UCC28070PWG4

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents Reference Design UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 UCC28070 Interleaving Continuous Conduction Mode PFC Controller 1 Features 3 Description • The UCC28070 is an advanced power factor correction (PFC) device that integrates two pulsewidth modulators (PWMs) operating 180° out of phase. This interleaved PWM operation generates substantial reduction in the input and output ripple currents, allowing the conducted-EMI filtering to become easier and less expensive. A significantly improved multiplier design provides a shared current reference to two independent current amplifiers that ensures matched average-current mode control in both PWM outputs while maintaining a stable, lowdistortion, sinusoidal input-line current. 1 • • • • • • • • • • • • Interleaved Average Current-Mode PWM Control With Inherent Current Matching Advanced Current Synthesizer Current Sensing for Superior Efficiency Highly-Linear Multiplier Output With Internal Quantized Voltage Feed-Forward Correction for Near-Unity PF Programmable Frequency from 30 kHz to 300 kHz Programmable Maximum Duty-Cycle Clamp Programmable Frequency-Dithering Rate and Magnitude for Enhanced EMI Reduction – Magnitude: 3 kHz to 30 kHz – Rate: Up to 30 kHz External-Clock Synchronization Capability Enhanced Load and Line Transient Response through Voltage Amplifier Output Slew-Rate Correction Programmable Peak Current Limiting Bias-Supply UVLO, Overvoltage Protection, OpenLoop Detection, and PFC-Enable Monitoring External PFC-Disable Interface Open-Circuit Protection on VSENSE and VINAC pins Programmable Soft-Start The UCC28070 device contains multiple innovations including current synthesis and quantized voltage feed-forward to promote performance enhancements in PF, efficiency, THD, and transient response. Features including frequency dithering, clock synchronization, and slew rate enhancement further expand the potential performance enhancements. The UCC28070 device also contains a variety of protection features including output-overvoltage detection, programmable peak-current limit, undervoltage lockout, and open-loop protection. Device Information(1) PART NUMBER 2 Applications • • • High-Efficiency Server and Desktop Power Supplies Telecom Rectifiers White Goods and Industrial Equipment PACKAGE BODY SIZE (NOM) UCC28070DW SOIC (20) 12.80 mm × 7.50 mm UCC28070DWR SOIC (20) 12.80 mm × 7.50 mm UCC28070PW TSSOP (20) 6.50 mm × 4.40 mm UCC28070PWG4 TSSOP (20) 6.50 mm × 4.40 mm UCC28070PWR TSSOP (20) 6.50 mm × 4.40 mm UCC28070PWRG4 TSSOP (20) 6.50 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Application Diagram VIN L1 D1 + VOUT COUT – 12V to 21V To CSB CCDR 1 CDR DMAX 20 RRDM 2 RDM RT 19 RA 3 VAO RB SS 18 4 VSENSE GDB 17 5 VINAC GND 16 RIMO 6 IMO RSYN 7 RSYNTH T1 RS RDMX RRT CSS M1 VCC 15 GDA 14 8 CSB VREF 13 9 CSA CAOA 12 L2 D2 To CSA 10 PKLMT CAOB 11 RS From Ixfrms CZV RPK1 CPV CZC CREF CPC T2 RA CZC CPC M2 RPK2 RZV RZC RZC RB Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 5 5 5 9 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description ............................................ 12 7.1 Overview ................................................................. 12 7.2 Functional Block Diagram ....................................... 13 7.3 Feature Description................................................. 14 7.4 Device Functional Modes........................................ 28 8 Application and Implementation ........................ 29 8.1 Application Information............................................ 29 8.2 Typical Application .................................................. 29 9 Power Supply Recommendations...................... 37 10 Layout................................................................... 38 10.1 Layout Guidelines ................................................. 38 10.2 Layout Example .................................................... 38 11 Device and Documentation Support ................. 39 11.1 11.2 11.3 11.4 11.5 Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 39 39 39 39 39 12 Mechanical, Packaging, and Orderable Information ........................................................... 39 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (April 2011) to Revision F • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 Changes from Revision D (June 2010) to Revision E • 2 Page Changed PWM switching frequency....................................................................................................................................... 6 Changes from Revision C (June 2009) to Revision D • Page Page Changed 30 kHz to 300 kHz .................................................................................................................................................. 1 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 5 Pin Configuration and Functions DW and PW Packages 20-Pin SOIC and TSSOP Top View CDR 1 20 DMAX RDM 2 19 RT VAO 3 18 SS VSENSE 4 17 GDB VINAC 5 16 GND IMO 6 15 VCC RSYNTH 7 14 GDA CSB 8 13 VREF CSA 9 12 CAOA 10 11 CAOB PKLMT Pin Functions PIN I/O DESCRIPTION NAME NO. CAOA 12 O Phase A Current Amplifier Output. Output of phase A transconductance current amplifier. Internally connected to the inverting input of phase A PWM comparator for trailing-edge modulation. Connect the current regulation loop compensation components between this pin and GND. CAOB 11 O Phase B Current Amplifier Output. Output of phase B transconductance current amplifier. Internally connected to the inverting input of phase B PWM comparator for trailing-edge modulation. Connect the current regulation loop compensation components between this pin and GND. CDR 1 I Dither Rate Capacitor. Frequency-dithering timing pin. An external capacitor to GND programs the rate of oscillator dither. Connect the CDR pin to the VREF pin to disable dithering. CSA 9 I Phase A Current Sense Input. During the ON-time of GDA, CSA is internally connected to the inverting input of phase A current amplifier through the current synthesis stage. CSB 8 I Phase B Current Sense Input. During the ON-time of GDB, CSB is internally connected to the inverting input of phase B current amplifier through the current synthesis stage. DMAX 20 I Maximum Duty-Cycle Resistor. Maximum PWM duty-cycle programming pin. A resistor to GND sets the PWM maximum duty-cycle based on the ratio of RDMX / RRT. GDA 14 O Phase A Gate Drive. This limited-current output is intended to connect to a separate gate-drive device suitable for driving the phase A switching component(s). The output voltage is typically clamped to 13.5 V. GDB 17 O Phase B Gate Drive. This limited-current output is intended to connect to a separate gate-drive device suitable for driving the phase B switching component(s). The output voltage is typically clamped to 13.5 V. GND 16 I/O Device Ground Reference. Connect all compensation and programming resistor and capacitor networks to this pin. Connect this pin to the system through a separate trace for high-current noise isolation. IMO 6 O Multiplier Current Output. Connect a resistor between this pin and GND to set the multiplier gain. PKLMT 10 I Peak Current Limit Programming. Connect a resistor-divider network between VREF and this pin to set the voltage threshold of the cycle-by-cycle peak current limiting comparators. Allows adjustment for desired ΔILB. RDM (SYNC) 2 I Dither Magnitude Resistor. Frequency-dithering magnitude and external synchronization pin. An external resistor to GND programs the magnitude of oscillator frequency dither. When frequency dithering is disabled (CDR > 5 V), the internal master clock synchronizes to positive edges presented on the RDM pin. Connect RDM to GND when dithering is disabled and synchronization is not desired. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 3 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com Pin Functions (continued) PIN NAME NO. I/O DESCRIPTION RSYNTH 7 I Current Synthesis Down-Slope Programming. Connect a resistor between this pin and GND to set the magnitude of the current synthesizer down-slope. Connecting RSYNTH to VREF disables current synthesis and connect CSA and CSB directly to their respective current amplifiers. RT 19 I Timing Resistor. Oscillator frequency programming pin. A resistor to GND sets the running frequency of the internal oscillator. SS 18 I Soft-Start and External Fault Interface. Connect a capacitor to GND on this pin to set the soft-start slew rate based on an internally-fixed, 10-μA current source. The regulation reference voltage for VSENSE is clamped to VSS until VSS exceeds 3 V. Upon recovery from certain fault conditions, a 1-mA current source is present at the SS pin until the SS voltage equals the VSENSE voltage. Pulling the SS pin below 0.6 V immediately disables both GDA and GDB outputs. VAO 3 O Voltage Amplifier Output. Output of transconductance voltage error amplifier. Internally connected to the multiplier input and the zero-power comparator. Connect the voltage regulation loop compensation components between this pin and GND. VCC 15 I Bias Voltage Input. Connect a 0.1-μF ceramic bypass capacitor as close as possible to this pin and GND. VINAC 5 I Scaled AC Line Input Voltage. Internally connected to the multiplier and negative terminal of the current synthesis difference amplifier. Connect a resistor-divider network between VIN, VINAC, and GND identical to the PFC output divider network connected at VSENSE. VREF 13 O 6-V Reference Voltage and Internal Bias Voltage. Connect a 0.1-μF ceramic bypass capacitor as close as possible to this pin and GND. VSENSE 4 I Output Voltage Sense. Internally connected to the inverting input of the transconductance voltage error amplifier in addition to the positive terminal of the current synthesis difference amplifier. Also connected to the OVP, PFC enable, and slew-rate comparators. Connect to PFC output with a resistor-divider network. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN Supply voltage VCC Supply current, IVCC MAX UNIT 22 V 20 mA Gate drive current – continuous GDA, GDB ±0.25 A Gate drive current – pulsed GDA, GDB ±0.75 GDA, GDB –0.5 VCC + 0.3 DMAX, RDM, RT, CDR, VINAC, VSENSE, SS, VAO, IMO, CSA, CSB, CAOA, CAOB, PKLMT, VREF –0.5 7 RT, DMAX, RDM, RSYNTH –0.5 Voltage Current VREF, VAO, CAOA, CAOB, IMO A mA 10 Lead temperature (10 seconds) V 260 °C Operating junction temperature, TJ –40 125 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) (2) 4 Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) 500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VCC MIN MAX UNIT VUVLO + 1 V 21 V 2 mA Input voltage (from a low-impedance source) VCC Load current VREF Input voltage range VINAC 0 3 V Voltage range IMO 0 3.3 V VPKLMT Voltage range CSA, CSB 0 3.6 V RSYN RSYNTH resistance 15 750 kΩ RRDM RDM resistance 30 330 kΩ 6.4 Thermal Information UCC28070 THERMAL METRIC (1) SOIC (DW) TSSOP (PW) 20 PINS 20 PINS UNIT RθJA Junction-to-ambient thermal resistance 78.1 99.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 42.5 34.1 °C/W RθJB Junction-to-board thermal resistance 46 50.8 °C/W ψJT Junction-to-top characterization parameter 17.5 1.9 °C/W ψJB Junction-to-board characterization parameter 45.5 50.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Electrical Characteristics TA = –40°C to 125°C, TJ = TA, VCC = 12 V, GND = 0 V, RRT = 75 kΩ, RDMX = 68.1 kΩ, RRDM = RSYN = 100 kΩ, CCDR = 2.2 nF, CSS = CVREF = 0.1 μF, CVCC = 1 μF, IVREF = 0 mA (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 23 25 27 UNIT BIAS SUPPLY VCC(SHUNT) VCC shunt voltage IVCC (1) Supply current IVCC = 10 mA disabled VVSENSE = 0 V 7 enabled VVSENSE = 3 V (switching) 9 UVLO VUVLO VCC = 7 V VCC = 9 V UVLO turnon threshold Measured at VCC (rising) UVLO hysteresis Measured at VCC (falling) VREF enable threshold Measured at VCC (rising) 9.8 12 V mA 200 µA 4 6 mA 10.2 10.6 1 V 7.5 8 8.5 V 6 6.18 V LINEAR REGULATOR VVREF (1) Reference voltage no load IVREF = 0 mA 5.82 load rejection Measured as the change in VVREF (IVREF = 0 mA and –2 mA) –12 12 line rejection Measured as the change in VVREF (VCC = 11 V and 20 V, IVREF = 0 μA) –12 12 mV Excessive VCC input voltage or current damages the device. This clamp does not protect the device from an unregulated supply. If an unregulated supply is used, TI recommends a series-connected fixed positive voltage regulator such as a UA78L15A. See Absolute Maximum Ratings for the limits on VCC voltage and current. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 5 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com Electrical Characteristics (continued) TA = –40°C to 125°C, TJ = TA, VCC = 12 V, GND = 0 V, RRT = 75 kΩ, RDMX = 68.1 kΩ, RRDM = RSYN = 100 kΩ, CCDR = 2.2 nF, CSS = CVREF = 0.1 μF, CVCC = 1 μF, IVREF = 0 mA (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 0.65 0.75 0.85 UNIT PFC ENABLE Enable threshold VEN Measured at VSENSE (rising) Enable hysteresis 0.15 V EXTERNAL PFC DISABLE Disable threshold Measured at SS (falling) Hysteresis VVSENSE > 0.85 V 0.5 0.6 V 0.15 V OSCILLATOR Output phase shift Measured between GDA and GDB 179 180 181 ° VDMAX, VRT, and VRDM Timing regulation voltages Measured at DMAX, RT, and RDM 2.91 3 3.09 V 95 100 105 fPWM PWM switching frequency 270 290 330 92% 95% 98% 50 150 250 DMAX RRT = 75 kΩ, RDMX = 68.1 kΩ, VRDM = 0 V, VCDR = 6 V kHz RRT = 24.9 kΩ, RDMX = 22.6 kΩ, VRDM = 0 V, VCDR = 6 V Duty-cycle clamp RRT = 75 kΩ, RDMX = 68.1 kΩ, VRDM = 0 V, VCDR = 6 V Minimum programmable OFF-time RRT = 24.9 kΩ, RDMX = 22.6 kΩ, VRDM = 0 V, VCDR = 6 V fDM Frequency dithering magnitude change in fPWM RRDM = 316 kΩ, RRT = 75 kΩ fDR Frequency dithering rate of change in fPWM CCDR = 2.2 nF, RRDM = 100 kΩ 3 CCDR = 0.3 nF, RRDM = 100 kΩ 20 ICDR Dither rate current Measured at CDR (sink and source) Dither disable threshold Measured at CDR (rising) 5 5.25 V SYNC enable threshold Measured at CDR (rising) 5 5.25 V SYNC propagation delay VCDR = 6 V, measured from RDM (rising) to GDx (rising) 50 100 ns SYNC threshold (rising) VCDR = 6 V, measured at RDM 1.2 1.5 V SYNC threshold (falling) VCDR = 6 V, measured at RDM 0.4 SYNC pulses Positive pulse width 0.2 RRDM = 31.6 kΩ, RRT = 24.9 kΩ 2 3 4 24 30 36 ns kHz kHz μA ±10 CLOCK SYNCHRONIZATION VCDR Maximum duty cycle 0.7 V μs (2) 50% VOLTAGE AMPLIFIER gMV (2) 6 VSENSE voltage In regulation, TA = 25°C 2.97 VSENSE voltage In regulation 2.94 VSENSE input bias current In regulation VAO high voltage VVSENSE = 2.9 V VAO low voltage VVSENSE = 3.1 V VAO transconductance VVSENSE = 2.8 V to 3.2 V, VVAO = 3 V 70 μS VAO sink current, overdriven limit VVSENSE = 3.5 V, VVAO = 3 V 30 μA VAO source current, overdriven VVSENSE = 2.5 V, VVAO = 3 V, SS = 3 V –30 μA VAO source current, overdriven limit + ISRC VVSENSE = 2.5 V, VVAO = 3 V –130 μA Slew-rate correction threshold Measured as VVSENSE (falling) / VVSENSE (regulation) 4.8 92% 3 3.03 3 3.06 V 250 500 nA 5 5.2 V 0.05 0.50 V 93% V 95% Due to the influence of the synchronization pulse width on the programmability of the maximum PWM switching duty cycle (DMAX), TI recommends minimizing the synchronization signal duty cycle. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 Electrical Characteristics (continued) TA = –40°C to 125°C, TJ = TA, VCC = 12 V, GND = 0 V, RRT = 75 kΩ, RDMX = 68.1 kΩ, RRDM = RSYN = 100 kΩ, CCDR = 2.2 nF, CSS = CVREF = 0.1 μF, CVCC = 1 μF, IVREF = 0 mA (unless otherwise noted) PARAMETER ISRC TEST CONDITIONS Slew-rate correction hysteresis Measured at VSENSE (rising) Slew-rate correction current Measured at VAO, in addition to VAO source current Slew-rate correction enable threshold Measured at SS (rising) VAO discharge current MIN TYP MAX 3 9 UNIT mV –100 μA 4 V VVSENSE = 0.5 V, VVAO = 1 V 10 μA SS source current VVSENSE = 0.9 V, VSS = 1 V –10 μA Adaptive source current VVSENSE = 2 V, VSS = 1 V –1.5 –2.5 mA Adaptive SS disable Measured as VVSENSE – VSS –30 0 30 mV SS sink current VVSENSE = 0.5 V, VSS = 0.2 V 0.5 0.9 104% 106% SOFT-START ISS mA OVERVOLTAGE VOVP OVP threshold Measured as VVSENSE (rising) / VVSENSE (regulation) OVP hysteresis Measured at VSENSE (falling) 100 OVP propagation delay Measured between VSENSE (rising) and GDx (falling) 0.2 108% mV 0.3 μs ZERO-POWER VZPWR Zero-power detect threshold Measured at VAO (falling) 0.65 Zero-power hysteresis 0.75 V 0.15 V MULTIPLIER kMULT IIMO Gain constant Output current: zero VVAO ≥ 1.5 V, TA = 25°C 16 17 18 VVAO = 1.2 V, TA = 25°C 14.5 17 19.5 VVAO ≥ 1.5 V 15 17 19 VVAO = 1.2 V 13 17 21 VVINAC = 0.9 VPK, VVAO = 0.8 V –0.2 0 0.2 VVINAC = 0 V, VVAO = 5 V –0.2 0 0.2 0.6 0.7 0.8 μA μA QUANTIZED VOLTAGE FEED-FORWARD (3) VLVL1 Level 1 threshold VLVL2 Level 2 threshold Measured at VINAC (rising) 1 V V VLVL3 Level 3 threshold 1.2 V VLVL4 Level 4 threshold 1.4 V VLVL5 Level 5 threshold 1.65 V VLVL6 Level 6 threshold 1.95 V VLVL7 Level 7 threshold 2.25 V VLVL8 Level 8 threshold 2.6 V 6 V CURRENT AMPLIFIERS CAOx high voltage 5.75 CAOx low voltage gMC 0.1 CAOx transconductance CAOx sink current, overdriven CAOx source current, overdriven Input common mode range Input offset voltage (3) μS 50 μA –50 μA 0 VRSYNTH = 6 V, TA = 25°C VRSYNTH = 6 V V 100 3.6 –4 –8 –13 0 –8 –20 V mV The Level 1 threshold represents the zero-crossing detection threshold above which VVINAC must rise to initiate a new input half-cycle, and below which VVINAC must fall to terminate that half-cycle. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 7 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com Electrical Characteristics (continued) TA = –40°C to 125°C, TJ = TA, VCC = 12 V, GND = 0 V, RRT = 75 kΩ, RDMX = 68.1 kΩ, RRDM = RSYN = 100 kΩ, CCDR = 2.2 nF, CSS = CVREF = 0.1 μF, CVCC = 1 μF, IVREF = 0 mA (unless otherwise noted) PARAMETER TEST CONDITIONS Input offset voltage MIN TYP MAX UNIT 0 –8 –20 mV 12 mV Phase mismatch Measured as phase A input offset minus phase B input offset –12 0 CAOx pulldown current VVSENSE = 0.5 V, VCAOx = 0.2 V 0.5 0.9 mA CURRENT SYNTHESIZER VRSYNTH Regulation voltage Synthesizer disable threshold VVSENSE = 3 V, VVINAC = 0 V 2.91 3 3.09 VVSENSE = 3 V, VVINAC = 2.85 V 0.10 0.15 0.20 5 5.25 V 0.250 0.500 μA 3.3 3.33 V 60 100 ns 3.8 4 4.2 V 0.65 0.7 V –2 mV/°C Measured at RSYNTH (rising) VINAC input bias current V PEAK CURRENT LIMIT Peak current limit threshold VPKLMT = 3.30 V, measured at CSx (rising) Peak current limit propagation delay Measured between CSx (rising) and GDx (falling) edges 3.27 PWM RAMP VRMP PWM ramp amplitude PWM ramp offset voltage TA = 25°C, RRT = 75 kΩ PWM ramp offset temperature coefficient GATE DRIVE 8 GDA, GDB output voltage, high, clamped VCC = 20 V, CLOAD = 1 nF GDA, GDB output voltage, high CLOAD = 1 nF GDA, GDB output voltage, low CLOAD = 1 nF 0.2 0.3 V Rise time GDx 1 V to 9 V, CLOAD = 1 nF 18 30 ns Fall time GDx 9 V to 1 V, CLOAD = 1 nF 12 25 ns GDA, GDB output voltage, UVLO VCC = 0 V, IGDA, IGDB = 2.5 mA 0.7 2 V Submit Documentation Feedback 11.5 13 10 10.5 15 V V Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 6.6 Typical Characteristics 12 6.18 IVCC, VCC = 12 V, enabled 6.12 Reference Voltage (V) Supply Current (mA) 10 8 IVCC, VCC = 12 V, disabled 6 4 6.06 6.00 5.94 5.88 2 5.82 0 –60 –40 –20 20 0 40 60 80 100 120 140 –60 –10 40 90 140 Temperature (°C) Temperature (°C) VVREF = 0 mA Figure 1. VCC Supply Current vs Junction Temperature Figure 2. VVREF vs Junction Temperature 0.50 3.06 0.45 0.40 0.35 3.02 Bias Current (mA) VSENSE Regulation (V) 3.04 3.00 2.98 0.30 0.25 0.20 0.15 0.10 2.96 0.05 0 2.94 –60 –40 –20 0 20 40 60 80 100 –60 120 140 –10 40 90 140 Temperature (°C) Temperature (°C) Figure 3. VVSENSE Regulation vs Junction Temperature Figure 4. IVSENSE Bias Current vs Junction Temperature 20 180 QVFF Level Level 1 160 Level 3 120 Multiplier Constant (mA) Multiplier Output Current (mA) 19 Level 2 140 Level 4 Level 5 100 Level 6 80 Level 7 Level 8 60 18 17 16 VAO 1.2 V 1.5 V 3V 5V 40 15 20 14 0 0 1 2 3 4 5 6 –60 –40 –20 0 20 40 60 80 100 120 140 Voltage Amplifier Output (V) Temperature (°C) Figure 