UCC20520
SLUSCN0A – NOVEMBER 2016 – REVISED JANUARY 2022
UCC20520 4-A, 6-A, 5.7-kVRMS Isolated Dual-Channel Gate Driver with Single Input
1 Features
3 Description
•
•
•
The UCC20520 is an isolated single input, dualchannel gate driver with 4-A source and 6-A sink
peak current. It is designed to drive power MOSFETs,
IGBTs, and SiC MOSFETs up to 5-MHz with best-inclass propagation delay and pulse-width distortion.
•
•
•
•
•
•
•
•
•
•
•
2 Applications
•
•
•
•
•
•
•
Isolated converters in offline AC-to-DC power
supplies
Server, telecom, IT and industrial infrastructures
Motor drive and DC-to-AC solar inverters
LED lighting
Inductive heating
Uninterruptible power supply (UPS)
HEV and BEV battery chargers
The input side is isolated from the two output
drivers by a 5.7-kVRMS reinforced isolation barrier,
with a minimum of 100-V/ns common-mode transient
immunity (CMTI). Internal functional isolation between
the two secondary-side drivers allows a working
voltage of up to 1500-VDC.
This driver can be used for half-bridge driver with
programmable dead time (DT). A disable pin shuts
down both outputs simultaneously when it is set
high, and allows normal operation when left open or
grounded. As a fail-safe measure, primary-side logic
failures force both outputs low.
The device accepts VDD supply voltages up to 25-V.
A wide input VCCI range from 3-V to 18-V makes
the driver suitable for interfacing with both analog and
digital controllers. All the supply voltage pins have
under voltage lock-out (UVLO) protection.
With all these advanced features, the UCC20520
enables high efficiency, high power density, and
robustness in a wide variety of power applications.
Device Information
PART NUMBER
UCC20520
(1)
PACKAGE(1)
DW SOIC (16)
BODY SIZE (NOM)
10.30 mm × 7.50 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
VCCI 3,8
16 VDDA
Driver
PWM
1
DIS
5
NC 2,7
DT
MOD
DEMOD
Reinforced Isolation
•
Single input, dual output
Operating temperature range: –40 to 125°C
Switching parameters:
– 19-ns typical propagation delay
– 10-ns minimum pulse width
– 5-ns maximum delay matching
– 6-ns maximum pulse-width distortion
Common-mode transient immunity (CMTI) greater
than 100-V/ns
Surge immunity up to 12.8-kV
Isolation barrier life >40 Years
4-A peak source, 6-A peak sink output
TTL and CMOS compatible inputs
3-V to 18-V input VCCI range to interface with both
digital and analog controllers
Up to 25-V VDD output drive supply
Programmable dead time
Rejects input pulses and noise transients shorter
than 5-ns
Fast disable for power sequencing
Industry standard wide body SOIC-16 (DW)
package
Safety-related and regulatory approvals:
– 8000-VPK isolation per DIN V VDE V
0884-11:2017-01
– 5700-VRMS isolation for 1 minute per UL 1577
– CSA certification per IEC 60950-1, IEC
62368-1, IEC 61010-1 and IEC 60601-1 end
equipment standards
– CQC certification per GB4943.1-2011
Disable,
UVLO
and
Deadtime
6
UVLO
15 OUTA
14 VSSA
13 NC
Functional Isolation
12 NC
11 VDDB
Driver
MOD
GND
DEMOD
UVLO
4
10 OUTB
9
VSSB
Copyright © 2016, Texas Instruments Incorporated
Functional Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
UCC20520
www.ti.com
SLUSCN0A – NOVEMBER 2016 – REVISED JANUARY 2022
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................5
6.5 Power Ratings.............................................................5
6.6 Insulation Specifications............................................. 6
6.7 Safety-Related Certifications...................................... 7
6.8 Safety-Limiting Values................................................ 7
6.9 Electrical Characteristics.............................................8
6.10 Switching Characteristics..........................................9
6.11 Insulation Characteristics Curves............................10
6.12 Typical Characteristics............................................ 11
7 Parameter Measurement Information.......................... 15
7.1 Propagation Delay and Pulse Width Distortion......... 15
7.2 Rising and Falling Time.............................................15
7.3 PWM Input and Disable Response Time.................. 15
7.4 Programable Dead Time........................................... 16
