TUSB4020BI
SLLSEI0D – JULY 2015 – REVISED JANUARY 2022
TUSB4020BI Two-Port USB 2.0 Hub
1 Features
3 Description
•
•
The TUSB4020BI is a two-port USB 2.0 hub.
It provides USB high-speed/full-speed connections
on the upstream port and provides high-speed,
full-speed, or low-speed connections on the
two downstream ports. When the upstream
port is connected to an electrical environment
that supports high-speed and full-speed/low-speed
connections, high-speed and full-speed/low-speed
USB connectivity is enabled on the downstream ports.
When the upstream port is connected to an electrical
environment that only supports full-speed/low-speed
connections, high-speed connectivity are disabled on
the downstream ports.
•
•
•
•
•
•
•
•
•
•
Two-port USB 2.0 hub
USB 2.0 hub features:
– Multi-transaction translator (MTT) hub: two
transaction translators
– Four asynchronous endpoint buffers per
transaction translator
Type C compatible
Supports battery charging
– CDP mode (upstream port connected)
– DCP mode (upstream port unconnected)
– DCP mode complies with chinese
telecommunications industry standard YD/T
1591-2009
– D+/D– divider mode
Per port or ganged power switching and
overcurrent notification inputs
OTP ROM, serial EEPROM, or I2C/SMBus slave
interface for custom configurations:
– VID and PID
– Port customizations
– Manufacturer and product strings (not by OTP
ROM)
– Serial number (not by OTP ROM)
Application feature selection using terminal
selection or EEPROM/ or I2C/SMBus slave
interface
Provides 128-bit universally unique identifier
(UUID)
Supports on-board and in-system OTP/EEPROM
programming through the USB 2.0 upstream port
Single clock input, 24-MHz crystal or oscillator
No special driver requirements; works seamlessly
on any operating system with USB stack support
48-Pin HTQFP package (PHP)
2 Applications
•
•
•
•
Computer systems
Docking stations
Monitors
Set-top boxes
The TUSB4020BI supports per port or ganged power
switching and overcurrent protection.
An individually port power controlled hub switches
power on or off to each downstream port as requested
by the USB host. Also when an individually port
power controlled hub senses an over-current event,
only power to the affected downstream port will be
switched off.
A ganged hub switches on power to all its
downstream ports when power is required to be on
for any port. The power to the downstream ports is
not switched off unless all ports are in a state that
allows power to be removed. Also when a ganged hub
senses an overcurrent event, power to all downstream
ports will be switched off.
Device Information(1)
PART NUMBER
TUSB4020BI
(1)
PACKAGE
HTQFP (48)
BODY SIZE (NOM)
7.00 mm × 7.00 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
USB2
WebCAM
Personal
Computer
TUSB4020BI
Type A
Port
TUSB4020BI
USB 1.1
Keyboard
USB 2.0 Connection
USB 2.0 Hub
USB 2.0 Device
USB 2.0 Port
USB 1.1 Device
Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TUSB4020BI
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Description (continued).................................................. 3
6 Pin Configuration and Functions...................................4
7 Specifications.................................................................. 7
7.1 Absolute Maximum Ratings(1) .................................... 7
7.2 ESD Ratings............................................................... 7
7.3 Recommended Operating Conditions.........................7
7.4 Thermal Information....................................................7
7.5 3.3-V I/O Electrical Characteristics............................. 8
7.6 Hub Input Supply Current........................................... 8
7.7 Power-Up Timing Requirements................................. 9
8 Detailed Description......................................................10
8.1 Overview................................................................... 10
8.2 Functional Block Diagram......................................... 10
8.3 Feature Description...................................................11
8.4 Device Functional Modes..........................................12
8.5 Programming............................................................ 13
8.6 Register Maps...........................................................14
9 Application and Implementation.................................. 26
9.1 Application Information............................................. 26
9.2 Typical Applications.................................................. 27
10 Power Supply Recommendations..............................32
10.1 Power Supply..........................................................32
10.2 Downstream Port Power......................................... 32
10.3 Ground.................................................................... 32
11 Layout........................................................................... 33
11.1 Layout Guidelines................................................... 33
11.2 Layout Example...................................................... 34
12 Device and Documentation Support..........................36
12.1 Receiving Notification of Documentation Updates..36
12.2 Support Resources................................................. 36
12.3 Trademarks............................................................. 36
12.4 Electrostatic Discharge Caution..............................36
12.5 Glossary..................................................................36
13 Mechanical, Packaging, and Orderable
Information.................................................................... 36
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (April 2018) to Revision D (January 2022)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
• Removed 1M feedback resistor requirement for crystal on pages 4, 11, 12, and 31..........................................1
• Updated the pin description from: SMBus slave address bits 2 and 3 are always 1 for TUSB4020BI to:
SMBus slave address bit 3 is always 1 for TUSB4020BI .................................................................................. 4
• Corrected the default register setting for the Register offset 9h ...................................................................... 19
• Updated the Clock, Reset, and Miscellaneous Schematic in the Clock, Reset, and Miscellaneous section....30
Changes from Revision B (June 2017) to Revision C (April 2018)
Page
• Changed the Absolute Maximum Ratings table, added pin voltages................................................................. 7
Changes from Revision A (March 2016) to Revision B (June 2017)
Page
• Added SMBUS Programming current to the Hub Input Supply Current table ................................................... 8
• Added Note to the SMBus Slave Operation section......................................................................................... 13
Changes from Revision * (July 2015) to Revision A (March 2016)
Page
• Deleted Section 1 "DM/DP Polarity Swap"......................................................................................................... 1
2
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5 Description (continued)
The TUSB4020BI downstream ports provide support for battery charging applications by providing battery
charging connected downstream port (CDP) handshaking support. It also supports a dedicated charging port
(DCP) mode when the upstream port is not connected. The DCP mode supports USB devices which support
the USB Battery Charging and the Chinese Telecommunications Industry Standard YD/T 1591-2009. In addition,
an automatic mode provides transparent support for BC devices and devices supporting Divider Mode charging
solutions when the upstream port is unconnected.
The TUSB4020BI provides terminal strap configuration for some features including battery charging support,
and also provides customization though OTP ROM, I2C EEPROM or through an I2C/SMBus slave interface for
PID, VID, and custom port and phy configurations. Custom string support is also available when using an I2C
EEPROM or the I2C/SMBus slave interface.
The device is available in a 48-pin HTQFP package and is offered in an industrial version for operation over the
temperature range of –40°C to 85°C.
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VDD33
RSVD
RSVD
VDD
RSVD
RSVD
USB_DM_DN1
USB_DP_DN1
VDD33
XO
XI
VDD33
48
47
46
45
44
43
42
41
40
39
38
37
6 Pin Configuration and Functions
VDD
1
36
FULLPWRMGMTz/ SMBA1
SCL/SMBCLK
2
35
GANGED/SMBA2/ HS_UP
SDA/SMBDAT
3
34
VDD
PWRCTL1/BATEN1
4
33
VDD33
OVERCUR1z
5
32
RSVD
PWRCTL2/BATEN2
6
31
RSVD
VDD33
7
30
VDD
OVERCUR2z
8
29
RSVD
USB_VBUS
9
28
RSVD
TEST
10
27
USB_DM_UP
GRSTz
11
26
USB_DP_UP
VDD
12
25
VDD33
Thermal
24
Not to scale
USB_R1
23
VDD33
22
SMBUSz
21
PWRCTL_POL
20
RSVD
19
RSVD
18
VDD
17
RSVD
16
RSVD
15
USB_DM_DN2
14
USB_DP_DN2
VDD33
13
Pad
Figure 6-1. PHP Package 48-Pin HTQFP Top View
Table 6-1. Pin Functions
PIN
NAME
NO.