5. IMO, Multiplier Output Current vs VVAO Figure 6. Multiplier Constant vs Junction Temperature Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 9 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com Typical Characteristics (continued) 0.50 0.45 0.40 Bias Current (mA) 0.35 0.30 0.25 0.20 0.15 VINAC 0.2 V 1V 2V 2.5 V 2.85 V 0.10 0.05 0.00 –60 –10 40 90 Normalized Change in Switching Frequency (%) 1 Typical Frequency = 30 kHz RT = 249 kΩ 0.8 0.5 Typical Frequency = 100 kHz RT = 75 kΩ 0.3 0 –0.3 Typical Frequency = 290 kHz RT = 24.9 kΩ –0.5 –0.8 –1 140 –60 –40 –20 0 20 40 60 80 100 120 140 Temperature (°C) Temperature (°C) Figure 7. IVINAC Bias Current vs Junction Temperature Figure 8. Normalized Switching Frequency vs Junction Temperature 40 80 Voltage Amplifier Output Current (mA) Voltage Amplifier Transconductance (nS) 20 75 70 65 60 0 –20 –40 –60 –80 –100 55 –120 –140 50 –60 –40 –20 0 20 40 60 80 100 2.5 120 140 2.6 2.7 2.8 3.0 2.9 3.1 3.2 3.3 3.4 3.5 Temperature (°C) VSENSE (V) Figure 9. VAO, Voltage Amplifier Transconductance vs Junction Temperature Figure 10. Voltage Amplifier Transfer Function vs VVSENSE 110 5 105 100 CAx Input Offset (mV) CAOx Tranjsconductance (nS) 0 95 90 CAx + 3 σ –5 CAx AVG –10 CAx - 3 σ –15 85 80 –20 –60 –40 –20 0 20 40 60 80 100 120 140 –60 Temperature (°C) –40 –20 0 20 40 60 80 100 120 140 Temperature (°C) 0.8-V Common Mode Figure 11. Current Amplifier Transconductance vs Junction Temperature 10 Submit Documentation Feedback Figure 12. CAx Input Offset Voltage vs Junction Temperature Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 Typical Characteristics (continued) 5 10 0 A-B+3σ CAx Input Offset (mV) CA1 to CA2 Relative Offset Voltage (mV) 15 5 0 A - B AVG –5 CAx + 3 σ –5 CAx AVG –10 CAx - 3 σ A-B-3σ –15 –10 –20 –60 –15 –60 –40 –20 0 20 40 60 80 100 120 140 –40 –20 0 0.8-V Common Mode 40 60 80 100 120 140 2-V Common Mode Figure 13. CA1 to CA2 Relative Offset vs Junction Temperature Figure 14. CAx Input Offset Voltage vs Junction Temperature 5 15 10 0 A-B+3σ CAx Input Offset (mV) CA1 to CA2 Relative Offset Voltage (mV) 20 Temperature (°C) Tempterature (°C) 5 0 A - B AVG –5 CAx + 3 σ –5 CAx AVG –10 CAx - 3 σ A-B-3σ –15 –10 –20 –15 –60 –40 –20 0 20 40 60 80 –60 –40 –20 100 120 140 Temperature (°C) 0 20 40 60 80 100 120 140 Temperature (°C) 2-V Common Mode 3.6-V Common Mode Figure 15. CA1 to CA2 Relative Offset vs Junction Temperature Figure 16. CAx Input Offset Voltage vs Junction Temperature CA1 to CA2 Relative Offset Voltage (mV) 15 10 A-B+3σ 5 0 A - B AVG –5 A-B-3σ –10 –15 –60 –40 –20 0 20 40 60 80 100 120 140 Temperature (°C) 3.6-V Common Mode Figure 17. CA1 to CA2 Relative Offset vs Junction Temperature Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 11 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com 7 Detailed Description 7.1 Overview The UCC28070 power factor corrector IC controls two CCM (Continuous Conduction Mode) Boost PFC power stages operating 180° out of phase with each other. This interleaving action reduces the input and output ripple currents so that less EMI filtering is needed and allows operation at higher power levels than a non-interleaved solution. The UCC28070 can operate over a wide range of frequencies, making it suitable for use with both MOSFET and IGBT power switches. Multiple UCC28070 controllers can be synchronized for use in higher power applications where more than two interleaved power stages are needed. This device is especially suited to high-performance, high-power PFC applications where the use of Average Current Mode PWM control gives low THD. 12 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 7.2 Functional Block Diagram + OVP VCC 15 25V Linear EN VREF 13 6V Regulator 160 On o 140 Off C + ReStart ThermSD Ext.Disable 0.75V + 0.60V SS 8V 0.75V 0.60V VSENSE 3.18V 3.08V Fault S Q + VSENSE R Q 0.90V GND 16 UVLO 10.2V 9.2V ZeroPwr + 0.75V + VAO 6 IMO 5 VINAC DMAX 20 Voltage FeedForward CLKA Oscillator w/ Freq. Dither RT 19 CLKB IIMO = VVINAC ∗ (VVAO – 1) KVFF OffA ∗ 17uA 250nA KVFF x OffB Mult. / 3 VAO x RDM/ 2 SYNC SYNC Logic CDR 1 SYNC Dither Enable Disable + ReStart 100uA 5V + SS 4V Slew Rate Correction + 10uA 2.8V 5V GmAmp 4 VSENSE - VA + 3V + 250nA Adaptive SS PKLMT 10 IpeakA 1mA ReStart ISS 10uA + + Control Logic ReStart Ext.Disable IpeakB CSA 9 + + 18 SS PWM1 CA1 GmAmp + S Q OutA CSB 8 Current Synthesizer RSYNTH 7 5V CLKA R Q VINAC VSENSE CAOA 12 14 GDA PWM2 CA2 GmAmp Driver GND Fault + Disable + OffA IpeakA OutB VCC (Clamped at 13.5V) VCC S Q + OffB IpeakB Fault CAOB 11 CLKB R Q (Clamped at 13.5V) Driver 17 GDB GND Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 13 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com 7.3 Feature Description 7.3.1 Interleaving One of the main benefits from the 180° interleaving of phases is significant reductions in the high-frequency ripple components of both the input current and the current into the output capacitor of the PFC preregulator. Compared to that of a single-phase PFC stage of equal power, the reduced ripple on the input current eases the burden of filtering conducted-EMI noise and helps reduce the EMI filter and CIN sizes. Additionally, reduced highfrequency ripple current into the PFC output capacitor, COUT, helps to reduce its size and cost. Furthermore, with reduced ripple and average current in each phase, the boost inductor size can be smaller than in a single-phase design [1]. Ripple current reduction due to interleaving is often referred to as ripple cancellation, but strictly speaking, the peak-to-peak ripple is completely cancelled only at 50% duty-cycle in a 2-phase system. At duty-cycles other than 50%, ripple reduction occurs in the form of partial cancellation due to the superposition of the individual phase currents. Nevertheless, compared to the ripple currents of an equivalent single-phase PFC preregulator, those of a 2-phase interleaved design are extraordinarily smaller [1]. Independent of ripple cancellation, the frequency of the interleaved ripple, at both the input and output, is 2 × fPWM. On the input, 180° interleaving reduces the peak-to-peak ripple amplitude to ½ or less of the ripple amplitude of the equivalent single-phase current. On the output, 180° interleaving reduces the rms value of the PFC-generated ripple current in the output capacitor by a factor of slightly more than √2, for PWM duty-cycles > 50%. This can be seen in the following derivations, adapting the method by Erickson [2]. In a single-phase PFC preregulator, the total rms capacitor current contributed by the PFC stage at all dutycycles can be shown to be approximated by: æI ö iCRMS1j = ç O ÷ èhø æ æ 16 ´ VO ö ö 2 h çç ç ÷ ÷ ÷ è è 3p ´ VM ø ø (1) In a dual-phase interleaved PFC preregulator, the total rms capacitor current contributed by the PFC stage for D > 50% can be shown to be approximated by: æI ö iCRMS2j = ç O ÷ èhø æ æ 16 ´ VO ö ö 2 çç ç ÷ - h ÷÷ è è 6p ´ VM ø ø (2) In these equations, IO = average PFC output load current, VO = average PFC output voltage, VM = peak of the input ac-line voltage, and η = efficiency of the PFC stage at these conditions. It can be seen that the quantity under the radical for iCrms2φ is slightly smaller than ½ of that under the radical for iCrms1φ. The rms currents shown contain both the low-frequency and the high-frequency components of the PFC output current. Interleaving reduces the high-frequency component, but not the low-frequency component. 14 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 Feature Description (continued) 7.3.2 Programming the PWM Frequency and Maximum Duty-Cycle Clamp The PWM frequency and maximum duty-cycle clamps for both GDx outputs of the UCC28070 are set through the selection of the resistors connected to the RT and DMAX pins, respectively. The selection of the RT resistor (RRT) directly sets the PWM frequency (fPWM). RRT (kW ) = 7500 fPWM (kHz ) (3) Once RRT has been determined, the DMAX resistor (RDMX) may be derived. RDMX = RRT ´ (2 ´ DMAX - 1) where • DMAX is the desired maximum PWM duty-cycle (4) 7.3.3 Frequency Dithering (Magnitude and Rate) Frequency dithering refers to modulating the switching frequency to achieve a reduction in conducted-EMI noise beyond the capability of the line filter alone. The UCC28070 implements a triangular modulation method which results in equal time spent at every point along the switching frequency range. This total range from minimum to maximum frequency is defined as the dither magnitude, and is centered around the nominal switching frequency fPWM set with RRT. For example, a dither magnitude of 20 kHz on a nominal fPWM of 100 kHz results in a frequency range of 100 kHz ±10 kHz. Furthermore, the programmed duty-cycle clamp set by RDMX remains constant at the programmed value across the entire range of the frequency dithering. The rate at which fPWM traverses from one extreme to the other and back again is defined as the dither rate. For example, a dither rate of 1 kHz would linearly modulate the nominal frequency from 110 kHz to 90 kHz to 110 kHz once every millisecond. A good initial design target for dither magnitude is ±10% of fPWM. Most boost components can tolerate such a spread in fPWM. The designer can then iterate around there to find the best compromise between EMI reduction, component tolerances, and loop stability. The desired dither magnitude is set by a resistor from the RDM pin to GND, of value calculated with Equation 5: RRDM (kW ) = 937.5 fDM (kHz ) (5) Once the value of RRDM is determined, the desired dither rate may be set by a capacitor from the CDR pin to GND, of value calculated with Equation 6: æ R (kW) ö CCDR (pF ) = 66.7 ´ ç RDM ÷ è fDR (kHz) ø (6) Frequency dithering may be fully disabled by forcing the CDR pin > 5 V or by connecting it to VREF (6 V) and connecting the RDM pin directly to GND. (If populated, the relatively high impedance of the RDM resistor may allow system switching noise to couple in and interfere with the controller timing functions if not bypassed with a low impedance path when dithering is disabled.) If an external frequency source is used to synchronize fPWM and frequency dithering is desired, the external frequency source must provide the dither magnitude and rate functions as the internal dither circuitry is disabled to prevent undesired performance during synchronization. (See External Clock Synchronization for more details.) Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 15 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com Feature Description (continued) 7.3.4 External Clock Synchronization The UCC28070 has also been designed to be easily synchronized to almost any external frequency source. By disabling frequency dithering (pulling CDR > 5 V), the SYNC circuitry is enabled permitting the internal oscillator to be synchronized with pulses presented on the RDM pin. To ensure a precise 180° phase shift is maintained between the GDA and GDB outputs, the frequency (fSYNC) of the pulses presented at the RDM pin must be at twice the desired fPWM. For example, if a 100-kHz switching frequency is desired, the fSYNC should be 200 kHz. fPWM = fSYNC 2 (7) To ensure the internal oscillator does not interfere with the SYNC function, RRT must be sized to set the internal oscillator frequency at least 10% below fSYNC. RRT (kW ) = 15000 ´ 1.1 fSYNC (kHz ) (8) It must be noted that the PWM modulator gain is reduced by a factor equivalent to the scaled RRT due to a direct correlation between the PWM ramp current and RRT. Adjustments to the current loop gains should be made accordingly. It must also be noted that the maximum duty-cycle clamp programmability is affected during external synchronization. The internal timing circuitry responsible for setting the maximum duty cycle is initiated on the falling edge of the synchronization pulse. Therefore, the selection of RDMX becomes dependent on the synchronization pulse width (tSYNC). DSYNC = t SYNC ´fSYNCFor use in RDMX equation immediately below. (9) æ 15000 ö RDMX (kW ) = ç ÷ ´ (2 ´ DMAX - 1 - DSYNC ) è fSYNC (kHz) ø (10) Consequently to minimize the impact of the tSYNC it is clearly advantageous to use the smallest synchronization pulse width feasible. NOTE When external synchronization is used, a propagation delay of approximately 50 ns to 100 ns exists between internal timing circuits and the falling edge of the SYNC signal, which may result in reduced OFF-time at the highest of switching frequencies. Therefore, RDMX should be adjusted downward slightly by (tSYNC – 0.1 μs) / tSYNC to compensate. At lower SYNC frequencies, this delay becomes an insignificant fraction of the PWM period, and can be neglected. 16 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 Feature Description (continued) 7.3.5 Multi-phase Operation External synchronization also facilitates using more than 2 phases for interleaving. Multiple UCC28070s can easily be paralleled to add an even number of additional phases for higher-power applications. With appropriate phase-shifting of the synchronization signals, even more input and output ripple current cancellation can be obtained. (An odd number of phases can be accommodated if desired, but the ripple cancellation would not be optimal.) For 4-, 6-, or any 2 × n-phases (where n = the number of UCC28070 controllers), each controller should receive a SYNC signal which is 360/n degrees out of phase with each other. For a 4-phase application interleaving with two controllers, SYNC1 should be 180° out of phase with SYNC2 for optimal ripple cancellation. Similarly for a 6-phase system, SYNC1, SYNC2, and SYNC3 should be 120° out of phase with each other for optimal ripple cancellation. In a multi-phase interleaved system, each current loop is independent and treated separately; however, there is only one common voltage loop. To maintain a single control loop, all VSENSE, VINAC, SS, IMO, and VAO signals are paralleled, respectively between the n controllers. Where current-source outputs are combined (SS, IMO, VAO), the calculated load impedances must be adjusted by 1/n to maintain the same performance as with a single controller. Figure 18 illustrates the paralleling of two controllers for a 4-phase 90-degree-interleaved PFC system. 7.3.6 VSENSE and VINAC Resistor Configuration The primary purpose of the VSENSE input is to provide the voltage feedback from the output to the voltage control loop. Thus, a traditional resistor-divider network must be sized and connected between the output capacitor and the VSENSE pin to set the desired output voltage based on the 3-V regulation voltage on VSENSE. A unique aspect of the UCC28070 is the need to place the same resistor-divider network on the VIN side of the inductor to the VINAC pin. This provides the scaled input voltage monitoring needed for the linear multiplier and current synthesizer circuitry. It is not required that the actual resistance of the VINAC network be identical to the VSENSE network, but it is necessary that the attenuation (kR) of the two divider networks be equivalent for proper PFC operation. kR = RB (R A + RB ) (11) In noisy environments, it may be beneficial for small filter capacitors to be applied to the VSENSE and VINAC inputs to avoid the destabilizing effects of excessive noise on these inputs. If applied, the RC time-constant should not exceed 100 μs on the VSENSE input to avoid significant delay in the output transient response. The RC time-constant should also not exceed 100 μs on the VINAC input to avoid degrading of the wave-shape zerocrossings. Usually, a time constant of 3 / fPWM is adequate to filter out typical noise on VSENSE and VINAC. Some design and test iteration may be required to find the optimal amount of filtering required in a particular application. 7.3.7 VSENSE and VINAC Open-Circuit Protection Both the VSENSE and VINAC pins have been designed with an internal 250-nA current sink to ensure that in the event of an open circuit at either pin, the voltage is not left undefined, and the UCC28070 remains in a safe operating mode. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 17 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com Feature Description (continued) VIN – L1 D1 + To CSB1 VREF1 RA RB RDMX1 1 CDR DMAX 20 2 RDM RT 19 3 VAO SS 18 4 VSENSE GDB 17 5 VINAC GND 16 6 IMO VCC 15 7 RSYNTH GDA 14 CSB1 8 CSB VREF 13 9 CSA CAOA 12 T1 RS1 RRT1 M1 12V to 21V L2 VREF1 D2 From Ixfrms To CSA1 CSA1 10 PKLMT CAOB 11 T2 RSYN1 RS2 M2 CZV RIMO CPV CREF CPC CPC RPK2 CZC CZC RPK1 CSS RZV RZC RZC VOUT RZC RZC RA COUT CPC CZC CPC CZC RB CREF Vin L3 D3 RSYN2 To CSA2 10 PKLMT T3 RS3 CAOB 11 CSA2 9 CSA CAOA 12 8 CSB VREF 13 From Ixfrms VREF2 M3 CSB2 7 RSYNTH GDA 14 6 IMO VCC 15 5 VINAC GND 16 4 VSENSE GDB 17 3 VAO SS 18 2 RDM RT 19 1 CDR DMAX 20 12V to 21V L4 D4 RRT2 To CSB2 Synchronized Clocks with 180° Phase Shift RDMX2 RS4 T4 M4 Copyright © 2016, Texas Instruments Incorporated Figure 18. Simplified Four-Phase Application Diagram Using Two UCC28070 Devices 18 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 Feature Description (continued) 7.3.8 Current Synthesizer One of the most prominent innovations in the UCC28070 design is the current synthesizer circuitry that synchronously monitors the instantaneous inductor current through a combination of ON-time sampling and OFFtime down-slope emulation. During the ON-time of the GDA and GDB outputs, the inductor current is recorded at the CSA and CSB pins, respectively, through the current transformer network in each output phase. Meanwhile, the continuous monitoring of the input and output voltages through the VINAC and VSENSE pins permits the UCC28070 to internally recreate the down-slope of the inductor current during the respective OFF-time of each output. Through the selection of the RSYNTH resistor (RSYN), based on Equation 12, the internal response may be adjusted to accommodate the wide range of inductances expected across the wide array of applications. During inrush surge events at power up and AC drop-out recovery, VVSENSE < VVINAC, the synthesized downslope becomes zero. In this case, the synthesized inductor current remains above the IMO reference and the current loop drives the duty cycle to zero. This avoids excessive stress on the MOSFETs during the surge event. Once VVINAC falls below VVSENSE, the duty cycle increases until steady-state operation resumes. Waveform at CSx input Synthesized down-slope Current Synthesizer output to CA Figure 19. Downslope of the Inductor Current RSYN (kW ) = (10 ´ N CT ´ LB (mH)´ k R ) RS (W ) where: • • • • LB = Nominal Zero-Bias Boost Inductance (μH) RS = Sense Resistor (Ω) NCT = Current-sense Transformer turns ratio kR = RB / (RA + RB) = the resistor-divider attenuation at the VSENSE and VINAC pins Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 (12) 19 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com Feature Description (continued) 7.3.9 Programmable Peak Current Limit The UCC28070 has been designed with a programmable cycle-by-cycle peak current limit dedicated to disabling either the GDA or GDB output whenever the corresponding current-sense input (CSA or CSB, respectively) rises above the voltage established on the PKLMT pin. Once an output has been disabled through the detection of peak current limit, the output remains disabled until the next clock cycle initiates a new PWM period. The programming range of the PKLMT voltage extends to upwards of 4 V to permit the full use of the 3-V average current sense signal range; however, note that the linearity of the current amplifiers begins to compress above 3.6 V. A resistor-divider network from VREF to GND can easily program the peak current limit voltage on PKLMT, provided the total current out of VREF is less than 2 mA to avoid drooping of the 6-V VREF voltage. TI recommends a load of less than 0.5 mA, but if the resistance on PKLMT is very high, TI recommends a small filter capacitor on PKLMT to avoid operational problems in high-noise environments. Externally Programmable Peak Current Limit level (PKLMT) PKLMT 10 IPEAKx + To