UA79M08CKTPR

µ
   
  
 
 SLVS060K − JUNE 1976 − REVISED APRIL 2005 D 3-Terminal Regulators D Output Current Up To 500 mA D No External Components D High Power-Dissipation Capability D Internal Short-Circuit Current Limiting D Output Transistor Safe-Area Compensation µA79M05, µA79M08 . . . KTP PACKAGE (TOP VIEW) INPUT µA79M05 . . . KC (TO-220) PACKAGE (TOP VIEW) INPUT OUTPUT INPUT COMMON OUTPUT INPUT COMMON INPUT µA79M05 . . . KCS (TO-220) PACKAGE (TOP VIEW) OUTPUT INPUT COMMON description/ordering information This series of fixed-negative-voltage integrated-circuit voltage regulators is designed to complement the µA78M00 series in a wide range of applications. These applications include on-card regulation for elimination of noise and distribution problems associated with single-point regulation. Each of these regulators delivers up to 500 mA of output current. The internal current-limiting and thermal-shutdown features of these regulators essentially make them immune to overload. In addition to use as fixed-voltage regulators, these devices can be used with external components to obtain adjustable output voltages and currents, and also as the power-pass element in precision regulators. ORDERING INFORMATION TJ 0°C to 125°C VO(NOM) (V) −5 ORDERABLE PART NUMBER PACKAGE† PowerFLEX (KTP) Reel of 3000 µA79M05CKTPR TO-220 (KC) Tube of 50 µA79M05CKC TO-220, short shoulder (KCS) Tube of 20 µA79M05CKCS TOP-SIDE MARKING µA79M05C µA79M05C A79M05C −8 PowerFLEX (KTP) Reel of 3000 µA79M08CKTPR µA79M08C † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerFLEX is a trademark of Texas Instruments. Copyright  2005, Texas Instruments Incorporated   

  !   "#$ %!& %   "! "! '! !  !( ! %% )*& % "!+ %!  !!$* $%! !+  $$ "!!& POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 µ
   
  
 
 SLVS060K − JUNE 1976 − REVISED APRIL 2005 schematic COMMON 4.5 kΩ to 6.3 kΩ 1.7 kΩ to 18 kΩ OUTPUT 0.1 Ω 0.2 Ω INPUT Resistor values shown are nominal. absolute maximum ratings over virtual junction temperature range (unless otherwise noted)† Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 V Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. package thermal data (see Note 1) PowerFLEX (KTP) High K, JESD 51-5 θJC 19°C/W TO-220 (KC/KCS) High K, JESD 51-5 17°C/W PACKAGE BOARD θJA 28°C/W 19°C/W θJP‡ 1.4°C/W 3°C/W NOTE 1: Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. ‡ For packages with exposed thermal pads, such as QFN, PowerPAD, or PowerFLEX, θJP is defined as the thermal resistance between the die junction and the bottom of the exposed pad. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 µ
   
  
 
 SLVS060K − JUNE 1976 − REVISED APRIL 2005 recommended operating conditions VI Input voltage IO TJ Output current MIN MAX µA79M05C −7 −25 µA79M08C −10.5 −25 Operating virtual junction temperature 0 UNIT V 500 mA 125 °C electrical characteristics at specified virtual junction temperature, VI = −10 V, IO = 350 mA, TJ = 25°C (unless otherwise noted) µA79M05C TEST CONDITIONS† PARAMETER Output voltage VI = −7 V to −25 V, Input voltage regulation VI = −7 V to −25 V VI = −8 V to −18 V Ripple rejection VI = −8 V to −18 V, f = 120 Hz Output voltage regulation IO = 5 mA to 500 mA IO = 5 mA to 350 mA Temperature coefficient of output voltage IO = 5 mA, Output noise voltage f = 10 Hz to 100 kHz IO = 5 mA to 350 mA IO = 100 mA, IO = 300 mA TJ = 0°C to 125°C TJ = 0°C to 125°C MIN TYP MAX −4.8 −5 −5.2 −4.75 −5.25 7 50 3 30 54 100 mV −0.4 mV/°C 125 µV 1.1 Bias current 1 Bias current change VI = −8 V to −18 V, IO = 5 mA to 350 mA, Short-circuit output current VI = −30 V mV dB 60 50 Dropout voltage V 50 75 TJ = 0°C to 125°C UNIT TJ = 0°C to 125°C TJ = 0°C to 125°C V 2 mA 0.4 0.4 140 mA mA Peak output current 0.65 A † Pulse-testing techniques maintain TJ as close to TA as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 2-µF capacitor across the input and a 1-µF capacitor across the output. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 µ
   
  
 
 SLVS060K − JUNE 1976 − REVISED APRIL 2005 electrical characteristics at specified virtual junction temperature, VI = −19 V, IO = 350 mA, TJ = 25°C (unless otherwise noted) µA79M08C TEST CONDITIONS† PARAMETER Output voltage VI = −10.5 V to −25 V, Input voltage regulation VI = −10.5 V to −25 V VI = −11 V to −21 V Ripple rejection VI = −11.5 V to −21.5 V, f = 120 Hz Output voltage regulation IO = 5 mA to 500 mA IO = 5 mA to 350 mA Temperature coefficient of output voltage IO = 5 mA, Output noise voltage Dropout voltage IO = 5 mA to 350 mA IO = 100 mA, IO = 300 mA TJ = 0°C to 125°C TJ = 0°C to 125°C MIN TYP MAX −7.7 −8 −8.3 −7.6 −8.4 8 80 4 50 V mV 50 54 dB 59 90 160 mV 60 TJ = 0°C to 125°C UNIT −0.6 mV/°C f = 10 Hz to 100 kHz 200 µV IO = 5 mA 1.1 Bias current 1 Bias current change VI = −10.5 V to −25 V, IO = 5 mA to 350 mA, Short-circuit output current VI = −30 V TJ = 0°C to 125°C TJ = 0°C to 125°C V 2 mA 0.4 0.4 140 mA mA Peak output current 0.65 A † Pulse-testing techniques maintain TJ as close to TA as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 2-µF capacitor across the input and a 1-µF capacitor across the output. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 21-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 7704001HA OBSOLETE CFP U 10 TBD Call TI Call TI -55 to 125 UA79M05CKC OBSOLETE TO-220 KC 3 TBD Call TI Call TI 0 to 125 UA79M05C UA79M05CKCE3 OBSOLETE TO-220 KC 3 TBD Call TI Call TI 0 to 125 UA79M05C UA79M05CKCS ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 UA79M05C UA79M05CKCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 UA79M05C UA79M05CKTPR OBSOLETE PFM KTP 2 TBD Call TI Call TI 0 to 125 UA79M05C UA79M05CKTPRG3 OBSOLETE PFM KTP 2 TBD Call TI Call TI 0 to 125 UA79M05C UA79M05CKVURG3 ACTIVE TO-252 KVU 3 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 79M05C UA79M05MUB OBSOLETE CFP U 10 TBD Call TI Call TI -55 to 125 UA79M08CKC OBSOLETE TO-220 KC 3 TBD Call TI Call TI 0 to 125 UA79M08CKTPR OBSOLETE PFM KTP 2 TBD Call TI Call TI 0 to 125 UA79M08C UA79M08CKTPRG3 OBSOLETE PFM KTP 2 UA79M08CKVURG3 ACTIVE TO-252 KVU 3 2500 2500 TBD Call TI Call TI 0 to 125 UA79M08C Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 79M08C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-May-2013 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UA79M05CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 UA79M08CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UA79M05CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 UA79M08CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 Pack Materials-Page 2 PACKAGE OUTLINE KCS0003B TO-220 - 19.65 mm max height SCALE 0.850 TO-220 4.7 4.4 10.36 9.96 1.32 1.22 2.9 2.6 6.5 6.1 8.55 8.15 (6.3) ( 3.84) 12.5 12.1 19.65 MAX 9.25 9.05 3X 3.9 MAX 13.12 12.70 3 1 3X 3X 0.47 0.34 0.90 0.77 2.79 2.59 2X 2.54 1.36 1.23 5.08 4222214/A 10/2015 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-220. www.ti.com EXAMPLE BOARD LAYOUT KCS0003B TO-220 - 19.65 mm max height TO-220 0.07 MAX ALL AROUND 3X 2X (1.7) METAL (1.2) 2X SOLDER MASK OPENING (1.7) R (0.05) SOLDER MASK OPENING 2 1 (2.54) 3 0.07 MAX ALL AROUND (5.08) LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE:15X 4222214/A 10/2015 www.ti.com IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice. This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services. These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation modules, and samples (http://www.ti.com/sc/docs/sampterms.htm). Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated