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VSP2230Y

VSP2230Y

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    LQFP48

  • 描述:

    IC CCD SIGNAL PROCESSOR 48-LQFP

  • 数据手册
  • 价格&库存
VSP2230Y 数据手册
Not Recommended For New Designs  SLAS319A - MAY 2001 - REVISED APRIL 2014 SLAS319 − MAY 2001          FEATURES D CCD Signal Processing D D D D DESCRIPTION The VSP2230 is a complete mixed-signal processing IC for digital cameras that provides signal conditioning and analog-to-digital conversion for the output of a CCD array. The primary CCD channel provides correlated double sampling (CDS) to extract the video information from the pixels, a −6-dB to 42-dB gain with digital control for varying illumination conditions, and black level clamping for an accurate black level reference. − Correlated Double Sampling (CDS) − Programmable Black Level Clamping Programmable Gain Amplifier (PGA) − −6-dB to 42-dB Gain Ranging 10-Bit Digital Data Output − Up to 36-MHz Conversion Rate − No Missing Codes 76-dB Signal-to-Noise Ratio Portable Operation − Low Voltage: 2.7 V to 3.6 V − Low Power: 120 mW (typ) at 3.0 V − Standby Mode: 6 mW Input signal clamping and offset correction of the input CDS is also performed. The stable gain control is linear in dB. Additionally, the black level is quickly recovered after gain change. The VSP2230Y is pin-to-pin compatible with the VSP2260Y (10 bit, 20 MHz) one-chip product. The VSP2230Y is available in a 48-pin LQFP package and operates from a single 3-V/3.3-V supply. VSP2230 block diagram CLPDM SHP SHD SLOAD SCLK SDATA RESET ADCCK DRVDD VCC Serial Interface Input Clamp CCDIN CCD Output Signal Timing Control Correlated Double Sampling (CDS) Preblanking PBLK Programmable Gain Amplifier −6 to 42 dB (PGA) Optical Black (OB) Level Clamping COB B(0−9) Analog-to-Digital Converter Output Latch 10-Bit Digital Output Reference Voltage Generator CPLOB BYPP2 BYP BYPM REFN CM REFP DRVGND GNDA Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2001, Texas Instruments Incorporated       !   "#$ %!& %   "! "! '! !  !( ! %% )*& % "!+ %!  !!$* $%! !+  $$ "!!& www.ti.com 1 PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) VSP2230Y NRND LQFP PT 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 85 VSP2230Y VSP2230YG4 NRND LQFP PT 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 85 VSP2230Y (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. 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