power and should also light immediately.
2. Connect an RF source to RFINA on J1. Frequency ranges are given in Table 1.
3. Connect an LO source to LO on J4 with a nominal frequency offset of 200 MHz and a nominal
amplitude of 0 dBm
4. Connect the IFAP output on J9 to a spectrum analyzer
2
EVM Setup
The TRF37x32 EVM enables several supply options allowing easy setup and maximum evaluation
flexibility.
2.1
EVM Power Supply
The TRF37x32 device operates with a 3.3-V supply. The EVM includes a TPS74201IRGW ultra-low noise
LDO so that standard 5-V supply sources may be used to generate 3.3 V. In its default shipping
configuration, the EVM is set to draw power from a USB port. The USB may be used to supply power
without any need for USB communication. A standard 5-V power supply may instead be used as the
supply source through plug J10 or TP8. The most testing flexibility is achieved by directly supplying 3.3 V
from a lab supply. The 3.3-V supply connection also uses an SMA connector for mechanical robustness.
Only one of the three supply options may be used.
Table 2. Power Supply Configuration Options
2
Source
JP4
JP5
J5
J7
J10
5-V USB
pins 1-2, REG
pins 1-2, 5VUSB
USB
do not care
do not care
5-V wall
pins 1-2, REG
pins 2-3, 5VEXT
do not care
do not care
5V
3.3-V lab
pins 2-3, EXT
do not care
do not care
3.3 V
do not care
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EVM Setup
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Table 3. Power Supply Controls and Indicators
Reference
Designator
Label
Function
Selects device 3.3-V VCC from external connector J7 or on-board regulated supply
JP4
EXT, REG
Pins 1-2 = Regulated supply
Pins 2-3 = External connector J7
Selects 5-V supply to be regulated down to 3.3 V
JP5
5VUSB,
5VEXT
J5
USB
Pins 1-2 = 5 V through USB
Pins 2-3 = 5 V through J10 or TP8
J7
J10
5V
TP8
TP8
D1
5V
D2
2.2
Mini-USB input jack
3P3V_EXT External 3.3-V input connector
External 5-V input jack
External 5-V input clip connector
LED indicator for 5 V at input to LDO regulator, either through USB or external input
USB_PWR LED indicator for USB 5 V, prior to JP5
EVM Control
The EVM provides control over all device configurations including low-power mode and channel powerdown control. The boards ship configured for manual control, although they can also be controlled through
the USB port.
2.2.1
Low-Power Mode
Low-power mode reduces power consumption of the TRF37x32 device, trading linearity performance. A
high voltage on LPM activates low-power mode. JP3 provides a manual control point for LPM. Low-power
mode can also be controlled through a testpoint clip or through USB.
Table 4. Low-Power Mode Controls
Reference Designator
Label
JP3
LPM, NORM
or no
label
TP4
LPM
Function
Selects LPM
Pins 1-2 = 0 V = Normal operation
Pins 2-3 = 3.3 V = Low-power mode
No jumper = Normal operation through internal pull-down
2.2.2
Clip point for LPM control
Power-Down Mode
Power-down mode allows individual channels to be disabled completely for minimal supply draw and
interference. A high voltage on PD* activates power-down mode for the selected channel. Power-down
mode can also be controlled through USB.
Table 5. Power-Down Mode Controls
Reference Designator
Label
Function
Selects PDA
JP1
PUp, PDn
Pins 1-2 = 0 V = Normal operation
Pins 2-3 = 3.3 V = Power-down mode
No jumper = Normal operation through internal pull-down
Selects PDB
JP2
PUp, PDn
Pins 1-2 = 0 V = Normal operation
Pins 2-3 = 3.3 V = Power-down mode
No jumper = Normal operation through internal pull-down
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3
EVM Setup
2.2.3
www.ti.com
USB Control
It is possible to use the mini-USB port to control both LPM and PD*. The USB port connects to an FTDI
FT245RL device, which may be used to drive arbitrary digital signals on its output channels. The board is
shipped with the USB ports not connected; 0-Ω shorts must be installed to use USB controls. To avoid
contention between the control driver and header control, control jumpers must be removed. Also, when
both R17 and R18 are installed, independent control of the A and B channels is not possible.
There is no TRF37x32 GUI. Using the static control pins on the TRF37x42 GUI is also an available option.
Table 6. USB Control Configuration
2.3
Control
Channel
Control
Install
Component
Remove
Jumper
D6
PDA
R18
JP1
D6
PDB
R17
JP2
D7
LPM
R16
JP3
Signal Chain Setup
Channel A and B paths are identical. By default, the RFIN paths contain no matching components but do
offer pads.
The IFOUT paths each route two traces of differential pairs to output SMA connectors. The transformer
performs a 4:1 impedance transform to interface between the 200-Ω differential device outputs and singleended 50-Ω lab equipment. The N side of the differential pair is tied to ground. The transformer pads are
compatible with 0402 components so that the user may connect to additional signal chain components.
Insertion loss of the transformer is near 0.5 dB at 200-MHz IF frequencies and this must be considered
when taking high-performance measurements.
The TRF37x32 is a high-performance device and measured performance is extremely dependent on
proper equipment setup. Linearity measurements require excellent signal generator linearity and return
loss. High-performance pads may be required in order to isolate generators that are coupled through
combiners. Spectrum analyzers must be configured to accurately measure low-level tones such as thirdorder intermodulation tones.
4
TRF37x32 EVM
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Physical Description
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3
Physical Description
This section describes the schematic, layout and stackup, and bill of materials (BOM).
3.1
Schematic
Figure 1 through Figure 3 illustrate the EVM schematics.
