CY2309SZC-1

CY2305 CY2309 Low-Cost 3.3V Zero Delay Buffer Features • 10-MHz to 100-/133-MHz operating range, compatible with CPU and PCI bus frequencies • Zero input-output propagation delay • 60 ps typical cycle-to-cycle jitter (high drive) • Multiple low-skew outputs — 85 ps typical output-to-output skew — One input drives five outputs (CY2305) — One input drives nine outputs, grouped as 4 + 4 + 1 (CY2309) • Compatible with Pentium-based systems • Test Mode to bypass phase-locked loop (PLL) (CY2309 only [see “Select Input Decoding” on page 2]) • Available in space-saving 16-pin 150-mil SOIC or 4.4-mm TSSOP packages (CY2309), and 8-pin, 150-mil SOIC package (CY2305) • 3.3V operation • Industrial temperature available CY2309. It accepts one reference input, and drives out five low-skew clocks. The -1H versions of each device operate at up to 100-/133-MHz frequencies, and have higher drive than the -1 devices. All parts have on-chip PLLs which lock to an input clock on the REF pin. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The CY2309 has two banks of four outputs each, which can be controlled by the Select inputs as shown in the “Select Input Decoding” table on page 2. If all output clocks are not required, BankB can be three-stated. The select inputs also allow the input clock to be directly applied to the outputs for chip and system testing purposes. The CY2305 and CY2309 PLLs enter a power-down mode when there are no rising edges on the REF input. In this state, the outputs are three-stated and the PLL is turned off, resulting in less than 12.0 µA of current draw for commercial temperature devices and 25.0 µA for industrial temperature parts. The CY2309 PLL shuts down in one additional case as shown in the table below. Multiple CY2305 and CY2309 devices can accept the same input clock and distribute it. In this case, the skew between the outputs of two devices is guaranteed to be less than 700 ps. The CY2305/CY2309 is available in two/three different configurations, as shown in the ordering information (page 10). The CY2305-1/CY2309-1 is the base part. The CY2305-1H/ CY2309-1H is the high-drive version of the -1, and its rise and fall times are much faster than the -1s. Functional Description The CY2309 is a low-cost 3.3V zero delay buffer designed to distribute high-speed clocks and is available in a 16-pin SOIC or TSSOP package. The CY2305 is an 8-pin version of the Block Diagram Pin Configuration SOIC/TSSOP Top View REF CLKA1 CLKA2 VDD GND CLKB1 CLKB2 S2 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 PLL REF MUX CLKOUT CLKA1 CLKA2 CLKA3 CLKA4 CLKOUT CLKA4 CLKA3 VDD GND CLKB4 CLKB3 S1 S2 Select Input Decoding S1 CLKB1 CLKB2 CLKB3 CLKB4 REF CLK2 CLK1 GND 1 2 3 4 SOIC Top View 8 7 6 5 CLKOUT CLK4 V DD CLK3 Cypress Semiconductor Corporation Document #: 38-07140 Rev. *G • 3901 North First Street • San Jose, CA 95134 • 408-943-2600 Revised August 4, 2005 CY2305 CY2309 Pin Description for CY2309 Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 REF[1] CLKA1[2] CLKA2[2] VDD GND CLKB1[2] CLKB2 S2[3] S1[3] CLKB3[2] CLKB4[2] GND VDD CLKA3[2] CLKA4[2] CLKOUT[2] [2] Signal Buffered clock output, Bank A Buffered clock output, Bank A 3.3V supply Ground Buffered clock output, Bank B Buffered clock output, Bank B Select input, bit 2 Select input, bit 1 Buffered clock output, Bank B Buffered clock output, Bank B Ground 3.3V supply Buffered clock output, Bank A Buffered clock output, Bank A Description Input reference frequency, 5V-tolerant input Buffered output, internal feedback on this pin Pin