7.5 CMTI Testing.............................................................16
8 Detailed Description......................................................17
8.1 Overview................................................................... 17
8.2 Functional Block Diagram......................................... 17
8.3 Feature Description...................................................18
8.4 Device Functional Modes..........................................21
9 Application and Implementation.................................. 23
9.1 Application Information............................................. 23
9.2 Typical Application.................................................... 23
10 Layout...........................................................................35
10.1 Layout Guidelines................................................... 35
10.2 Layout Example...................................................... 36
11 Device and Documentation Support..........................38
11.1 Documentation Support.......................................... 38
11.2 Receiving Notification of Documentation Updates.. 38
11.3 Support Resources................................................. 38
11.4 Trademarks............................................................. 38
11.5 Electrostatic Discharge Caution.............................. 38
11.6 Glossary.................................................................. 38
4 Revision History
Changes from Revision * (November 2016) to Revision A (January 2022)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
• Changed maximum pulse-width distortion value in Features from "5 ns" to "6 ns"............................................ 1
• Changed maximum pulse width distortion specification in Section 6.10 from "5 ns" to "6 ns"............................9
• Updated bench test waveform colors for better readability only. No data or measurment changes. ............... 33
2
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: UCC20520
UCC20520
www.ti.com
SLUSCN0A – NOVEMBER 2016 – REVISED JANUARY 2022
5 Pin Configuration and Functions
PWM
1
16
VDDA
NC
2
15
OUTA
VCCI
3
14
VSSA
GND
4
13
NC
DISABLE
5
12
NC
DT
6
11
VDDB
NC
7
10
OUTB
VCCI
8
9
VSSB
Not to scale
Figure 5-1. DW Package, 16-Pin SOIC (Top View)
Table 5-1. Pin Functions
PIN
NAME
DISABLE
DT
NO.
5
6
TYPE1
DESCRIPTION
I
Disables both driver outputs if asserted high, enables if set low or left open. This pin is pulled
low internally if left open. It is recommended to tie this pin to ground if not used to achieve
better noise immunity.
I
Programmable dead time function.
Tying DT to VCCI disables the DT function with dead time ≅ 0 ns. Leaving DT open sets
the dead time to 8
mm
>8
mm
>21
µm
> 600
V
CPG
External creepage(1)
Shortest terminal to terminal distance across the package
surface
DTI
Distance through insulation
Distance through internal isolation (internal clearance)
CTI
Comparative tracking index
DIN EN 60112 (VDE 0303-11); IEC 60112
Material group
According to IEC 60664-1
Overvoltage category per
IEC 60664-1
Rated mains voltage ≤ 600 VRMS
I-IV
Rated mains voltage ≤ 1000 VRMS
I-III
DIN V VDE 0884-10 (VDE V 0884-10):
I
2006-2012(2)
VIORM
Maximum repetitive peak
isolation voltage
AC voltage (bipolar)
2121
VPK
VIOWM
Maximum isolation working
voltage
Time dependent dielectric breakdown (TDDB) test, (See
Figure 6-1)
1500
VRMS
2121
VDC
VIOTM
Maximum transient isolation
voltage
VTEST = VIOTM
t = 60 sec (qualification)
t = 1 sec (100% production)
8000
VPK
VIOSM
Maximum surge isolation
voltage(3)
Test method per IEC 60065, 1.2/50 µs waveform, VTEST = 1.6
× VIOSM = 12800 VPK (qualification)
8000
VPK
Apparent charge(4)
qpd
CIO
Barrier capacitance, input to
output(5)
RIO
Isolation resistance, input to
output
Method a, After Input/Output safety test subgroup 2/3. Vini =
VIOTM, tini = 60s;
Vpd(m) = 1.2 X VIORM = 2545 VPK, tm = 10s
pC
pF
Ω
109
Pollution degree
2
Climatic category
40/125/21
UL 1577
VISO
(1)
(2)
(3)
(4)
(5)
6
Withstand isolation voltage
VTEST = VISO = 5700 VRMS, t = 60 sec. (qualification),
VTEST = 1.2 × VISO = 6840VRMS, t = 1 sec (100% production)
5700
VRMS
Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application.
Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of
the isolator on the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become
equal in certain cases. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these
specifications.
This coupler is suitable for basic electrical insulation only within the maximum operating ratings. Compliance with the safety ratings
shall be ensured by means of suitable protective circuits.
Testing is carried out in air or oil to determine the intrinsic surge immunity of the isolation barrier.
Apparent charge is electrical discharge caused by a partial discharge (pd).
All pins on each side of the barrier tied together creating a two-terminal device.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: UCC20520
UCC20520
www.ti.com
SLUSCN0A – NOVEMBER 2016 – REVISED JANUARY 2022
6.7 Safety-Related Certifications
VDE
Certified according to DIN
VDE V 0884-10 (VDE V
0884-10):2006-12 and DIN
EN 60950-1 (VDE 0805 Teil
1):2011-01
CSA
UL
CQC
Approved under CSA Component
Certified according to UL 1577
Acceptance Notice 5A, IEC
component recognition program
60950-1 and IEC 60601-1
Certified according to
GB 4943.1-2011
Reinforced insulation maximum
transient isolation voltage,
8000 VPK;
Reinforced insulation per CSA
maximum repetitive peak
60950-1-07+A1+A2 and IEC
isolation voltage,
60950-1 2nd Ed.
2121 VPK;
maximum surge isolation voltage,
8000 VPK
Single protection,
5700 VRMS
Reinforced insulation,
Altitude ≤ 5000 m,
Tropical climate, 400 VRMS
maximum working voltage
Certification number:
40040142
File number:
E181974
Certification number:
CQC16001155011
Agency qualification planned
6.8 Safety-Limiting Values
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of
the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat
the die and damage the isolation barrier potentially leading to secondary system failures.
PARAMETER
IS
Safety output supply
current
PS
Safety supply power
TS
Safety temperature
TEST CONDITIONS
SIDE
MIN
TYP
MAX
UNIT
RθJA = 78.1°C/W, VDDA/B = 12 V, TA =
25°C, TJ = 150°C
See Figure 6-2
DRIVER A,
DRIVER B
64
mA
RθJA = 78.1°C/W, VDDA/B = 25 V, TA =
25°C, TJ = 150°C
DRIVER A,
DRIVER B
31
mA
INPUT
50
DRIVER A
775
DRIVER B
775
TOTAL
1600
RθJA = 78.1°C/W, TA = 25°C, TJ = 150°C
See Figure 6-3
150
mW
°C
The maximum safety temperature is the maximum junction temperature specified for the device. The power
dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines
the junction temperature. The assumed junction-to-air thermal resistance in the Section 6.4 table is that of a
device installed on a High-K test board for leaded surface mount packages. The power is the recommended
maximum input voltage times the current. The junction temperature is then the ambient temperature plus the
power times the junction-to-air thermal resistance.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: UCC20520
7
UCC20520
www.ti.com
SLUSCN0A – NOVEMBER 2016 – REVISED JANUARY 2022
6.9 Electrical Characteristics
VVCCI = 3.3 V or VVCCI = 5 V, 0.1-µF capacitor from VCCI to GND, VVDDA = VVDDB = 12 V, 1-µF capacitor from VDDA and
VDDB to VSSA and VSSB, TA = –40°C to +125°C, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENTS
IVCCI
VCCI quiescent current
DISABLE = VCCI
