TRS3386E
SLLS829C – APRIL 2007 – REVISED MARCH 2011
www.ti.com
RS-232 TRANSCEIVER WITH SPLIT SUPPLY PIN FOR LOGIC SIDE
Check for Samples: TRS3386E
FEATURES
APPLICATIONS
•
•
•
•
•
•
1
•
•
•
•
•
•
VL Pin for Compatibility With Mixed-Voltage
Systems Down to 2.5 V on Logic Side
Enhanced ESD Protection on RIN Inputs and
DOUT Outputs
– ±15-kV Human-Body Model
– ±15-kV IEC 61000-4-2, Air-Gap Discharge
– ±8-kV IEC 61000-4-2, Contact Discharge
Low 300-μA Supply Current
Specified 250-kbps Data Rate
1-μA Low-Power Shutdown
Meets EIA/TIA-232 Specifications Down
to 3 V
Designed to be Interchangeable With Industry
Standard '3386 Devices
Hand-Held Equipment
PDAs
Cell Phones
Battery-Powered Equipment
Data Cables
PW OR DW PACKAGE
TOP VIEW
C1+
1
20
PWRDOWN
V+
2
19
VCC
C1−
3
18
GND
C2+
4
17
DOUT1
C2−
5
16
DOUT2
V−
6
15
DOUT3
DIN1
7
14
RIN1
DIN2
8
13
RIN2
DIN3
9
12
VL
10
11
ROUT1
ROUT2
DESCRIPTION/ORDERING INFORMATION
The TRS3386E is a three-driver and two-receiver RS-232 interface device, with split supply pins for mixed-signal
operations. All RS-232 inputs and outputs are protected to ±15 kV using the IEC 61000-4-2 Air-Gap Discharge
method, ±8 kV using the IEC 61000-4-2 Contact Discharge method, and ±15 kV using the Human-Body Model.
The charge pump requires only four small 0.1-μF capacitors for operation from a 3.3-V supply. The TRS3386E is
capable of running at data rates up to 250 kbps, while maintaining RS-232-compliant output levels.
The TRS3386E has a unique VL pin that allows operation in mixed-logic voltage systems. Both driver in (DIN)
and receiver out (ROUT) logic levels are pin programmable through the VL pin. The TRS3386E is available in a
space-saving thin shrink small-outline package (TSSOP).
ORDERING INFORMATION
TA
0°C to 70°C
–40°C to 85°C
(1)
(2)
PACKAGE
(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
TSSOP – PW
TRS3386ECPWR
RV86EC
SOIC – DW
TRS3386ECDWR
TRS3386EC
TSSOP – PW
TRS3386EIPWR
RV86EI
SOIC – DW
TRS3386EIDWR
TRS3386EI
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2011, Texas Instruments Incorporated
TRS3386E
SLLS829C – APRIL 2007 – REVISED MARCH 2011
www.ti.com
Table 1. TRUTH TABLE (SHUTDOWN FUNCTION)
PWRDWN
DRIVER
OUTPUTS
RECEIVER OUTPUTS
CHARGE PUMP
L
High-Z
High-Z
Inactive
H
Active
Active
Active
FUNCTIONAL BLOCK DIAGRAM
DIN1
DIN1
DIN2
PWRDOWN
ROUT1
7
17
8
16
9
15
20
DOUT1
DOUT2
DOUT3
Powerdown
11
14
RIN1
5K
ROUT2
10
13
RIN2
5K
2
Submit Documentation Feedback
Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Link(s): TRS3386E
TRS3386E
SLLS829C – APRIL 2007 – REVISED MARCH 2011
www.ti.com
TERMINAL FUNCTIONS
TERMINAL
NAME
DESCRIPTION
NO.
C1+
1
Positive terminal of the voltage-doubler charge-pump capacitor
V+
2
5.5-V supply generated by the charge pump
C1–
3
Negative terminal of the voltage-doubler charge-pump capacitor
C2+
4
Positive terminal of the inverting charge-pump capacitor
C2–
5
Negative terminal of the inverting charge-pump capacitor
V–
6
–5.5-V supply generated by the charge pump
DIN1
DIN2
DIN3
7
8
9
Driver inputs
ROUT2
ROUT1
10
11
Receiver outputs. Swing between 0 and VL.
VL
12
Logic-level supply. All CMOS inputs and outputs are referenced to this supply.
