SPT7850SIS

SPT7850 10-BIT, 20 MSPS, 140 mW A/D CONVERTER TECHNICAL DATA JUNE 15, 2001 FEATURES • Monolithic 20 MSPS conver ter • 140 mW power dissipation • On-chip track-and-hold • Single +5 V power supply • TTL/CMOS outputs • 5 pF input capacitance • Low cost • Tri-state output buffers • High ESD protection: 3,500 V minimum • Selectable +3 V or +5 V logic I/O APPLICATIONS • All high-speed applications where low power dissipation is required • Video imaging • Medical imaging • IR imaging • Scanners • Digital communications GENERAL DESCRIPTION The SPT7850 is a 10-bit monolithic, low-cost, ultralowpower analog-to-digital conver ter capable of minimum word rates of 20 MSPS. The on-chip track-and-hold function assures ver y good dynamic performance without the need for exter nal components. The input dr ive requirements are minimized due to the SPT7850’s low input capacitance of only 5 pF. Power dissipation is extremely low at only 140 mW typical (165 mW maximum) at 20 MSPS with a power supply of +5.0 V. The digital outputs are +3 V or +5 V, and are user selectable. The SPT7850 is pin-compatible with an entire family of 10-bit, CMOS conver ters (SPT7835/40/50/55/60/ 61), which simplifies upgrades. The SPT7850 has incorporated proprietar y circuit design* and CMOS processing technologies to achieve its advanced perfor mance. Inputs and outputs are TTL/CMOS-compatible to interface with TTL/CMOS logic systems. Output data format is straight binary. The SPT7850 is available in 28-lead 300 mil PDIP and 32-lead small (7 mm square) TQFP packages over the commercial temperature range, and in a 28-lead SOIC package over the industrial temperature range. *Patent pending BLOCK DIAGRAM ADC Section 1 AIN 1:8 Mux T/H AutoZero CMP 11-Bit SAR 11 11 D10 Overrange D9 (MSB) D8 D7 D6 D5 D4 D3 D2 D1 P1 P2 Timing P7 and Control Enable P8 DAC CLK In . . . . . . ADC Section 7 ADC Section 2 ADC Section 8 T/H AutoZero CMP . . . 11-Bit SAR 11 DAC 11 . . . 11 11 11-Bit 8:1 Mux/ Error Correction Data Valid Ref In Reference Ladder VREF D0 (LSB) ABSOLUTE MAXIMUM RATINGS (Beyond which damage may occur)1 25 °C Supply Voltages AVDD ...................................................................... +6 V DVDD ..................................................................... +6 V Input Voltages Analog Input .............................. –0.5 V to AVDD +0.5 V VREF .............................................................. 0 to AVDD CLK Input ............................................................... VDD AVDD – DVDD .................................................. ±100 mV AGND – DGND .............................................. ±100 mV Output Digital Outputs ................................................... 10 mA Temperature Operating Temperature ............................ –40 to 85 °C Junction Temperature ........................................ 175 °C Lead Temperature, (soldering 10 seconds) ....... 300 °C Storage Temperature ............................ –65 to +150 °C Note: 1. Operation at any Absolute Maximum Rating is not implied. See Electrical Specifications for proper nominal applied conditions in typical applications. ELECTRICAL SPECIFICATIONS TA=TMIN to TMAX, AVDD=DVDD=OVDD=+5.0 V, VIN=0 to 4 V, ƒCLK=40 MHz, ƒS=20 MSPS, VRHS=4.0 V, VRLS=0.0 V, unless otherwise specified. PARAMETERS Resolution DC Accuracy Integral Linearity Error (ILE) Differential Linearity Error (DLE) No Missing Codes Analog Input Input Voltage Range Input Resistance Input Capacitance Input Bandwidth Offset Gain Error Reference Input Resistance Bandwidth Voltage Range VRLS VRHS VRHS – VRLS ∆(VRHF – VRHS) ∆(VRLS – VRLF) Reference Settling Time VRHS VRLS Conversion Characteristics Maximum Conversion Rate Minimum Conversion Rate Pipeline Delay (Latency) Aperture Delay Time Aperture Jitter Time Dynamic Performance Effective Number of Bits (ENOB) ƒIN = 3.58 MHz ƒIN = 10.3 MHz Signal-to-Noise Ratio (SNR) (without Harmonics) ƒIN = 3.58 MHz ƒIN = 10.3 MHz 1SPT7850SCN TEST CONDITIONS TEST LEVEL MIN 10 SPT7850 TYP MAX UNITS Bits 100 kHz clock rate1 V V VI VI IV V V V V VI V IV IV V V V V V VI V IV V V 20 50 12 5 30 VRLS 50 5.0 100 ±2.0 ±2.0 400 100 0 3.0 1.0 500 150 600 2.0 AVDD 5.0 ±1.0 ±0.5 Guaranteed VRHS LSB LSB (Small Signal) V kΩ pF MHz LSB LSB Ω MHz V V V mV mV Clock Cycles Clock Cycles MHz kHz Clock Cycles ns ps (p-p) 4.0 90 75 15 20 VI VI VI VI 53 52 8.8 8.5 56 55 Bits Bits dB dB is screened for DC accuracy tests at 100 kHz. SPT7850SIS and SPT7850SCT are screened for DC accuracy tests at 35 MHz. SPT7850 2 6/15/01 ELECTRICAL SPECIFICATIONS TA=TMIN to TMAX, AVDD=DVDD=OVDD=+5.0 V, VIN=0 to 4 V, ƒCLK=40 MHz, ƒS=20 MSPS, VRHS=4.0 V, VRLS=0.0 V, unless otherwise specified. PARAMETERS Dynamic Performance Total Harmonic Distortion (THD) ƒIN = 3.58 MHz ƒIN = 10.3 MHz Signal-to-Noise and Distortion (SINAD) ƒIN = 3.58 MHz ƒIN = 10.3 MHz Spurious Free Dynamic Range Digital Inputs Logic 1 Voltage Logic 0 Voltage Maximum Input Current Low Maximum Input Current High Input Capacitance Digital Outputs Logic 1 Voltage Logic 0 Voltage tRISE tFALL Output Enable to Data Output Delay Power Supply Requirements Voltages OVDD DVDD AVDD Currents AIDD DIDD Power Dissipation TEST CONDITIONS TEST LEVEL MIN SPT7850 TYP MAX UNITS VI VI VI VI V VI VI VI VI V IOH = 0.5 mA IOL = 1.6 mA 15 pF load 15 pF load 20 pF load, TA = +25 °C 50 pF load over temp. VI VI V V V V IV IV IV VI VI VI 56 53 52 50 59 56 55 53 63 dB dB dB dB dB V V µA µA pF V V ns ns ns ns V V V mA mA mW ƒIN = 1 MHz 2.0 –10 –10 5 3.5 0.4 10 10 10 22 3.0 4.75 4.75 5.25 5.25 5.25 12 21 165 0.8 +10 +10 5.0 5.0 10 18 140 TEST LEVEL CODES All electrical characteristics are subject to the following conditions: All parameters having min/max specifications are guaranteed. The Test Level column indicates the specific device testing actually performed during production and Quality Assurance inspection. Any blank section in the data column indicates that the specification is not tested at the specified condition. LEVEL I II III IV V VI TEST PROCEDURE 100% production tested at the specified temperature. 100% production tested at TA = +25 °C, and sample tested at the specified temperatures. QA sample tested only at the specified temperatures. Parameter is guaranteed (but not tested) by design and characterization data. Parameter is a typical value for information purposes only. 100% production tested at TA = +25 °C. Parameter is guaranteed over specified temperature range. SPT7850 3 6/15/01 SPECIFICATION DEFINITIONS APERTURE DELAY Aperture delay represents the point in time, relative to the rising edge of the CLOCK input, that the analog input is sampled. APERTURE JITTER The variations in aperture delay for successive samples. EFFECTIVE NUMBER OF BITS (ENOB) SINAD = 6.02N + 1.76, where N is equal to the effective number of bits. SINAD – 1.76 N= 6.02 INPUT BANDWIDTH Small signal (50 mV) bandwidth (3 dB) of analog input stage. DIFFERENTIAL LINEARITY ERROR (DLE) Error in the width of each code from its theoretical