0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
TUSB320EVM

TUSB320EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    EVAL MODULE TUSB320

  • 数据手册
  • 价格&库存
TUSB320EVM 数据手册
User's Guide SLLU222B – June 2015 – Revised October 2015 TUSB320 Evaluation Module This document describes how to use TUSB320 evaluation module (EVM). 1 2 3 4 Contents What is the TUSB320 EVM? ............................................................................................... TUSB320 EVM Features ................................................................................................... 2.1 Power ................................................................................................................. 2.2 VBUS ................................................................................................................. 2.3 DIP Switch Setting .................................................................................................. 2.4 I2C .................................................................................................................... 2.5 LEDs .................................................................................................................. TUSB320 EVM Configuration Examples ................................................................................. 3.1 UFP Operation ...................................................................................................... 3.2 DFP Operation ...................................................................................................... 3.3 DRP Operation ...................................................................................................... Schematics ................................................................................................................... 2 3 3 3 4 4 4 5 5 6 7 9 List of Figures 1 Example Configuration Using HD3SS2522 and TUSB320 EVMs..................................................... 5 2 Example Configuration Using Two TUSB320 EVMs .................................................................... 6 3 Example Configuration Using HD3SS2522 and TUSB320 EVMs..................................................... 7 4 Example Configuration Using Two TUSB320 EVMs .................................................................... 8 5 TUSB320 EVM Schematic.................................................................................................. 9 6 TUSB320 EVM Components ............................................................................................. 10 7 TUSB321 EVM Power ..................................................................................................... 11 List of Tables ........................................................................................... 1 DIP Switch Modes of Operation 2 LEDs Debug Descriptions .................................................................................................. 4 3 TUSB320 UFP DIP Switch SW1 Settings ................................................................................ 5 4 TUSB320 DFP EVM DIP Switch SW1 Configuration ................................................................... 6 5 TUSB320 DRP EVM DIP Switch SW1 .................................................................................... 7 6 TUSB320 DRP DIP Switch SW1 Configuration ......................................................................... SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback TUSB320 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 4 8 1 What is the TUSB320 EVM? 1 www.ti.com What is the TUSB320 EVM? The TUSB320 EVM is designed to evaluate TUSB320 devices. The EVM can be configured to operate in DFP, UFP, or DRP mode via DIP switch selection and/or I2C control. All of the control inputs are also selectable via DIP switch configuration. The TUSB320 devices can be used with legacy USB systems or Type-C systems for evaluation purposes. 