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TRS3221
SLLS814A – JULY 2007 – REVISED JUNE 2015
TRS3221 3-V to 5.5-V RS-232 Line Driver and Receiver
With ±15-kV ESD Protection
1 Features
3 Description
•
The TRS3221 device consists of one line driver, one
line receiver with dedicated enable pin, and a dual
charge-pump circuit with ±15-kV ESD protection pinto-pin (serial-port connection pins, including GND).
The device meets the requirements of TIA/EIA-232-F
and provides the electrical interface between an
asynchronous communication controller and the
serial-port connector. The charge pump and four
small external capacitors allow operation from one
3-V to 5.5-V supply. The TRS3221 device operates at
data signaling rates up to 250 kbps and a maximum
of 30-V/μs driver output slew rate.
1
•
•
•
•
•
•
•
•
•
RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
Meets or Exceeds the Requirements of TIA/EIA232-F and ITU V.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbps
One Driver and One Receiver
Low Standby Current: 1-μA Typical
External Capacitors: 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
Alternative High-Speed Pin-Compatible
Device (1 Mbps)
– SNx5C3221
Automatic Power-Down Feature Automatically
Disables Drivers for Power Savings
Flexible control options for power management are
available when the serial port is inactive. The
automatic power-down feature functions when
FORCEON is low and FORCEOFF is high. During
this mode of operation, if the device does not sense a
valid RS-232 signal on the receiver input, the driver
output is disabled and the supply current is reduced
to 1 μA. The INVALID output notifies the user if an
RS-232 signal is present at the receiver input.
2 Applications
•
•
•
•
Battery-Powered, Hand-Held, and Portable
Equipment
Notebooks, Subnotebooks, and Laptops
Digital Cameras
Mobile Phones and Wireless Devices
Device Information(1)
PART NUMBER
TRS3221
PACKAGE
BODY SIZE (NOM)
SSOP (32)
6.20 mm x 5.30 mm
TSSOP (32)
5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
3.3 V, 5 V
POWER
EN [RX]
FORCEON
APD
FORCEOFF
DIN
1
1
TX
DOUT
RS232
1
ROUT
INVALID
RX
1
RIN
RS232
STATUS
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TRS3221
SLLS814A – JULY 2007 – REVISED JUNE 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
4
4
4
5
5
5
6
6
6
7
7
7
Absolute Maximum Ratings .....................................
ESD Ratings ............................................................
Recommended Operating Conditions ......................
Thermal Information ..................................................
Electrical Characteristics—Power ............................
Electrical Characteristics—Driver .............................
Electrical Characteristics—Receiver ........................
Electrical Characteristics—Status ............................
Switching Characteristics—Driver ............................
Switching Characteristics—Receiver .....................
Switching Characteristics—Status .........................
Typical Characteristics ............................................
Parameter Measurement Information .................. 8
8
Detailed Description ............................................ 11
8.1
8.2
8.3
8.4
9
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
11
11
11
12
Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Application .................................................. 13
10 Power Supply Recommendations ..................... 15
11 Layout................................................................... 15
11.1 Layout Guidelines ................................................. 15
11.2 Layout Example .................................................... 15
12 Device and Documentation Support ................. 16
12.1
12.2
12.3
12.4
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
16
16
16
16
13 Mechanical, Packaging, and Orderable
Information ........................................................... 16
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (July 2007) to Revision A
Page
•
Added Thermal Information table, Typical Characteristics section, Detailed Description section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
•
Changed Typical Operating Circuit and Capacitor Values image ........................................................................................ 13
2
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5 Pin Configuration and Functions
DB or PW Package
16-Pin SSOP or TSSOP
Top View
EN
1
16
C1+
V+
C1C2+
C2VRIN
2
3
15
14
4
13
5
6
12
7
8
10
9
11
FORCEOFF
VCC
GND
DOUT
FORCEON
DIN
INVALID
ROUT
Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
C1+
2
—
C2+
5
—
C1–
4
—
C2–
6
—
DIN
11
I
Driver input
DOUT
13
O
RS-232 driver output
EN
1
I
Low input enables receiver ROUT output. High input sets ROUT to high impedance.