value. (Theoretical = VFS/2N) INTEGRAL LINEARITY ERROR (ILE) Linearity error refers to the deviation of each individual code (normalized) from a straight line drawn from –FS through +FS. The deviation is measured from the edge of each particular code to the true straight line. OUTPUT DELAY Time between the clock’s triggering edge and output data valid. OVERVOLTAGE RECOVERY TIME The time required for the ADC to recover to full accuracy after an analog input signal 125% of full scale is reduced to 50% of the full-scale value. SIGNAL-TO-NOISE RATIO (SNR) The ratio of the fundamental sinusoid power to the total noise power. Harmonics are excluded. SIGNAL-TO-NOISE AND DISTORTION (SINAD) The ratio of the fundamental sinusoid power to the total noise and distortion power. TOTAL HARMONIC DISTORTION (THD) The ratio of the total power of the first 9 harmonics to the power of the measured sinusoidal signal. SPURIOUS FREE DYNAMIC RANGE (SFDR) The ratio of the fundamental sinusoidal amplitude to the single largest harmonic or spurious signal. SPT7850 4 6/15/01 Figure 1A – Timing Diagram 1 1 ANALOG IN CLOCK IN SAMPLING CLOCK (Internal) 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 INVALID VALID DIGITAL OUT 1 2 3 4 5 6 7 8 9 10 11 DATA VALID Figure 1B – Timing Diagram 2 tC tCH tCLK CLOCK IN tOD DATA OUTPUT Data 0 Data 1 Data 2 tCL DATA VALID tS tDAV tDAV Table I – Timing Parameters DESCRIPTION Conversion Time Clock Period Clock High Duty Cycle Clock Low Duty Cycle Clock to Output Delay (15 pF Load) DAV Pulse Width Clock to DAV PARAMETERS tC tCLK tCH tCL tOD tDAV tS 16 MIN 2*tCLK 25 40 40 15 50 50 20 tCLK 21 26 60 60 25 TYP MAX UNITS ns ns % % ns ns ns SPT7850 5 6/15/01 TYPICAL PERFORMANCE CHARACTERISTICS SNR vs Input Frequency 80 80 THD vs Input Frequency Total Harmonic Distortion (dB) Signal-to-Noise Ratio (dB) 70 70 ƒS = 20 MSPS 60 50 40 30 20 ƒs = 20 MSPS 60 50 40 30 20 100 Input Frequency (MHz) 101 102 100 Input Frequency (MHz) 101 102 SINAD vs Input Frequency 80 170 Total Power Dissipation vs Sample Rate Reference is Excluded = 30 mW Typ Signal-to-Noise and Distortion (dB) 70 60 50 40 30 20 100 Power Dissipation (mW) 102 ƒS =20 MSPS 150 130 110 90 Input Frequency (MHz) 101 70 5 10 15 20 Sample Rate (CLK/2) MHz SPT7850 6 6/15/01 Figure 2 – Typical Interface Circuit Ref In (+4 V) VRHF VRHS VRLS VRLF VIN VIN VCAL CLK IN CLK DAV AVDD AGND D10 D9 D8 D7 D6 D5 OVDD OGND D4 D3 D2 D1 D0 EN DGND* DVDD SPT7850 3.3/5 Interfacing Logics 3.3/5 +A5 Enable/Tri-State (Enable = Active Low) L1 DGND 3.3/5 +A5 AGND + 10 µF +5 V Analog +5 V Analog RTN *To reduce the possibility of latch-up, avoid connecting the DGND pins of the ADC to the digital ground of the system. 10 µF +5 V Digital RTN +5 V Digital + NOTES: 1) L1 is to be located as closely to the device as possible. 2) All capacitors are 0.1 µF surface-mount unless otherwise specified. 3) L1 is a 10 µH inductor or a ferrite bead. TYPICAL INTERFACE CIRCUIT Very few external components are required to achieve the stated device performance. Figure 2 shows the typical interface requirements when using the SPT7850 in nor mal circuit operation. The following sections provide descriptions of the major functions and outline critical performance criteria to consider for achieving the optimal device perfor mance. POWER SUPPLIES AND GROUNDING OPERATING DESCRIPTION The general architecture for the CMOS ADC is shown in the block diagram. The design contains eight identical successive approximation ADC sections, all operating