application
INFO
available
UC2855A/B
UC3855A/B
High Performance Power Factor Preregulator
FEATURES
DESCRIPTION
• Controls Boost PWM to Near Unity
Power Factor
The UC3855A/B provides all the control features necessary for high
power, high frequency PFC boost converters. The average current mode
control method allows for stable, low distortion AC line current programming without the need for slope compensation. In addition, the UC3855
utilizes an active snubbing or ZVT (Zero Voltage Transition technique) to
dramatically reduce diode recovery and MOSFET turn-on losses, resulting in lower EMI emissions and higher efficiency. Boost converter switching frequencies up to 500kHz are now realizable, requiring only an
additional small MOSFET, diode, and inductor to resonantly soft switch
the boost diode and switch. Average current sensing can be employed using a simple resistive shunt or a current sense transformer. Using the current sense transformer method, the internal current synthesizer circuit
buffers the inductor current during the switch on-time, and reconstructs the
inductor current during the switch off-time. Improved signal to noise ratio
and negligible current sensing losses make this an attractive solution for
higher power applications.
• Fixed Frequency Average Current
Mode Control Minimizes Line Current
Distortion
• Built-in Active Snubber (ZVT) allows
Operation to 500kHz, improved EMI
and Efficiency
• Inductor Current Synthesizer allows
Single Current Transformer Current
Sense for Improved Efficiency and
Noise Margin
• Accurate Analog Multiplier with Line
Compensator allows for Universal
Input Voltage Operation
• High Bandwidth (5MHz), Low Offset
Current Amplifier
• Overvoltage and Overcurrent
protection
• Two UVLO Threshold Options
• 150µA Startup Supply Current Typical
• Precision 1% 7.5V Reference
The UC3855A/B also features a single quadrant multiplier, squarer, and
divider circuit which provides the programming signal for the current loop.
The internal multiplier current limit reduces output power during low line
conditions. An overvoltage protection circuit disables both controller outputs in the event of a boost output OV condition.
Low startup supply current, UVLO with hysteresis, a 1% 7.5V reference,
voltage amplifier with softstart, input supply voltage clamp, enable comparator, and overcurrent comparator complete the list of features. Available packages include: 20 pin N, DW, Q, J, and L.
BLOCK DIAGRAM
License Patent from Pioneer Magnetics. Pin numbers refer to DIL-20 J or N packages.
SLUS328B JUNE 1998 - REVISED October 2005
UDG-94001-2
UC2855A/B
UC3855A/B
CONNECTION DIAGRAMS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage VCC. . . . . . . . . . . . . . . . . . . . . . . . . . Internally Limited
VCC Supply Clamp Current . . . . . . . . . . . . . . . . . . . . . . . 20mA
PFC Gate Driver Current (continuous) . . . . . . . . . . . . . . ± 0.5A
PFC Gate Driver Current (peak) . . . . . . . . . . . . . . . . . . . ± 1.5A
ZVT Drive Current (continuous) . . . . . . . . . . . . . . . . . . . ± 0.25A
ZVT Drive Current (peak). . . . . . . . . . . . . . . . . . . . . . . . ± 0.75A
Input Current (IAC, RT, RVA) . . . . . . . . . . . . . . . . . . . . . . . 5mA
Analog Inputs (except Peak Limit) . . . . . . . . . . . . . . −0.3 to 10V
Peak Limit Input . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to 6.5V
Softstart Sinking Current . . . . . . . . . . . . . . . . . . . . . . . . . 1.5mA
Storage Temperature . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . −55°C to +150°C
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300°C
PLCC-20 & LCC-20 (Top View)
Q or L Package
Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages. All voltages are
referenced to GND.
