UCC29411, UCC29412
UCC29413, UCC39411
UCC39412, UCC39413
www.ti.com
SLUS245E – MARCH 2000 – REVISED JULY 2005
LOW-POWER SYNCHRONOUS BOOST CONVERTER
FEATURES
•
•
•
•
•
•
•
•
PW PACKAGE
(TOP VIEW)
1 V Input Voltage Operation Start-Up Ensured
Under Full Load on Main Output, and
Operation Down to 0.5 V
200 mW Output Power at Battery Voltages as
Low as 0.8 V
Secondary 7 V Supply from a Single Inductor
Output Fully Disconnected in Shutdown
Adaptive Current Mode Control for Optimum
Efficiency
High Efficiency Over Wide Operating Range
6 µA Shutdown Supply Current
Output Reset Function with Programmable
Reset Period
1
2
3
4
VIN
SD/FB
RESB
CT
8
7
6
5
VGD
VOUT
SW
GND
D PACKAGE
(TOP VIEW)
VOUT
VGD
VIN
SD/FB
1
8
2
7
3
6
4
5
SW
GND
CT
RESB
DESCRIPTION
The UCCx9411 family of low-input voltage, single-inductor-boost converters is optimized to operate from a single
or dual alkaline cell, and steps up to a 3.3 V, 5 V, or adjustable output at 200 mW. The UCCx9411 family also
provides an auxiliary 7 V output, primarily for the gate-drive supply, which can be used for applications requiring
an auxiliary output, such as 5 V, by linear regulating. The primary output starts up under full load at input
voltages typically as low as 0.8 V with a ensured max of 1 V, and operates down to 0.5 V once the converter is
operating, thereby maximizing battery usage.
SIMPLIFIED BLOCK DIAGRAM AND APPLICATION CIRCUIT
+
22 µ H
100 µ F
SW
1
VGD
VIN
1 V TO 3.5 V
6
3.3 V 200 mW
8
1.2 Ω
7
100 µ F
START–UP
CIRCUITRY
VOUT
100 µ F
0.5 Ω
MODULATOR CONTROL CIRCUIT
SYNCHRONOUS RECTIFICATION CIRCUITRY
ANTI–CROSS CONDUCTION
START–UP
MULTIPLEXING LOGIC
MAX INPUT POWER CONTROL
ADAPTIVE CURRENT CONTROL
R RES
RESB
SD/FB
2
RESET CONTROL CIRCUIT
GLITCH SUPRESSION
PROGRAMMABLE TIMING
3
CT
4
5
A.
GND
CT
Pinout shown is for the TSSOP Package. Consult Package Descriptions for the SOIC configurations.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2005, Texas Instruments Incorporated
UCC29411, UCC29412
UCC29413, UCC39411
UCC39412, UCC39413
www.ti.com
SLUS245E – MARCH 2000 – REVISED JULY 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
The UCCx9411 family is designed to accommodate demanding applications such as pagers and cell phones that
require high efficiency over a wide operating range of several milliwatts to a couple of hundred milli-watts. High
efficiency at low output current is achieved by optimizing switching and conduction losses with a low total
quiescent current. At higher output current, the 0.5 Ω switch and 1.2 Ω synchronous rectifier along with
continuous mode conduction provide high power efficiency. The wide input voltage range of the UCCx9411
family can accommodate other power sources such as NiCd and NiMH.
The UCCx9411 family also provides shutdown control. Packages available are the 8-pin SOIC (D) and 8-pin
TSSOP (PW) to optimize board space.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1) (2)
VALUE/UNIT
VIN
Input voltage
SD
Input voltage
–0.3 V to VIN
VGD
Input voltage
–0.3 V to 14 V
SW
Input voltage
–0.3 V to 15 V
VOUT
Output voltage
–0.3 V to 10 V
(1)
(2)
–0.3 V to 10 V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Currents are positive into, negative out of the specific terminal. Consult Packaging Section of the Portable Products Data Book
(SLUD001) for thermal limitations and considerations of packages.
available options
TJ
(1)
PACKAGE PW (1)
PACKAGE D (1)
OUTPUT VOLTAGE
OUTPUT VOLTAGE
ADJ
3.3 V
5V
ADJ
3.3 V
5V
–40°C to 85°C
29411PW
29412PW
29413PW
29411D
29412D
29413D
0°C to 70°C
39411PW
39412PW
39413PW
39411D
39412D
39413D
The UCC39411, UCC39412 and UCC39413 is avilable in tape and reel. Add TR suffix to device type (e.g. UCC39411PWTR or
UCC39411DTR) to order quantities of 2000 devices per reel (PW package) or 2500 devices per reel (D package).