in parallel, a 16-phase clock generator, an 11-bit 8:1 digital output multiplexer, correction logic, and a voltage reference generator that provides common reference levels for each ADC section. The high sample rate is achieved by using multiple SAR ADC sections in parallel, each of which samples the input CADEKA suggests that both the digital and the analog sup- signal in sequence. Each ADC uses 16 clock cycles to ply voltages on the SPT7850 be derived from a single ana- complete a conversion. The clock cycles are allocated as log supply as shown in figure 2. A separate digital supply shown in table II. should be used for all interface circuitr y. CADEKA suggests using this power supply configuration to prevent a possible latch-up condition on powerup. SPT7850 7 6/15/01 Table II – Clock Cycles Clock 1 2 3 4 5-15 16 Operation Reference zero sampling Auto-zero comparison Auto-calibrate comparison Input sample 11-bit SAR conversion Data transfer Figure 3 – Ladder Force/Sense Circuit AGND + – VRHF VRHS The 16-phase clock, which is derived from the input clock, synchronizes these events. The timing signals for adjacent ADC sections are shifted by two clock cycles so that the analog input is sampled on every other cycle of the input clock by exactly one ADC section. After 16 clock periods, the timing cycle repeats. The sample rate for the configuration is one-half of the clock rate; e.g., for a 40 MHz clock rate, the input sample rate is 20 MHz. The latency from analog input sample to the corresponding digital output is 12 clock cycles. • Since only eight comparators are used, a huge power savings is realized. • The auto-zero operation is done using a closed loop system that uses multiple samples of the comparators’ response to a reference zero. • The auto-calibrate operation, which calibrates the gain of the MSB reference and the LSB reference, is also done with a closed loop system. Multiple samples of the gain error are integrated to produce a calibration voltage for each ADC section. • Capacitive displacement currents, which can induce sampling error, are minimized since only one comparator samples the input during a clock cycle. • The total input capacitance is very low since sections of the converter that are not sampling the signal are isolated from the input by transmission gates. VOLTAGE REFERENCE The SPT7850 requires the use of a single external voltage reference for driving the high side of the reference ladder. It must be within the range of 3 V to 5 V. The lower side of the ladder is typically tied to AGND (0.0 V), but can be run up to 2.0 V with a second reference. The analog input voltage range will track the total voltage difference measured between the ladder sense lines, VRHS and VRLS. Force and sense taps are provided to ensure accurate and stable setting of the upper and lower ladder sense line voltages across part-to-part and temperature variations. By using the configuration shown in figure 3, offset and gain errors of less than ±2 LSB can be obtained. In cases where wider variations in offset and gain can be tolerated, VREF can be tied directly to VRHF, and AGND can be tied directly to VRLF as shown in figure 4. Decouple VRLS (0.075 V) VRLF (AGND) 0.0 V VRLS – + VRLF VIN All capacitors are 0.01 µF Figure 4 – Reference Ladder +4.0 V External Reference VRHS (+3.91 V) 90 mV R/2 R R R R R=30 W (typ) All capacitors are 0.01 µF R R 75 mV R/2 force and sense lines to AGND with a .01 µF capacitor (chip cap preferred) to minimize high-frequency noise injection. If this simplified configuration is used, the following considerations should be taken into account. The reference ladder circuit shown in figure 4 is a simplified representation of the actual reference ladder with force and sense taps shown. Due to the actual internal structure of the ladder, the voltage drop from VRHF to VRHS is not equivalent to the voltage drop from VRLF to VRLS. SPT7850 8 6/15/01 Typically, the top side voltage drop for VRHF to VRHS will equal: VRHF – VRHS = 2.25 % of (VRHF – VRLF) (typical), and the bottom side voltage drop for VRLS to VRLF will equal: VRLS – VRLF = 1.9 % of (VRHF – VRLF) (typical). Figure 4 shows an example of expected voltage drops for a specific case. VREF of 4.0 V is applied to VRHF, and VRLF is tied to AGND. A 90 mV drop is seen at VRHS (= 3.91 V), and a 75 mV increase is seen at VRLS (= 0.075 V). ANALOG INPUT VIN is the analog input. The input voltage range is from VRLS to VRHS (typically 4.0 V) and will scale proportionally with respect to the voltage reference. (See voltage reference section.) The drive requirements for the analog inputs are very minimal when compared to most other converters due to the SPT7850’s extremely low input capacitance of only 5 pF and very high input resistance of 50 kΩ. The analog input should be protected through a series resistor and diode clamping circuit as shown in figure 5. Figure 5 – Recommended Input Protection Circuit +V AVDD Upon powerup, the SPT7850 begins its calibration algorithm. In order to achieve the calibration accuracy required, the offset and gain adjustment step size is a fraction of a 10-bit LSB. Since the calibration algorithm is an oversampling process, a minimum of 10,000 clock cycles are required. This results in a minimum calibration time upon powerup of 250 µsec for a 20 MHz sample rate. Once calibrated, the SPT7850 remains calibrated over time and temperature. Since the calibration cycles are initiated on the rising edge of the clock, the clock must be continuously applied for the SPT7850 to remain in calibration. INPUT PROTECTION All I/O pads are protected with an on-chip protection circuit shown in figure 6. This circuit provides ESD robustness to 3.5 kV and prevents latch-up under severe discharge conditions without degrading analog transition times. Figure 6 – On-Chip Protection Circuit VDD 120 W Analog 120 W Pad D1 Buffer 47 W D2 ADC POWER SUPPLY SEQUENCING CONSIDERATIONS –V D1 = D2 = Hewlett-Packard HP5712 or equivalent All logic inputs should be held low until power to the device has settled to the specific tolerances. Avoid power decoupling networks with large time constants that could delay VDD power to the device. CLOCK INPUT The SPT7850 is driven from a single-ended TTL-input clock. Because the pipelined architecture operates on the rising edge of the clock input, the device can operate over a wide range of input clock duty cycles without degrading the dynamic performance. The device’s sample rate is 1/2 of the input clock frequency. (See figure 1A timing diagram.) CALIBRATION The SPT7850 uses an auto-calibration scheme to ensure 10-bit accuracy over time and temperature. Gain and offset errors are continually adjusted to 10-bit accuracy during device operation. This process is completely transparent to the user. SPT7850 9 6/15/01 DIGITAL OUTPUTS The digital outputs (D0–D10) are driven by a separate supply (OVDD) ranging from +3 V to +5 V. This feature makes it possible to drive the SPT7850’s