DIL–20 (Top View)
J or N Package
SOIC-20 (Top View)
DW Package
ELECTRICAL CHARACTERISTICS:Unless otherwise specified: VCC = 18V, RVS = 23k, CT = 470pF, CI = 150pF, VRMS
= 1.5V, IAC = 100µA, ISENSE = 0V, CAO = 4V, VAOUT= 3.5V, VSENSE = 3V. –40°C to 85°C (UC2855A/B), 0°C to 70°C
(UC3855A/B).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
CAO, VAOUT = 0V, VCC = UVLO −0.3V
150
500
µA
17
25
mA
VCC Turn-On Threshold
UC3855A
15.5
17.5
VCCTurn-Off Threshold
UC3855A,B
Overall
Supply Current, OFF
Supply Current, OPERATING
9
VCC Turn-On Threshold
UC3855B
VCC Clamp
I(VCC) = ICC(on) + 5mA
10
V
V
10.5
10.8
V
20
22
V
3.1
V
−500
25
500
nA
18
Voltage Amplifier
Input Voltage
2.9
VSENSE Bias Current
Open Loop Gain
VOUT = 2 to 5V
65
80
VOUT High
ILOAD = –300µA
5.75
6
6.25
VOUT Low
ILOAD = 300µA
0.3
0.5
V
Output Short Circuit Current
VOUT = 0V
0.6
3
mA
2
dB
V
UC2855A/B
UC3855A/B
ELECTRICAL CHARACTERISTICS:Unless otherwise specified: VCC = 18V, RVS = 23k, CT = 470pF, CI = 150pF, VRMS
= 1.5V, IAC = 100µA, ISENSE = 0V, CAO = 4V, VAOUT= 3.5V, VSENSE = 3V. –40°C to 85°C (UC2855A/B), 0°C to 70°C
(UC3855A/B).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNITS
Current Amplifier
−4
4
mV
Input Offset Voltage
VCM = − 2.5V
−500
500
nA
Input Bias Current (Sense)
VCM = 2.5V
80
110
dB
Open Loop Gain
VCM = 2.5V, VOUT = 2 to 6V
ILOAD = −500µA
6
V
VOUT High
ILOAD = 500µA
0.3
0.5
V
VOUT Low
1
3
mA
Output Short Circuit Current
VOUT = 0V
Common Mode Range
−0.3
5
V
2.5
5
MHz
Gain Bandwidth Product
FIN = 100kHz, 10mV, P–P, TA = 25°C
Reference
7.388
7.5
7.613
V
Output Voltage
IREF = 0mA, TA = 25°C
7.313
7.5
7.688
V
IREF = 0mA
−15
15
mV
Load Regulation
IREF = 1 to 10 mA
Line Regulation
VCC = 15 to 35V
−10
10
mV
Short Circuit Current
REF = 0V
20
45
65
mA
Oscillator
170
200
230
kHz
Initial Accuracy
TA = 25°C
1
%
Voltage Stability
VCC = 12 to 18V
Total Variation
Line, Temp.
160
240
kHz
Ramp Amplitude (P–P)
Outputs at 0% duty cycle
4.7
5.7
V
Ramp Valley Voltage
1.1
1.6
V
Enable/OVP/Current Limit
Enable Threshold
1.8
2.2
V
OVP Threshold
7.5
7.66
V
OVP Hysteresis
200
400
600
mV
OVP Propagation Delay
200
ns
OVP Input Bias Current
V= 7.5V
1
10
µA
1.25
1.5
1.75
V
PKLIMIT Threshold
VPKLIMIT = 1.5V
100
µA
PKLIMIT Input Current
100
ns
PKLIMIT Prop. Delay
Soft Start
Soft Start Charge Current
-10
-13
-20
mA
Soft Start Discharge Current
2
10
20
mA
Multiplier
Output Current - IAC Limited
IAC = 100µA, VRMS = 1V
−235 −205 −175
µA
Output Current - Zero
IAC = 0µA
−2
−0.2
2
µA
Output Current - Power Limited
VRMS = 1.5V, VAOUT = 5.5V
−250 −209 −160
µA
Output Current
VRMS = 1.5V, VAOUT = 2V
−26
µA
VRMS = 1.5V VAOUT = 5V
−190
µA
VRMS = 5V, VAOUT = 2V
−3
µA
VRMS = 5V, VAOUT = 5V
−17
µA
Gain Constant
Refer to Note 1
−0.95 −0.85 −0.75
1/V
3
UC2855A/B
UC3855A/B
ELECTRICAL CHARACTERISTICS:Unless otherwise specified: VCC = 18V, RVS = 23k, CT = 470pF, CI = 150pF, VRMS
= 1.5V, IAC = 100µA, ISENSE = 0V, CAO = 4V, VAOUT= 3.5V, VSENSE = 3V. –40°C to 85°C (UC2855A/B), 0°C to 70°C
(UC3855A/B).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNITS
Gate Driver Output
Output High Voltage
Output Low Voltage
Output Low Voltage
Output Low (UVLO)
Output RISE/FALL Time
Output Peak Current
lOUT = −200mA, VCC = 15V
lOUT = 200mA
lOUT = 10mA
lOUT = 50mA, VCC = 0V
CLOAD = 1nF
CLOAD = 10nF
ZVT
ZVS Threshold
Input Bias Current
Propagation Delay
Maximum Pulse Width
Output High Voltage
Output Low Voltage
0.5
2.3
V = 2.5V, VCT = 0
Measured at ZVTOUT
lOUT = −100mA, VCC = 15V
lOUT = 100mA
lOUT = 10mA
lOUT = 50mA, VCC = 0V
CLOAD = 1nF
CLOAD = 10nF
Output Low (UVLO)
Output RISE/FALL Time
Output Peak Current
Current Synthesizer
ION to CS Offset