RIN2
RIN1
13
14
RS-232 receiver inputs
DOUT3
DOUT2
DOUT1
15
16
17
RS-232 driver outputs
GND
18
Ground
VCC
19
3-V to 5.5-V supply voltage
PWRDWN
20
Powerdown input
L = Powerdown
H = Normal operation
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
VCC to GND
–0.3
6
V
VL to GND
–0.3
VCC + 0.3
V
V+ to GND
–0.3
7
V
V– to GND
0.3
–7
V
13
V
V+ + |V–| (2)
VI
Input voltage
VO
Output voltage
DIN, PWRDWN to GND
–0.3
±13.2
DOUT to GND
ROUT
Continuous power dissipation
TJ
Junction temperature
Tstg
Storage temperature range
–0.3
VL + 0.3
V
V
Continuous
TA = 70°C, 20-pin TSSOP
(derate 7 mW/°C above 70°C)
–65
Lead temperature (soldering, 10 s)
(2)
6
±25
RIN to GND
Short-circuit duration DOUT to GND
(1)
MAX UNIT
559
mW
150
°C
150
°C
300
°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
V+ and V– can have maximum magnitudes of 7 V, but their absolute difference cannot exceed 13 V.
Submit Documentation Feedback
Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Link(s): TRS3386E
3
TRS3386E
SLLS829C – APRIL 2007 – REVISED MARCH 2011
www.ti.com
Recommended Operating Conditions
MIN
MAX
VCC
Supply voltage
3
5.5
V
VL
Supply voltage
2.25
VCC
V
Input logic threshold low
DIN, PWRDWN
Input logic threshold high
DIN, PWRDWN
VL = 3 V or 5.5 V
0.8
VL = 2.3 V
0.6
VL = 5.5 V
2.4
VL = 3 V
2.0
VL = 2.7 V
1.4
TRS3386ECPWR
Operating temperature
TRS3386EIPWR
Receiver input voltage
UNIT
V
V
0
70
–40
85
–25
25
°C
V
Electrical Characteristics
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 μF (tested at 3.3 V ± 10%), C1 = 0.047 μF,
C2–C4 = 0.33 μF (tested at 5 V ± 10%) (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
1
10
μA
0.3
1
mA
UNIT
DC Characteristics (VCC = 3.3 V or 5 V, TA = 25°C)
Powerdown supply current
PWRDWN = GND, All inputs at VCC or GND
Supply current
PWRDWN = VCC, No load
(1)
Typical values are at VCC = VL = 3.3 V, TA = 25°C.
ESD Protection
PARAMETER
RIN, DOUT
4
TEST CONDITIONS
TYP
Human-Body Model
±15
IEC 61000-4-2 Air-Gap Discharge
±15
IEC 61000-4-2 Contact Discharge
±8
Submit Documentation Feedback
UNIT
kV
Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Link(s): TRS3386E
TRS3386E
SLLS829C – APRIL 2007 – REVISED MARCH 2011
www.ti.com
RECEIVER SECTION
Electrical Characteristics
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 μF (tested at 3.3 V ± 10%), C1 = 0.047 μF,
C2–C4 = 0.33 μF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Ioff
Output leakage current
ROUT, receivers disabled
VOL
Output voltage low
IOUT = 1.6 mA
VOH
Output voltage high
IOUT = –1 mA
VIT–
Input threshold low
TA = 25°C
VIT+
Input threshold high
TA = 25°C
Vhys
Input hysteresis
Input resistance
(1)
MIN
TYP (1)
MAX
UNIT
±0.05
±10
μA
0.4
V
VL – 0.6
VL – 0.1
VL = 5 V
0.8
1.2
VL = 3.3 V
0.6
1.5
V
V
VL = 5 V
1.8
2.4
VL = 3.3 V
1.5
2.4
0.5
TA = 25°C
3
5
V
V
7
kΩ
Typical values are at VCC = VL = 3.3 V, TA = 25°C
Switching Characteristics
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 μF (tested at 3.3 V ± 10%), C1 = 0.047 μF,
C2–C4 = 0.33 μF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
tPHL
Receiver propagation delay
tPLH
TEST CONDITIONS
Receiver input to receiver output, CL = 150 pF
TYP (1)
0.15
0.15
UNIT
μs
tPHL – tPLH
Receiver skew
50
ns
ten
Receiver output enable time
From PWRDWN
200
ns
tdis
Receiver output disable time
From PWRDWN
200
ns
(1)
Typical values are at VCC = VL = 3.3 V, TA = 25°C.
Submit Documentation Feedback
Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Link(s): TRS3386E
5
TRS3386E
SLLS829C – APRIL 2007 – REVISED MARCH 2011
www.ti.com
DRIVER SECTION
Electrical Characteristics
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 μF (tested at 3.3 V ± 10%), C1 = 0.047 μF,
C2–C4 = 0.33 μF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
±5
±5.4
V
300
10M
Ω
MAX
UNIT
VOH
Output voltage swing
All driver outputs loaded with 3 kΩ to ground
rO
Output resistance
VCC = V+ = V– = 0, Driver output = ±2 V
IOS
Output short-circuit current
VT_OUT = 0
±60
mA
Output leakage current
VT_OUT = ±12 V, Driver disabled,
VCC = 0 or 3 V to 5.5 V
±25
μA
0.5
V
±1
μA
IOZ
Driver input hysteresis
Input leakage current
(1)
±0.01
DIN, PWRDWN
Typical values are at VCC = VL = 3.3 V, TA = 25°C
Timing Requirements
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 μF (tested at 3.3 V ± 10%), C1 = 0.047 μF,
C2–C4 = 0.33 μF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
|tPHL – tPLH|
Maximum data rate
RL = 3 kΩ, CL = 1000 pF, One driver switching
Time-to-exit powerdown
|VT_OUT| > 3.7 V
VCC = 3.3 V,
TA = 25°C,
RL = 3 kΩ to 7 kΩ,
Measured from 3 V
to –3 V or –3 V to 3 V
TYP (1)
MAX
250
Driver skew (2)
Transition-region
slew rate
(1)
(2)
MIN
UNIT
kbps
100
μs
100
ns
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
V/μs
Typical values are at VCC = VL = 3.3 V, TA = 25°C.
