www.ti.com
TRS3222
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
FEATURES
•
•
•
•
•
•
•
•
•
RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbit/s
Two Drivers and Two Receivers
Low Standby Current . . . 1 μA Typical
External Capacitors . . . 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
Alternative High-Speed Pin-Compatible Device
(1 Mbit/s)
– TRSF3222
SLLS815 – JULY 2007
DB, DW, OR PW PACKAGE
(TOP VIEW)
EN
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
ROUT2
1
20
2
3
19
18
4
17
5
16
6
7
15
14
8
9
13
12
10
11
PWRDOWN
VCC
GND
DOUT1
RIN1
ROUT1
NC
DIN1
DIN2
NC
NC − No internal connection
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The TRS3222 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver
output slew rate.
The TRS3222 can be placed in the power-down mode by setting PWRDOWN low, which draws only 1 μA from
the power supply. When the device is powered down, the receivers remain active while the drivers are placed in
the high-impedance state. Also, during power down, the onboard charge pump is disabled; V+ is lowered to VCC,
and V– is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting
EN high.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TRS3222
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS815 – JULY 2007
ORDERING INFORMATION
PACKAGE (1) (2)
TA
SOIC – DW
0°C to 70°C
SSOP – DB
TSSOP – PW
SOIC – DW
–40°C to 85°C
SSOP – DB
TSSOP – PW
(1)
(2)
ORDERABLE PART NUMBER
Tube of 25
TRS3222CDW
Reel of 2000
TRS3222CDWR
Tube of 70
TRS3222CDB
Reel of 2000
TRS3222CDBR
Tube of 70
TRS3222CPW
Reel of 2000
TRS3222CPWR
Tube of 25
TRS3222IDW
SSOP – DB
TRS3222IDWR
Tube of 70
TRS3222IDB
Reel of 2000
TRS3222IDBR
Tube of 70
TRS3222IPW
Reel of 2000
TRS3222IPWR
TRS3222C
RS22C
RS22C
TRS3222I
RS22I
RS22I
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLES
Each Driver (1)
INPUTS
DIN
(1)
PWRDOWN
OUTPUT
DOUT
X
L
Z
L
H
H
H
H
L
H = high level, L = low level, X = irrelevant,
Z = high impedance
Each Receiver (1)
INPUTS
(1)
2
TOP-SIDE MARKING
RIN
EN
OUTPUT
ROUT
L
L
H
H
L
L
X
H
Z
Open
L
H
H = high level, L = low level, X = irrelevant,
Z = high impedance (off), Open = input
disconnected or connected driver off
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TRS3222
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS815 – JULY 2007
LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1
DIN2
PWRDOWN
EN
ROUT1
ROUT2
13
17
12
8
20
DOUT1
DOUT2
Powerdown
1
15
16
10
9
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RIN1
RIN2
3
TRS3222
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS815 – JULY 2007
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range (2)
–0.3
6
V
V+
Positive output supply voltage range (2)
–0.3
7
V
0.3
–7
V
13
V
V–
Negative output supply voltage range
V+ – V–
Supply voltage difference (2)
VI
Input voltage range
VO
Output voltage range
θJA
Package thermal impedance (3) (4)
(2)
Tstg
Storage temperature range
(4)
6
Receivers
–25
25
Receivers
Operating virtual junction temperature
(2)
(3)
–0.3
Drivers
TJ
(1)
Drivers, EN, PWRDOWN
–13.2
13.2
–0.3
VCC + 0.3
DB package
70
DW package
58
PW package
83
–65
UNIT
V
V
°C/W
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
See Figure 5
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver and control high-level input voltage
DIN, EN, PWRDOWN
VIL
Driver and control low-level input voltage
DIN, EN, PWRDOWN
VI
Driver and control input voltage
DIN, EN, PWRDOWN
VI
Receiver input voltage
TA
Operating free-air temperature
(1)
VCC = 3.3 V
VCC = 5 V
TRS222C
TRS222I
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
UNIT
V
2
V
2.4
0.8
V
0
5.5
V
–25
25
V
0
70
–40
85
°C
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
II
ICC
(1)
(2)
4
TEST CONDITIONS
Input leakage current (EN, PWRDOWN)
Supply current
No load, PWRDOWN at VCC
Supply current (powered off)
No load, PWRDOWN at GND
MIN
TYP (2)
MAX
±0.01
±1
μA
0.3
1
mA
1
10
μA
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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UNIT
TRS3222
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS815 – JULY 2007
DRIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = GND
5
5.4
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = VCC
–5
–5.4
IIH
High-level input current
VI = VCC
IIL
Low-level input current
VI at GND
IOS
Short-circuit output current (3)
ro
Output resistance
Ioff
(1)
(2)
(3)
Output leakage current
MAX
V
V
±0.01
±1
μA
±0.01
±1
μA
±35
±60
mA
VCC = 3.6 V,
VO = 0 V
VCC = 5.5 V,
VO = 0 V
VCC, V+, and V– = 0 V,
VO = ±2 V
PWRDOWN = GND,
VCC = 3 V to 3.6 V
VO = ±12 V
±25
PWRDOWN = GND,
VCC = 4.5 V to 5.5 V
VO = ±10 V
±25
300
UNIT
Ω
10 M
μA
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
Maximum data rate
CL = 1000 pF,
One DOUT switching,
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
See Figure 2
SR(tr)
Slew rate, transition region
(see Figure 1)
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
(1)
(2)
(3)
RL = 3 kΩ,
See Figure 1
MIN
TYP (2)
150
250
kbit/s
300
ns
MAX
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
UNIT
V/μs
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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5
TRS3222
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS815 – JULY 2007
RECEIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOH = 1.6 mA
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
1.5
2.4
VCC = 5 V
1.8
2.4
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT– )
Ioff
Output leakage current
EN = VCC
rI
Input resistance
VI = ±3 V to ±25 V
VCC = 3.3 V
0.6
1.2
VCC = 5 V
0.8
1.5
V
V
V
0.3
3
UNIT
V
0.4
VCC = 3.3 V
VIT+
(1)
(2)
MIN
V
±0.05
±10
μA
5
7
kΩ
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
MIN
TYP (2)
MAX
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF, See Figure 3
300
ns
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF, See Figure 3
300
ns
ten
Output enable time
CL = 150 pF, RL = 3 kΩ,
See Figure 4
200
ns
tdis
Output disable time
CL = 150 pF, RL = 3 kΩ,
See Figure 4
200
ns
tsk(p)
Pulse skew (3)
See Figure 3
300
ns
(1)
(2)
(3)
6
TEST CONDITIONS
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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TRS3222
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS815 – JULY 2007
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
RL
1.5 V
0V
CL
(see Note A)
tTHL
3V
PWRDOWN
tTLH
VOH
3V
3V
Output
−3 V
−3 V
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
SR(tr) +
t
THL
6V
or t
TLH
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
PWRDOWN
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
EN
0V
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
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TRS3222
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS815 – JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
GND
S1
3V
Input
1.5 V
RL
3 V or 0 V
0V
tPZH
(S1 at GND)
tPHZ
Output
CL
(see Note A)
EN
S1 at GND)
VOH
Output
50%
0.3 V
Generator
(see Note B)
1.5 V
50 Ω
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
tPZL
(S1 at VCC)
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤10 ns, tf ≤ 10 ns.
Figure 4. Receiver Enable and Disable Times
8
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TRS3222
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS815 – JULY 2007
APPLICATION INFORMATION
1
EN
2
+
C1
−
3
C3†
+
20
Powerdown
VCC
C1+
V+
GND
PWRDOWN
19
18
+ C
BYPASS
− = 0.1 µF
−
4
5
17
C1−
16
C2+
DOUT1
RIN1
+
C2
−
6
7
C4
DOUT2
RIN2
ROUT2
−
15
C2−
14
V−
ROUT1
NC
+
8
13
9
12
10
11
DIN1
DIN2
NC
† C3 can be connected to V
CC or GND.
NOTES: A. Resistor values shown are nominal.
B. NC − No internal connection
C. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
VCC vs CAPACITOR VALUES
VCC
3.3 V " 0.3 V
C1
0.1 µF
C2, C3, and C4
0.1 µF
5 V " 0.5 V
0.047 µF
0.33 µF
3 V to 5.5 V
0.1 µF
0.47 µF
Figure 5. Typical Operating Circuit and Capacitor Values
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TRS3222CDB
ACTIVE
SSOP
DB
20
TBD
Call TI
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Purchase Samples
TRS3222CDBG4
ACTIVE
SSOP
DB
20
TBD
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Purchase Samples
TRS3222CDBR
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TRS3222CDBRG4
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TRS3222CDW
ACTIVE
SOIC
DW
20
TBD
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TRS3222CDWG4
ACTIVE
SOIC
DW
20
TBD
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TRS3222CDWR
ACTIVE
SOIC
DW
20
TBD
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TRS3222CDWRG4
ACTIVE
SOIC
DW
20
TBD
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TRS3222CPW
ACTIVE
TSSOP
PW
20
TBD
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TRS3222CPWG4
ACTIVE
TSSOP
PW
20
TBD
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TRS3222CPWR
ACTIVE
TSSOP
PW
20
TBD
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TRS3222CPWRG4
ACTIVE
TSSOP
PW
20
TBD
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TRS3222IDB
ACTIVE
SSOP
DB
20
TBD
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TRS3222IDBG4
ACTIVE
SSOP
DB
20
TBD
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TRS3222IDBR
ACTIVE
SSOP
DB
20
TBD
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TRS3222IDBRG4
ACTIVE
SSOP
DB
20
TBD
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TRS3222IDW
ACTIVE
SOIC
DW
20
TBD
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TRS3222IDWG4
ACTIVE
SOIC
DW
20
TBD
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TRS3222IDWR
ACTIVE
SOIC
DW
20
TBD
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TRS3222IDWRG4
ACTIVE
SOIC
DW
20
TBD
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TRS3222IPW
ACTIVE
TSSOP
PW
20
TBD
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TRS3222IPWG4
ACTIVE
TSSOP
PW
20
TBD
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TRS3222IPWR
ACTIVE
TSSOP
PW
20
TBD
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TRS3222IPWRG4
ACTIVE
TSSOP
PW
20
TBD
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(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2010
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TRS3222CDBR
Package Package Pins
Type Drawing
SSOP
DB
20
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
8.2
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
7.5
2.5
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TRS3222CDBR
SSOP
DB
20
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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