Cl Discharge Current
VION = 0V
IAC = 50µA
IAC = 500µA
IAC Offset Voltage
ION Buffer Slew Rate
ION Input Bias Current
RVS Output Voltage
Note 1: Gain constant (K) =
12
12
0.25
105
0.3
VION = 2V
23k from RVS to GND
IAC • (VAOUT – 1. 5V )
(VR MS 2 • IMO )
2.87
12.8
1
300
0.9
35
1.5
2.6
6
100
400
12.8
1
300
0.9
35
0.75
30
118
5
0.65
10
2
3
2.2
500
1.5
2.9
20
2.2
900
1.5
50
140
1.1
15
3.13
V
V
mV
V
ns
A
V
µA
ns
ns
V
V
mV
V
ns
A
mV
µA
µA
V
V/µs
µA
V
at VRMS = 1.5V, VAOUT = 5.5V.
PIN DESCRIPTIONS
CI: The level shifted current sense signal is impressed
upon a capacitor connected between this pin and GND.
The buffered current sense transformer signal charges
the capacitor when the boost switch is on. When the
switch is off, the current synthesizer discharges the capacitor at a rate proportional to the dI/dt of the boost inductor current. In this way, the discharge current is
approximately equal to
CA This is the inverting input to the current amplifier.
Connect the required compensation components between this pin and CAOUT. The common mode operating
range for this input is between −0.3V and 5V.
CAO: This is the output of the wide bandwidth current
amplifier and one of the inputs to the PWM duty cycle
comparator. The output signal generated by this amplifier
commands the PWM to force the correct input current.
The output can swing from 0.1V to 7.5V.
3V
IAC
.
–
R R VS
4
Discharging the CI capacitor in this fashion, a “reconstructed” version of the inductor current is generated using only one current sense transformer.
4
UC2855A/B
UC3855A/B
PIN DESCRIPTIONS (cont.)
CS: The reconstructed inductor current waveform generated on the CI pin is level shifted down a diode drop to
this pin. Connect the current amplifier input resistor between CS and the inverting input of the current amplifier.
The waveform on this pin is compared to the multiplier
output waveform through the average current sensing
current amplifier. The input to the peak current limiting
comparator is also connected to this pin. A voltage level
greater than 1.5 volts on this pin will trip the comparator
and disable the gate driver output.
ION: This pin is the current sensing input. It should be
connected to the secondary side output of a current
sensing transformer whose primary winding is in series
with the boost switch. The resultant signal applied to this
input is buffered and level shifted up a diode to the CI capacitor on the CI pin. The ION buffer has a source only
output. Discharge of the CI cap is enabled through the
current synthesizer circuitry. The current sense transformer termination resistor should be designed to obtain
a 1V input signal amplitude at peak switch current.
CT: A capacitor from CT to GND sets the PWM oscillator
frequency according to the following equation:
OVP: This pin senses the boost output voltage through a
voltage divider. The enable comparator input is TTL compatible and can be used as a remote shutdown port. A
voltage level below 1.8V, disables VREF, oscillator, and
the PWM circuitry via the enable comparator. Between
1.8V and VREF (7.5V) the UC is enabled. Voltage levels
above 7.5V will set the PWM latch via the hysteretic OVP
comparator and disable both ZVTOUT and GTOUT until
the OVP level has decayed by the nominal hysteresis of
400mV. If the voltage divider is designed to initiate an
OVP fault at 5% of OV, the internal hysteresis enables
normal operation again when the output voltage has
reached its nominal regulation level. Both the OVP and
enable comparators have direct logical connections to
the PWM output and exhibit typical propagation delays of
200ns.
f≈
1
.