2 TUSB320 Evaluation Module SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TUSB320 EVM Features www.ti.com 2 TUSB320 EVM Features The EVM can be configured to be used for the evaluation of DFP, UFP, or DRP Type-C implementation. The EVM can also be configured to operate in I2C or GPIO mode. Default configuration is I2C. This section describes features provided by the EVM to enable users to evaluate Type-C implementations in different modes of operation. 2.1 Power The EVM can be powered by USB VBUS or 5-V to 5.5-V DC IN through a power jack J5 (2 mm positive tip, 6.5 mm negative outer shield). The VBUS can be provided via a legacy connection or Type-C connection. When the EVM operates in DFP mode, the VBUS is provided through micro-AB connector J6, if the board is connected to a USB host or VBUS source. When the EVM operates in UFP mode, the VBUS is provided through Type-C connector J1, if the board is connected to a USB host or VBUS source through a Type-C cable. The 5-V DC IN (J5) can also be used to supply power if a stand-alone operation is desired without connecting to a USB VBUS power source. If D9 is installed on the board, do not connect the EVM to a USB Host system through the micro-AB USB2 connector(J6) at the same time 5 V is supplied through 5-V DC IN J5 or Type-C Connector J7. Due to diode/IR drop in the test setup, the VBUS on the connector may be below the desired level. The board is designed to take up to 5.5 V through DC_5V IN or TP5(PWRIN) header for test purposes. Test loops and headers to power rails and GND are provided for test purposes. Some power rails can be isolated from the main power supply by removing ferrite beads or passive components. Refer to the schematics for power rail connection details. Do not supply external power through the test headers/loops unless the power rail has been isolated from other power sources. In normal operation, power must be provided through the USB connectors or DC power barrel only: J7, J6, or J5. 2.2 2.2.1 VBUS VBUSOff time To meet the VBUSOff time of 650 ms, remove the 10-µF capacitor C1 . Current limiting can be reduced to 3 A–3.5 A by changing the R30 value to 47 kΩ. 2.2.2 VBUS Min Level VBUS, provided on J1 or J6 may be lower than 4.75 V. For bus-powered devices to be attached to the EVM for test purposes, TI recommends using a 5.5-V external power supply through J5 or TP5. SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback TUSB320 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 3 TUSB320 EVM Features 2.3 www.ti.com DIP Switch Setting The DIP switch (SW1) is provided to configured the EVM in different modes of operation. Table 1. DIP Switch Modes of Operation Reference Designator SW Control Function Default Switch Setting Description SW1.1 EN# ON EN_N= High, if SW1.1 = OFF EN_N = Low, if SW1.1 = ON SW1.2 OUT2 OFF OUT2 = SCL with a pullup, if SW1.2 = OFF OUT2 connected to LED, if SW1.2 = ON SW1.3 OUT1 OFF OUT1 = SDA with a pullup, if SW1.2 = OFF OUT2 connected to LED, if SW1.2 = ON SW1.4 ADDR OFF For I2C mode of operation: ADDR = High, if SW1.4 = OFF ADDR = Low, if SW1.4 = ON For GPIO mode of operation: Remove R12 and SW1.4 = OFF 2.4 SW1.5 INT OFF INT = High, if SW1.5 = OFF INT = OUT3, if SW1.5 = ON SW1.6 320_VBUS OFF 320_VBUS = high/low or open if option resistors are populated. Don’t care in normal operation. SW1.7 PORT_H OFF PORT = Open, if SW1.7 = OFF PORT = High, if SW1.7 = ON SW1.8 PORT_L ON PORT = Open, if SW1.8 = OFF PORT = Low, if SW1.8 = ON I2C The I2C bus can be accessed through a header: J1 or J2. 