Figure 1. TRF37x32 EVM Schematic (1 of 3)
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Physical Description
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Figure 2. FTRF37x32 EVM Schematic (2of 3)
Figure 3. TRF37x32 EVM Schematic (3 of 3)
6
TRF37x32 EVM
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Physical Description
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3.2
Layout
Figure 4 through Figure 9 illustrate the printed-circuit board layout views.
Figure 4. Top Layer
Figure 5. Layer 2, Ground
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Physical Description
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Figure 6. Layer 3, Power
8
Figure 7. Layer 4, Power
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Figure 8. Layer 5, Ground
3.3
Figure 9. Bottom Layer
Stackup
Figure 10. Stackup
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Physical Description
3.4
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Bill of Materials
Table 7 lists the BOM for this EVM.
Table 7. Bill of Materials
Qty
Reference
Part
Part Number
Mfr
2
C1, C12
0.1 µF
GRM155R71C104KA88
Murata
10
C2 ,C11, C13, C17, C42, C44, C51,
C57, C62, C64
10 pF
GRM1555C1H100JZ01D
Murata
3
C3, C5, C9
100 pF
GRM1555C1H101JA01D
Murata
DNI
C4, C7, C8, C10, C22, C59
0.01 µF
GRM155R71H103KA88D
Murata
DNI
C6
0.01 µF
GRM155R71E103KA01D
Murata
C14, C43, C50, C58, C61, C63, C65
0.01 µF
GRM155R71H103KA88D
Murata
DNI
C15, C16, C36, C41
2.2 pF
GRM1555C1H2R2CA01D
Murata
DNI
C18, C19, C23, C60
10 pF
GRM1555C1H100JZ01D
Murata
7
1
C20
0.1 µF
GRM155R61A104KA01D
Murata
10
C24, C25, C27, C29, C30, C31, C32,
C33, C38, C39
0.01 µF
GRM155R71E103KA01D
Murata
2
C26, C28
10 pF
04025U100FAT2A
AVX
1
C34
0.1 µF
GRM155R61A104KA01D
Murata
1
C35
47 µF
TPSB476K010R0500
AVX
DNI
C37, C40
0.01 µF
GRM155R71E103KA01D
Murata
1
C45
0.01 µF
GRM155R71E103KA01D
Murata
2
C46, C48
47 pF
04025A470JAT2A
AVX Corp
2
C47, C49
0.1 µF
GRM155R61A104KA01D
Murata
4
C52, C54, C55, C56
10 µF
GRM188R60J106ME47D
Murata
1
C53
1 µF
C2012X5R1E105K
TDK Corp
1
D1
GREEN
LTST-C170KGKT
LITE ON
1
D2
LED BLUE
LTST-C170TBKT
LITE ON
1
FB1
1 kΩ
FBMH4525HM102NT
TAIYO YUDEN
FB2, FB6
1 kΩ
BLM15AG102SN1
Murata
6
FB3, FB4, FB5, FB7, FB8, FB9
1 kΩ
BLM15AG102SN1
Murata
2
JP1, JP2
HEADER
HTSW-103-07-G-S
SAMTEC
1
JP3
HEADER
HMTSW-103-07-G-S-.240
SAMTEC
1
JP4
HEADER
HMTSW-103-07-G-S-.240
SAMTEC
1
JP5
HEADER
HMTSW-103-07-G-S-.240
SAMTEC
8
J1, J2, J3, J4, J6, J7, J8, J9
SMA
142-0701-851
Johnson
1
J5
USB_MINI
MNE20-5G5P10
ACON
1
J10
JACK PWR
RAPC722
Switchcraft
4
L1, L2, L3, L4
560nH
0805CS-561XGL
Coilcraft
1
Q1
FDMA7632
FDMA7632
Fairchild
7
R1, R2, R12, R14, R19, R20, R27
0
ERJ-2GE0R00X
Panasonic
R3, R7, R8, R22, R23
1.5K
ERJ-2RKF1501X
Panasonic
R4
2.6K
ERJ-2RKF2601X
Panasonic
R5, R6, R9, R11, R13, R15, R21
0
ERJ-2GE0R00X
Panasonic
1
R_indicator
0
ERJ-2GE0R00X
Panasonic
1
R10
1.5K
ERJ-2RKF1501X
Panasonic
R16, R17, R18
0
ERJ-2GE0R00X
Panasonic
1
R24
31.6K
ERJ-3EKF3162V
Panasonic
1
R25
10K
ERJ-3EKF1002V
Panasonic
1
R26
10.2K
ERJ-3EKF1022V
Panasonic
DNI
DNI
1
DNI
DNI
10
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Physical Description
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Table 7. Bill of Materials (continued)
Qty
Reference
Part
Part Number
Mfr
1
R28
510
ERJ-2RKF5100X
Panasonic
1
R29
0
ERJ-3GEY0R00V
Panasonic
1
R30
15K
ERJ-2GEJ153X
Panasonic
5
TP1, TP2, TP3, TP4, TP7
RED
5010
Keystone
2
TP5, TP10
BLK
5011
Keystone
1
TP6
BLK
5011
Keystone
1
TP8
RED
5010
Keystone
1
TP9
BLK
5011
Keystone
2
T1, T2
TC4-1T
TC4-1T
Minicircuits
1
U1
TRF3732
TRF37X32
TI
1
U2
FT245RL
FT245RL
FTDI
1
U3
TPS74201
TPS74201RGW
TI
1
U4
TPS2400
TPS2400DBV
TI
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan are NOT certified by
TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
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Products
Applications
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www.ti.com/audio
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www.ti.com/automotive
Amplifiers
amplifier.ti.com
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www.ti.com/communications
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dataconverter.ti.com
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www.ti.com/computers
DLP® Products
www.dlp.com
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Copyright © 2014, Texas Instruments Incorporated