11200 • CT
Use a high quality ceramic capacitor with low ESL and
ESR for best results. A minimum CT value of 200pF insures good accuracy and less susceptibility to circuit layout parasitics. The oscillator and PWM are designed to
provide practical operation to 500kHz.
GND: All voltages are measured with respect to this pin.
All bypass and timing capacitors connected to GND
should have leads as short and direct as possible.
GTOUT: The output of the PWM is a 1.5A peak totem
pole MOSFET gate driver on GTOUT. A series resistor
between GTOUT and the MOSFET gate of at least 10
ohms should be used to limit the overshoot on GTOUT.
In addition, a low VF Schottky diode should be connected
between GTOUT and GND to limit undershoot and possible erratic operation.
REF: REF is the output of the precision reference. The
output is capable of supplying 25mA to peripheral circuitry and is internally short circuit current limited. REF is
disabled and low whenever VCC is below the UVLO
threshold, and when OVP is below 1.8V. A REF “GOOD”
comparator senses REF and disables the stage until
REF has attained approximately 90% of its nominal
value. Bypass REF to GND with a 0.1µF or larger ceramic capacitor for best stability.
IAC: This is a current input to the multiplier. The current
into this pin should correspond to the instantaneous
value of the rectified AC input line voltage. This is accomplished by connecting a resistor directly between IAC
and the rectified input line voltage. The nominal 650mV
level present on IAC negates the need for any additional
compensating resistors to accommodate for the zero
crossings of the line. A current equal to one fourth of the
IAC current forms one of the inductor current synthesizer
inputs.
RVS: The nominal 3V signal present on the VSENSE pin
is buffered and brought out to the RVS pin. A current proportional to the output voltage is generated by connecting a resistor between this pin and GND. This current
forms the second input to the current synthesizer.
SS: Soft-start VSS is discharged for VVCC low conditions.
When enabled, SS charges an external capacitor with a
current source. This voltage is used as the voltage error
signal during start-up, enabling the PWM duty cycle to increase slowly. In the event of a VVCC dropout, the
OVP/EN is forced below 1.8V (typ), SS quickly discharges to disable the PWM.
IMO: This is the output of the multiplier, and the noninverting input of the current amplifier. Since this output
is a current, connect a resistor between this pin and
ground equal in value to the input resistor of the current
amplifier. The common mode operating range for this pin
is −0.3V to 5V.
5
UC2855A/B
UC3855A/B
PIN DESCRIPTIONS (cont.)
VAO: This is the output of the voltage amplifier. At a
given input RMS voltage, the voltage on this pin will vary
directly with the output load. The output swing is limited
from approximately 100mV to 6V. Voltage levels below
1.5V on this pin will inhibit the multiplier output.
VSENSE: This pin is the inverting input of the voltage
amplifier and serves as the output voltage feedback point
for the PFC boost converter. It senses the output voltage
through a voltage divider which produces a nominal 3V.
The voltage loop compensation is normally connected
between this pin and VAO. The VSENSE pin must be
above 1.5V at 25°C, (1.9V at –55°C) for the current synthesizer to work properly.
VCC: Positive supply rail for the IC. Bypass this pin to
GND with a 1µF low ESL, ESR ceramic capacitor. This
pin is internally clamped to 20V. Current into this clamp
should be limited to less than 10mA. The UC3855A has a
15.5V (nominal) turn on threshold with 6 volts of hysteresis while the UC3855B turns on at 10.5V with 500mV of
hysteresis.
ZVS: This pin senses when the drain voltage of the main
MOSFET switch has reached approximately zero volts,
and resets the ZVT latch via the ZVT comparator. A minimum and maximum ZVTOUT pulse width are programmable from this pin. To directly sense the ≈400V drain
voltage of the main switch, a blocking diode is connected
between ZVS and the high voltage drain. When the drain
reaches 0V, the level on ZVS is ≈0.7V which is below the
2.6V ZVT comparator threshold. The maximum ZVTOUT
pulse width is approximately equal to the oscillator blanking period time.