4.7-kΩ pullups to 3.3 V are added on I2C SCL and SDA. The ADDR pin can be pulled high or low through DIP SW configuration described in Section 2.3, DIP Switch Setting. The ADDR pin determines the last bit of the TUSB320 I2C address to be high or low. J1 is intended to match the Aardvark I2C programmer dongle pinout 2.5 LEDs Several LEDs are provided for easier debug purposes. Table 2. LEDs Debug Descriptions Reference Designator LED Name Description D1 OUT1 Valid only in GPIO mode. Illuminates if OUT1 pin driven low. D2 OUT2 Valid only in GPIO mode. Illuminates if OUT2 pin driven low. D3 OUT3 Valid only in GPIO mode. Illuminates if OUT3 pin driven low. D4 320 ID Illuminates if the ID pin of TUSB320 is driven low. D10 POWER Illuminates if 5-V power is available. Note that the OUT1, OUT2, OUT3 LEDs are used in GPIO mode of operation. The DIP SW must be configured accordingly to configure TUSB320 EVM in GPIO mode of operation. The LED may light up dim even when OUT pins are not driven due to a pullup to 3.3 V. 4 TUSB320 Evaluation Module SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TUSB320 EVM Configuration Examples www.ti.com 3 TUSB320 EVM Configuration Examples This section provides different configuration examples of the TUSB320 EVM: DRP, DFP or UFP operation. The PORT pins and the I2C must be programmed for the corresponding mode of operation. No external 5V DC IN is needed unless the board is to operate standalone without any connections to the USB upstream or downstream port. 3.1 UFP Operation The board can be configured to operate in UFP mode using the PORT pin on the board or I2C register setting. If the PORT pin is to be used, SW1.8 must be switched ON and the Mode_Select bits at addr0x0A bit 5:4 must be set to 00b. The Mode_Select is 00b by default so there is no need to re-program unless it has been reconfigured for other modes of operation. Configured as DRP Type C HD3SS2522 EVM Micro USB USB Host Type C Type-A to micro-B Cable Micro USB Figure 1 describes an example configuration using HD3SS2522 and TUSB320 EVMs. The HD3SS2522 is a TI’s DFP CC controller compliant to USB Type-C spec v1.1. TUSB320 EVM Configured as UFP Micro AB to Type-A Receptacle USB Hub/Device Figure 1. Example Configuration Using HD3SS2522 and TUSB320 EVMs 1. TUSB320 UFP: Configure the DIP switches as shown in Table 3. Table 3. TUSB320 UFP DIP Switch SW1 Settings Reference Designator SW Control Function Switch Setting SW1.1 EN# ON SW1.2 OUT2 OFF SW1.3 OUT1 OFF SW1.4 ADDR OFF SW1.5 INT OFF SW1.6 320_VBUS Don’t care SW1.7 PORT_H OFF SW1.8 PORT_L ON 2. Connect the HD3SS2522 EVM to a USB host. 3. Connect TUSB320 to the HD3SS2522 using a Type-C Cable. VBUS should be provided over the Type-C cable connection. LED D10 should illuminate on the TUSB320 board. D3 and D4 should illuminate on the HD3S2522 indicating an UFP connection. Please refer to the HD3SS2522 users manual (SLLU215) for the details of the HD3SS2522 EVM operation. 4. USB devices plugged into the Micro AB USB receptacle(J6) of the TUSB320 UFP EVM should enumerate at USB2 speed: HS, FS, or LS. SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback TUSB320 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 5 TUSB320 EVM Configuration Examples 3.2 www.ti.com DFP Operation The board can be configured to operate in DFP mode using the PORT pin on the board or I2C register setting. If the PORT pin is to be used, the SW1.7 must be switched ON and the Mode_Select bits at addr0x0A bit 5:4 must be set to 00b. The Mode_Select is 00b by default, so there is no need to reprogram unless it has been reconfigured for other modes of operation. Type C TUSB320 EVM Configured as DFP TUSB320 EVM Configured as UFP Micro USB USB Host Type C Type-A to micro-B Cable Micro USB Figure 2 describes an example configuration using two TUSB320 EVMs: one configured as DFP, the other configured as UFP. Refer to Section 3.1 for TUSB320 UFP EVM configuration. Micro AB to Type A Receptacle USB Hub/Device Figure 2. Example Configuration Using Two TUSB320 EVMs 1. Configure TUSB320 DFP EVM DIP switch SW1 as shown in Table 4. Table 4. TUSB320 DFP EVM DIP Switch SW1 Configuration Reference Designator SW Control Function Switch Setting SW1.1 EN# ON SW1.2 OUT2 OFF SW1.3 OUT1 OFF SW1.4 ADDR OFF SW1.5 INT OFF SW1.6 320_VBUS Don’t care SW1.7 PORT_H ON SW1.8 PORT_L OFF 2. Connect TUSB320 DFP EVM to a legacy USB host using a Type-A to micro-B cable via micro-AB connector (J5) provided on board. The LED D10 should illuminate by the VBUS provided by the legacy USB host over the Type-A to micro-B cable connection. 3. Connect TUSB320 UFP EVM to the TUSB320 DFP EVM using a Type-C Cable. The TUSB320 UFP EVM should be powered by VBUS provided over the Type-C cable connection. The LED D10 on the TUSB320 UFP EVM should also light up. Upon the Type-C cable, attach to the TUSB320 DFP EVM, D4 should light up indicating the ID pin has been driven low from the TUSB320. 4. USB device plugged into the micro-AB USB receptacle(J6) of the TUSB320 UFP EVM should enumerate at USB2 speed: HS, FS, or LS. 6 TUSB320 Evaluation Module SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TUSB320 EVM Configuration Examples www.ti.com 3.3 DRP Operation The board can be configured to operate in DFP mode using the PORT pin on the board or I2C register setting. If PORT pin is to be used, the SW1.7 must be switched ON and the Mode_Select bits at addr0x0A bit 5:4 must be set to 00b. The Mode_Select is 00b by default, so there is no need to reprogram unless it has been reconfigured for other modes of operation. It is important that both SW settings are in the OFF position to have the PORT input to the TUSB320 open. Type C Micro USB TUSB320 EVM Configured as DRP TUSB320 EVM Type C USB Host Type-A to Micro-B Cable Micro USB Figure 3 illustrates an example configuration using HD3SS2522 and TUSB320 EVMs. The HD3SS2522 is TI’s DFP CC controller, compliant to USB Type-C spec v1.1. Configured as UFP Micro AB to Type-A Receptacle USB Hub/Device Figure 3. Example Configuration Using HD3SS2522 and TUSB320 EVMs 1. Configure the TUSB320 DRP EVM DIP switch SW1 as shown in Table 5. Table 5. TUSB320 DRP EVM DIP Switch SW1 Reference Designator SW Control Function Switch Setting SW1.1 EN# ON SW1.2 OUT2 OFF SW1.3 OUT1 OFF SW1.4 ADDR OFF SW1.5 INT OFF SW1.6 320_VBUS Don’t care SW1.7 PORT_H OFF SW1.8 PORT_L OFF 2. Connect the HD3SS2522 EVM to a USB host. 3. Connect the TUSB320 to the HD3SS2522 using a Type-C cable. VBUS should be provided over the Type-C cable connection. LED D10 should light up on the TUSB320 board. D3 and D4 should light up on the HD3S2522 indicating an UFP connection. Please refer to HD3SS2522 users manual (SLLU215) for details on the HD3SS2522 EVM operation. 4. USB devices plugged into the micro-AB USB receptacle(J6) of the TUSB320 UFP EVM should enumerate at USB2 speed: HS, FS, or LS. SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback TUSB320 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 7 TUSB320 EVM Configuration Examples www.ti.com Type C TUSB320 EVM Configured as DRP TUSB320 EVM Configured as UFP Micro USB USB Host Type C Type-A to micro-B Cable Micro USB Figure 4 describes an example configuration using two TUSB320 EVMs: one configured as DRP, the other configured as UFP. Refer to Section 3.1 for TUSB320 UFP EVM configuration. Micro AB to Type-A Receptacle USB Hub/Device Figure 4. Example Configuration Using Two TUSB320 EVMs 1. Configure the TUSB320 DRP DIP switch SW1 as shown in Table 6. Table 6. TUSB320 DRP DIP Switch SW1 Configuration Reference Designator SW Control Function Switch Setting SW1.1 EN# ON SW1.2 OUT2 OFF SW1.3 OUT1 OFF SW1.4 ADDR OFF SW1.5 INT OFF SW1.6 320_VBUS Don’t care SW1.7 PORT_H OFF SW1.8 PORT_L OFF 2. Connect the TUSB320 DRP EVM to a legacy USB host using a Type-A to micro-B cable via micro-AB connector (J5) provided on the board. The LED D1, D2, and D3 should be lit up by the VBUS provided by the legacy USB host over the Type-A to micro-B cable connection. 3. Connect the TUSB320 UFP EVM to the TUSB320 DFP EVM using a Type-C cable. The TUSB320 UFP EVM should be powered by VBUS provided over the Type-C cable connection. The LED D10 on the TUSB320 UFP EVM should also light up. Upon the Type-C cable attach to the TUSB320 DFP EVM, D4 should light up indicating the ID pin has been driven low from the TUSB320. 4. The USB device plugged into the micro-AB USB receptacle (J6) of the TUSB320 UFP EVM should enumerate at USB2 speed: HS, FS, or LS. NOTE: Two TUSB320 EVMs can be used for DRP to DRP connection. In this configuration, it is not recommended to connect the EVM to legacy USB systems as the role cannot be predicted until both sides enters the attach state. This configuration can be used for evaluation purposes with 5 V provided via DC IN (J5) on both boards. 8 TUSB320 Evaluation Module SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Schematics www.ti.com 4 Schematics Figure 5, Figure 6, and Figure 7 illustrate the TUSB320 EVM revision B schematics. DC_IN DC IN PWR_IN TypeC_VBUS uAB_VBUS VBUS SW TPS25910 VDD_320 CC1 Type C Receptacle CC1 CC2 CC2 VBUS Vdd ID TUSB320 EN# ADDR PORT Test Header/ Switch micro AB Receptacle OUT[1,2,3] D+ D- PWR_IN VDD_320 4.5V-5.5V TPS63020 Figure 5. TUSB320 EVM Schematic SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback TUSB320 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 9 Schematics www.ti.com I2C Test Header SilkScreen: SCL_OUT2 SDA_OUT1 1 GND 0.1" Test Post TP2 1 GND I2C J1 SILKSCREEN TP1 VDD_320 1 3 5 7 9 SilkScreen: 2 4 6 8 10 TestPoint TypeC_VBUS J2 SilkScreen: R1 NC SILKSCREEN R2 NC R3 NC SDA_OUT1 SCL_OUT2 320_ID CC1 CC2 INT_OUT3 EN# SDA/OUT1 SCL/OUT2 32xID CC1 CC2 INT/OUT3 EN_DIR Header 5x2 0.1" thru-hole 0.1" Test Post SilkScreen: 2 4 6 8 10 12 14 1 3 5 7 9 11 13 VBUS detection option for EN GND 1 EN# D12 2 R182 1M +/-1% NC, RB751V-40 R4 NC HEADER 7X2 0.1" thru-hole Type C Connector TP7 TypeC_VBUS TP8 microAB_ID 1 1 0.1" Test Post A2 SSTXN1 SSTXN2 A3 B10 A4 B9 VBUS CC1 A5 B11 B8 SSRXP1 SSRXP2 B7 DN2 A7 B6 DP2 SBU1 A8 B5 CC2 A9 B4 VBUS SSRXN2 SSRXN1 A10 B3 SSTXN2 SSTXN1 SSRXP2 SSRXP1 A11 B2 SSTXP2 SSTXP1 B1 DP2 DN2 SBU2 A6 A12 DN1 DP1 VBUS DN1 GND SBU1 SBU2 SSRXN1 SSRXN1 DP1 VBUS CC1 CC2 SSTXP1 SSTXN1 SSRXP2 SSRXN2 SSTXP2 SSTXN2 G6 G5 G4 G3 G2 G1 SSRXP1 Shield6 SSRXN1 Shield5 Shield4 GND0 Shield3 GND1 Shield2 GND2 Shield1 GND3 A5 B5 A8 B8 A7 A6 C1 NC, 10uF TUSB32x CC1 CC2 CSBU1 CSBU2 USB2_N0 USB2_P0 B6 B7 A2 A3 SilkScreen: CSBU1 NOTE: Place LP1, LP2, LP3, LP4 and LP5 5mm away from U1 socket outline STUB on DP or DN no greater than 3.5mm TP3 LP6 1 SilkScreen: VDD CSBU1 R178 NC 15-mil TEST PAD TP4 A11 A10 1 VDD_320 SilkScreen: VDD32x LP1 LP2 SilkScreen: GND TypeC_VBUS FB1 CSBU2 C2 B11 B10 10uF SilkScreen: CC1 15-mil TEST PAD SilkScreen: CSBU2 LP3 LP4 SilkScreen: CC2 A1 A12 B1 B12 CC1 CC2 Test Purposes Only USB_TypeC_Receptacle_Topmount C14 NC, 10uF R35 R36 0 0 C15 NC, 10uF GND CC1_R CC2_R 1 2 ADDR 5 SDA_OUT1 SCL_OUT2 7 8 INT_OUT3 6 0.1uF J6 Max Value 220uF U1 R177 NC micAB_VBUS C11 220 @ 100MHZ B2 B3 microAB Receptacle VDD320_LP 12 SSTXP1 SSTXP2 GND CC1 CC2 VBUS ADDR EN# PORT SDA/OUT1 SCL/OUT2 INT#/OUT3 TUSB320 SilkScreen: 32xVBUS LP5 VDD B12 A4 A9 B4 B9 ID 320_ID 320_VBUS 4 R6 R181 - DNI for TUSB321 11 3 EN# R181 0 EN#_SW PORT 1 USB2_N0 2 USB2_P0 3 NC, 0microAB_ID 4 5 1M +/-1% C12 VBUS DD+ ID GND Shield1 Shield2 Shield3 Shield4 Shield5 Shield6 6 7 8 9 10 11 USB2_micAB_Recept 9 320_ID pg3 LEDs DIP Switches VDD_3P3V SilkScreen: R5 NC, 1nF GND A1 VBUS1 VBUS2 VBUS3 VBUS4 10 TypeC Connector Pin Mapping GND 0.1" Test Post J7 VDD_320 OUT1 VDD_320 NOTE: ALL DIFF PAIRS ARE ROUTED 85 TO 90 OHMS DIFFERENTIAL AND 50 OHMS COMMON MODE. ALL OTHER TRACES ARE 50 OHM. TUSB320 Default D1 R8 500R OUT1_RED OUT1 R179 R9 NC, 100K 200K LED Red 0805 R11 4.7K R13 4.7K R12 100K R10 100K SilkScreen: OUT2 VDD_320 EN#_SW R37 SCL_OUT2 NC, 1M +/-1% SDA_OUT1 D2 Recommended for ESD protection. Not included in REVA version of the EVM R16 500R OUT2_RED OUT2 LED Red 0805 USB2_P0 USB2_N0 1 2 3 4 5 D1+ NC10 D1NC9 GND GND1 D2+ NC7 D2NC6 10 9 8 7 6 CC1 CC2 SilkScreen: VDD_320 OUT3 500R OUT3_RED SilkScreen: EN# OUT3 OUT1 OUT2 ADDR 32xVBUS PORTH PORTL EN#_PD OUT2 OUT1 GPIO_MD OUT3 320_VBUS PORT R17 1K R20 4.7K D3 R21 1 2 3 4 5 6 7 8 R38 NC, 100K USB2_P0 USB2_N0 TPD4E05U06 16 15 14 13 12 11 10 9 ADDR INT_OUT3 320_VBUS_L PORT_H PORT_L U9 CC1 CC2 R14 100K SW1 8-POS 50-MIL SMT C&K (ITT-CANNON) TDA08H0SK1R VDD_320 R18 1K R176 NC ADDR=L: DNI R10, Install R176 ADDR=H: Install R10, DNI R176 OUT3 LED Red 0805 SilkScreen: 32xID VDD_320 D4 R23 500R ID_RED 320_ID_D R40 0 320_ID LED Red 0805 Figure 6. TUSB320 EVM Components 10 TUSB320 Evaluation Module SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Schematics www.ti.com micAB_VBUS SilkScreen: PWR_IN uABVBUS_IN micAB_VBUS_IN 2 R24 0R 3A PWR_IN PWR_IN VDD_320 TypeC_VBUS R25 NC, 10K R26 200K 1 J9 R175 330 0402 5% D11 RB751V-40 R27 10K DNI J9 D10 LED Green 0805 25910EN# 25910FLT# R39 0 2 1 320_ID R180 0 D6 SMAJ20A EN# FLT# OUT1 OUT2 OUT3 GND1 GND2 GND3 17 R29 1M R28 NC, 10K 16 15 10 11 12 14 13 9 Q1 8 6 1 5 2 TPS25910_GATE1 PWPD U2 pg2 IN1 IN2 IN3 GATE GND4 GND5 GND6 ILIM 1 2 3 4 5 6 8 7 C3 47uF TPS25910_GATE1 25910_ILIM1 R30 47K TPS25910RSA C4 47nF 7 3 micABVBUS_OUT 4 CSD17313Q2 TypeC_VBUS micAB_VBUS D7 2 R31 1TypeC_VBUS_R RB751V-40 External power supply option for test purposes only 0R 3A PWR_IN TP5 SilkScreen: PWRIN 1 1 1 NC, 0.1mil Test Post 2 D9 RB751V-40 2 D8 Connection to TypeC_VBUS, micAB_VBUS and DC_IN must be removed by uninstalling 0-Ohm resistors DNI, RB751V-40 VDD_3P3V R32 DC_IN_R J5 DC_IN 1 NOTE: POPULATE JUMPER BY DEFAULT 5V DC Input 3 0R 3A J8 R73 175K PWR_IN 2 1 3 10uF 6 SW VOS TUSB320 VIN = 4.5-5.5V MODE 1uH GND FB 5 C17 4 22uF TPS62082DSGT TUSB321 Vout = 5V Vout = 4.25V PWR_IN 7 EN 9 2 VIN PG 2 1 8 C16 L2 PwPd U4 DC_POWER_JACK VDD_320 R33 = 1.5M R34 = 200K R33 = 1.8M R34 = 200K VDD_320 MAY NEED TO CHANGE TO HIGHER POWER REGULATOR U3 C5 10uF 10 11 C6 10uF VIN_1 VIN_2 VOUT_1 VOUT_2 L1 PG 1.0uH(0.06Ohm) 6 7 63020_L1 8 9 L2_1 L2_2 FB L1_1 L1_2 PS/SYNC VINA EN GND PAD 63020_L2 4 5 TP6 14 63020_PG 3 63020_FB 13 1 12 R33 1.5M 1 15-mil TEST PAD 63020_PS R41 63020_VINA 63020_EN C7 22uF R43 NC,10K C8 22uF R44 NC, 10K 63020_PS 0 R34 200K 63020_EN 2 15 TPS63020 R42 0 C9 100nF Figure 7. TUSB321 EVM Power SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback TUSB320 Evaluation Module Copyright © 2015, Texas Instruments Incorporated 11 Revision History www.ti.com Revision History Changes from A Revision (August 2015) to B Revision ................................................................................................ Page • • Changed voltage powering the EVM from 5 V, to a range of 5 V to 5.5 V, in the first paragraph of the Power section..... 3 Added VBUS section. ..................................................................................................................... 3 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Revision History Changes from Original (June 2015) to A Revision ......................................................................................................... Page • • • • Added two sentences to the end of the first paragraph in the Power section. .................................................... Added 'J1' to the first sentence of the I2C section. ................................................................................... Added sentence to the end of the first paragraph of the I2C section. .............................................................. Added Schematics section. .............................................................................................................. 3 4 4 9 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 12 Revision History SLLU222B – June 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated
TUSB320EVM 价格&库存

很抱歉,暂时无法提供与“TUSB320EVM”相匹配的价格&库存,您可以联系我们找货

免费人工找货