ELECTRICAL CHARACTERISTICS
TJ = 0°C to 70°C for the UCC3941x, TJ = –40°C to 85°C for the UCC2941x, VIN = 1.25 V for UCC39411, UCC39412,
VIN = 2.5 V for the UCC39413, TA = TJ
PARAMETER
TEST CONDITIONS
UCC3941x
MIN
UCC2941x
TYP
MAX
No external VGD load, TJ = 25°C,
IOUT = 60 mA (1)
0.8
No external VGD load, IOUT = 60 mA (1)
0.9
MIN
UNITS
TYP
MAX
1
0.8
1
V
1.1
1.2
1.4
V
0.7
V
3.2
V
16
µA
INPUT VOLTAGE SECTION
Minimum start-up voltage
Minimum dropout voltage
No external VGD load, IOUT = 10 mA (1)
Input voltage range
Quiescent supply current
(1)
(2)
2
0.5
1.1
See
(2)
3.2
6
12
1.3
8
Ensured by design. Not production tested.
For the UCC39411 FB = 1.306 V, VGD = 7.7 V, For the UCC39412 VOUT = 3.5 V and VGD = 7.7 V, For the UCC39413 VOUT = 5.3 V,
VGD=9.3 V.
UCC29411, UCC29412
UCC29413, UCC39411
UCC39412, UCC39413
www.ti.com
SLUS245E – MARCH 2000 – REVISED JULY 2005
ELECTRICAL CHARACTERISTICS (continued)
TJ = 0°C to 70°C for the UCC3941x, TJ = –40°C to 85°C for the UCC2941x, VIN = 1.25 V for UCC39411, UCC39412,
VIN = 2.5 V for the UCC39413, TA = TJ
PARAMETER
Supply current at shutdown
UCC3941x
TEST CONDITIONS
MIN
UCC2941x
MAX
6
MIN
UNITS
TYP
MAX
12
8
16
µA
15
28
20
37
µA
3
6
5
10
µA
3.2
3.3
3.39
3.15
3.3
3.45
V
3.17
3.3
3.43
3.11
3.3
3.5
V
4.85
5
5.15
4.78
5
5.23
V
4.8
5
5.2
4.71
5
5.3
V
1.212
1.25
1.288
1.194
1.25
1.306
V
5.5
V
SD = GND
TYP
OUTPUT SECTION
(2)
Quiescent supply current
See
Supply current at shutdown
SD = GND
Regulation voltage (UCC39412)
Regulation voltage (UCC39413)
ADJ voltage (UCC39411)
1 V < VIN < 3 V
1 V < VIN < 3 V, 0 mA < IOUT < 60
mA (1)
1 V < VIN < 5 V
1 V < VIN < 5 V, 0 mA < IOUT < 60 mA (1)
1 V < VIN < 3 V
Maximum output voltage
(UCCx9411)
5.5
VGD OUTPUT SECTION
Quiescent supply current
See
(2)
20
40
27
55
µA
Supply current at shutdown
SD = GND
20
40
27
55
µA
7
7.7
6.3
7
7.7
V
Regulation voltage (UCC39411/2)
Regulation voltage (UCC39413)
1 V < VIN < 3 V
1 V < VIN < 3 V, 0 mA < IOUT < 10
6.3
mA (1)
6.3
7
7.7
6.3
7
7.7
V
1 V < VIN < 5 V
7.7
8.5
9.3
7.7
8.5
9.3
V
1 V < VIN < 5 V, 0 mA < IOUT < 10 mA (3)
7.7
8.5
9.3
7.7
8.5
9.3
V
180
250
300
180
250
300
mA
385
550
715
385
550
715
mA
D package
0.5
0.75
0.6
0.85
Ω
(3)
50
D package
1.2
1.8
0.4
0.6
0.8
2
5
15
5
20
INDUCTOR CHARGING SECTION (L = 22 µH)
Peak discontinuous current
Operating range, L = 22 µH
Peak continuous current
Charge switch RDS(on)
Current limit delay
See
50
ns
SYNCHRONOUS RECTIFIER SECTION
Rectifier RDS(on)
1.4
2.16
Ω
SHUTDOWN SECTION
Threshold
Input bias current
SD = GND
SD = 1.25 V
0.2 0.6
2
0.9
V
5
15
µA
20
100
nA
RESET SECTION
Threshold (UCC39411)
1.08
1.125
1.17
1.07
1.125
1.18
V
Threshold (UCC39412)
2.85
2.97
3.09
2.83
2.97
3.11
V
4.32
4.5
4.68
4.3
4.5
4.7
V
113
188
300
94
188
300
ms
Threshold (UCC39413)
Reset period
CT = 0.15 µF
VOUT to reset delay
VOUT falling at -1 mV/µs (3)
Sink current
Output low voltage
1
IOUT = 500 µA
Output leakage
(3)
60
60
20