VRMS: This pin is the feedforward line voltage compensation input to the multiplier. A voltage on VRMS proportional to the AC input RMS voltage commands the
multiplier to alter the current command signal by
2
1/VRMS to maintain a constant power balance. The input to VRMS is generally derived from a two pole low
pass filter/voltage divider connected to the rectified AC
input voltage. This feature allows universal input supply
voltage operation and faster response to input line fluctuations for the PFC boost preregulator. For most designs, a voltage level of 1.5V on this pin should
correspond to low line, and 4.7V for high line. The input
range for this pin extends from 0 to 5.5V.
ZVTOUT: The output of the ZVT block is a 750mA peak
totem pole MOSFET gate driver on ZVTOUT. Since the
ZVT MOSFET switch is typically 3X smaller than the
main switch, less peak current is required from this output. Like GTOUT, a series gate resistor and Schottky diode to GND are recommended. This pin may also be
used as a high current synchronization output driver.
For more information see Unitrode Applications Note U-153.
5.992 496 516 MHz
120
Gain
-90
100
120
Phase
Margin
degrees
Phase
-45 Phase
Gain (dB)
80
Degrees
0
60
100
80
60
40
Open-Loop 40
20
Gain
dB
0
20
0
-20
0.1
-20
1
10
100
1000
10000
Frequency
kHz
-40
-60
10kHz
100kHz
1MHz
10MHz
log f
Figure 1. Current Amplifier Frequency Response
Figure 2. Voltage Amplifier Gain Phase vs Frequency
6
UC2855A/B
UC3855A/B
24
3.10
3.08
22
3.06
20
3.04
3.02
18
2.98
mA
VOLTS
3.00
2.96
16
14
2.94
12
2.92
2.90
-60 -40 -20
0
20
40
60
10
80 100 120 140
-60 -40 -20
TEMP ERATURE °C
20
40
60
80
100 120 140
TEMP ERATURE °C
Figure 3. Voltage Amplifier Input Threshold
Figure 4. Supply Current ON
230
-0.75
225
-0.77
220
-0.79
215
-0.81
210
-0.83
205
-0.85
200
kHz
GAIN CONSTANT (K)
0
-0.87
195
190
-0.89
185
-0.91
180
-0.93
175
-0.95
170
-60 -40 -20
0
20
40
60
80 100 120 140
-60 -40 -20
TEMP ERATURE °C
0
20
40
60
TEMP ERATURE °C
Figure 5. Multiplier Current Gain Constant
Figure 6. Oscillator Initial Accuracy
7
80 100 120 140
UC2855A/B
UC3855A/B
TYPICAL APPLICATION
UDG-95165-1
Figure 7. Typical Application
8
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
UC2855ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2855ADW
UC2855AN
ACTIVE
PDIP
N
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
UC2855AN
UC2855BDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2855BDW
UC2855BDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2855BDW
UC2855BDWTR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2855BDW
UC2855BDWTR/81363G4
PREVIEW
SOIC
DW
20
TBD
Call TI
Call TI
-40 to 85
UC2855BDWTRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2855BDW
UC2855BN
ACTIVE
PDIP
N
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
UC2855BN
UC2855BNG4
ACTIVE
PDIP
N
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
UC2855BN
UC3855ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3855ADW
UC3855ADWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3855ADW
UC3855ADWTR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3855ADW
UC3855ADWTRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3855ADW
UC3855AN
ACTIVE
PDIP
N
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3855AN
UC3855ANG4
ACTIVE
PDIP
N
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3855AN
UC3855BDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3855BDW
UC3855BDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3855BDW
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
UC3855BDWTR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3855BDW
UC3855BDWTRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3855BDW
UC3855BN
ACTIVE
PDIP
N
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3855BN
UC3855BNG4
ACTIVE
PDIP
N
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3855BN
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC3855A, UC3855B :
• Military: UC1855A, UC1855B
NOTE: Qualified Version Definitions:
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
UC3855ADWTR
Package Package Pins
Type Drawing
SOIC
DW
20
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
10.8
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.3
2.7
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UC3855ADWTR
SOIC
DW
20
2000
367.0
367.0
45.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated