TUSB501DRFR

TUSB501 www.ti.com SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013 USB 3.0 Single Channel Redriver with Equalization Check for Samples: TUSB501 FEATURES DESCRIPTION • The TUSB501 is a 3rd generation 3.3-V USB 3.0 single-channel redriver. When 5 Gbps SuperSpeed USB signals travel across a PCB or cable, signal integrity degrades due to loss and inter-symbol interference. The TUSB501 recovers incoming data by applying equalization that compensates channel loss, and drives out signals with a high differential voltage. This extends the possible channel length, and enables systems to pass USB 3.0 compliance. The TUSB501 advanced state machine makes it transparent to hosts and devices. 1 2 • • • • • • • Aggressive Low-Power Architecture (Typ): – 126 mW Active Power – 20 mW in U2/U3 – 3 mW with No Connection Automatic LFPS DE Control Excellent Jitter and Loss Compensation – 32 inches of FR4 4 mil Stripline – 3 m of 30 AWG cable Integrated Termination Small 2 x 2 mm QFN Package Selectable Receiver Equalization, Transmitter De-Emphasis and Output Swing Hot-Plug Capable ESD Protection ±5 kV HBM APPLICATIONS • Cell Phones, Computers, Docking Stations, TVs, Active Cables, Backplanes EQ DE OS Driver TX- RX- VCC GND Detect Receiver/ Equalizer Termination TX+ Termination RX+ rd 3 Generation State Machine LFPS Controller After power up, the TUSB501 periodically performs receiver detection on the TX pair. If it detects a SuperSpeed USB receiver, RX termination becomes enabled, and the TUSB501 is ready to redrive. The receiver equalizer has three gain settings that are controlled by pin EQ: 3 dB, 6 dB, and 9 dB. This should be set based on amount of loss before the TUSB501. Likewise, the output driver supports configuration of De-Emphasis and Output Swing (pins DE and OS). These settings allow the TUSB501 to be flexibly placed in the SuperSpeed USB path, with optimal performance. Over previous generations, the TUSB501 features reduced power in all link states, a stronger OS option, improved receiver equalization settings, and an intelligent LFPS Controller. This controller senses the low frequency signals and automatically disables driver de-emphasis, for full USB 3.0 compliance. The TUSB501 is packaged in a small 2 x 2 mm QFN, and operates through an industrial temperature range of –40°C to 85°C. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated TUSB501 SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DRF PACKAGE (TOP VIEW) VCC 1 8 DE RXP 2 7 TXP GND RXN 3 6 TXN OS 4 5 EQ PIN FUNCTIONS PIN NAME NO. RXP 2 RXN 3 TXN 6 TXP 7 EQ 5 DE OS 2 8 TYPE Differential input pair for 5 Gbps SuperSpeed USB signals. Differential I/O Differential output pair for 5 Gbps SuperSpeed USB signals. Sets the receiver equalizer gain. 3-state input with integrated pull-up and pulldown resistors. CMOS Input VCC 1 Thermal Pad Sets the output de-emphasis gain. 3-state input with integrated pull-up and pulldown resistors. Sets the output swing (differential voltage amplitude). 2-state input with an integrated pull-down resistor. 4 GND DESCRIPTION Power 3.3-V power supply Reference ground Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TUSB501 TUSB501 www.ti.com SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013 DEVICE CONFIGURATION Table 1. Control Pin Effects (Typical Values) PIN DESCRIPTION EQ (1) LOGIC STATE GAIN Low 3 dB Floating 6 dB High 9 dB Equalization Amount PIN DESCRIPTION LOGIC STATE OUTPUT DIFFERENTIAL VOLTAGE FOR THE TRANSITION BIT OS Output Swing Amplitude Low 930 mVpp High 1300 mVpp PIN DESCRIPTION LOGIC STATE DE De-Emphasis Amount High DE-EMPHASIS RATIO (1) FOR OS = LOW FOR OS = HIGH Low 0 dB –2.6 dB Floating –3.5 dB –5.9 dB –6.2 dB –8.3 dB Typical values ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) Supply voltage range (2) Voltage range at any input or output terminal Electrostatic discharge (1) MIN MAX VCC –0.5 4 V Differential I/O –0.5 4 V CMOS inputs –0.5 VCC + 0.5 V Human body model (all pins) (3) Charged-device model (all pins) UNIT ±5 (4) kV ±1.5 Storage temperature, TSTG –65 150 °C Maximum junction temperature, TJ -40 105 °C (1) (2) (3) (4) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the GND terminals. Tested in accordance with JEDEC Standard 22, Test Method A114-B. Tested in accordance with JEDEC Standard 22, Test Method C101-A. THERMAL INFORMATION THERMAL METRIC (1) TUSB501 DRF θJA Junction-to-ambient thermal resistance 102.4 θJC(top) Junction-to-case(top) thermal resistance 90.3 θJB Junction-to-board thermal resistance 21.2 ψJT Junction-to-top characterization parameter 70 ψJB Junction-to-board characterization parameter 3.6 θJC(bottom) Junction-to-case(bottom) thermal resistance 70.2 (1) UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TUSB501 3 TUSB501 SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013 www.ti.com RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) VCC Main power supply TA Operating free-air temperature CAC AC coupling capacitor MIN NOM MAX 3 3.3 3.6 V 85 °C nF –40 75 100 200 MIN TYP (1) MAX (2) UNIT POWER SUPPLY CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER ICC-ACTIVE Average active current TEST CONDITIONS UNIT Link in U0 with SuperSpeed USB data transmission, OS = Low 38.1 Link in U0 with SuperSpeed USB data transmission, OS = High 43.8 29.8 mA mA 65 ICC-IDLE Average current in idle state Link has some activity, not in U0, OS = Low ICC-U2U3 Average current in U2/U3 Link in U2 or U3 6.1 mA ICC-NC Average current with no connection No SuperSpeed USB device is connected to TXP, TXN 1.3 mA PD Power Dissipation in U0 OS = Low 126 OS = High 145 234 TYP MAX (1) (2) mW TYP values use VCC = 3.3 V, TA = 25°C. MAX values use VCC = 3.6 V, TA = –40°C. DC ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN UNIT 3-State CMOS Inputs (EQ, DE) VIH High-level input voltage VIM Mid-level input voltage 2.8 VIL Low-level input voltage VF Floating voltage RPU RPD IIH High-level input current VIN = 3.6 V IIL Low-level input current VIN = GND, VCC = 3.6 V V VCC / 2 V 0.6 VIN = High impedance V VCC / 2 V Internal pull-up resistance 190 kΩ Internal pull-down resistance 190 kΩ 36 µA -36 µA 2 V 2-State CMOS Input (OS) VIH High-level input voltage VIL Low-level input voltage VF Floating voltage RPD Internal pull-down resistance IIH High-level input current VIN = 3.6 V IIL Low-level input current VIN = GND 4 0.5 VIN = High impedance Submit Documentation Feedback V 270 kΩ 26 -1 V GND µA µA Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TUSB501 TUSB501 www.ti.com SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013 AC ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN AC-coupled differential peak-to-peak signal 100 TYP MAX UNIT 1200 mVpp Differential Receiver (RXP, RXN) VDIFF-pp Input differential voltage swing VCM-RX Common-mode voltage bias in the receiver (DC) ZRX-DIFF Differential input impedance (DC) Present after a SuperSpeed USB device is detected on TXP/TXN 72 91 120 Ω ZRX-CM Common-mode input impedance (DC) Present after a SuperSpeed USB device is detected on TXP, TXN 18 22.8 30 Ω ZRX-HIGH- Common-mode input impedance with termination disabled (DC) Present when no SuperSpeed USB device is detected on TXP, TXN. Measured over the range of 0-500 mV with respect to GND. 25 35 Low Frequency Periodic Signaling (LFPS) Detect Threshold Below the minimum is squelched IMP-DC-POS VRX-LFPSDET-DIFF-pp 3.3 100 V kΩ 300 mVpp Differential Transmitter (TXP, TXN) VTX-DIFF-PP Transmitter differential voltage swing OS = Low, No load (transition-bit) OS = High, No load VTX-DE- Transmitter de-emphasis DE = Floating, OS = Low CTX TX input capacitance to GND At 2.5 GHz ZTX-DIFF Differential impedance of the driver ZTX-CM Common-mode impedance of the driver Measured with respect to AC ground over 0-500 mV ITX-SC TX short circuit current TX ± shorted to GND VCM-TX Common-mode voltage bias in the transmitter (DC) VCM-TX-AC AC common-mode voltage swing in active mode Within U0 and within LFPS VTX-IDLE- Differential voltage swing during electrical idle Tested with a high-pass filter Absolute delta of DC CM voltage during active and idle states Restrict the test condition to meet 100 mV DC electrical idle differential output voltage Voltage must be low pass filtered to remove any AC component 930 mVpp 1300 -3.5 dB RATIO DIFF -AC-pp VTX-CMDeltaU1-U0 VTX-idle-diffDC 1.25 75 93 18.75 1.2 0 0 pF 125 Ω 31.25 Ω 60 mA 2.5 V 100 mVpp 10 mVpp 100 mV 12 mV Differential Transmitter (TXP, TXN) tR, tF Output rise, fall time see Figure 4 20%-80% of differential voltage measured 1 inch from the output pin tRF-MM Output Rise, Fall time mismatch 20%-80% of differential voltage measured 1 inch from the output pin tdiff-LH, tdiff-HL Differential propagation delay see Figure 2 De-emphasis = -3.5 dB propagation delay between 50% level at input and output tidleEntry, tidleExit Idle entry and exit times see Figure 3 80 ps 20 290 ps 3.6 ns Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TUSB501 ps 5 TUSB501 SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013 www.ti.com AC ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Timing Time from power applied until RX termination tREADY Apply 0 V to VCC, connect SuperSpeed USB termination to TX±, apply 3.3 V to VCC, and measure when ZRX-DIFF is enabled. 9 ms Jitter (1) (2) TJTX-EYE Total jitter DJTX Deterministic jitter RJTX (1) (2) (3) (4) Random jitter EQ = Floating, OS = High, DE = High See Figure 1. (2) (2) (4) 0.213 UI (3) 0.197 UI (3) 0.016 UI (3) Includes RJ at 10-12. Measured at the ends of reference channel in Figure 1 with K28.5 pattern, VID = 1000 mVpp, 5 Gbps, -3.5 dB de-emphasis from source. UI = 200 ps. Rj calculated as 14.069 times the RMS random jitter for 10-12 BER. spacer PARAMETER MEASUREMENT INFORMATION Jitter Measurement A TUSB501 AWG 24" 4" Up to 3m (30AWG) 1"-6" Figure 1. Jitter Measurement Setup spacer IN Tdiff_LH Tdiff_HL OUT Figure 2. Propagation Delay 6 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TUSB501 TUSB501 www.ti.com SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013 PARAMETER MEASUREMENT INFORMATION (continued) IN+ Vcm VRX-LFPS-DET-DIFF-pp INtidleExit t idleEntry OUT+ Vcm OUT- Figure 3. Electrical Idle Mode Exit and Entry Delay spacer 80% 20% tr tf Figure 4. Output Rise and Fall Times spacer Transition bit Transition bit Consecutive bits Consecutive bits DE = 0dB 415mV DE = -3.5dB DE = -6.2dB VTX-DIFF- PP 0V DE = -6.2dB DE = -3.5dB DE = 0dB -415mV 0ps 200ps 400ps 600ps 800ps 1000ps 1200ps Figure 5. Transmitter Differential Voltage, OS = L Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TUSB501 7 TUSB501 SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Figure 6. Input for Typical Output Measurement at TUSB501 at TA = 25°C 8 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TUSB501 TUSB501 www.ti.com SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013 PARAMETER MEASUREMENT INFORMATION (continued) Figure 7. Typical Output Eye for Jitter Measurement Setup in Figure 1 at TA = 25°C, DE = HIGH, OS = HIGH, EQ = NC Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TUSB501 9 TUSB501 SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013 www.ti.com REVISION HISTORY Changes from Original (August 2013) to Revision A • 10 Page Changed from Product Preview to Production Data ............................................................................................................. 1 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TUSB501 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TUSB501DRFR ACTIVE WSON DRF 8 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 T501 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of