PROCESS
Small Signal Transistors
CP353V
NPN - High Current Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter 1 Bonding Pad Area Emitter 2 Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 3,878 PRINCIPAL DEVICE TYPES CZT853 EPITAXIAL PLANAR 66 x 66 MILS 7.1 MILS 7.9 x 7.9 MILS 7.9 x 9.5 MILS 7.9 x 9.5 MILS Al-Si - 30,000Å Ti/Ni/Ag - 2,000Å/3,000Å/20,000Å
R2 (22-March 2010)
w w w. c e n t r a l s e m i . c o m
PROCESS
CP353V
Typical Electrical Characteristics
R2 (22-March 2010)
w w w. c e n t r a l s e m i . c o m
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