Gate-Drive Shut-down CSx Current Synthesizer DI To Current Amplifier 3V Average Current-sense Signal Range, plus Ripple Figure 20. Externally Programmable Peak Current Limit 7.3.10 Linear Multiplier and Quantized Voltage Feed Forward The UCC28070 multiplier generates a reference current which represents the desired wave shape and proportional amplitude of the AC input current. This current is converted to a reference voltage signal by the RIMO resistor which is scaled in value to match the voltage of the current-sense signals. The instantaneous multiplier current is dependent upon the rectified, scaled input voltage VVINAC and the voltage-error amplifier output VVAO. VVINAC conveys three pieces of information to the multiplier: • The overall wave-shape of the input voltage (typically sinusoidal) • The instantaneous input voltage magnitude at any point in the line cycle • The rms level of the input voltage. VVAO represents the total output power of the PFC preregulator. A major innovation in the UCC28070 multiplier architecture is the internal quantized VRMS feed-forward (QVFF) circuitry, which eliminates the requirement for external filtering of the VINAC signal and the subsequent slow response to transient line variations. A unique circuit algorithm detects the transition of the peak of VVINAC through seven thresholds and generates an equivalent VFF level centered within the 8-QVFF ranges. The boundaries of the ranges expand with increasing VIN to maintain an approximately equal-percentage delta between levels. These 8-QVFF levels are spaced to accommodate the full universal line range of 85 to 265 VRMS. 20 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 Feature Description (continued) A great benefit of the QVFF architecture is that the fixed kVFF factors eliminate any contribution to distortion of the multiplier output, unlike an externally-filtered VINAC signal which unavoidably contains 2nd-harmonic distortion components. Furthermore, the QVFF algorithm allows for rapid response to both increasing and decreasing changes in input rms voltage so that disturbances transmitted to the PFC output are minimized. 5% hysteresis in the level thresholds help avoid chattering between QVFF levels for VVINAC voltage peaks near a particular threshold or containing mild ringing or distortion. The QVFF architecture requires that the input voltage be largely sinusoidal, and relies on detecting zero-crossings to adjust QVFF downward on decreasing input voltage. Zerocrossings are defined as VVINAC falling below 0.7 V for at least 50 μs, typically. Table 1 shows the relationship between the various VVINAC peak voltages and the corresponding kVFF terms for the multiplier equation. Table 1. VVINAC Peak Voltages VVINAC PEAK VOLTAGE kVFF (V2) 8 2.6 V ≤ VVINAC(pk) 3.857 >345 V 7 2.25 V ≤ VVINAC(pk) < 2.6 V 2.922 300 V to 345 V 6 1.95 V ≤ VVINAC(pk) < 2.25 V 2.199 260 V to 300 V 5 1.65 V ≤ VVINAC(pk) < 1.95 V 1.604 220 V to 260 V 4 1.4 V ≤ VVINAC(pk) < 1.65 V 1.156 187 V to 220 V 3 1.2 V ≤ VVINAC(pk) < 1.4 V 0.839 160 V to 187 V 2 1 V ≤ VVINAC(pk) < 1.2 V 0.600 133 V to 160 V 1 VVINAC(pk) ≤ 1 V 0.398 10.2 V, and 1 V of hysteresis assures reliable start-up from a possibly low-compliance bias source. An internal 25-V Zener-like clamp on the VCC pin is intended only to protect the device from brief energy-limited surges from the bias supply, and should not be used as a regulator with a current-limited source. At minimum, a 0.1-μF ceramic bypass capacitor must be applied from VCC to GND close to the device pins to provide local filtering of the bias supply. Larger values may be required depending on ICC peak current magnitudes and durations to minimize ripple voltage on VCC. To provide a smooth transition out of UVLO and to make the 6-V voltage reference available as early as possible, the output from VREF is enabled when VCC exceeds 8 V typically. The VREF circuitry is designed to provide the biasing of all internal control circuits and for limited use externally. At minimum, a 22-nF ceramic bypass capacitor must be applied from VREF to GND close to the device pins to ensure stability of the circuit. External load current on the VREF pin should be limited to less than 2 mA, or degraded regulation may result. 7.3.13 PFC Enable and Disable The UCC28070 contains two independent circuits dedicated to disabling the GDx outputs based on the biasing conditions of the VSENSE or SS pins. The first is a PFC Enable which monitors VVSENSE and holds off soft-start and the overall PFC function until the output has pre-charged to approximately 25%. Prior to VVSENSE reaching 0.75 V, almost all of the internal circuitry is disabled. Once VVSENSE reaches 0.75 V and VVAO < 0.75 V, the oscillator, multiplier, and current synthesizer are enabled and the SS circuitry begins to ramp up the voltage on the SS pin. The second circuit provides an external interface to emulate an internal fault condition to disable the GDx output without fully disabling the voltage loop and multiplier. By externally pulling the SS pin below 0.6 V, the GDx outputs are immediately disabled and held low. Assuming no other fault conditions are present, normal PWM operation resumes when the external SS pulldown is released. The external pulldown must be sized large enough to override the internal 1.5-mA adaptive SS pullup once the SS voltage falls below the disable threshold. TI recommends using a MOSFET with less than 100-Ω RDS(on) resistance to ensure the SS pin is held adequately below the disable threshold. 7.3.14 Adaptive Soft Start To maintain a controlled power up, the UCC28070 has been designed with an adaptive soft-start function that overrides the internal reference voltage with a controlled voltage ramp during power up. On initial power up, once VVSENSE exceeds the 0.75-V enable threshold (VEN), the internal pulldown on the SS pin is released, and the 1.5‑mA adaptive soft-start current source is activated. This 1.5-mA pull-up almost immediately pulls the SS pin to 0.75 V (VVSENSE) to bypass the initial 25% of dead time during a traditional 0 V to Vregulation SS ramp. Once the SS pin has reached the voltage on VSENSE, the 10-μA soft-start current (ISS) takes over. Thus, through the selection of the soft-start capacitor (CSS), the effective soft-start time (tSS) may be easily programmed based on Equation 21. æ 2.25 V ö t SS = CSS ´ ç ÷ è 10 mA ø (21) Often, a system restart is desired following a brief shut-down. In such a case, VSENSE may still have substantial voltage if VOUT has not fully discharged or if high line has peak charged COUT. To eliminate the delay caused by charging CSS from 0 V up to the precharged VVSENSE with only the 10-μA current source and minimize any further output voltage sag, the adaptive soft start uses a 1.5-mA current source to rapidly charge CSS to VVSENSE, after which time the 10-μA source controls the VSS rise at the desired soft-start ramp rate. In such a case, tSS is estimated as follows: æ 3 V - VVSENSE0 ö t SS = CSS ´ ç ÷ 10 mA è ø where • VVSENSE0 is the voltage at VSENSE at the moment a soft start or restart is initiated Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 (22) 23 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com NOTE For soft start to be effective and avoid overshoot on VOUT, the SS ramp must be slower than the voltage-loop control response. Choose CSS ≥ CVZ to ensure this. (V) VSS VVSENSE VSS if no adaptive current Time (s) PFC externally disabled due to AC-line drop-out Reduced delay to regulation AC-Line recovers and SS pin released Figure 21. Soft-Start Ramp Rate 7.3.15 PFC Start-Up Hold Off An additional feature designed into the UCC28070 is the Start-Up Hold Off logic that prevents the device from initiating a soft-start cycle until the VAO pin is below the zero-power threshold (0.75 V). This feature ensures that the SS cycle initiates from zero-power and zero duty-cycle while preventing the potential for any significant inrush currents due to stored charge in the VAO compensation network. 7.3.16 Output Overvoltage Protection (OVP) Because of the high voltage output and a limited design margin on the output capacitor, output overvoltage protection is essential for PFC circuits. The UCC28070 implements OVP through the continuous monitoring of VVSENSE. In the event VVSENSE rises above 106% of regulation (3.18 V), the GDx outputs are immediately disabled to prevent the output voltage from reaching excessive levels. Meanwhile the CAOx outputs are pulled low to ensure a controlled recovery starting from 0% duty-cycle after an OVP fault is released. Once VVSENSE has dropped below 3.08 V, the PWM operation resumes normal operation. 7.3.17 Zero-Power Detection To prevent undesired performance under no-load and near no-load conditions, the UCC28070 zero-power detection comparator is designed to disable both GDA and GDB outputs in the event VVAO voltage falls below 0.75 V. The 150 mV of hysteresis ensures that the outputs remain disabled until VVAO has nearly risen back into the linear range of the multiplier (VVAO ≥ 0.9 V). 7.3.18 Thermal Shutdown To protect the power supplies from silicon failures at excessive temperatures, the UCC28070 has an internal temperature-sensing comparator that shuts down nearly all of the internal circuitry, and disables the GDA and GDB outputs, if the die temperature rises above 160°C. Once the die temperature falls below 140°C, the device brings the outputs up through a typical soft start. 24 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 7.3.19 Current Loop Compensation The UCC28070 incorporates two identical and independent transconductance-type current-error amplifiers (one for each phase) with which to control the shaping of the PFC input current waveform. The current-error amplifier (CA) forms the heart of the embedded current control loop of the boost PFC preregulator, and is compensated for loop stability using familiar principles [4, 5]. The output of the CA for phase-A is CAOA, and that for phase-B is CAOB. Because the design considerations are the same for both, they are collectively referred to as CAOx, where x is A or B. In a boost PFC preregulator, the current control loop comprises the boost power plant stage, the current sensing circuitry, the wave-shape reference, the PWM stage, and the CA with compensation components. The CA compares the average boost inductor current sensed with the wave-shape reference from the multiplier stage and generates an output current proportional to the difference. This CA output current flows through the impedance of the compensation network generating an output voltage, VCAO, which is then compared with a periodic voltage ramp to generate the PWM signal necessary to achieve PFC. IMO CAOx + CAx – CSx Current Synthesizer CZC gmC = 100 µs CPC RZC Copyright © 2016, Texas Instruments Incorporated Figure 22. Current Error Amplifier With Type II Compensation For frequencies above boost LC resonance and below fPWM, the small-signal model of the boost stage, which includes current sensing, can be simplified to: VOUT ´ NRCTS v RS = v CA DVRMP ´ k SYNC ´ s ´ LB where: • • • • • • • LB = mid-value boost inductance RS = CT sense resistor NCT = CT turns ratio VOUT = average output voltage ∆VRMP = 4 Vpk-pk amplitude of the PWM voltage ramp kSYNC = ramp reduction factor (if PWM frequency is synchronized to an external oscillator; kSYNC = 1, otherwise) s = Laplace complex variable (23) An RZCCZC network is introduced on CAOx to obtain high gain for the low-frequency content of the inductor current signal, but reduced flat gain above the zero frequency out to fPWM to attenuate the high-frequency switching ripple content of the signal (thus averaging it). The switching ripple voltage should be attenuated to less than 1/10 of the ΔVRMP amplitude so as to be considered negligible ripple. Thus, CAOx gain at fPWM is: gmc ´ Rzc £ DVRMP ´k SYNC 10 RS LB NCT DI ´ where: • • ∆ILB is the maximum peak-to-peak ripple current in the boost inductor gmc is the transconductance of the CA, 100 μS (24) Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 25 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 Rzc £ www.ti.com 4 V ´ NCT 10 ´ 100 ms ´ DILB ´ RS (25) The current-loop cross-over frequency is then found by equating the open loop gain to 1 and solving for fCXO: fCXO = VOUT ´ NRCTS DVRMP ´ k SYNC ´ 2p ´ LB ´ gmc ´ Rzc (26) CCZ is then determined by setting fZC = fCXO = 1 / (2πRZC × CZC) and solving for CZC. At fZC = fCXO, a phase margin of 45° is obtained at fCXO. Greater phase margin may be had by placing fZC < fCXO. An additional high-frequency pole is generally added at fPWM to further attenuate ripple and noise at fPWM and higher. This is done by adding a small-value capacitor, Cpc, across the RzcCzcnetwork. Cpc = 1 2p ´ fPWM ´ Rzc (27) The procedure above is valid for fixed-value inductors. NOTE If a swinging-choke boost inductor (inductance decreases with increasing current) is used, fCXO varies with inductance, so CZC should be determined at maximum inductance. 7.3.20 Voltage Loop Compensation The outer voltage control loop of the dual-phase PFC controller functions the same as with a single-phase controller, and compensation techniques for loop stability are standard [4]. The bandwidth of the voltage-loop must be considerably lower than the twice-line ripple frequency (f2LF) on the output capacitor to avoid distortioncausing correction to the output voltage. The output of the voltage-error amplifier (VVAO) is an input to the multiplier to adjust the input current amplitude relative to the required output power. Variations on VAO within the bandwidth of the current loops influences the wave-shape of the input current. Because the low-frequency ripple on COUT is a function of input power only, its peak-to-peak amplitude is the same at high-line as at low-line. Any response of the voltage-loop to this ripple has a greater distorting effect on high-line current than on low-line current. Therefore, the allowable percentage of 3rd-harmonic distortion on the input current contributed by VAO should be determined using high-line conditions. Because the voltage-error amplifier (VA) is a transconductance type of amplifier, the impedance on its input has no bearing on the amplifier gain, which is determined solely by the product of its transconductance (gmv) with its output impedance (ZOV). Thus, the VSENSE input divider-network values are determined separately based on criteria discussed in VSENSE and VINAC Resistor Configuration. Its output is the VAO pin. VAO 3V + VA – VSENSE CZV gmv = 70 µs CPV RZV Copyright © 2016, Texas Instruments Incorporated Figure 23. Voltage Error Amplifier With Type II Compensation The twice-line ripple voltage component of VVSENSE must be sufficiently attenuated and phase-shifted at VAO to achieve the desired level of 3rd-harmonic distortion of the input current wave-shape [4]. For every 1% of 3rdharmonic input distortion allowable, the small-signal gain GVEA = VVAOpk / vSENSEpk = gmv × ZOV at the twice-line frequency should allow no more than 2% ripple over the full VVAO voltage range. In the UCC28070, VVAO can range from 1 V at zero load power to ~4.2 V at full load power for a ΔVVAO = 3.2 V, so 2% of 3.2 V is 64-mV peak ripple. 26 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 NOTE Although the maximum VVAO is clamped at 5 V, at full load VVAO may vary around an approximate center point of 4.2 V to compensate for the effects of the quantized feedforward voltage in the multiplier stage (see Linear Multiplier and Quantized Voltage Feed Forward for details). Therefore, 4.2 V is the proper voltage to use to represent maximum output power when performing voltage-loop gain calculations. The output capacitor maximum low-frequency, zero-to-peak, ripple voltage is closely approximated by: v 0pk = PIN(avg) ´ XCout PIN(avg) = VOUT(avg) VOUT(avg) ´ 2p ´ f2LF ´ COUT where: • • • PIN(avg) is the total maximum input power of the interleaved-PFC preregulator VOUT(avg) is the average output voltage COUT is the output capacitance VSENSEpk = vopk × kR (28) where • kR is the gain of the resistor-divider network on VSENSE (29) Thus, for k3rd, the percentage of allowable 3rd-harmonic distortion on the input current attributable to the VAO ripple, ZOV( f2LF ) = k 3rd ´ 64 mV ´ VOUT(avg) ´ 2p ´ f2LF ´ COUT gmv ´ k R ´ PIN(avg) (30) This impedance on VAO is set by a capacitor (CPV), where CPV = 1 / (2πf2LF × ZOV(f2LF)); therefore: Cpv = gmv ´ k R ´ PIN(avg) k 3rd ´ 64 mV ´ VOUT(avg) ´ (2p ´ f2LF )2 ´ COUT (31) The voltage-loop unity-gain cross-over frequency (fVXO) may now be solved by setting the open-loop gain equal to 1: æ PIN(avg) ´ XCout ö ´ g ´ XCpv )´ k R = 1 Tv(fVXO ) = GBST ´ GVEA ´ k R = ç ç DVVAO ´ VOUT(avg) ÷÷ ( mv è ø g k P ´ ´ mv R IN(avg) fVXO 2 = 2 DVVAO ´ VOUT(avg) ´ (2p ) ´ Cpv ´ COUT so, (32) (33) The zero-resistor (RZV) from the zero-placement network of the compensation may now be calculated. Together with CPV, RZV sets a pole right at fVXO to obtain 45° phase margin at the cross-over. Rzv = Thus, 1 2p ´ fVXO ´ Cpv (34) Finally, a zero is placed at or below fVXO / 6 with capacitor CZV to provide high gain at DC but with a breakpoint far enough below fVXO so as not to significantly reduce the phase margin. Choosing fVXO / 10 allows one to approximate the parallel combination value of CZV and CPV as CZV, and solve for CZV simply as: Czv = 10 2p ´ fVXO ´ Rzv » 10 ´ Cpv (35) By using a spreadsheet or math program, CZV, RZV, and CPV may be manipulated to observe their effects on fVXO and phase margin and the percentage contribution to 3rd-harmonic distortion. Also, phase margin may be checked as PIN(avg) level and system parameter tolerances vary. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 27 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com NOTE The percent of 3rd-harmonic distortion calculated in this section represents the contribution from the f2LF voltage ripple on COUT only. Other sources of distortion, such as the current-sense transformer, the current synthesizer stage, even distorted VIN, and so on, can contribute additional 3rd and higher order harmonic distortion. 7.4 Device Functional Modes The UCC28070 operates in Average Current Mode. This eliminates the peak-to-average current error inherent in the peak current mode control method and gives lower THD and harmonics on the current drawn from the line. It does not require slope compensation and has better noise immunity than the peak current control method. 28 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The UCC28070 is a switch-mode controller used in interleaved boost converters for power factor correction. The UCC28070 requires few external components to operate as an active PFC preregulator. It operates at a fixed frequency in continuous conduction mode. The operating switching frequency can be programmed from 30 kHz to 300 kHz by a single resistor from the RT pin to ground. The magnitude and rate of optional frequency dithering may also be controlled easily. The internal 5-V reference voltage provides for accurate output voltage regulation over the typical world-wide 85-VAC to 265-VAC mains input range from zero to full output load. The reference may also be used to set a peak current limit. Regulation is accomplished in two loops. The inner current loop shapes the average input current to match the sinusoidal input voltage under continuous inductor current conditions. A single multiplier output is shared between the two current amplifiers to ensure close matching of the currents in the two phases. A Zero Power detector disables both the GDA and GDB outputs under light-load conditions. 