1
µs
20
mA
0.1
0.1
V
0.5
0.5
µA
Ensured by design. Not production tested.
3
UCC29411, UCC29412
UCC29413, UCC39411
UCC39412, UCC39413
www.ti.com
SLUS245E – MARCH 2000 – REVISED JULY 2005
PIN ASSIGNMENTS
VIN: Input voltage to supply the IC during start-up. After the output is running the IC draws power from VOUT or
VGD.
SW: An inductor is connected between this pin and VIN. The VGD (gate drive supply) flyback diode is also
connected to this pin. When servicing the main output supply this pin pulls low, charging the inductor, then shuts
off dumping the energy through the synchronous rectifier to the output. When servicing the VGD supply, the
internal synchronous rectifier stays off and the energy is diverted to VGD through the flyback diode. During
discontinuous portions of the inductor current, a MOSFET resistively connects VIN to SW damping excess
circulating energy to eliminate undesired high-frequency ringing.
VGD: The VGD pin, which is coarsely regulated around 7 V (8.5 V for the UCC39413), is primarily used for the
gate drive supply for the power switches in the IC. This pin can be loaded with up to 10 mA as long as it does
not present a load at voltages below 2 V (this ensures proper start-up of the IC). The VGD supply can go as low
as 6.3 V without interfering with the servicing of the main output. When below 6.3 V, VGD has the highest
priority.
VOUT: Main output voltage (3.3 V, 5 V, or adjustable), has highest priority in the multiplexing scheme, as long as
VGD is above the critical level of 6.3 V. Startup at full load is achievable at input voltages down to 1 V.
CT: This pin provides the timer for determining the reset period. The period is controlled by placing a capacitor to
ground of value C = (0.81e-6) × t where t is the desired reset period.
RESB: This pin provides an active low signal to alert the user when the main output voltage falls below 10% of
its targeted value. The open-drain output can be used to reset a microcontroller that may be powered off of the
main output voltage.
SD/FB: For the UCC39411, this pin is used to adjust the output voltage via a resistive divider from VOUT. It also
serves as the shutdown pin for all three versions. Pulling this pin low provides a shutdown signal to the IC.
GND: Ground of the IC.
4
UCC29411, UCC29412
UCC29413, UCC39411
UCC39412, UCC39413
www.ti.com
SLUS245E – MARCH 2000 – REVISED JULY 2005
APPLICATION INFORMATION
OPERATION
A detailed block diagram of the UCC39411 is shown in Figure 1. Unique control circuitry provides high-efficiency
power conversion for both light and heavy loads by transitioning between discontinuous and continuous
conduction based on load conditions. Figure 2 depicts converter waveforms for the application circuit shown in
Figure 3. A single 22µH inductor provides the energy pulses required for a highly efficient 3.3 V converter at up
to 200 mW output power.
At time t1, the 3.3 V output voltage has dropped below its lower threshold, and the inductor is charged with an on
time determined by: tON = 5.5 µs/VIN. For a 1.25 V input and a 22 µH inductor, the resulting peak current is
approximately 250 mA. At time t2, the inductor begins to discharge with a minimum off time of approximately 1
ms. Under lightly loaded conditions, the amount of energy delivered in this single pulse satisfies the
voltage-control loop, and the converter does not command any more energy pulses until the output again drops
below the lower-voltage threshold.
At time t3, the VGD supply drops below its lower threshold, but the output voltage is still above its threshold
point. This results in an energy pulse to the gate-drive supply at t4. In some cases, a single pulse supplied to
VGD is insufficient to raise the VGD voltage level enough to satisfy the voltage loop. Under this condition,
multiple pulses are supplied to VGD. Note that when the UCC3941x is servicing VGD only, the IC maintains a
discontinuous mode of operation. After time t4, the 3.3 V output drops below its threshold and requests to be
serviced once the VGD cycle has completed, which occurs at time t5.
Time t6 represents a transition between light load and heavy load. A single energy pulse is not sufficient to force
the output voltage above its upper threshold before the minimum off time has expired and a second charge cycle
is commanded. Since the inductor current does not reach zero in this case, the peak current is greater than 250
mA at the end of the next charge on time. The result is a ratcheting of inductor current until either the output
voltage is satisfied, or the converter reaches its set current limit. At time t7, the gate drive voltage has dropped
below its 7 V threshold but the converter continues to service the output because it has higher priority unless
VGD drops below about 6.3 V.
Between time t7 and t8, the converter reaches its peak current limit.
Once the peak current is reached, the converter operates in continuous mode with approximately 60 mA of
inductor current ripple. At time t8, the 3.3 V output is satisfied and the converter can service the gate drive
voltage, VGD, which occurs at time t9.
5
A.
6
2
6
5
VGD
CT
RESET
Figure 1. Low Power Synchronous Boost
2.5 V
VOUT
VREF
GOOD
5 V GS
VGD
RESET
TIMER
CT
VLOW
VBAT
VGD
1.25 V
REFERENCE
0.66 A
MAX
FROM SD
INTERNAL
BIAS
VDD
RISING EDGE
DELAY
T ON = 5.5 E –6
VBAT
50 ns
R.E.D.
C PUMP
8
3
200 kHZ
START–UP
OSCILLATOR
AND
CONTROL
SW
VIN
VON
50 ns
R.E.D.
VGD
1 µs
R.E.D.
VON
SD
R
Q
Q
t OFF TIMER
1- µ s RISING
EDGE DELAY
VBAT
R
SD
PRIORITY
ENCODER
D
CLK
FROM SD
VREF GOOD
VGD
Q
6 V (UCC39411/2)
7.5 V (UCC39413)
VGD
7.5 V (UCC39411/2)
8.5 V (UCC39413)
VGD
1.25 V (UCC39411)
3.3 V (UCC39412)
5.0 V (UCC39413)
0.5V
SD
1.2 Ω
7
4
1
SD/FB
VOUT
UCC29411, UCC29412
UCC29413, UCC39411
UCC39412, UCC39413
SLUS245E – MARCH 2000 – REVISED JULY 2005
www.ti.com
APPLICATION INFORMATION (continued)
Switches are shown in the low state. Pinouts as shown is for the 8-pin D package (SOIC). See package description
for 8-pin PW (TSSOP).
UCC29411, UCC29412
UCC29413, UCC39411
UCC39412, UCC39413
www.ti.com
SLUS245E – MARCH 2000 – REVISED JULY 2005
APPLICATION INFORMATION (continued)
VGD
RIPPLE
50 mV/DIV
7V
200 mVP–P
TYPICAL
OUTPUT
RIPPLE
20 mV/DIV
3.3 V
20 mVP–P
CURRENT
LIMIT
TYPICAL
INDUCTOR
CURRENT
t2
t1
t3
t4
t5
t6
t7
LIGHT LOAD CURRENT
t8
t9
HIGH LOAD CURRENT
Figure 2. Inductor Current and Output Ripple Waveforms
L = 10 µH TO 100 µH
10 µF
8
VGD
1
6
VIN
SW
VOUT
7
10 µF
R1
4
80 nF
CT
SD/FB
1–2 CELL ALKALINE
1.0 V TO 3.2 V
100 µF
2
VOUT
100 kΩ
R2
UDG–98069
3
A.
RESB
GND
5
Pinout shown is for the TSSOP package. Consult Package Description for the SOIC configuration.
Figure 3. Low Power Synchronous Boost Converter ADJ Version -200 mW
SHUTDOWN CONTROL
Shutdown of the UCC3941x is controlled via the interface with the SD/FB pin. Pulling the SD/FB pin low, for all
7
UCC29411, UCC29412
UCC29413, UCC39411
UCC39412, UCC39413
www.ti.com
SLUS245E – MARCH 2000 – REVISED JULY 2005
APPLICATION INFORMATION (continued)
versions, causes the IC to go into shutdown. In the UCC39412 and UCC39413, the SD/FB pin is used solely as
a shutdown function. Therefore, the SD/FB pin for the UCC39412 and UCC39413 can be directly controlled
using conventional CMOS or transistor to transistor logic (TTL) technology. For the UCC39411, interface into the
SD/FB is slightly more complicated due to the added feedback function. When feeding back the output voltage to
the SD/FB pin on the UCC39411, the IC requires a Thevenin impedance of at least 200 kΩ (500 kΩ for
industrial/military applications) to ground. Then, to accomplish shutdown of the IC, an open-drain device may be
used.
COMPONENT SELECTION INDUCTOR SELECTION
An inductor value of 22 µH works well in most applications, but values between 10 µH to 100 µH are also
acceptable. Lower value inductors typically offer lower ESR and smaller physical size. Due to the nature of the
bang-bang controllers, larger inductor values typically result in larger overall voltage ripple, because once the
output voltage level is satisfied the converter goes discontinuous, resulting in the residual energy of the inductor
causing overshoot.
It is recommended to keep the ESR of the inductor below 0.15 Ω for 200 mW applications.
OUTPUT CAPACITOR SELECTION
Once the inductor value is selected, the capacitor value determines the ripple of the converter. The worst case
peak-to-peak ripple of a cycle is determined by two components, one is due to the charge storage characteristic,
and the other is the ESR of the capacitor. The worst case ripple occurs when the inductor is operating at max
current and is expressed as follows:
2
I
L
CL
V
I C
CL ESR
2C V V
O
I
(1)
•
•
•
•
•
ICL = the peak inductor current = 550 mA
∆V = Output ripple
VO = Output voltage
VI = Input voltage
CESR = ESR of the output capacitor
INPUT CAPACITOR SELECTION
Since the UCCx9411 family does not require a large decoupling capacitor on the input voltage to operate
properly, a 10 µF cap is sufficient for most applications. Optimum efficiency occurs when the capacitor value is
large enough to decouple the source impedance, this usually occurs for capacitor values in excess of 100 µF.
RESET OPERATION
A reset function is provided to prevent the microprocessor from executing code during undervoltage conditions,
typically during power up or power down. The reset voltage threshold is fixed at 90% of the output voltage for all
versions of the UCCx941x. To prevent erratic operation in noisy environments, a glitch filter is provided.
To allow sufficient time for the microprocessor clock to stabilize, a user-programmable reset period is provided.
The reset period, the time from the output voltage rising above 90% of nominal to RESB going high, is
programmed via an external capacitor connected to the CT pin.
The reset period is defined as:
tRP = C × 1.25
where C is in µF, and tRP is in seconds.
A typical reset profile during power up is shown in Figure 4 and power down in Figure 5.
8
UCC29411, UCC29412
UCC29413, UCC39411
UCC39412, UCC39413
www.ti.com
SLUS245E – MARCH 2000 – REVISED JULY 2005
TYPICAL CHARACTERISTICS
POWER-UP SEQUENCE
POWER-DOWN SEQUENCE
VOUT
VOUT
RESB
RESB
CT
Figure 4.
Figure 5.
TYPICAL EFFICIENCY
vs
LOAD CURRENT
TYPICAL EFFICIENCY
vs
LOAD CURRENT
100
90
100
VIN = 3.0 V
90
80
IN
= 3.0 V
80
V
70
V
IN
= 2.4 V
IN
= 1.2 V
60
70
Efficiency - %
Efficiency - %
V
50
40
30
0
0
0.01
0.025
Load Current − A
Figure 6.
0.04
0.06
V
IN
= 1.2 V
UCC39411 @ 3.3 VOUT
L = 22 µH, DO1608-223
20
10
0.001
= 2.4 V
40
10
0.0001
IN
50
30
UCC39411 @ 3.3 VOUT L
= 22 µH, DO3316-223
20
V
60
0.0001
0.001
0.01
0.025
0.04
0.06
Load Current − A
Figure 7.
9
UCC29411, UCC29412
UCC29413, UCC39411
UCC39412, UCC39413
www.ti.com
SLUS245E – MARCH 2000 – REVISED JULY 2005
TYPICAL CHARACTERISTICS (continued)
TYPICAL EFFICIENCY
vs
LOAD CURRENT
TYPICAL EFFICIENCY
vs
LOAD CURRENT
100
90
100
V
IN
= 3.0 V
90
80
80
70
V
IN
V
= 2.4 V
IN
70
= 1.2 V
Efficiency - %
Efficiency - %
V = 3.0 V
IN
60
50
40
30
20
60
50
40
30
UCC39412 L = 22 µH,
DO3316-223
10
0
0
0.01
0.02
0.03
UCC39413 L = 15 µH,
DO3316-153
20
10
0.0001 0.001
0.04
0.06
0.0001
0.001
Load Current − A
0.03
Figure 9.
TYPICAL EFFICIENCY
vs
LOAD CURRENT
TYPICAL EFFICIENCY
vs
LOAD CURRENT
0.04
100
V
IN
= 3.0 V
90
V = 3.0 V
IN
80
70
V
IN
V
= 2.4 V
IN
70
= 1.2 V
Efficiency - %
Efficiency - %
0.02
Load Current − A
80
60
50
40
30
60
50
40
10
0
0
0.01
0.02
0.03
Load Current − A
Figure 10.
UCC39413 L = 15 µH,
DO1608-153
20
10
0.0001 0.001
0.04
0.06
VIN = 1.2 V
VIN = 2.4 V
30
UCC39412 L = 22 µH,
DO1608-223
20
10
0.01
Figure 8.
100
90
V = 1.2 V
IN
V = 2.4 V
IN
0.0001
0.001
0.01
0.02
Load Current − mA
Figure 11.
0.03
0.04
UCC29411, UCC29412
UCC29413, UCC39411
UCC39412, UCC39413
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SLUS245E – MARCH 2000 – REVISED JULY 2005
TYPICAL CHARACTERISTICS (continued)
TYPICAL EFFICIENCY
vs
LOAD CURRENT (2 CELL APPLICATION)
MAXIMUM LOAD CURRENT, 2 CELL APPLICATION
vs
INPUT CURRENT
155
100
150
95
Efficiency - %
90
V
V
85
V
80
IN
IN
IN
IN
145
= 3.0 V
= 2.5 V
= 2.0 V
= 1.8 V
Load Current - mA
V
140
135
130
125
UCC39411 @ 3.3 VOUT
L = DO1608-223
120
75
UCC39411 @ 3.3 VOUT
L = DO1608-223
115
70
110
75
100
Load Current − mA
Figure 12.
150
1.8
2.0
2.5
3.0
Input Voltage − V
Figure 13.
11
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
UCC39411D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
0 to 70
UCC
39411
Samples
UCC39411PW
ACTIVE
TSSOP
PW
8
150
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
0 to 70
39411
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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