FORCEOFF
16
I
Automatic power-down control input
FORCEON
12
I
Automatic power-down control input
GND
14
GND
INVALID
10
O
Invalid output pin. Output is low when all RIN inputs are unpowered.
RIN
8
I
RS-232 receiver input
Positive terminals of the voltage-doubler charge-pump capacitors
Negative terminals of the voltage-doubler charge-pump capacitors
Ground
ROUT
9
O
Receiver output
VCC
15
—
3-V to 5.5-V supply voltage
V+
3
O
5.5-V supply generated by the charge pump
V–
7
O
–5.5-V supply generated by the charge pump
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
VCC to GND
–0.3
6
V
V+ to GND
–0.3
7
V
V– to GND
0.3
–7
V
13
V
V+ + |V–| (2)
VI
Input voltage
VO
Output voltage
TJ
Junction temperature (3)
Tstg
Storage temperature
(1)
(2)
(3)
DIN, EN, FORCEOFF, and FORCEON to GND
–0.3
6
RIN to GND
V
±25
DOUT to GND
±13.2
ROUT to GND
–0.3
VCC + 0.3
–65
V
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
V+ and V– can have maximum magnitudes of 7 V, but their absolute difference cannot exceed 13 V.
Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6.2 ESD Ratings
VALUE
V(ESD)
Electrostatic discharge
Human-body model (HBM), per
ANSI/ESDA/JEDEC JS-001 (1)
Charged-device model (CDM), per
JEDEC specification JESD22-C101 (2)
(1)
(2)
All pins except Pin 8 and Pin 13
±3000
Pin 8, Pin 13
(RS232 ports)
±15000
All pins
±1500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
(see Figure 9) (1)
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver high-level input voltage
DIN, FORCEOFF,
FORCEON, EN
VIL
Driver low-level input voltage
DIN, FORCEOFF,
FORCEON, EN
Driver input voltage
DIN, FORCEOFF,
FORCEON, EN
VI
VCC = 3.3 V
VCC = 5 V
(1)
4
Operating free-air temperature
NOM
MAX
3
3.3
3.6
4.5
5
5.5
2
TRS3221C
TRS3221I
UNIT
V
V
2.4
0.8
Receiver input voltage
TA
MIN
0
5.5
–25
25
0
70
–40
85
V
V
°C
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
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6.4 Thermal Information
TRS3221
THERMAL METRIC (1)
DB (SSOP)
PW (TSSOP)
16 PINS
16 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
98.0
106.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
48.3
41.1
°C/W
RθJB
Junction-to-board thermal resistance
48.7
51.4
°C/W
ψJT
Junction-to-top characterization parameter
10.1
3.9
°C/W
ψJB
Junction-to-board characterization parameter
48.1
50.9
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics—Power
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
II
Input leakage
current
Supply current
±0.01
±1
µA
0.3
1
mA
Powered off
No load, FORCEOFF at GND
1
10
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded
1
10
No load, FORCEOFF and
FORCEON at VCC
No load,
VCC = 3.3 V to 5 V
Auto-powerdown enabled
(1)
(2)
MAX
MIN
FORCEOFF, FORCEON, EN
Automatic power down
disabled
ICC
TYP (2)
TEST CONDITIONS
UNIT
µA
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6.6 Electrical Characteristics—Driver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
MAX
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = GND
5
5.4
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = VCC
–5
–5.4
IIH
High-level input current
VI = VCC
±0.01
±1
IIL
Low-level input current
VI at GND
±0.01
±1
IOS
Short-circuit output current (3)
rO
Output resistance
Ioff
(1)
(2)
(3)
Output leakage current
V
VCC = 3.6 V
VO = 0 V
±35
±60
VCC = 5.5 V
VO = 0 V
±35
±60
VCC, V+, and V– = 0 V
VO = ±2 V
FORCEOFF = GND
300
UNIT
μA
mA
Ω
10M
VO = ±12 V,
VCC = 3 V to 3.6 V
±25
VO = ±12 V,
VCC = 4.5 V to 5.5 V
±25
µA
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
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6.7 Electrical Characteristics—Receiver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
Ioff
Output leakage current
FORCEOFF = 0 V
ri
Input resistance
VI = ±3 V to ±25 V
(1)
(2)
MIN
TYP (2)
VCC – 0.6
VCC – 0.1
TEST CONDITIONS
MAX
0.4
VCC = 3.3 V
1.5
2.4
VCC = 5 V
1.8
2.4
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.8
1.4
UNIT
V
V
V
0.5
3
±0.05
±10
µA
5
7
kΩ
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6.8 Electrical Characteristics—Status
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VT+(valid)
Receiver input threshold for INVALID
high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT–(valid)
Receiver input threshold for INVALID
high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–2.7
VT(invalid)
Receiver input threshold for INVALID low- FORCEON = GND,
level output voltage
FORCEOFF = VCC
–0.3
VOH
INVALID high-level output voltage
IOH = –1 mA,
FORCEON = GND,
FORCEOFF = VCC
VCC – 0.6
VOL
INVALID low-level output voltage
IOH = –1 mA,
FORCEON = GND,
FORCEOFF = VCC
(1)
(2)
TYP (2)
MIN
MAX
2.7
UNIT
V
V
0.3
V
V
0.4
V
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6.9 Switching Characteristics—Driver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
Maximum data rate
CL = 1000 pF, RL = 3 kΩ,
(see Figure 3)
tsk(p)
Pulse skew (3)
CL = 150 to 2500 pF, RL = 3 kΩ to 7 kΩ,
(see Figure 4)
SR(tr)
Slew rate, transition region
(see Figure 3)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ
(1)
(2)
(3)
6
MIN
TYP (2)
150
250
kbps
100
ns
MAX
CL = 150 to 1000 pF
6
30
CL = 150 to 2500 pF
4
30
UNIT
V/μs
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
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6.10 Switching Characteristics—Receiver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
MAX
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF,
(see Figure 5)
150
ns
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF,
(see Figure 5)
150
ns
ten
Output enable time
CL = 150 pF, RL = 3 kΩ,
(see Figure 6)
200
ns
tdis
Output disable time
CL = 150 pF, RL = 3 kΩ,
(see Figure 6)
200
ns
tsk(p)
Pulse skew (3)
See Figure 5
50
ns
(1)
(2)
(3)
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
6.11 Switching Characteristics—Status
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
MIN
TYP (2)
MAX
UNIT
tvalid
Propagation delay time, low- to high-level output
1
µs
tinvalid
Propagation delay time, high- to low-level output
30
µs
ten
Supply enable time
100
µs
(1)
(2)
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6.12 Typical Characteristics
VCC = 3.3 V
0
6
VOH
VOL
±1
DOUT Voltage (V)
DOUT Voltage (V)
5
4
3
2
1
±2
±3
±4
±5
0
±6
0
5
10
15
20
DOUT Current (mA)
25
0
C001
Figure 1. DOUT VOH vs Load Current
5
10
15
20
DOUT Current (mA)
Product Folder Links: TRS3221
C001
Figure 2. DOUT VOL vs Load Current
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7 Parameter Measurement Information
3V
Input
Generator
(see Note B)
RS-232
Output
50 W
RL
0V
tTHL
CL
(see Note A)
3V
FORCEOFF
tTLH
3V
Output
3V
-3 V
-3 V
TEST CIRCUIT
SR(tr)
VOH
VOL
VOLTAGE WAVEFORMS
6V
tTHL or tTLH
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbps, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 3. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
3V
FORCEOFF
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPLH
tPHL
VOH
50%
Output
50%
VOL
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbps, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 4. Driver Pulse Skew
50 Ω
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 5. Receiver Propagation Delay Times
8
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Parameter Measurement Information (continued)
50 Ω
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
C.
tPLZ and tPHZ are the same as tdis.
D.
tPZL and tPZH are the same as ten.
Figure 6. Receiver Enable and Disable Times
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Parameter Measurement Information (continued)
2.7 V
2.7 V
0V
Receiver
Input
ROUT
Generator
(see Note B)
3V
0V
−2.7 V
−2.7 V
−3 V
50 Ω
tvalid
tinvalid
VCC
Automatic
Power Down
INVALID
CL = 30 pF
(see Note A)
FORCEOFF
FORCEON
DIN
DOUT
INVALID
Output
50% VCC
50% VCC
0V
ten
V+
≈V+
0.3 V
VCC
0V
0.3 V
Supply
Voltages
V−
TEST CIRCUIT
≈V−
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
Indeterminate
0.3 V
0V
If Signal Remains Within This Region
(A)
For More Than 30 µs, INVALID Is Low
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
A.
Automatic Power Down disables drivers and reduces supply current to 1 µA.
B.
CL includes probe abnd jig capacitance.
C.
The pulse generator has the following characteristics: PRR = 5 kbps, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 7. INVALID Propagation Delay Times and Driver Enabling Time
10
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8 Detailed Description
8.1 Overview
The TRS3221 device is a one-driver and one-receiver RS-232 interface device. All RS-232 inputs and outputs
are protected up to ±15 kV using the Human-Body Model. The charge pump requires only four small 0.1-μF
capacitors for operation from a 3.3-V supply. The TRS3221 device is capable of running at data rates up to 250
kbps while maintaining RS-232-compliant output levels.
Automatic power down can be disabled when FORCEON and FORCEOFF are high. With automatic power down
plus enabled, the device activates automatically when a valid signal is applied to any receiver input. The device
can automatically power down the driver to save power when the RIN input is unpowered.
INVALID is high (valid data) if receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been
between –0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid data) if receiver input voltages are
between –0.3 V and 0.3 V for more than 30 μs. Refer to Figure 7 for receiver input levels.
8.2 Functional Block Diagram
3.3 V, 5 V
POWER
EN [RX]
FORCEON
APD
FORCEOFF
DIN
1
1
TX
DOUT
RS232
1
ROUT
INVALID
RX
1
RIN
RS232
STATUS
8.3 Feature Description
8.3.1 Power
The power block increases, inverts, and regulates voltage at V+ and V– pins using a charge pump that requires
four external capacitors. The automatic power-down feature for the driver is controlled by FORCEON and
FORCEOFF inputs. The receiver is controlled by the EN input (see Table 1 and Table 2).
When the TRS3221 device is unpowered, it can be safely connected to an active remote RS232 device.
8.3.2 RS232 Driver
One driver interfaces standard logic level to RS232 levels. DIN input must be valid high or low.
8.3.3 RS232 Receiver
One receiver interfaces RS232 levels to standard logic levels. An open input results in a high output on ROUT.
RIN input includes an internal standard RS232 load. A logic high input on the EN pin shuts down the receiver
output.
8.3.4 RS232 Status
The INVALID output goes low when RIN input is unpowered for more than 30 μs. The INVALID output goes high
when the receiver has a valid input. The INVALID output is active when Vcc is powered regardless of FORCEON
and FORCEOFF inputs (see Table 3).
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8.4 Device Functional Modes
Table 1. Driver (1)
INPUTS
(1)
OUTPUT
DRIVER STATUS
DIN
FORCEON
FORCEOFF
VALID RIN RS-232
LEVEL
X
X
L
X
Z
Powered off
Normal operation with
automatic power down disabled
DOUT
L
H
H
X
H
H
H
H
X
L
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
Normal operation with
automatic power down enabled
Powered off by
automatic power-down feature
H = high level, L = low level, X = irrelevant, Z = high impedance, Yes = |RIN| > 2.7 V, No = |RIN| < 0.3 V
Table 2. Receiver (1)
INPUTS
(1)
OUTPUT
RIN
EN
VALID RIN RS-232
LEVEL
X
H
X
Z
L
L
X
H
H
L
X
L
Open
L
No
H
RECEIVER STATUS
ROUT
Output off
Normal operation
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
Table 3. INVALID (1)
INPUTS
(1)
OUTPUT
RIN
FORCEON
FORCEOFF
EN
INVALID
L
X
X
X
H
H
X
X
X
H
Open
X
X
X
L
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
13
11
DIN
DOUT
16
FORCEOFF
12
Automatic
Power Down
10
INVALID
FORCEON
9
8
RIN
ROUT
1
EN
Figure 8. Logic Diagram
12
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TRS3232 device is designed to convert single-ended signals into RS232-compatible signals, and vice-versa.