8.2 Typical Application L1 VIN D1 12–21 V VOUT VREF VREF 1 CDR DMAX 20 2 RDM RT 19 3 VAO SS 18 4 VSENSE GDB 17 5 VINAC GND 16 6 IMO VCC 15 7 RSYNTH GDA 14 8 CSB VREF 13 9 CSA CAOA 12 RDMX RRDM RA RA To CSB R S1 RRT T1 CSS M1 CVCC L2 CREF CSB D2 To CSA R S2 CSA CZV 11 M2 CZC RIMO CPV RB CAOB COUT RSYN 10 PKLMT T2 RPK1 CPC CZC CPC RB RZV RPK2 RZC RZC Copyright © 2016, Texas Instruments Incorporated Figure 24. Typical Application Diagram Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 29 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com Typical Application (continued) 8.2.1 Design Requirements For this design example, use the parameters listed in Table 2 as the input parameters. Table 2. Design Parameters DESIGN PARAMETER MIN TYP 85 MAX UNIT 265 V 63 Hz VAC Input voltage VOUT Output voltage fLINE Line frequency fSW Switching frequency 200 kHz POUT Output power 300 W η Full load efficiency 390 47 V 90% 8.2.2 Detailed Design Procedure 8.2.2.1 Output Current Calculation The first step is to determine the maximum load current on the output. P 300W Io = o = = 0.78A Vo 385V (36) 8.2.2.2 Bridge Rectifier The maximum RMS input-line current is given by Equation 37: Po 300W Iline _ max = = = 3.6Arms hVAC _ min 98%(85V) (37) The peak input current is given by Equation 38: Iin _ pk = 2 ´ Iline _ max = 2 ´ 3.6A = 5.1A (38) The maximum average rectified line current is given by Equation 39: Iin _ avg _ max = 2 2 2 2 ´ Iline _ max = ´ 3.6A = 3.25A p p (39) A typical bridge rectifier has a forward voltage drop VF of 0.95 V. The power loss in the rectifier bridge can be calculated by Equation 40: PBR _ max = 2 ´ VF ´ Iin _ avg _ max = 2 ´ 0.95V ´ 3.25A = 6.2W (40) The bridge rectifier must be rated to carry the full line current. The voltage rating of the bridge should be at least 600 V. The bridge rectifier also carries the full inrush current as the bulk capacitor COUT charges when line is connected. 30 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 8.2.2.3 PFC Inductor (L1 and L2) The selection of the PFC inductor value may be based on a number of different considerations. Cost, core size, EMI filter, and inductor ripple current are some of the factors that have an influence. For this design we choose the inductor so that at the minimum input voltage the peak to peak ripple (ΔIL) has the same amplitude as the peak of line current in each phase. The line current flows equally in the two phases so ΔII is half Iin_pk calculated in Equation 38. The inductor is calculated by Equation 41. V ´ D(1 - D) 385V ´ 0.7(1 - 0.7) L 1 = OUT = » 160µH 5.1A f sw ´ DI L 200kHz ´ 2 where • • • VOUT is the PFC stage output voltage fSW is the switching frequency ΔIL is the allowed peak-to-peak ripple current. (41) D is the PFC stage duty cycle at 120 VIN (peak of 85 Vrms line) and is given by Equation 42: V D = 1 - IN V OUT (42) The peak current in each boost inductor is then: I in _ pk DI L 5.1A 5.1A + = + = 3.8A I L _ pk = 2 2 2 4 (43) The inductor specifications are: • Inductance: 160 µH • Current: 4 A 8.2.2.4 PFC MOSFETs (M1 and M2) The main specifications for the PFC MOSFETs are: • BVDSS, drain source breakdown voltage: ≥650 V • RDS(on), ON-state drain source resistance: 520 mΩ at 25°C, estimate 1 Ω at 125°C • CDSS, output capacitance: 32 pF • tr, devise rise time: 12 ns • tf, device fall time: 16 ns The losses in the device are calculated by Equation 44 and Equation 45. These calculations are approximations because the losses are dependent on parameters which are not well controlled. For example, the RDS(on) of a MOSFET can vary by a factor of 2 from 25°C to 125°C. Therefore several iterations may be needed to choose an optimum device for an application different than the one discussed. Each phase carries half the load power so the conduction losses are estimated by: PM _ cond æ 2 ´ VIN(min) 0.5 ´ Po 16 =ç ´ 2´ ç 2´V 3p VOUT IN(min) è 2 ö æ 150W 16 2 ´ 85V ÷ ´R ç = ´ 2´ DS(on) ÷ ç 3p 385V è 2 ´ 85V ø 2 ö ÷ ´ 1.0 = 2.25W ÷ ø (44) The switching losses in each MOSFET are estimated by: PM _ sw = Iline _ max æ ö 1 1 3.6A æ ö ´ f SW çç Vo ´ ´ (t r + t f ) + C os s ´ Vo 2 ÷÷ = ´ 200kHz ç 385V ´ ´ (12ns + 16ns ) + 32pF ´ 385V 2 ÷ = 2.4W 2 2 2 è ø è ø 2 (45) The total losses in each MOSFET are then: PM = PM _ cond + PM _ sw = 2.25W + 2.4W = 4.9W (46) Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 31 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com 8.2.2.5 PFC Diode Reverse recovery losses can be significant in a CCM boost converter. A Silicon Carbide Diode is chosen here because it has no reverse recovery charge (QRR) and therefore zero reverse recovery losses. I 0.78A PD = Vf ´ OUT = 1.5V ´ = 580mW (47) 2 2 8.2.2.6 PFC Output Capacitor The value of the output capacitor is governed by the required hold-up time and the allowable ripple on the output. The hold-up time depends on the load current and the minimum acceptable voltage at the output. The value of the output capacitor must be large enough to provide the required hold-up time and keep the ripple voltage at twice line frequency within acceptable limits. Normally a capacitance value of about 0.6 μF per Watt of output power is a reasonable compromise where hold-up time is not significant. At 300 W this would indicate a capacitance of about 200 μF. The low frequency (at twice line frequency) rms voltage ripple on VOUT is given by Equation 48: Io 1 1 0.78A Vo _ ripple = ´ = ´ = 4.4Vrms 2 2 2p ´ fline ´ C o 2 2 2p ´ 50Hz ´ 200µF (48) The resulting low frequency current in the capacitor is: Io _ ripple = 2p ´ flf ´ C o ´ Vo _ ripple = 4p ´ 100Hz ´ 200µF ´ 4.4V = 1.1Arms (49) 8.2.2.7 Current Loop Feedback Configuration (Sizing of the Current Transformer Turns Ratio and Sense Resistor (RS) A current-sense transformer (CT) is typically used in high-power applications to sense inductor current in order to avoid the losses inherent in the use of a current sensing resistor. For average current-mode control, the entire inductor current waveform is required; however low-frequency CTs are obviously impracticable. Normally, two high-frequency CTs are used, one in the switching leg to obtain the up-slope current and one in the diode leg to obtain the down-slope current. These two current signals are summed together to form the entire inductor current, but this is not necessary with the UCC28070. A major advantage of the UCC28070 design is the current synthesis function, which internally recreates the inductor current down-slope during the switching period OFF-time. This eliminates the need for the diode-leg CT in each phase, significantly reducing space, cost and complexity. A single resistor programs the synthesizer down slope, as previously discussed in the Current Synthesizer section. A number of trade-offs must be made in the selection of the CT. Various internal and external factors influence the size, cost, performance, and distortion contribution of the CT. These factors include, but are not limited to: • Turns-ratio (NCT) • Magnetizing inductance (LM) • Leakage inductance (LLK) • Volt-microsecond product (Vμs) • Distributed capacitance (Cd) • Series resistance (RSER) • External diode drop (VD) • External current sense resistor (RS) • External reset network Traditionally, the turns-ratio and the current sense resistor are selected first. Some iterations may be needed to refine the selection once the other considerations are included. In general, 50 ≤ NCT ≤ 200 is a reasonable range from which to choose. If NCT is too low, there may be high power loss in RS and insufficient LM. If too high, there could be excessive LLK and Cd. (A one-turn primary winding is assumed.) 32 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 LLK IDS 1 NCT LM CSx RSER D Cd iM Reset Network RS Copyright © 2016, Texas Instruments Incorporated Figure 25. Current Sense Transformer Equivalent Circuit A major contributor to distortion of the input current is the effect of magnetizing current on the CT output signal (iRS). A higher turns-ratio results in a higher LM for a given core size. LM should be high enough that the magnetizing current (iM) generated is a very small percentage of the total transformed current. This is an impossible criterion to maintain over the entire current range, because iM unavoidably becomes a larger fraction of iRS as the input current decreases toward zero. The effect of iM is to steal some of the signal current away from RS, reducing the CSx voltage and effectively understating the actual current being sensed. At low currents, this understatement can be significant and CAOx increases the current-loop duty-cycle in an attempt to correct the CSx input(s) to match the IMO reference voltage. This unwanted correction results in overstated current on the input wave shape in the regions where the CT understatement is significant, such as near the AC line zero crossings. It can affect the entire waveform to some degree under the high line, light-load conditions. The sense resistor RS is chosen, in conjunction with NCT, to establish the sense voltage at CSx to be about 3 V at the center of the reflected inductor ripple current under maximum load. The goal is to maximize the average signal within the common-mode input range VCMCAO of the CAOx current-error amplifiers, while leaving room for the peaks of the ripple current within VCMCAO. The design condition should be at the lowest maximum input power limit as determined in the section on the Linear Multiplier and Quantized Voltage Feed Forward. If the inductor ripple current is so high as to cause VCSx to exceed VCMCAO, then RS or NCT or both must be adjusted to reduce peak VCSx, which could reduce the average sense voltage center below 3 V. There is nothing wrong with this situation; but be aware that the signal is more compressed between full- and no-load, with potentially more distortion at light loads. The matter of volt-second balancing is important, especially with the widely varying duty-cycles in the PFC stage. Ideally, the CT is reset once each switching period; that is, the OFF-time Vμs product equals the ON-time Vμs product. On-time Vμs is the time-integral of the voltage across LM generated by the series elements RSER, LLK, D, and RS. Off-time Vμs is the time-integral of the voltage across the reset network during the OFF-time. With passive reset, Vμs-off is unlikely to exceed Vμs-on. Sustained unbalance in the on or off Vμs products leads to core