1.5
2.0
mA
IVDDA,
IVDDB
VDDA and VDDB quiescent current
DISABLE = VCCI
1.0
1.8
mA
IVCCI
VCCI operating current
(f = 500 kHz) current per channel,
COUT = 100 pF
2.5
mA
IVDDA,
IVDDB
VDDA and VDDB operating current
(f = 500 kHz) current per channel,
COUT = 100 pF
2.5
mA
VCCI SUPPLY UNDERVOLTAGE LOCKOUT THRESHOLDS
VVCCI_ON
Rising threshold VCCI_ON
2.55
2.7
2.85
V
VVCCI_OFF
Falling threshold VCCI_OFF
2.35
2.5
2.65
V
VVCCI_HYS
Threshold hysteresis
0.2
V
VDDA/VDDB SUPPLY UNDERVOLTAGE LOCKOUT THRESHOLDS
VVDDA_ON,
VVDDB_ON
Rising threshold VDDA_ON, VDDB_ON
VVDDA_OFF,
VVDDB_OFF
Falling threshold VDDA_OFF, VDDB_OFF
VVDDA_HYS,
VVDDB_HYS
Threshold hysteresis
8
8.5
9
V
7.5
8
8.5
V
0.5
V
PWM AND DISABLE
VPWMH,
VDISH
Input high voltage
VPWML, VDISL Input low voltage
8
VPWM_HYS,
VDIS_HYS
Input hysteresis
VPWM
Negative transient, ref to GND, 50 ns
pulse
1.6
1.8
2
V
0.8
1
1.2
V
0.8
Not production tested, bench test
only
Submit Document Feedback
–5
V
V
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: UCC20520
UCC20520
www.ti.com
SLUSCN0A – NOVEMBER 2016 – REVISED JANUARY 2022
VVCCI = 3.3 V or VVCCI = 5 V, 0.1-µF capacitor from VCCI to GND, VVDDA = VVDDB = 12 V, 1-µF capacitor from VDDA and
VDDB to VSSA and VSSB, TA = –40°C to +125°C, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IOA+, IOB+
Peak output source current
CVDD = 10 µF, CLOAD = 0.18 µF, f
= 1 kHz, bench measurement
4
A
IOA-, IOB-
Peak output sink current
CVDD = 10 µF, CLOAD = 0.18 µF, f
= 1 kHz, bench measurement
6
A
ROHA, ROHB
Output resistance at high state
IOUT = –10 mA, TA = 25°C, ROHA,
ROHB do not represent drive pullup performance. See tRISE in
Section 6.10 and Section 8.3.4
for details.
5
Ω
ROLA, ROLB
Output resistance at low state
IOUT = 10 mA, TA = 25°C
0.55
Ω
VOHA, VOHB
Output voltage at high state
VVDDA, VVDDB = 12 V, IOUT = –10
mA, TA = 25°C
11.95
V
VOLA, VOLB
Output voltage at low state
VVDDA, VVDDB = 12 V, IOUT = 10
mA, TA = 25°C
OUTPUT
5.5
mV
Pull DT pin to VCCI
0
ns
DT pin is left open, min spec
characterized only, tested for
outliers
8
15
ns
200
240
ns
DEADTIME AND OVERLAP PROGRAMMING
Dead time
RDT = 20 kΩ
160
6.10 Switching Characteristics
VVCCI = 3.3 V or 5 V, 0.1-µF capacitor from VCCI to GND, VVDDA = VVDDB = 12 V, 1-µF capacitor from VDDA and VDDB to
VSSA and VSSB, TA = –40°C to +125°C, (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
6
16
ns
7
12
ns
20
ns
tRISE
Output rise time, 20% to 80%
measured points
COUT = 1.8 nF
tFALL
Output fall time, 90% to 10%
measured points
COUT = 1.8 nF
tPWmin
Minimum pulse width
tPDHL
Propagation delay from INx to OUTx
falling edges
19
30
ns
tPDLH
Propagation delay from INx to OUTx
rising edges
19
30
ns
tPWD
Pulse width distortion |tPDLH – tPDHL|
6
ns
tDM
Propagation delays matching
between VOUTA, VOUTB
f = 100 kHz
5
ns
Static common-mode transient
immunity (See Section 7.5)
Slew rate of GND versus VSSA and
VSSB, PWM is tied to GND or VCCI
CMTI
Output off for less than minimum,
COUT = 0 pF
100
V/ns
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: UCC20520
9
UCC20520
www.ti.com
SLUSCN0A – NOVEMBER 2016 – REVISED JANUARY 2022
6.11 Insulation Characteristics Curves
1.E+11
1.E+10
Safety Margin Zone: 1800 VRMS, 254 Years
Operating Zone: 1500 VRMS, 135 Years
TDDB Line (