TYPE(1)
DESCRIPTION
CLOCK AND RESET SIGNALS
GRSTz
11
I
PU
Global power reset. This reset brings all of the TUSB4020BI internal registers to their default states.
When GRSTz is asserted, the device is completely nonfunctional.
XI
38
I
Crystal input. This terminal is the crystal input for the internal oscillator. The input may alternately be
driven by the output of an external oscillator.
XO
39
O
Crystal output. This terminal is the crystal output for the internal oscillator. If XI is driven by an external
oscillator this pin may be left unconnected.
USB_DP_UP
26
I/O
USB high-speed differential transceiver (positive)
USB_DM_UP
27
I/O
USB high-speed differential transceiver (negative)
USB_R1
24
I
Precision resistor reference. A 9.53-kΩ ±1% resistor should be connected between USB_R1 and GND.
USB_VBUS
9
I
USB upstream port power monitor. The VBUS detection requires a voltage divider. The signal
USB_VBUS must be connected to VBUS through a 90.9-kΩ ±1% resistor, and to ground through a
10-kΩ ±1% resistor from the signal to ground.
USB UPSTREAM SIGNALS
4
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Table 6-1. Pin Functions (continued)
PIN
NAME
NO.
TYPE(1)
DESCRIPTION
USB DOWNSTREAM SIGNALS
USB_DP_DN1
41
I/O
USB high-speed differential transceiver (positive) downstream port 1.
USB_DM_DN1
42
I/O
USB high-speed differential transceiver (negative) downstream port 1.
USB port 1 power-on control for downstream power or battery charging enable. The terminal is used for
control of the downstream power switch for Port 1.
PWRCTL1/BATEN1
4
I/O
PD
In addition, the value of the terminal is sampled at the deassertion of reset to determine the value of the
battery charging support for Port 1 as indicated in the Battery Charging Support register.
0 = Battery charging not supported
1 = Battery charging supported
USB DS port 1 overcurrent detection input. This terminal is used to connect the over current output of
the downstream port power switch for port 1.
OVERCUR1z
5
I
PU
0 = An overcurrent event has occurred
1 = An overcurrent event has not occurred
If power management is enabled, the external circuitry needed should be determined by the power
switch. In ganged mode, either OVERCUR1z or OVERCUR2z can be used. In ganged mode, the
overcurrent will be reported as a hub event instead of a port event.
USB_DP_DN2
14
I/O
USB high-speed differential transceiver (positive) downstream port 2.
USB_DM_DN2
15
I/O
USB high-speed differential transceiver (negative) downstream port 2.
Power-on control /battery charging enable for downstream port 2. This terminal is used for control of the
downstream power switch for port 2.
PWRCTL2/BATEN2
6
I/O
PD
The value of the terminal is sampled at the deassertion of reset to determine the value of the battery
charging support for port 2 as indicated in the Battery Charging Support register.
0 = Battery charging not supported
1 = Battery charging supported
Overcurrent detection for downstream port 2. This terminal is used to connect the over current output of
the downstream port power switch for port 2.
OVERCUR2z
8
I
PU
0 = An overcurrent event has occurred
1 = An overcurrent event has not occurred
If power management is enabled, the external circuitry needed should be determined by the power
switch. In ganged mode either OVERCUR1z or OVERCUR2z can be used. In ganged mode the
overcurrent will be reported as a hub event instead of a port event.
I2C/SMBUS SIGNALS
I2C clock/SMBus clock. Function of terminal depends on the setting of the SMBUSz input.
When SMBUSz = 1, this terminal acts as the serial clock interface for an I2C EEPROM.
SCL/SMBCLK
2
I/O
PD
When SMBUSz = 0, this terminal acts as the serial clock interface for an SMBus host.
This pin must be pulled up to use the OTP ROM.
Can be left unconnected if external interface not implemented.
I2C data/SMBus data. Function of terminal depends on the setting of the SMBUSz input.
When SMBUSz = 1, this terminal acts as the serial data interface for an I2C EEPROM.
SDA/SMBDAT
3
I/O
PD
When SMBUSz = 0, this terminal acts as the serial data interface for an SMBus host.
This pin must be pulled up to use the OTP ROM.
Can be left unconnected if external interface not implemented.
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Table 6-1. Pin Functions (continued)
PIN
NAME
NO.
TYPE(1)
DESCRIPTION
TEST AND MISCELLANEOUS SIGNALS
SMBUS mode.
The value of the terminal is sampled at the deassertion of reset to enable I2C or SMBus mode.
SMBUSz
22
I
PU
0 = SMBus mode selected
1 = I2C mode selected
After reset, this signal is driven low by the TUSB4020BI. Due to this behavior, it is recommended to not
tie directly to supply but instead pull-up or pull-down using external resistor.
Power control polarity.
The value of the terminal is sampled at the deassertion of reset to set the polarity of PWRCTL[2:1].
PWRCTL_POL
21
I/O
PD
0 = PWRCTL polarity is active high.
1 = PWRCTL polarity is active low.
After reset, this signal is driven low by the TUSB4020BI. Due to this behavior, it is recommended to not
tie directly to supply but instead pull-up or pull-down using external resistor.
Ganged operation enable/SMBus address bit 2/ high-speed status for upstream port
The value of the terminal is sampled at the deassertion of reset to set the power switch and over current
detection mode as follows:
GANGED/SMBA2/
HS_UP
35
I
PU
0 = Individual power control supported when power switching is enabled.
1 = Power control gangs supported when power switching is enabled.
When SMBus mode is enabled using SMBUSz, this terminal sets the value of the SMBus slave address
bit 2. SMBus slave address bit 3 is always 1 for the TUSB4020BI.
After reset, this signal indicates the high-speed USB connection status of the upstream port. A value of
1 indicates the upstream port is connected to a high-speed USB capable port.
Note: Individual power control must be enabled for battery charging applications.
Full power management enable/ SMBus Address bit 1.
The value of the terminal is sampled at the deassertion of reset to set the power switch control follows:
0 = Power switching supported
1 = Power switching not supported
FULLPWRMGMTz/
SMBA1
36
I, PU
Full power management is the ability to control power to the downstream ports of the TUSB4020BI
using PWRCTL[2:1]/BATEN[2:1].
When SMBus mode is enabled using SMBUSz, this terminal sets the value of the SMBus slave address
bit 1. SMBus slave address bit 3 is always 1 for the TUSB4020BI.
Can be left unconnected if full power management and SMBus are not implemented.
After reset, this signal is driven low by the TUSB4020BI. Due to this behavior, it is recommended to not
tie directly to supply but instead pull-up or pull-down using external resistor.
Note: Power switching must be supported for battery charging applications.
RSVD
16, 17, 19,
20, 28, 29,
31, 32, 43,
44, 46, 47
I/O
Reserved. These pins are for internal use only and should be left unconnected on PCB.
TEST
10
I
PD
TEST mode enable. When this terminal is asserted high at reset enables test mode. This terminal is
reserved for factory use. It is recommended to pull-down this terminal to ground.
POWER AND GROUND SIGNALS
VDD
1, 12, 18, 30,
34, 45
PWR
1.1-V power rail
VDD33
7, 13, 23, 25,
33, 37, 40, 48
PWR
3.3-V power rail
PAD
—
GND
(1)
6
Ground
I = input, O = output, I/O = input/output, PU = internal pullup resistor, PD = internal pulldown resistor, and PWR = power signal
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7 Specifications
7.1 Absolute Maximum Ratings(1)
over operating free-air temperature (unless otherwise noted)
Supply Voltage
MIN
MAX
UNIT
VDD Steady-state supply voltage
–0.3
1.4
V
VDD33 Steady-state supply voltage
–0.3
3.8
V
USB_VBUS pin
–0.3
1.4
V
Voltage
XI pins
–0.3
2.45
V
All other pins
–0.3
3.8
V
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±4000
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)
±1500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
1.1-V supply voltage
0.99
1.1
1.26
V
3.3-V supply voltage
3
3.3
3.6
V
VDD(1)
VDD33
USB_VBUS
Voltage at USB_VBUS pin
1.155
V
TA
Operating free-air temperature range
–40
25
85
°C
TJ
Operating junction temperature range
–40
25
105
°C
(1)
0
A 1.05-V, 1.1-V, or 1.2-V supply may be used as long as minimum and maximum supply conditions are met.
7.4 Thermal Information
TUSB4020BI
THERMAL
METRIC(1)
PHP (HTQFP)
UNIT
48 PINS
Rθ JA
Junction-to-ambient thermal resistance
31.8
°C/W
Rθ JC(top)
Junction-to-case (top) thermal resistance
16.1
°C/W
Rθ JB
Junction-to-board thermal resistance
13
°C/W
ψJT
Junction-to-top characterization parameter
0.5
°C/W
ψJB
Junction-to-board characterization parameter
12.9
°C/W
Rθ JC(bot)
Junction-to-case (bottom) thermal resistance
0.9
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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7.5 3.3-V I/O Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
OPERATION
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIH
High-level input
voltage(1)
VDD33
2
VDD33
V
VIL
Low-level input voltage(1)
VDD33
0
0.8
V
VI
Input voltage
0
VDD33
V
VO
Output voltage(2)
0
VDD33
V
tt
Input transition time (trise and tfall)
0
25
ns
0.13 ×
VDD33
V
Vhys
Input hysteresis(3)
VOH
High-level output voltage
VDD33
IOH = –4 mA
VOL
Low-level output voltage
VDD33
IOL = 4 mA
current(2)
2.4
V
0.4
V
IOZ
High-impedance, output
VDD33
VI = 0 to VDD33
±20
µA
IOZP
High-impedance, output current with
internal pullup or pulldown resistor(4)
VDD33
VI = 0 to VDD33
±225
µA
II
Input current(5)
VDD33
VI = 0 to VDD33
±15
µA
(1)
(2)
(3)
(4)
(5)
Applies to external inputs and bidirectional buffers
Applies to external outputs and bidirectional buffers
Applies to GRSTz
Applies to pins with internal pullups/pulldowns
Applies to external input buffers
7.6 Hub Input Supply Current
typical values measured at TA = 25°C
VDD33
VDD11
3.3 V
1.1 V
Power-on (after reset)
5
39
mA
Disconnect from host
5
39
mA
Suspend
5
39
mA
2.0 host / 1 HS device active
48
71
mA
2.0 host / 2 HS devices active
60
80
mA
SMBUS Programming current
79
225
mA
PARAMETER
UNIT
LOW-POWER MODES
ACTIVE MODES (US STATE / DS STATE)
8
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7.7 Power-Up Timing Requirements
MIN
stable(1)
td1
VDD33 stable before VDD
td2
VDD and VDD33 stable before deassertion of GRSTz
inputs(3)
see
NOM
MAX
UNIT
(2)
ms
3
ms
tsu_io
Setup for MISC
sampled at the deassertion of GRSTz
0.1
µs
thd_io
Hold for MISC inputs(3) sampled at the deassertion of GRSTz.
0.1
µs
tVDD33_RAMP
VDD33 supply ramp requirements
0.2
100
ms
tVDD_RAMP
VDD supply ramp requirements
0.2
100
ms
(1)
(2)
(3)
An active reset is required if the VDD33 supply is stable before the VDD11 supply. This active Reset shall meet the 3ms power-up
delay counting from both power supplies being stable to the de-assertion of GRSTz.
There is no power-on relationship between VDD33 and VDD unless GRSTz is only connected to a capacitor to GND. Then VDD must
be stable minimum of 10 μs before the VDD33.
MISC pins sampled at deassertion of GRSTz: FULLPWRMGMTz, GANGED, PWRCTL_POL, SMBUSz, BATEN[4:1], and AUTOENz.
Td2
GRSTz
VDD33
Td1
VDD
Tsu_io
Thd_io
MISC_IO
Figure 7-1. Power-Up Timing Requirements
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8 Detailed Description
8.1 Overview
The TUSB4020BI is a two-port USB 2.0 hub. It provides USB high-speed/full-speed connections on the
upstream port and provides USB high-speed, full-speed, or low-speed connections on the downstream ports.
When the upstream port is connected to an electrical environment that supports high-speed and full-speed/
low-speed connections, USB high-speed and full-speed/low-speed connectivity is enabled on the downstream
ports. When the upstream port is connected to an electrical environment that only supports full-speed/low-speed
connections, USB high-speed connectivity are disabled on the downstream ports.
8.2 Functional Block Diagram
USB_VBUS
USB_DM_UP
USB_DP_UP
USB_R1
VDD33
VDD
VSS
VBUS
Detect
Power
Distribution
USB 2.0 Hub
XI
Oscillator
XO
USB_DM_DN2
USB_DP_DN2
USB_DM_DN1
USB_DP_DN1
GRSTz
Clock
and
Reset
Distribution
TEST
GANGED/SMBA2/HS_UP
FULLPWRMGMTz/SMBA1
PWRCTL_POL
SMBUSz
SCL/SMBCLK
SDA/SMBDAT
GPIO
2
I C
SMBUS
OVERCUR1z
PWRCTL1/BATEN1
Control
Registers
OTP
ROM
OVERCUR2z
PWRCTL2/BATEN2
10
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8.3 Feature Description
8.3.1 Battery Charging Features
The TUSB4020BI provides support for battery charging. Battery charging support may be enabled on a per port
basis through the REG_6h(batEn[1:0]).
Battery charging support includes both charging downstream port (CDP) and dedicated charging port (DCP)
modes. The DCP mode is compliant with the Chinese Telecommunications Industry Standard YD/T 1591-2009.
In addition to standard DCP mode, the TUSB4020BI provides a mode (AUTOMODE) which automatically
provides support for DCP devices and devices that support custom charging indication. AUTOMODE is disabled
by default. When in AUTOMODE, the port automatically switches between a divider mode and the DCP mode
depending on the portable device connected. The divider mode places a fixed DC voltage on the ports DP
and DM signals which allows some devices to identify the capabilities of the charger. The default divider mode
indicates support for up to 5 W. The divider mode can be configured to report a high-current setting (up to 10 W)
through REG_Ah(HiCurAcpModeEn). When AUTOMODE is enabled through REG_Ah(autoModeEnz), the CDP
mode is not functional. CDP mode can not be used when AUTOMODE is enabled.
The battery charging mode for each port depends on the state of Reg_6h(batEn[n]), the status of the VBUS
input, and the state of REG_Ah(autoModeEnz) upstream port, as identified in Table 8-1. Battery charging can
also be enabled through the PWRCTL1/BATEN1 and PWRCTL2/BATEN2 pins.
Table 8-1. TUSB4020BI Battery Charging Modes
batEn[n]
VBUS
autoModeEnz
BC Mode Port x
(x = n + 1)
0
Do not care
Do not care
Do not care
0
Automode(3) (4)
1
DCP(1) (2)
1
CDP(1)
1
4 V
(1)
(2)
(3)
(4)
USB device is USB Battery Charging Specification Revision 1.2 Compliant
USB device is Chinese Telecommunications Industry Standard YD/T 1591-2009
Auto-mode automatically selects divider-mode or DCP mode.
Divider mode can be configured for high-current mode through register or OTP settings.
8.3.2 USB Power Management
The TUSB4020BI can be configured for power switched applications using either per-port or ganged powerenable controls and overcurrent status inputs.
Power switch support is enabled by REG_5h(fullPwrMgmtz) and the per-port or ganged mode is configured by
REG_5h(ganged). It can also be enabled through the FULLPWRMGMTz pin. Also ganged or individual control
can be controlled by the GANGED pin.
The TUSB4020BI supports both active-high and active-low power-enable controls. The PWRCTL[2:1] polarity is
configured by REG_Ah(pwrctlPol). The polarity can also be configured by the PWRCTL_POL pin.
8.3.3 Clock Generation
The TUSB4020BI accepts a crystal input to drive an internal oscillator or an external clock source. Keep the XI
and XO traces as short as possible and away from any switching leads to minimize noise coupling.
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R1
TUSB4020BI
1M
R1 is optional
XI
XO
CL1
24 MHz
CL2
Figure 8-1. TUSB4020BI Clock
8.3.4 Power-Up and Reset
The TUSB4020BI does not have specific power sequencing requirements with respect to the VDD or VDD33
power rails. The VDD or VDD33 power rails may be powered up for an indefinite period of time while the other is
not powered up if all of these constraints are met:
•
•
•
•
All maximum ratings and recommended operating conditions are observed.
All warnings about exposure to maximum rated and recommended conditions are observed, particularly
junction temperature. These apply to power transitions as well as normal operation.
Bus contention while VDD33 is powered-up must be limited to 100 hours over the projected lifetime of the
device.
Bus contention while VDD33 is powered-down may violate the absolute maximum ratings.
A supply bus is powered up when the voltage is within the recommended operating range. A supply bus is
powered down when it is below that range, either stable or in transition.
A minimum reset duration of 3 ms is required, which is defined as the time when the power supplies are in the
recommended operating range to the deassertion of GRSTz. This can be generated using programmable-delay
supervisory device or using an RC circuit.
8.4 Device Functional Modes
8.4.1 External Configuration Interface
The TUSB4020BI supports a serial interface for configuration register access. The device may be configured by
an attached I2C EEPROM or accessed as a slave by a SMBus-capable host controller. The external interface is
enabled when both the SCL/SMBCLK and SDA/SMBDAT terminals are pulled up to 3.3 V at the deassertion of
reset. The mode, I2C master, or SMBus slave is determined by the state of SMBUSz terminal at reset.
12
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8.5 Programming
8.5.1 One-Time Programmable (OTP) Configuration
The TUSB4020BI allows device configuration through OTP non-volatile memory (OTP). The programming of the
OTP is supported using vendor-defined USB device requests. For details using the OTP features, contact your
TI representative.
Table 8-2 provides a list features which may be configured using the OTP. The bit field section in Table 8-2
shows which features can be controlled by OTP ROM. The bits not listed in the table are not accessible by the
OTP ROM.
Table 8-2. OTP Configurable Features
CONFIGURATION REGISTER OFFSET
BIT FIELD
DESCRIPTION
REG_01h
[7:0]
Vendor ID LSB
REG_02h
[7:0]
Vendor ID MSB
REG_03h
[7:0]
Product ID LSB
REG_04h
[7:0]
Product ID MSB
REG_07h
[0]
Port removable configuration for downstream ports 1. OTP configuration is
inverse of rmbl[1:0], that is:
1 = Not removable
0 = Removable
REG_07h
[1]
Port removable configuration for downstream ports 2. OTP configuration is
inverse of rmbl[1:0], that is:
1 = Not removable
0 = Removable
REG_0Ah
[1]
Automode enable
REG_0Ah
[4]
High-current divider mode enable.
REG_F2h
[3:1]
USB power switch power-on delay.
8.5.2 I2C EEPROM Operation
The TUSB4020BI supports a single-master, standard mode (100 kbit/s) connection to a dedicated I2C EEPROM
when the I2C interface mode is enabled. In I2C mode, the TUSB4020BI reads the contents of the EEPROM at
bus address 1010000b using 7-bit addressing starting at address 0.
If the value of the EEPROM contents at byte 00h equals 55h, the TUSB4020BI loads the configuration registers
according to the EEPROM map. If the first byte is not 55h, the TUSB4020BI exits the I2C mode and continues
execution with the default values in the configuration registers. The hub will not connect on the upstream port
until the configuration is completed. If the TUSB4020BI detects an unprogrammed EEPROM (value other than
55h), it enters programming mode and a programming endpoint within the hub is enabled.
Note, the bytes located above offset Ah are optional. The requirement for data in those addresses depends
on the options configured in the Device Configuration, Phy Custom Configuration, and Device Configuration 2
registers.
For details on I2C operation, refer to the UM10204 I2C-bus Specification and User Manual.
8.5.3 SMBus Slave Operation
When the SMBus interface mode is enabled, the TUSB4020BI supports read block and write block protocols as
a slave-only SMBus device.
The TUSB4020BI slave address is 1000 1xyz, where:
• x is the state of GANGED/SMBA2/HS_UP terminal at reset
• y is the state of FULLPWRMGMTz/SMBA1 terminal at reset
• z is the read/write bit; 1 = read access, 0 = write access.
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If the TUSB4020BI is addressed by a host using an unsupported protocol, it does not respond. The TUSB4020BI
waits indefinitely for configuration by the SMBus host and does not connect on the upstream port until the
SMBus host indicates configuration is complete by clearing the CFG_ACTIVE bit.
For details on SMBus requirements, refer to the System Management Bus Specification.
Note
During the SMBUS configuration the hub may draw an extra current, this extra current consumption
will end as soon as the CFG_ACTIVE bit is cleared. For more information, see Section 7.6 Section in
this datasheet.
8.6 Register Maps
8.6.1 Configuration Registers
The internal configuration registers are accessed on byte boundaries. The configuration register values are
loaded with defaults but can be overwritten when the TUSB4020BI is in I2C or SMBus mode.
Table 8-3. TUSB4020BI Register Map
BYTE ADDRESS
EEPROM CONFIGURABLE
00h
ROM Signature Register
No
01h
Vendor ID LSB
Yes
02h
Vendor ID MSB
Yes
03h
Product ID LSB
Yes
04h
Product ID MSB
Yes
05h
Device Configuration Register
Yes
06h
Battery Charging Support Register
Yes
07h
Device Removable Configuration Register
Yes
08h
Port Used Configuration Register
09h
Reserved
0Ah
Device Configuration Register 2
Yes
Yes, program to 00h
Yes
0Bh to 0Fh
Reserved
10h to 1Fh
UUID Byte [15:0]
No
20h to 21h
LangID Byte [1:0]
Yes, if customStrings is set
22h
Serial Number String Length
Yes, if customSerNum is set
23h
Manufacturer String Length
Yes, if customStrings is set
24h
Product String Length
Yes, if customStrings is set
25h to 2Fh
Reserved
30h to 4Fh
Serial Number String Byte [31:0]
Yes, if customSerNum is set
Yes
50h to 8Fh
Manufacturer String Byte [63:0]
Yes, if customStrings is set
90h to CFh
Product String Byte [63:0]
Yes, if customStrings is set
D0 to DFh
Reserved
No
F0h
Additional Feature Configuration Register
Yes
F1h
Reserved
Yes
F2h
Charging Port Control Register
Yes
Reserved
No
Device Status and Command Register
No
Reserved
No
F3 to F7h
F8h
F9 to FFh
14
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8.6.1.1 ROM Signature Register (offset = 0h) [reset = 0h]
Figure 8-2. Register Offset 0h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-4. ROM Signature Register
Bit
Field
7:0
Type
romSignature
R/W
Reset
Description
0h
ROM Signature Register. This register is used by the TUSB4020BI in I2C mode
to validate the attached EEPROM has been programmed. The first byte of the
EEPROM is compared to the mask 55h and if not a match, the TUSB4020BI aborts
the EEPROM load and executes with the register defaults.
8.6.1.2 Vendor ID LSB Register (offset = 1h) [reset = 51h]
Figure 8-3. Register Offset 51h
7
6
5
4
3
2
1
0
0
1
0
1
0
0
0
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-5. Vendor ID LSB Register
Bit
Field
7:0
Type
vendorIdLsb
R/W
Reset
Description
51h
Vendor ID LSB. Least significant byte of the unique vendor ID assigned by the
USB-IF; the default value of this register is 51h representing the LSB of the TI
Vendor ID 0451h. The value may be overwritten to indicate a customer vendor ID.
This field is read/write unless the OTP ROM VID and OTP ROM PID values are
non-zero. If both values are non-zero, the value when reading this register shall
reflect the OTP ROM value.
8.6.1.3 Vendor ID MSB Register (offset = 2h) [reset = 4h]
Figure 8-4. Register Offset 2h
7
6
5
4
3
2
1
0
0
0
0
0
0
1
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-6. Vendor ID MSB Register
Bit
7:0
Field
vendorIdMsb
Type
R/W
Reset
Description
4h
Vendor ID MSB. Most significant byte of the unique vendor ID assigned by the
USB-IF; the default value of this register is 04h representing the MSB of the TI
Vendor ID 0451h. The value may be overwritten to indicate a customer vendor ID.
This field is read/write unless the OTP ROM VID and OTP ROM PID values are
non-zero. If both values are non-zero, the value when reading this register shall
reflect the OTP ROM value.
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8.6.1.4 Product ID LSB Register (offset = 3h) [reset = 25h]
Figure 8-5. Register Offset 3h
7
6
5
4
3
2
1
0
0
0
1
0
0
1
0
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-7. Product ID LSB Register
Bit
Field
7:0
Type
productIdLsb
R/W
Reset
Description
25h
Product ID LSB. Least significant byte of the product ID assigned by TI. The default
value of this register is 25h representing the LSB of the product ID assigned by TI. The
value reported in the USB 2.0 device descriptor is the value of this register bit wise
XORed with 00000010b. The value may be overwritten to indicate a customer product
ID.
This field is read/write unless the OTP ROM VID and OTP ROM PID values are nonzero. If both values are non-zero, the value when reading this register shall reflect the
OTP ROM value.
8.6.1.5 Product ID MSB Register (offset = 4h) [reset = 80h]
Figure 8-6. Register Offset 4h
7
6
5
4
3
2
1
0
1
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-8. Bit Descriptions – Product ID MSB Register
Bit
7:0
16
Field
productIdLsb
Type
R/W
Reset
Description
80h
Product ID MSB. Most significant byte of the product ID assigned by TI; the default
value of this register is 80h representing the MSB of the product ID assigned by TI. The
value may be overwritten to indicate a customer product ID.
This field is read/write unless the OTP ROM VID and OTP ROM PID values are nonzero. If both values are non-zero, the value when reading this register will reflect the
OTP ROM value.
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8.6.1.6 Device Configuration Register (offset = 5h) [reset = 1Xh]
Figure 8-7. Register Offset 5h
7
6
5
4
3
2
1
0
0
0
0
1
X
X
0
0
R/W
R/W
R/W
R
R/W
R/W
R/W
R
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-9. Device Configuration Register
Bit
7
Field
customStrings
Type
R/W
Reset
Description
1Xh
Custom strings enable. This bit controls the ability to write to the Manufacturer String
Length, Manufacturer String, Product String Length, Product String, and Language ID
registers.
0 = The Manufacturer String Length, Manufacturer String, Product String Length, Product
String, and Language ID registers are read only.
1 = The Manufacturer String Length, Manufacturer String, Product String Length, Product
String, and Language ID registers may be loaded by EEPROM or written by SMBus.
The default value of this bit is 0.
6
customSernum
R/W
1Xh
Custom serial number enable. This bit controls the ability to write to the serial number
registers.
0 = The Serial Number String Length and Serial Number String registers are read only.
1 = The Serial Number String Length and Serial Number String registers may be loaded by
EEPROM or written by SMBus.
The default value of this bit is 0.
5
RSVD
R/W
1Xh
Reserved. This bit is reserved.
4
RSVD
R
1Xh
Reserved. This bit is reserved and returns 1 when read.
1Xh
Ganged. This bit is loaded at the deassertion of reset with the value of the GANGED/
SMBA2/HS_UP terminal.
0 = When fullPwrMgmtz = 0, each port is individually power switched and enabled by the
PWRCTL[2:1]/BATEN[2:1] terminals
1 = When fullPwrMgmtz = 0, the power switch control for all ports is ganged and enabled
by the PWRCTL1/BATEN1 terminal
When the TUSB4020BI is in I2C mode, the TUSB4020BI loads this bit from the contents of
the EEPROM.
When the TUSB4020BI is in SMBUS mode, the value may be overwritten by an SMBus
host.
3
ganged
R/W
2
fullPwrMgmtz
R/W
1Xh
Full Power Management. This bit is loaded at the deassertion of reset with the value of the
FULLPWRMGMTz/SMBA1 terminal.
0 = Port power switching and over-current status reporting is enabled
1 = Port power switching and over-current status reporting is disabled
When the TUSB4020BI is in I2C mode, the TUSB4020BI loads this bit from the contents of
the EEPROM.
When the TUSB4020BI is in SMBUS mode, the value may be overwritten by an SMBus
host.
1
RSVD
R/W
1Xh
Reserved. This bit is reserved and should not be altered from the default.
0
RSVD
R
1Xh
Reserved. This field is reserved and returns 0 when read.
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8.6.1.7 Battery Charging Support Register (offset = 6h) [reset = 0Xh]
Figure 8-8. Register Offset 6h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
X
X
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-10. Battery Charging Support Register
Bit
Field
Type
Reset
Description
7:2
RSVD
R
0Xh
Reserved. Read only, returns 0 when read.
0Xh
Battery Charger Support. The bits in this field indicate whether the downstream port
implements the charging port features.
0 = The port is not enabled for battery charging support features
1 = The port is enabled for battery charging support features
Each bit corresponds directly to a downstream port, that is batEn0 corresponds to
downstream port 1, and batEN1 corresponds to downstream port 2.
The default value for these bits are loaded at the deassertion of reset with the value of
PWRCTL/BATEN[1:0].
When in I2C/SMBus mode the bits in this field may be overwritten by EEPROM contents or
by an SMBus host.
1:0
batEn[1:0]
R/W
8.6.1.8 Device Removable Configuration Register (offset = 7h) [reset = 0Xh]
Figure 8-9. Register Offset 7h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
X
X
R/W
R
R
R
R
R
R
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-11. Device Removable Configuration Register
Bit
7
6:2
1:0
18
Field
Type
Reset
Description
customRmbl
R/W
0Xh
Custom removable status. When this field is a 1, the TUSB4020BI uses rmbl bits in this
register to identify removable status for the ports.
RSVD
R
0Xh
Reserved. Read only, returns 0 when read. Bits 3:2 are RW. They are reserved and
return 0 when read.
0Xh
Removable. The bits in this field indicate whether a device attached to downstream
ports 2 through 1 are removable or permanently attached.
0 = The device attached to the port is not removable
1 = The device attached to the port is removable
Each bit corresponds directly to a downstream port n + 1, that is rmbl0 corresponds to
downstream port 1, rmbl1 corresponds to downstream port 2, and so forth.
This field is read only unless the customRmbl bit is set to 1. Otherwise the value of this
filed reflects the inverted values of the OTP ROM non_rmb[1:0] field.
rmbl[1:0]
R/W
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8.6.1.9 Port Used Configuration Register (offset = 8h) [reset = 0h]
Figure 8-10. Register Offset 8h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
1
1
R
R
R
R
R
R
R
R
1
0
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-12. Port Used Configuration Register
Bit
Field
Type
Reset
Description
7:0
RSVD
R
0h
Reserved. Read only.
8.6.1.10 PHY Custom Configuration Register (offset = 9h) [reset = 0h]
Figure 8-11. Register Offset 9h
7
6
5
4
3
2
0
0
0
0
0
0
0
0
R
R
R/W
R
R
R
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-13. PHY Custom Configuration Register
Bit
Field
Type
Reset
Description
7:6
RSVD
R
0h
Reserved. Read only, returns 0 when read.
5
RSVD
R/W
0h
Reserved. This bit is reserved and should not be altered from the default.
4:2
RSVD
R
0h
Reserved. Read only, returns 0 when read.
1:0
RSVD
R/W
0h
Reserved. This field is reserved and should not be altered from the default.
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8.6.1.11 Device Configuration Register 2 (offset = Ah)
Figure 8-12. Register Offset Ah
7
6
5
4
3
2
1
0
0
0
X
0
0
0
0
0
R
RW
RW
RW
RW
RW
RW
R
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-14. Bit Descriptions – Device Configuration Register 2
Bit
Field Name
Access
7
RSVD
RO
Reset
Description
Reserved. Read only, returns 0 when read.
Custom Battery Charging Feature Enable. This bit controls the ability to write to the
battery charging feature configuration controls.
6
customBCfeatures
RW
0 = The HiCurAcpModeEn and AutoModeEnz bits are read only and the values
are loaded from the OTP ROM.
1 = The HiCurAcpModeEn and AutoModeEnz bits are read/write and can be
loaded by EEPROM or written by SMBus. from this register.
This bit may be written simultaneously with HiCurAcpModeEn and AutoModeEnz.
Power enable polarity. This bit is loaded at the deassertion of reset with the inverse
value of the PWRCTL_POL terminal.
0 = PWRCTL polarity is active low
5
pwrctlPol
RW
1 = PWRCTL polarity is active high
When the TUSB4020BI is in I2C mode, the TUSB4020BI loads this bit from the
contents of the EEPROM.
When the TUSB4020BI is in SMBUS mode, the value may be overwritten by an
SMBus host.
High-current ACP mode enable. This bit enables the high-current tablet charging mode
when the automatic battery charging mode is enabled for downstream ports.
4
HiCurAcpModeEn
RO/RW
0 = High current divider mode disabled
1 = High current divider mode enabled
This bit is read only unless the customBCfeatures bit is set to 1. Otherwise the value of
this bit reflects the value of the OTP ROM HiCurAcpModeEn bit.
3
RSVD
RW
Reserved
DSPort ECR enable. This bit enables full implementation of the DSPORT ECR (April
2013).
2
dsportEcrEn
RW
0 = DSPort ECR (April 2013) is enabled with the exception of changes related
to the CCS bit is set upon entering U0, and changes related to avoiding or
reporting compliance mode entry.
1 = The full DSport ECR (April 2013) is enabled.
Automatic Mode Enable. This bit is loaded from the OTP ROM.
The automatic mode only applies to downstream ports with battery charging enabled
when the upstream port is not connected. Under these conditions:
0 = Automatic mode battery charging features are enabled. Only battery
charging DCP and custom BC (divider mode) is enabled.
1
autoModeEnz
RO/RW
1 = Automatic mode is disabled; only battery charging DCP and CDP mode is
supported.
Note: When the upstream port is connected, battery charging CDP mode is supported
on all ports when this field is one.
This bit is read only unless the customBCfeatures bit is set to 1. Otherwise the value of
this bit reflects the value of the OTP ROM AutoModeEnz bit.
0
20
RSVD
RO
Reserved. Read only, returns 0 when read.
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8.6.1.12 UUID Registers (offset = 10h to 1Fh)
Figure 8-13. Register Offset 10h to 1Fh
7
6
5
4
3
2
1
0
X
X
X
X
X
X
X
X
R
R
R
R
R
R
R
R
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-15. Bit Descriptions – UUID Byte N Register
Bit
Field Name
7:0
Access
uuidByte[n]
Reset
Description
UUID byte N. The UUID returned in the Container ID descriptor. The value of this register
is provided by the device and is meets the UUID requirements of Internet Engineering Task
Force (IETF) RFC 4122 A UUID URN Namespace.
RO
8.6.1.13 Language ID LSB Register (offset = 20h)
Figure 8-14. Register Offset 20h
7
6
5
4
3
2
1
0
0
0
0
0
1
0
0
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-16. Bit Descriptions – Language ID LSB Register
Bit
Field Name
7:0
Access
langIdLsb
Reset
Description
Language ID least significant byte. This register contains the value returned in the LSB
of the LANGID code in string index 0. The TUSB4020BI only supports one language
ID. The default value of this register is 09h representing the LSB of the LangID 0409h
indicating English United States. When customStrings is 1, this field may be overwritten
by the contents of an attached EEPROM or by an SMBus host.
RW
8.6.1.14 Language ID MSB Register (offset = 21h)
Figure 8-15. Register Offset 21h
7
6
5
4
3
2
1
0
0
0
0
0
0
1
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-17. Bit Descriptions – Language ID MSB Register
Bit
7:0
Field Name
langIdMsb
Access
Reset
RO/RW
Description
Language ID most significant byte. This register contains the value returned in the MSB of
the LANGID code in string index 0. The TUSB4020BI only supports one language ID. The
default value of this register is 04h representing the MSB of the LangID 0409h indicating
English United States.
When customStrings is 1, this field may be overwritten by the contents of an attached
EEPROM or by an SMBus host.
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8.6.1.15 Serial Number String Length Register (offset = 22h)
Figure 8-16. Register Offset 22h
7
6
5
4
3
2
1
0
0
0
0
1
1
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-18. Bit Descriptions – Serial Number String Length Register
Bit
Field Name
Access
7:6
RSVD
RO
5:0
serNumStringLen
Reset
Description
Reserved. Read only, returns 0 when read.
Serial number string length. The string length in bytes for the serial number string. The
default value is 18h indicating that a 24-byte serial number string is supported. The
maximum string length is 32 bytes.
When customSernum is 1, this field may be overwritten by the contents of an attached
EEPROM or by an SMBus host.
When the field is non-zero, a serial number string of serNumbStringLen bytes is
returned at string index 1 from the data contained in the Serial Number String registers.
RO/RW
8.6.1.16 Manufacturer String Length Register (offset = 23h)
Figure 8-17. Register Offset 23h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-19. Bit Descriptions – Manufacturer String Length Register
Bit
Field Name
Access
7
RSVD
RO
6:0
22
mfgStringLen
RO/RW
Reset
Description
Reserved. Read only, returns 0 when read.
Manufacturer string length. The string length in bytes for the manufacturer string. The default
value is 0, indicating that a manufacturer string is not provided. The maximum string length is
64 bytes.
When customStrings is 1, this field may be overwritten by the contents of an attached
EEPROM or by an SMBus host.
When the field is non-zero, a manufacturer string of mfgStringLen bytes is returned at string
index 3 from the data contained in the Manufacturer String registers.
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8.6.1.17 Product String Length Register (offset = 24h)
Figure 8-18. Register Offset 24h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-20. Bit Descriptions – Product String Length Register
Bit
Field Name
Access
7
RSVD
RO
6:0
prodStringLen
Reset
Description
Reserved. Read only, returns 0 when read.
Product string length. The string length in bytes for the product string. The default value is 0,
indicating that a product string is not provided. The maximum string length is 64 bytes.
When customStrings is 1, this field may be overwritten by the contents of an attached
EEPROM or by an SMBus host.
When the field is non-zero, a product string of prodStringLen bytes is returned at string
index 2 from the data contained in the Product String registers.
RO/RW
8.6.1.18 Serial Number Registers (offset = 30h to 4Fh)
Figure 8-19. Register Offset 30h to 4Fh
7
6
5
4
3
2
1
0
X
X
x
x
x
x
x
x
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-21. Bit Descriptions – Serial Number Registers
Bit
7:0
Field Name
Access
serialNumber[n]
Reset
Description
Serial Number byte N. The serial number returned in the Serial Number string descriptor at
string index 1. The default value of these registers is set by TI. When customSernum is 1,
these registers may be overwritten by EEPROM contents or by an SMBus host.
RO/RW
8.6.1.19 Manufacturer String Registers (offset = 50h to 8Fh)
Figure 8-20. Register Offset 50h to 8Fh
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-22. Bit Descriptions – Manufacturer String Registers
Bit
7:0
Field Name
mfgStringByte[n]
Access
Reset
RO/RW
Description
Manufacturer string byte N. These registers provide the string values returned for string
index 3 when mfgStringLen is greater than 0. The number of bytes returned in the string
is equal to mfgStringLen.
The programmed data should be in UNICODE UTF-16LE encodings as defined by The
Unicode Standard, Worldwide Character Encoding, Version 5.0.
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8.6.1.20 Product String Registers (offset = 90h to CFh)
Figure 8-21. Register Offset 90h to CFh
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-23. Bit Descriptions – Product String Byte N Register
Bit
Field Name
7:0
Access
prodStringByte[n]
Reset
Description
Product string byte N. These registers provide the string values returned for string
index 2 when prodStringLen is greater than 0. The number of bytes returned in the
string is equal to prodStringLen.
The programmed data should be in UNICODE UTF-16LE encodings as defined by The
Unicode Standard, Worldwide Character Encoding, Version 5.0.
RW
8.6.1.21 Additional Feature Configuration Register (offset = F0h)
Figure 8-22. Register Offset F0h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-24. Bit Descriptions – Additional Feature Configuration Register
Bit
Field Name
Access
7:1
RSVD
RO
0
RSVD
RW
Reset
Description
Reserved. Read only, returns 0 when read.
Reserved
This bit is loaded at the deassertion of reset with the value of the SCL/SMBCLK terminal.
8.6.1.22 Charging Port Control Register (offset = F2h)
Figure 8-23. Register Offset F2h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
R
R
R
R
R/W
R/W
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-25. Bit Descriptions – Charging Port Control Register
Bit
Field Name
Access
7:4
RSVD
RO
Reserved. Read only, returns 0 when read.
RW
Power-On Delay Time. When dsportEcrEn is set, this field sets the delay time from the
removal disable of PWRCTL to the enable of PWRCTL when transitioning battery charging
modes. For example, when disabling the power on a transition from custom charging mode
to Dedicated Charging Port Mode. The nominal timing is defined as follows:
3:1
pwronTime
Reset
Description
TPWRON_EN = (pwronTime + 1) × 200 ms
(1)
These registers may be overwritten by EEPROM contents or by an SMBus host.
0
24
RSVD
RW
Reserved. This bit is reserved and should not be altered from the default.
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8.6.1.23 Device Status and Command Register (offset = F8h)
Figure 8-24. Register Offset F8h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
R
R
R
R
R
R
RSU
RCU
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8-26. Bit Descriptions – Device Status and Command Register
Bit
Field Name
Access
7:2
RSVD
R
1
smbusRst
RSU
SMBus interface reset. This bit loads the registers back to their GRSTz values.
This bit is set by writing a 1 and is cleared by hardware on completion of the reset. A
write of 0 has no effect.
RCU
Configuration active. This bit indicates that configuration of the TUSB4020BI is currently
active. The bit is set by hardware when the device enters the I2C or SMBus mode. The
TUSB4020BI will not connect on the upstream port while this bit is 1.
When in the SMBus mode, this bit must be cleared by the SMBus host to exit the
configuration mode and allow the upstream port to connect.
The bit is cleared by a writing 1. A write of 0 has no effect.
0
cfgActive
Reset
Description
Reserved. Read only, returns 0 when read.
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The TUSB4020BI is a two-port USB 2.0 hub. It provides USB high-speed/full-speed connections on the
upstream port and provides USB high-speed, full-speed, or low-speed connections on the downstream port.
The TUSB4020BI can be used in any application that needs additional USB compliant ports. For example, a
specific notebook may only have two downstream USB ports. By using the TUSB4020BI, the notebook can
increase the downstream port count to three.
USB
Type B
Connector
DC
PWR
US Port
TUSB4020BI
USB
PWR
SWITCH
DS Port 1
DS Port 2
USB Type A
Connector
USB Type A
Connector
Figure 9-1. Discrete USB Hub Product
9.1.1 Crystal Requirements
The crystal must be fundamental mode with load capacitance of 12 to 24 pF and frequency stability rating
of ±100 PPM or better. To ensure proper startup oscillation condition, TI recommends a maximum crystal
equivalent series resistance (ESR) of 50 Ω. A parallel load capacitor should be used if a crystal source is
used. The exact load capacitance value used depends on the crystal vendor. Refer to application note Selection
and Specification of Crystals for Texas Instruments USB 2.0 Devices for details on how to determine the load
capacitance value.
26
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9.1.2 Input Clock Requirements
When using an external clock source such as an oscillator, the reference clock should have a ±100 PPM or
better frequency stability and have less than 50-ps absolute peak-to-peak jitter. XI should be tied to the 1.8-V
clock source and XO should be left floating.
9.2 Typical Applications
A common application for the TUSB4020BI is as a self-powered standalone USB hub product. The product is
powered by an external 5-V DC power adapter. In this application using a USB cable, TUSB4020BI device’s
upstream port is plugged into a USB host controller. The downstream ports of the TUSB4020BI are exposed to
users for connecting USB hard drives, camera, flash drive, and so forth.
9.2.1 Upstream Port Implementation
Figure 9-2. Upstream Port Implementation Schematic
9.2.1.1 Design Requirements
Table 9-1. Input Parameters
DESIGN PARAMETER
EXAMPLE VALUE
VDD supply
1.1 V
VDD33 supply
3.3 V
Upstream port USB support (HS, FS)
HS, FS
Downstream port 1 USB support (HS, FS, LS)
HS, FS, LS
Downstream port 2 USB support (HS, FS, LS)
HS, FS, LS
Number of removable downstream ports
2
Number of non-removable downstream ports
0
Full power management of downstream ports
Yes (FULLPWRMGMTZ = 0)
Individual control of downstream port power switch
Power switch enable polarity
Yes (GANGED = 0)
Active high (PWRCTL_POL = 0)
Battery charge support for downstream port 1
Yes
Battery charge support for downstream port 2
Yes
I2C
EEPROM support
No
24-MHz clock source
Crystal
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9.2.1.2 Detailed Design Procedure
The upstream of the TUSB4020BI is connected to a USB2 type B connector. This particular example has
GANGED terminal and FULLPWRMGMTZ terminal pulled low, which results in individual power support each
downstream port. The VBUS signal from the USB2 type B connector is fed through a voltage divider. The
purpose of the voltage divider is to make sure the level meets USB_VBUS input requirements.
9.2.1.3 Application Curves
Figure 9-3. HighSpeed TX Eye for Downstream
Port 1
28
Figure 9-4. HighSpeed TX Eye for Downstream
Port 2
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9.2.2 Downstream Port 1 Implementation
The downstream port 1 of the TUSB4020BI is connected to a USB2 type A connector. With BATEN1 terminal
pulled up, battery charge support is enabled for port 1. If battery charge support is not needed, then the pullup
resistor on BATEN1 should be uninstalled. The PWRCTL_POL is pulled-down, which results in active-high
power enable (PWRCTL1 and PWRCTL2) for a USB VBUS power switch.
Figure 9-5. Downstream Port 1 Implementation Schematic
9.2.3 Downstream Port 2 Implementation
The downstream port 2 of the TUSB4020BI is connected to a USB2 type A connector. With BATEN2 terminal
pulled up, battery charge support is enabled for port 2. If battery charge support is not needed, then the pullup
resistor on BATEN2 should be uninstalled.
Figure 9-6. Downstream Port 2 Implementation Schematic
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9.2.4 VBUS Power Switch Implementation
This particular example uses the TI TPS2561 dual-channel precision adjustable current-limited power switch. For
details on this power switch or other power switches available from TI, refer to www.ti.com.
Figure 9-7. Power Switch Implementation Schematic
9.2.5 Clock, Reset, and Miscellaneous
R11 is optional
Figure 9-8. Clock, Reset, and Miscellaneous Schematic
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9.2.6 Power Implementation
Figure 9-9. Power Implementation Schematic
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10 Power Supply Recommendations
10.1 Power Supply
VDD should be implemented as a single power plane, as should VDD33.
•
•
•
•
The VDD terminals of the TUSB4020BI supply 1.1-V (nominal) power to the core of the TUSB4020BI. This
power rail can be isolated from all other power rails by a ferrite bead to reduce noise.
The DC resistance of the ferrite bead on the core power rail can affect the voltage provided to the device due
to the high current draw on the power rail. The output of the core voltage regulator may need to be adjusted
to account for this or a ferrite bead with low DC resistance (less than 0.05 Ω) can be selected.
The VDD33 terminals of the TUSB4020BI supply 3.3-V power rail to the I/O of the TUSB4020BI. This power
rail can be isolated from all other power rails by a ferrite bead to reduce noise.
All power rails require a 10-µF capacitor or 1-µF capacitors for stability and noise immunity. These bulk
capacitors can be placed anywhere on the power rail. The smaller decoupling capacitors should be placed as
close to the TUSB4020BI power pins as possible with an optimal grouping of two of differing values per pin.
10.2 Downstream Port Power
•
•
•
The downstream port power, VBUS, must be supplied by a source capable of supplying 5 V and at least
500 mA per port. Downstream port power switches can be controlled by the TUSB4020BI signals. It is
possible to leave the downstream port power always enabled.
Each downstream port’s VBUS requires a large bulk low-ESR capacitor of 22 µF or larger to limit in-rush
current.
TI recommends ferrite beads on the VBUS pins of the downstream USB port connections for both ESD and
EMI reasons. A 0.1-µF capacitor on the USB connector side of the ferrite provides a low-impedance path to
ground for fast rise time ESD current that might have coupled onto the VBUS trace from the cable.
10.3 Ground
TI recommends to use only one board ground plane in the design. This provides the best image plane for
signal traces running above the plane. The thermal pad of the TUSB4020BI and any of the voltage regulators
should be connected to this plane with vias. An earth or chassis ground is only implemented near the USB port
connectors on a different plane for EMI and ESD purposes.
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11 Layout
11.1 Layout Guidelines
11.1.1 Placement
1. A 9.53-kΩ ±1% resistor connected to terminal USB_R1 should be placed as close as possible to the
TUSB4020BI.
2. A 0.1-µF capacitor should be placed as close as possible on each VDD and VDD33 power pin.
3. The ESD and EMI protection devices (if used) should also be placed as possible to the USB connector.
4. If a crystal is used, it must be placed as close as possible to the TUSB4020BI device’s XI and XO terminals.
5. Place voltage regulators as far away as possible from the TUSB4020BI, crystal, and differential pairs.
6. In general, the large bulk capacitors associated with each power rail should be placed as close as possible
to the voltage regulators.
11.1.2 Package Specific
1. The TUSB4020BI package has a 0.5-mm pin pitch.
2. The TUSB4020BI package has a 3.6-mm × 3.6-mm thermal pad. This thermal pad must be connected to
ground through a system of vias.
3. All vias under device, except for those connected to thermal pad, should be solder masked to avoid potential
issues with thermal pad layouts.
11.1.3 Differential Pairs
This section describes the layout recommendations for all of the TUSB4020BI differential pairs: USB_DP_XX,
USB_DM_XX.
•
•
•
•
•
•
•
•
•
•
Must be designed with a differential impedance of 90 Ω ±10%.
To minimize crosstalk, TI recommends to keep high-speed signals away from each other. Each pair should be
separated by at least 5× the signal trace width. Separating with ground as depicted in the layout example also
helps minimize crosstalk.
Route all differential pairs on the same layer adjacent to a solid ground plane.
Do not route differential pairs over any plane split.
Adding test points causes impedance discontinuity, and therefore, negatively impacts signal performance. If
test points are used, they should be placed in series and symmetrically. They must not be placed in a manner
that causes stub on the differential pair.
Avoid 90° turns in trace. The use of bends in differential traces should be kept to a minimum. When bends
are used, the number of left and right bends should be as equal as possible and the angle of the bend should
be ≥135°. Taking this action minimizes any length mismatch caused by the bends, and therefore, minimizes
the impact bends have on EMI.
Minimize the trace lengths of the differential pair traces. Eight inches is the maximum recommended trace
length for USB 2.0 differential-pair signals. Longer trace lengths require very careful routing to assure proper
signal integrity.
Match the etch lengths of the differential pair traces (that is DP and DM). The USB 2.0 differential pairs
should not exceed 50-mils relative trace length difference.
Minimize the use of vias in the differential-pair paths as much as possible. If this is not practical, ensure that
the same via type and placement are used for both signals in a pair. Any vias used should be placed as close
as possible to the TUSB4020BI device.
Do not place power fuses across the differential-pair traces.
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11.2 Layout Example
Figure 11-1 shows an example layout of the upstream port to a USB3 Type B connector. The routing to a USB2
Type B connector will be similar.
Figure 11-1. Upstream Port
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Figure 11-2 shows an example layout of the Downstream Port to a USB3 Type A connector. The routing to a
USB2 Type A connector will be similar.
Figure 11-2. Downstream Port
Figure 11-3. Thermal Pad
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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14-Dec-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TUSB4020BIPHP
ACTIVE
HTQFP
PHP
48
250
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
T4020BI
TUSB4020BIPHPR
ACTIVE
HTQFP
PHP
48
1000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
T4020BI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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