saturation and a total loss of the current-sense signal. Loss of VCSx causes VCAOx to quickly rise to its maximum, programming a maximum duty-cycle at any line condition. This, in turn causes the boost inductor current to increase without control, until the system fuse or some component failure interrupts the input current. It is vital that the CT has plenty of Vμs design-margin to accommodate various special situations where there may be several consecutive maximum duty-cycle periods at maximum input current, such as during peak current limiting. Maximum Vμs(on) can be estimated by: Vm(on)max = t ON(max ) ´ (VRS + VD + VRSER + VLK ) where • • all factors are maximized to account for worst-case transient conditions tON(max) occurs during the lowest dither frequency, if frequency dithering is enabled Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 (50) 33 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com For design margin, a CT rating of approximately 5 × Vμs(on)max or higher is suggested. The contribution of VRS varies directly with the line current. However, VD may have a significant voltage even at near-zero current, so substantial Vμs(on) may accrue at the zero-crossings where the duty-cycle is maximum. VRSER is the least contributor, and often can be neglected if RSER < RS. VLK is developed by the di/dt of the sensed current, and is not observable externally. However, its impact is considerable, given the sub-microsecond rise-time of the current signal plus the slope of the inductor current. Fortunately, most of the built-up Vμs across LM during the ON-time is removed during the fall-time at the end of the duty-cycle, leaving a lower net Vμs(on) to be reset during the OFF-time. Nevertheless, the CT must, at the very minimum, be capable of sustaining the full internal Vμs(on)max built up until the moment of turn-off within a switching period. Vμs(off) may be generated with a resistor or Zener diode, using the iM as bias current. CRST D D RRST RRST ZRST Copyright © 2016, Texas Instruments Incorporated Figure 26. Possible Reset Networks To accommodate various CT circuit designs and prevent the potentially destructive result due to CT saturation, the UCC28070’s maximum duty-cycle must be programmed such that the resulting minimum OFF-time accomplishes the required worst-case reset. (See the PWM Frequency and Duty-Cycle Clamp section of the data sheet for more information on sizing RDMX) Be aware that excessive Cd in the CT can interfere with effective resetting, because the maximum reset voltage is not reached until after 1/4-period of the CT self-resonant frequency. A higher turns-ratio results in higher Cd [3], so a trade-off between NCTand DMAX must be made. The selected turns-ratio also affects LM and LLK, which vary proportionally to the square of the turns. Higher LM is good, while higher LLK is not. If the voltage across LM during the ON-time is assumed to be constant (which it is not, but close enough to simplify) then the magnetizing current is an increasing ramp. This upward ramping current subtracts from iRS, which affects VCSx especially heavily at the zero-crossings and light loads, as stated earlier. With a reduced peak at VCSx, the current synthesizer starts the down-slope at a lower voltage, further reducing the average signal to CAOx and further increasing the distortion under these conditions. If low input current distortion at very light loads is required, special mitigation methods may need to be developed to accomplish that goal. 34 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 8.2.2.8 Current Sense Offset and PWM Ramp for Improved Noise Immunity To improve noise immunity at extremely light loads, TI recommends adding a PWM ramp with a DC offset to the current sense signals. Electrical components RTA, RTB, ROA, ROB, CTA, CTB, DPA1, DPA2, DPB1, DPB1 CTA, and CTB form a PWM ramp that is activated and deactivated by the gate drive outputs of the UCC28070. Resistor ROA and ROB add a DC offset to the CS resistors (RSA and RSB). VCC DPA1 ROA DPA2 RTA GDA CSA CTA RSA VCC DPB1 ROB DPB2 RTB GDB CTB RSB Copyright © 2016, Texas Instruments Incorporated Figure 27. PWM Ramp and Offset Circuit When the inductor current becomes discontinuous the boost inductors ring with the parasitic capacitances in the boost stages. This inductor current rings through the CTs causing a false current sense signal. Please refer to the following graphical representation of what the current sense signal looks like when the inductor current goes discontinuous. NOTE The inductor current and RS may vary from this graphical representation depending on how much inductor ringing is in the design when the unit goes discontinuous. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 35 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com Figure 28. False Current Sense Signal To counter for the offset (VOFF) just requires adjusting resistors ROA and ROB to ensure that when the unit goes discontinuous the current sense resistor is not seeing a positive current when it should be zero. Setting the offset to 120 mV is a good starting point and may need to be adjusted based on individual design criteria. RSA = RSB ROA = ROB = (51) (VVCC - VOFF )´ RSA VOFF (52) A small PWM ramp that is equal to 10% of the maximum current sense signal (VS) less the offset can then be added by properly selecting RTA, RTB, CTA and CTB. RTA = RTB = CTA = CTB = 36 (VVCC - (VS ´ 0.1 - VOFF ) + VDA 2 )´ RSA VS ´ 0.1 - VOFF 1 RTA ´ fS ´ 3 (53) (54) Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 8.2.3 Application Curves Ch1: Inductor current (IA) M1: Inductor Current (IB) Ch3: GDB Ch2: GDA Figure 29. Typical Inductor Currents Ch1: Inductor current (IA) M4: Input current (IA + IB) Ch1: Inductor current (IA) M4: Input current (IA + IB) M1: Inductor current (IB) Figure 30. Typical Inductor and Input Ripple Currents Ch1: Input current Figure 31. Typical Inductor and Input Ripple Currents 120 VAC PF = 0.98 Figure 32. Typical Input Current 9 Power Supply Recommendations The UCC28070 should be operated from a VCC rail which is within the limits given in Recommended Operating Conditions. To avoid the possibility that the device might stop switching, VCC must not be allowed to fall into the UVLO range. In order to minimize power dissipation in the device, VCC should not be unnecessarily high. Keeping VCC at 12 V is a good compromise between these competing constraints. The gate drive outputs from the UCC28070 can deliver large current pulses into their loads. This indicates the need for a low ESR decoupling capacitor to be connected as directly as possible between the VCC and GND pins. TI recommends ceramic capacitors with a stable dielectric characteristic over temperature, such as X7R. Avoid capacitors which have a large drop in capacitance with applied DC voltage bias and use a part that has a low voltage co-efficient of capacitance. TI recommends a decoupling capacitance of 10 μF, X7R, with at least a 25-V rating. A capacitor of at least 0.1 μF must be placed as close as possible between the VCC and GND pins. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 37 UCC28070 SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com 10 Layout 10.1 Layout Guidelines Interleaved PFC techniques dramatically reduce input and output ripple current caused by the PFC boost inductor, which allows the circuit to use smaller and less expensive filters. To maximize the benefits of interleaving, the output filter capacitor should be located after the two phases allowing the current of each phase to be combined together before entering the boost capacitor. Similar to other power management devices, when laying out the PCB it is important to use star grounding techniques and to keep filter and high frequency bypass capacitors as close to device pins and ground as possible. To minimize the possibility of interference caused by magnetic coupling from the boost inductor, the device should be located at least 1 inch away from the boost inductor. TI recommends the device not be placed underneath magnetic elements. 10.2 Layout Example To VOUT CBOUT RBOUT CZV RRDM CCDR Reference Designators are those used in the Simplified Application Diagram RZV CPV UCC28070 RDMX 1 CDR DMAX 20 2 RDM RT 19 3 VAO SS 18 To VIN CBIN RBIN RAOUT RRT CSS To Gate B 4 VSENSE GDB 17 5 VINAC GND 16 6 IMO VCC 15 7 RSYNTH GDA 14 RIMO RSYN To Current Sense B RCSB CCSB 8 CSB VREF 13 9 CSA CAOA 12 10 PKLMT CAOB 11 RCSA To VCC Supply To Gate A CPCA CCSA To Current Sense A CVCC RAIN RPK2 CZCA RZCA CZCB RZCB CREF CPCB RPK1 Copyright © 2016, Texas Instruments Incorporated Figure 33. Layout Diagram 38 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 UCC28070 www.ti.com SLUS794F – NOVEMBER 2007 – REVISED APRIL 2016 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: 1. O’Loughlin, Michael, An Interleaving PFC Pre-Regulator for High-Power Converters, Texas Instruments, Inc. 2006 Unitrode Power Supply Seminar, Topic 5 2. Erickson, Robert W., Fundamentals of Power Electronics, 1st ed., pp. 604-608 Norwell, MA: Kluwer Academic Publishers, 1997 3. Creel, Kirby Measuring Transformer Distributed Capacitance, White Paper, Datatronic Distribution, Inc. website: http://www.datatronics.com/pdf/distributed_capacitance_paper.pdf 4. L. H. Dixon, Optimizing the Design of a High Power Factor Switching Preregulator, Unitrode Power Supply Design Seminar Manual SEM700, 1990. SLUP093 5. L. H. Dixon, High Power Factor Preregulator for Off-Line Power Supplies, Unitrode Power Supply Design Seminar Manual SEM600, 1988. SLUP087 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: UCC28070 39 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) UCC28070DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 UCC28070 UCC28070DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 UCC28070 UCC28070PW ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 28070 UCC28070PWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 28070 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of