Driver skew is measured at the driver zero crosspoint.
ESD Protection
PARAMETER
RIN, DOUT
6
TEST CONDITIONS
TYP
Human-Body Model
±15
IEC 61000-4-2 Air-Gap Discharge
±15
IEC 61000-4-2 Contact Discharge
±8
Submit Documentation Feedback
UNIT
kV
Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Link(s): TRS3386E
TRS3386E
SLLS829C – APRIL 2007 – REVISED MARCH 2011
www.ti.com
APPLICATION INFORMATION
3.3 V
20
CBYPASS
C1
0.1mF
C2
0.1mF
TTL/CMOS
Inputs
19
12
PWRDWN V CC
1 C1+
3
VL
V+
2
C3
0.1µF
C1−
4 C2+
5
C2−
V−
6
7 DIN1
DOUT1 17
DIN2
DOUT2 16
DIN3
DOUT3 15
C4
0.1 µF
VL
RIN1 14
11 ROUT1
5kΩ
TTL/CMOS
Outputs
VL
10 ROUT2
RIN2 13
5kΩ
GND
18
Submit Documentation Feedback
Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Link(s): TRS3386E
7
TRS3386E
SLLS829C – APRIL 2007 – REVISED MARCH 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
RL
1.5 V
0V
CL
(see Note A)
tTHL
3V
PWRDWN
tTLH
VOH
3V
3V
Output
−3 V
−3 V
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
SR(tr) +
t
THL
6V
or t
TLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle,
tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
PWRDWN
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
PWRDWN
3V
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
8
Submit Documentation Feedback
Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Link(s): TRS3386E
TRS3386E
SLLS829C – APRIL 2007 – REVISED MARCH 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION (Continued)
VCC
GND
S1
RL
3 V or 0 V
Output
CL
(see Note A)
PWRDWN
3V
Input
1.5 V
0V
tPZH
(S1 at GND)
tPHZ
S1 at GND)
VOH
Output
50%
0.3 V
Generator
(see Note B)
1.5 V
50 Ω
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
tPZL
(S1 at VCC)
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 4. Receiver Enable and Disable Times
Submit Documentation Feedback
Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Link(s): TRS3386E
9
TRS3386E
SLLS829C – APRIL 2007 – REVISED MARCH 2011
www.ti.com
REVISION HISTORY
Changes from Revision B (April 2009) to Revision C
Page
•
Changed VL Pin for Compatibility With Mixed-Voltage Systems Down to 2.5 V (originally 1.8 V) on the Logic Side. ......... 1
•
Changed VL Supply MIN value from 1.65 V to 2.25 V. ......................................................................................................... 4
•
Deleted VL = 1.65V parameter from Input logic threshold low. ............................................................................................. 4
•
Deleted VL = 1.95V parameter from Input logic threshold high. ........................................................................................... 4
10
Submit Documentation Feedback
Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Link(s): TRS3386E
PACKAGE OPTION ADDENDUM
www.ti.com
29-Aug-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TRS3386ECDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TRS3386EC
TRS3386ECDWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TRS3386EC
TRS3386ECPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
RV86EC
TRS3386ECPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
RV86EC
TRS3386ECPWRG4
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
RV86EC
TRS3386EIDW
ACTIVE
SOIC
DW
20
TBD
Call TI
Call TI
-40 to 85
TRS3386EI
TRS3386EIDWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TRS3386EI
TRS3386EIPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
RV86EI
TRS3386EIPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
RV86EI
TRS3386EIPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
RV86EI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
29-Aug-2015
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TRS3386ECDWR
SOIC
TRS3386ECPWR
TRS3386EIDWR
TRS3386EIPWR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.0
2.7
12.0
24.0
Q1
DW
20
2000
330.0
24.4
10.8
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TRS3386ECDWR
SOIC
DW
20
2000
367.0
367.0
45.0
TRS3386ECPWR
TSSOP
PW
20
2000
367.0
367.0
38.0
TRS3386EIDWR
SOIC
DW
20
2000
367.0
367.0
45.0
TRS3386EIPWR
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
