0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
CM1424-03CP

CM1424-03CP

  • 厂商:

    CALMIRCO

  • 封装:

  • 描述:

    CM1424-03CP - MultiMedia Card EMI Filter Array with ESD Protection - California Micro Devices Corp

  • 数据手册
  • 价格&库存
CM1424-03CP 数据手册
CM1424 MultiMedia Card EMI Filter Array with ESD Protection Features • • • • • • • • • • Three channels of EMI filtering, each with ESD protection Two channels of ESD protection Flow-through routing for MMC interface ±15kV ESD protection (IEC 61000-4-2, contact discharge) ±30kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 10-bump, 1.998mm x 1.458mm footprint Chip Scale Package (CSP) Available with OptiGuard™ coating for improved reliability Lead-free version available Product Description The CM1424 is an EMI filter array integrating 3 pi-filters (C-R-C) and 2 channels of ESD protection. The CM1424 has component values of 12pF - 100Ω - 12pF. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. The ESD diodes on pins A2 and C2 safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. This device is particularly well-suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easy-to-use pin assignments. In particular, the CM1424 is ideal for EMI filtering and protecting data lines from ESD for the MultiMedia Card (MMC) slot in mobile handsets. The CM1424 devices are optionally available with OptiGuard™ coating which results in improved reliability. The CM1424 is available in space-saving, low-profile, chip-scale packages with optional lead-free finishing. Applications • • • MultiMedia Card (MMC) slot in mobile handsets and other handheld devices such as digital cameras and MP3 players I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers Electrical Schematic EMI Filter + ESD Channel 1 CMD A1 100 Ω C1 CMD ESD Channel 1 A2 ESD Channel 2 C2 12pF 12pF EMI Filter + ESD Channel 2 CLK A3 100 Ω C3 CLK DAT0 A4 EMI Filter + ESD Channel 3 100 Ω C4 DAT0 12pF 12pF © 2005 California Micro Devices Corp. All rights reserved. 09/16/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 12pF 12pF ▲ www.cmd.com 1 CM1424 PACKAGE / PINOUT DIAGRAMS (Bumps Down View) 1 2 3 4 A B C TOP VIEW BOTTOM VIEW (Bumps Up View) EMI+ESD3 EMI+ESD2 ESD1 A4 A3 B2 GND A2 GND A1 EMI+ESD1 N241 C4 B1 C1 EMI+ESD1 C3 EMI+ESD2 C2 ESD2 EMI+ESD3 CM1424 CSP Package (Uncoated) (Bumps Down View) Orientation Marking (see note 2) TOP VIEW 2 3 4 BOTTOM VIEW (Bumps Up View) EMI+ESD3 EMI+ESD2 ESD1 1 A B C A4 A3 B2 GND A2 GND A1 EMI+ESD1 N243 C4 B1 C1 EMI+ESD1 C3 EMI+ESD2 C2 ESD2 EMI+ESD3 Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. CM1424 CSP Package (OptiGuard™ coated) PIN DESCRIPTIONS PIN(s) A1 A2 A3 A4 B1-B2 NAME EMI+ESD1 ESD1 EMI+ESD2 EMI+ESD3 GND DESCRIPTION CMD Filter Channel 1 ESD Channel 1 CLK Filter Channel 2 DAT0 Filter Channel 3 Device Ground PIN(s) C1 C2 C3 C4 NAME EMI+ESD1 ESD2 EMI+ESD2 EMI+ESD3 DESCRIPTION CMD Filter Channel 1 ESD Channel 2 CLK Filter Channel 2 DAT0 Filter Channel 3 Ordering Information PART NUMBERING INFORMATION Standard Finish No Coating Ordering Part Bumps 10 PKG CSP Number1 CM1424-01CS Part Marking N241 OptiGuard™ Coated Ordering Part Number1 CM1424-03CS Part Marking N243 Lead-free Finish2 No Coating Ordering Part Number1 CM1424-01CP Part Marking N241 OptiGuard™ Coated Ordering Part Number1 CM1424-03CP Part Marking N243 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.cmd.com A1 Orientation Marking (see note 2) Orientation Marking Orientation Marking A1 09/16/05 CM1424 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL R C VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Diode Standoff Voltage Diode Leakage Current (reverse bias) Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω Channel R=100Ω, Channel C=12pF At 2.5V DC, 1MHz, 30mV AC IDIODE = 10μA VDIODE = +3.3V ILOAD = 10mA 5.6 -1.5 ±30 ±15 CONDITIONS MIN 80 9 TYP 100 12 6.0 100 6.8 -0.8 300 9.0 -0.4 MAX 120 15 UNITS Ω pF V nA V V kV kV VESD Notes 2 and 3 RDYN 1.6 0.4 157 Ω Ω MHz fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 09/16/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.cmd.com 3 CM1424 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.cmd.com 09/16/05 CM1424 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss VS. Frequency (A4-C4 to GND B2) Figure 4. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) © 2005 California Micro Devices Corp. All rights reserved. 09/16/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.cmd.com 5 CM1424 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Maximum Soldering Temperature for a Eutectic Device using Eutectic Solder Paste Maximum Soldering Temperature for a Lead-free Device using Lead-free Solder Paste VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 240°C 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 6. Eutectic (SnPb) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. Figure 7. Lead-free (SnAgCu) Solder Ball Reflow Profile 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.cmd.com 09/16/05 CM1424 Mechanical Details (cont’d) CM1424 devices are supplied in custom Chip Scale Packages (CSP) and are available with optional OptiGuard™ coating. CM1424 Mechanical Specifications The package dimensions for the CM1424 are presented below. B2 B1 Mechanical Package Diagrams Non-coated CSP BOTTOM VIEW A1 C1 B4 B3 SIDE VIEW PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 1 1 C B A 1 Max A2 Custom CSP 10 Millimeters Inches Min Nom Nom Max 2 3 4 C2 Min 1.953 1.998 2.043 0.0769 0.0787 0.0804 1.413 1.458 1.503 0.0556 0.0574 0.0592 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.199 0.249 0.299 0.0078 0.0098 0.0118 0.244 0.294 0.344 0.0096 0.0116 0.0135 0.562 0.606 0.650 0.0221 0.0239 0.0256 0.356 0.381 0.406 0.0140 0.0150 0.0160 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 OptiGuard™ Coated CSP BOTTOM VIEW A1 B2 B1 C1 B4 B3 OptiGuardTM Coating C B A 1 2 3 4 C2 D3 D4 A2 D32 D42 # per tape and reel Controlling dimension: millimeters Note 1: Applies to uncoated devices only. Note 2: Applies to OptiGuard™ (coated) devices only. 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1424 Chip Scale Package © 2005 California Micro Devices Corp. All rights reserved. 09/16/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.cmd.com 7 CM1424 Mechanical Details (cont’d) CSP Tape and Reel Specifications PART NUMBER CM1424-01 CM1424-03 CHIP SIZE (mm) 1.998x 1.458 x 0.606 1.998 x 1.458 x 0.644 POCKET SIZE (mm) B0 X A0 X K0 2.29 x 1.6 x 0.81 2.29 x 1.6 x 0.81 TAPE WIDTH W 8mm 8mm REEL DIAMETER 178mm (7") 178mm (7") 10 Pitches Cumulative Tolerance On Tape ±0.2 mm QTY PER REEL 3500 3500 P0 4mm 4mm P1 4mm 4mm Po Top Cover Tape Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 8. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.cmd.com 09/16/05
CM1424-03CP 价格&库存

很抱歉,暂时无法提供与“CM1424-03CP”相匹配的价格&库存,您可以联系我们找货

免费人工找货