This device can be used in any application where an RS232 line driver or receiver is required. One benefit of this
device is its ESD protection, which helps protect other components on the board when the RS232 lines are tied
to a physical connector.
9.2 Typical Application
EN
1
16
2
VCC
C1+
15
+
3
C1
+
−
+
C3
−
4
5
(A)
V+
Automatic
Power Down
GND
C1−
6
RIN
12
C2−
7
11
V−
10
C4
+
CBYPASS = 0.1 µF
DOUT
C2+
C2
−
−
14
13
+
−
FORCEOFF
8
9
FORCEON
DIN
INVALID
ROUT
5 kΩ
A.
C3 can be connected to VCC or GND.
B.
Resistor values shown are nominal.
C.
Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they must
be connected as shown.
D.
See Table 4 for capacitor values.
Figure 9. Typical Operating Circuit
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Typical Application (continued)
9.2.1 Design Requirements
•
•
•
Recommended VCC is 3.3 V or 5 V
– 3 V to 5.5 V is also possible
Maximum recommended bit rate is 250 kbps
Use capacitors as shown in Figure 9 and Table 4
Table 4. VCC versus Capacitor Values
VCC
C1
C2, C3, and C4
3.3 V ± 0.3 V
0.1 µF
0.1 µF
5 V ± 0.5 V
0.047 µF
0.33 µF
3 V to 5.5 V
0.1 µF
0.47 µF
9.2.2 Detailed Design Procedure
For proper operation, add capacitors as shown in Figure 9 and Table 4.
•
•
DIN, FORCEOFF and FORCEON inputs must be connected to valid low or high logic levels
Select capacitor values based on VCC level for best performance
ROUT and DIN connect to UART or general purpose logic lines. FORCEON and FORCEOFF may be connected
general purpose logic lines or tied to ground or VCC. INVALID may be connected to a general purpose logic line
or left unconnected. RIN and DOUT lines connect to a RS232 connector or cable. DIN, FORCEON, and
FORCEOFF inputs must not be left unconnected.
9.2.3 Application Curve
VCC of 3.3 V and 250 kbps alternative bit data stream
6
5
4
Voltage (V)
3
2
1
0
±1
±2
±3
±4
DIN
DOUT to RIN
ROUT
±5
±6
0
1
2
3
4
5
6
7
Time ( s)
8
9
10
C001
Figure 10. 250 kbps Driver to Receiver Loopback Timing Waveform,
VCC= 3.3 V
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10 Power Supply Recommendations
VCC must be between 3 V and 5.5 V. Charge pump capacitors must be chosen using Table 4.
11 Layout
11.1 Layout Guidelines
Keep the external capacitor traces short. This is more important on C1 and C2 nodes, which have the fastest rise
and fall times.
11.2 Layout Example
Ground
C3
1 EN
2 C1+
FORCEOFF 16
VCC 15
VCC
0.1 µF
C1
3 V+
GND 14
4 C1-
DOUT 13
5 C2+
FORCEON 12
6 C2-
DIN 11
Ground
C2
Ground
7 V-
INVALID 10
C4
8 RIN
ROUT 9
Figure 11. Layout Diagram
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12 Device and Documentation Support
12.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16
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PACKAGE OPTION ADDENDUM
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14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TRS3221IPWR
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
RS21I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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