TTL/CMOScompatible outputs with the user’s logic system supply. The format of the output data (D0–D9) is straight binary. (See table III.) The outputs are latched on the rising edge of CLK. These outputs can be switched into a tri-state mode by bringing EN high. Table III – Output Data Information OVERRANGE OUTPUT CODE D10 D9–D0 +F.S. + 1/2 LSB 1 11 1111 1111 +F.S. –1/2 LSB 0 1 1 1 1 1 1 1 1 1Ø +1/2 F.S. 0 ØØ ØØØØ ØØØØ +1/2 LSB 0 00 0000 000Ø 0.0 V 0 00 0000 0000 (Ø indicates the flickering bit between logic 0 and 1.) ANALOG INPUT OVERRANGE OUTPUT The OVERRANGE OUTPUT (D10) is an indication that the analog input signal has exceeded the positive fullscale input voltage by 1 LSB. When this condition occurs, D10 will switch to logic 1. All other data outputs (D0 to D9) will remain at logic 1 as long as D10 remains at logic 1. This feature makes it possible to include the SPT7850 in higher resolution systems. EVALUATION BOARD The EB7850 evaluation board is available to aid designers in demonstrating the full performance of the SPT7850. This board includes a reference circuit, clock driver circuit, output data latches, and an on-board reconstruction of the digital data. An application note describing the operation of this board, as well as information on the testing of the SPT7850, is also available. Contact the factory for price and availability. SPT7850 10 6/15/01 PACKAGE OUTLINES 28-Lead SOIC INCHES MIN MAX 0.699 0.709 0.005 0.011 0.050 typ 0.018 typ 0.0077 0.0083 0.090 0.096 0.031 0.039 0.396 0.416 0.286 0.292 MILLIMETERS MIN MAX 17.75 18.01 0.13 0.28 1.27 typ 0.46 typ 0.20 0.21 2.29 2.44 0.79 0.99 10.06 10.57 7.26 7.42 28 IH 1 SYMBOL A B C D E F G H I A F B C H D G E 32-Lead TQFP GH A B C D I J E F SYMBOL A B C D E F G H I J K L INCHES MIN MAX 0.346 0.362 0.272 0.280 0.346 0.362 0.272 0.280 0.031 typ 0.012 0.016 0.053 0.057 0.002 0.006 0.037 0.041 0.007 0° 7° 0.020 0.030 MILLIMETERS MIN MAX 8.80 9.20 6.90 7.10 8.80 9.20 6.90 7.10 0.80 BSC 0.30 0.40 1.35 1.45 0.05 0.15 0.95 1.05 0.17 0° 7° 0.50 0.75 K L SPT7850 11 6/15/01 PACKAGE OUTLINES 28-Lead Skinny PDIP INCHES NOM MAX 0.288 0.295 1.365 1.370 0.130 0.055 0.060 0.065 0.100 BSC 0.020 0.120 0.130 0.135 0.300 BSC 0.430 MILLIMETERS MIN NOM MAX 7.112 7.315 7.493 34.544 34.671 34.798 3.302 1.397 1.524 1.651 2.540 BSC 0.508 3.048 3.302 3.429 7.620 BSC 10.922 A D C B F G E SYMBOL A B C D E F G H I MIN 0.280 1.360 H I SPT7850 12 6/15/01 PIN ASSIGNMENTS AGND VRHF 1 2 28 D10 PIN FUNCTIONS Name AGND VRHF VRHS VRLS VRLF VCAL VIN AVDD DVDD DGND CLK EN D0–9 D10 DAV OVDD OGND N/C 24 23 22 D7 D6 D5 OVDD OGND D4 D3 D2 Function Analog Ground Reference High Force Reference High Sense Reference Low Sense Reference Low Force Calibration Reference Analog Input Analog VDD Digital VDD Digital Ground Input Clock ƒCLK = FS (TTL) Output Enable Tri-State Data Output, (D0=LSB) Tri-State Output Overrange Data Valid Output Digital Output Supply Digital Output Ground No Connect 27 D9 26 D8 25 D7 VRHS 3 N/C 4 VRLS 5 VRLF VIN AGND VCAL 6 7 8 9 24 D6 23 D5 PDIP and SOIC 22 21 OVDD OGND 20 D4 19 18 D3 D2 AVDD 10 DVDD 11 DGND 12 CLK 13 DAV 14 17 D1 16 15 D0 EN AGND AGND VRHS 31 VRHF VRLS 32 D10 D9 D8 29 25 30 26 27 28 VRLF VIN AGND AGND VCAL AVDD AVDD DVDD 1 2 3 4 5 6 7 8 12 16 15 D0 10 DGND 14 13 11 DGND 9 TQFP 21 20 19 18 17 D1 EN DAV CLK ORDERING INFORMATION PART NUMBER SPT7850SCN SPT7850SIS SPT7850SCT TEMPERATURE RANGE 0 to +70 °C –40 to +85 °C 0 to +70 °C PACKAGE TYPE 28L Plastic DIP (300 mil) 28L SOIC 32L TQFP DVDD SPT7850 13 6/15/01