User's Guide
SLLU244 – August 2016
TUSB522P EVM
This is the user guide for the evaluation module (EVM) of the TUSB522P. The purpose of this user guide
is to facilitate an easy evaluation process of the TUSB522P USB 3.1 SuperSpeed (5 Gbps) Re-Driver.
The contents of this user’s guide are meant to provide an overview of the TUSB522P, including the key
features, operating conditions, and how to setup this EVM for use in a system level evaluation.
The construction of the TUSB522P EVM also serves as a reference design that can be easily modified for
any intended application. Target applications include cell phones, computers, docking stations, TVs, and
active cables. Schematic and layout information is included at the end of this manual.
1
2
3
4
Contents
Introduction ................................................................................................................... 2
TUSB522P EVM Configuration ............................................................................................ 3
2.1
Description of EVM Board ......................................................................................... 3
2.2
TUSB522P Configuration Pins .................................................................................... 5
2.3
Monitoring the Device Current .................................................................................... 5
PCB Construction ............................................................................................................ 6
3.1
TUSB522P EVM Board Schematics ............................................................................. 6
3.2
TUSB522P EVM Board Layout ................................................................................... 8
EVM Material Listing ....................................................................................................... 12
List of Figures
1
TUSB522P Functional System Level Block Diagram ................................................................... 2
2
EVM (Top Side) .............................................................................................................. 3
3
TUSB522P EVM Schematic (High Speed Pins / Power) ............................................................... 6
4
TUSB522P EVM Schematic (Device Control Pins) ..................................................................... 7
5
EVM Layout Layer 1 (Top) ................................................................................................. 8
6
EVM Layout Layer 2 (GND) ................................................................................................ 9
7
EVM Layout Layer 3 (VCC) ............................................................................................... 10
8
EVM Layout Layer 4 (Bottom) ............................................................................................ 11
List of Tables
1
Jumper / Switch Description and Settings ................................................................................ 4
2
TUSB522P Equalization Selection Table ................................................................................. 5
3
TUSB522P Output Swing Amplitude ...................................................................................... 5
4
TUSB522P De-Emphasis
5
.................................................................................................. 5
Bill of Materials ............................................................................................................. 12
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1
Introduction
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Introduction
The TUSB522P is a dual channel, USB 3.1 SuperSpeed re-driver and signal conditioner supporting data
rates of 5.0 Gbps. The device complies with USB 3.1 spec revision 1.0, supporting electrical idle condition
and low frequency periodic signals (LFPS) for USB 3.1 power management modes.
The device offers programmable equalization that extends the interconnect distance between two devices.
Also, the device supports low power modes when unplugged. The device can also function in USB
compliance mode to test the transmitter for compliance to voltage and timing specifications per USB 3.1
compliance specs.
This EVM was designed to be used as a medium connection between a USB host and a USB device. The
interface to the EVM consists of a USB 3.1 Type A Receptacle and a USB 3.1 Type B Receptacle.
Therefore, in order to connect the EVM to your system set up, the user will most likely need 2 USB 3.1
Standard Type AM B cables. Your test setup should look similar to Figure 1.
USB 3.1 Host/Source (Desktop, Laptop, Docking Station, etc)
USB 3.1 Type A Receptacle
USB 3.1
Type A ÆB
Cable
USB 3.1 Type B Receptacle [INPUT]
TUSB522P EVM
USB 3.1 Type A Receptacle [OUTPUT]
USB 3.1
Type A ÆB
Cable
USB 3.1 Type B Receptacle
USB 3.1 Device/Sink (External Hard Drive, Thumb Drive, etc)
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Figure 1. TUSB522P Functional System Level Block Diagram
2
TUSB522P EVM
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TUSB522P EVM Configuration
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2
TUSB522P EVM Configuration
This EVM kit should contain the following items:
• TUSB522P EVM board
• This user’s manual
2.1
Description of EVM Board
The TUSB522P EVM is designed to provide easy evaluation of the TUSB522P device. It is also meant to
serve as a reference design to show a practical example of how to use the device in a mass-production
system. Figure 2 highlights the jumpers and switch installed on this EVM and Table 1 highlights their
functionality and configuration.
Figure 2. EVM (Top Side)
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TUSB522P EVM Configuration
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Table 1. Jumper / Switch Description and Settings
4
Jumper
Functionality and Configuration
J1
EQ1
1-2 = 1 (1K to VCC)
3-4 = R (20K to GND)
5-6 = 0 (1K to GND)
NC = F (No Connect)
J2
DE2
1-2 = 1 (1K to VCC)
3-4 = R (20K to GND)
5-6 = 0 (1K to GND)
NC = F (No Connect)
J3
DE1
1-2 = 1 (1K to VCC)
3-4 = R (20K to GND)
5-6 = 0 (1K to GND)
NC = F (No Connect)
J4
EQ2
1-2 = 1 (1K to VCC)
3-4 = R (20K to GND)
5-6 = 0 (1K to GND)
NC = F (No Connect)
J5
OS2
1-2 = 1 (1K to VCC)
3-4 = R (20K to GND)
5-6 = 0 (1K to GND)
NC = F (No Connect)
J6
NC2
1-2 = 1 (1K to VCC)
3-4 = R (20K to GND)
5-6 = 0 (1K to GND)
NC = F (No Connect)
J7
NC1
1-2 = 1 (1K to VCC)
3-4 = R (20K to GND)
5-6 = 0 (1K to GND)
NC = F (No Connect)
J8
OS1
1-2 = 1 (1K to VCC)
3-4 = R (20K to GND)
5-6 = 0 (1K to GND)
NC = F (No Connect)
J9/SW1
EN_RXD (Shutdown Mode)
1-2 = 1K to GND
NC = Internal Pull-up (Default)
SW1 = Push to Short EN to GND
J10
RSVD
1-2 = 1K to GND
NC = Internal Pull-up (Default)
J11
VCC 3.3V
1-2 = VCC_3.3V Provided from U2 (Default)
NC = Provide external 3.3 V on Pin 2
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TUSB522P EVM Configuration
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2.2
TUSB522P Configuration Pins
The equalization, output swing amplitude, and de-emphasis levels of each channel are configured via EQ,
DE and OS pin states. Table 2 through Table 4 list all possible levels that can be achieved with the
TUSB522P.
Table 2. TUSB522P Equalization Selection Table
Equalization Level
EQx Pin Level
EQ Gain at 2.5 GHz (dB)
Low
3
Floating
6
High
9
Table 3. TUSB522P Output Swing Amplitude
Equalization Level
OSx Pin Level
Transition Bit Output Differential Voltage (mV)
Low
900
High
1200
Table 4. TUSB522P De-Emphasis
DEx
2.3
De-Emphasis Ratio (dB)
OS = Low
OS = High
Low
0
–2.6
Floating
–3.5
–5.9
High
–6.2
–8.3
Monitoring the Device Current
The TUSB522P EVM includes the option of monitoring the current draw of the device. In order to enable
this feature, the following steps must be taken:
1. Un-install the shunt located at JMP11 and remove R26.
2. Obtain a power supply with the ability to display its current draw (or connect a current meter in series
to the power supply)
3. Connect to 3.3 V of external power source to VCC_3.3V (J11-2) and GND of the external supply to a
convenient GND location on the EVM (J10-2).
4. Turn on your power supply and observe the measured current on your power supply display (or current
meter)
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PCB Construction
3
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PCB Construction
This section discusses the construction of the EVM boards. It includes the board schematics and layout files to show how the board was built.
3.1
TUSB522P EVM Board Schematics
Figure 3 and Figure 4 illustrate the EVM schematics.
DE1
EQ2
VBUS
CH2_EQ1
CFG2
CH2_EQ2
SLP_S0#
OS1
RSV
P1
P2
TX1P_Conn
5
TX1N_Conn
C1
C2
0.1uF
0.1uF
22
TX1N
23
24
RSVD1
NC2
USB3.0 Type B Receptacle
TX1P
14
13
VCC
15
OS1
RSV
16
17
18
TUSB522PRGE
TX1P
RX1P
TX1N
RX1N
NC
PAD
1
25
GND
12
TX2P
TX2P_Conn
9
11
TX2N
TX2N_Conn
8
C4
10
7
9
RX1P
6
8
RX1N
5
7
NC
0.1uF
MODE
NC1
USB2_DM
USB2_DP
GND
SS_TX_P
SS_TX_N
GND_Drain
SS_RX_P Shield2
SS_RX_N Shield1
11
10
USB3 Type A Receptacle
NC
6
GND
0.1uF
C3
VBUS
6
21
TX2N
EN_RXD
7
RX2N
OS2
20
4
TX2P
5
RX2N
DE1
EQ2
8
3
USB2_DP
RX2P
EN
SS_TX_N
19
4
SS_TX_P
RX2P
CFG1
Shield2
9
DE2
11
Shield1 GND_DRAIN
4
1
2
USB2_DM
U1
USB2_DP
EQ1
10
VBUS
VBUS
USB2_DM
3
SS_RX_N
USB2_DP
CH1_EQ2
SS_RX_P
USB2_DM
3
NC
GND
2
VCC
USB2_DP
VCC_3.3V
VBUS
2
USB2_DM
1
CH1_EQ1
VBUS
VCC_3.3V
EQ1
EN_RXD
DE2
OS2
Silkscreen:
J11-1
3.3V VREG
J11-2
VCC_3.3V
VCC_3.3V
3.3V
VBUS
U2
1
2
C5
10uF
C7
1uf
3
VIN
J11
VOUT
5
C6
GND
EN
1
3.3V
N/C
4
10uF
2
HDR2X1 M .1
C8
1uf
R28
300 Ohm
R26
LP5907
C15
C9
22uF
1uF
C10
C11
C12
1uF 0.1uF 0.1uF
C13
C14
0.01uF
0.01uF
0 Ohm
D1
LED Green 0805
Silkscreen:
3.3V VREG
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Figure 3. TUSB522P EVM Schematic (High Speed Pins / Power)
6
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PCB Construction
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VCC_3.3V
VCC_3.3V
J1
CH1_EQ1
1
3
5
2
4
6
HDR3X2 .1X.1
R1
1k
R2
20k
R3
1k
Silkscreen:
CH1_EQ1 Selection
1-2 = 1
3-4 = R
5-6 = 0
NC = F
J3
1
3
5
CH2_EQ1
2
4
6
R7
1k
R8
20k
R9
HDR3X2 .1X.1
Silkscreen:
CH2_EQ1 Selection
1-2 = 1
3-4 = R
5-6 = 0
NC = F
1k
VCC_3.3V
VCC_3.3V
R4
J2
CH1_EQ2
1
3
5
2
4
6
HDR3X2 .1X.1
R5
R6
1k
20k
R10
J4
Silkscreen:
CH1_EQ2 Selection
1-2 = 1
3-4 = R
5-6 = 0
NC = F
1
3
5
CH2_EQ2
2
4
6
HDR3X2 .1X.1
1k
R12
1k
1k
VCC_3.3V
R13
J5
CFG1
1
3
5
2
4
6
1k
R14
20k
R15
1k
VCC_3.3V
Silkscreen:
CFG1 Selection
1-2 = 1
3-4 = R
5-6 = 0
NC = F
R16
J6
1
3
5
RSVD1
HDR3X2 .1X.1
2
4
6
1k
20k
R17
R18
1k
R22
1k
R19
J7
MODE
2
4
6
Silkscreen:
RSVD1 Selection
1-2 = 1
3-4 = R
5-6 = 0
NC = F
HDR3X2 .1X.1
VCC_3.3V
1
3
5
Silkscreen:
CH2_EQ2 Selection
1-2 = 1
3-4 = R
5-6 = 0
NC = F
20k
R11
1k
R20
20k
R21
1k
VCC_3.3V
J8
Silkscreen:
MODE Selection
1-2 = 1
3-4 = R
5-6 = 0
NC = F
1
3
5
CFG2
2
4
6
R23
20k
1k
R24
Silkscreen:
CFG2 Selection
1-2 = 1
3-4 = R
5-6 = 0
NC = F
HDR3X2 .1X.1
HDR3X2 .1X.1
VCC_3.3V
R27
10k
J10
SLP_S0#
1
J9
2
1
EN
HDR2X1 M .1
R25
1k
HDR2X1 M .1
A2
A1
C16
.22uF
B A
B A
Silkscreen:
RESET
B2
B1
Silkscreen:
SLP_S0#
2
Silkscreen:
EN
SW1
Switch - Push Button
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Figure 4. TUSB522P EVM Schematic (Device Control Pins)
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PCB Construction
3.2
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TUSB522P EVM Board Layout
This EVM was designed to show the implementation on a 4-layer board. Figure 5 through Figure 8 display
the EVM PCB board layout.
Figure 5. EVM Layout Layer 1 (Top)
8
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PCB Construction
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Figure 6. EVM Layout Layer 2 (GND)
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PCB Construction
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Figure 7. EVM Layout Layer 3 (VCC)
10
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PCB Construction
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Figure 8. EVM Layout Layer 4 (Bottom)
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EVM Material Listing
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EVM Material Listing
Table 5 is the complete BOM for the TUSB522P EVM.
Table 5. Bill of Materials
12
Item
Qty
1
6
C1,C2,C3,C4,C11,C12
Reference
0.1uF
Part
2
2
C5,C6
10uF
3
4
C7,C8,C9,C10
1uF
4
2
C13,C14
0.01uF
5
1
C15
22uF
6
1
C16
.22uF
7
1
D1
LED Green 0805
8
8
J1,J2,J3,J4,J5,J6,J7,J8
HDR3X2 .1X.1
9
3
J9,J10,J11
HDR2X1 M .1
10
1
P1
USB3.0 Type B Receptacle
11
1
P2
USB3 Type A Receptacle
12
17
R1,R3,R4,R6,R7,R9,R10,R12,R13,R15,R16,R18,R19,
R21,R22, R24,R25
1k
13
8
R2,R5,R8,R11,R14,R17,R20,R23
20k
14
1
R26
0 Ohm
15
1
R27
10k - NO POP
16
1
R28
300 Ohm
17
1
SW1
Switch - Push Button
18
1
U1
TUSB522PRGE
19
1
U2
LP5907
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
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