Description for CY2305 Pin 1 2 3 4 5 6 7 8 REF[1] CLK2[2] CLK1[2] GND CLK3[2] VDD CLK4[2] CLKOUT[2] Signal Buffered clock output Buffered clock output Ground Buffered clock output 3.3V supply Buffered clock output Buffered clock output, internal feedback on this pin Description Input reference frequency, 5V-tolerant input Select Input Decoding for CY2309 S2 0 0 1 1 S1 0 1 0 1 CLOCK A1–A4 Three-state Driven Driven Driven CLOCK B1–B4 Three-state Three-state Driven Driven CLKOUT[4] Driven Driven Driven Driven Output Source PLL PLL Reference PLL PLL Shutdown N N Y N Notes: 1. Weak pull-down. 2. Weak pull-down on all outputs. 3. Weak pull-ups on these inputs. 4. This output is driven and has an internal feedback for the PLL. The load on this output can be adjusted to change the skew between the reference and output. Document #: 38-07140 Rev. *G Page 2 of 14 CY2305 CY2309 REF. Input to CLKA/CLKB Delay vs. Loading Difference between CLKOUT and CLKA/CLKB Pins Zero Delay and Skew Control All outputs should be uniformly loaded to achieve Zero Delay between the input and output. Since the CLKOUT pin is the internal feedback to the PLL, its relative loading can adjust the input-output delay. This is shown in the above graph. For applications requiring zero input-output delay, all outputs, including CLKOUT, must be equally loaded. Even if CLKOUT is not used, it must have a capacitive load, equal to that on other outputs, for obtaining zero input-output delay. If input to output delay adjustments are required, use the above graph to calculate loading differences between the CLKOUT pin and other outputs. For zero output-output skew, be sure to load all outputs equally. For further information refer to the application note entitled “CY2305 and CY2309 as PCI and SDRAM Buffers.” Document #: 38-07140 Rev. *G Page 3 of 14 CY2305 CY2309 Absolute Maximum Conditions Supply Voltage to Ground Potential ............... –0.5V to +7.0V DC Input Voltage (Except REF) ............–0.5V to VDD + 0.5V DC Input Voltage REF......................................... –0.5V to 7V Storage Temperature ................................. –65°C to +150°C Junction Temperature ................................................. 150°C Static Discharge Voltage (per MIL-STD-883, Method 3015) ........................... > 2,000V Operating Conditions for CY2305SC-XX and CY2309SC-XX Commercial Temperature Devices Parameter VDD TA CL CL CIN tPU Supply Voltage Operating Temperature (Ambient Temperature) Load Capacitance, below 100 MHz Load Capacitance, from 100 MHz to 133 MHz Input Capacitance Power-up time for all VDDs to reach minimum specified voltage (power ramps must be monotonic) Description Min. 3.0 0 – – – 0.05 Max. 3.6 70 30 10 7 50 Unit V °C pF pF pF ms Electrical Characteristics for CY2305SC-XX and CY2309SC-XX Commercial Temperature Devices Parameter VIL VIH IIL IIH VOL VOH IDD (PD mode) IDD Description Input LOW Voltage[5] Input HIGH Voltage[5] VIN = 0V VIN = VDD IOL = 8 mA (–1) IOH = 12 mA (–1H) IOH = –8 mA (–1) IOL = –12 mA (–1H) REF = 0 MHz Unloaded outputs at 66.67 MHz, SEL inputs at VDD Input LOW Current Input HIGH Current Output LOW Voltage[6] Output HIGH Voltage[6] Power Down Supply Current Supply Current Test Conditions Min. – 2.0 – – – 2.4 – – Max. 0.8 – 50.0 100.0 0.4 – 12.0 32.0 Unit V V µA µA V V µA mA Switching Characteristics for CY2305SC-1and CY2309SC-1 Commercial Temperature Devices[7] Parameter t1 Name Output Frequency Duty Cycle[6] = t2 ÷ t1 t3 t4 t5 t6A t6B t7 tJ tLOCK Rise Time [6] Test Conditions 30-pF load 10-pF load Measured at 1.4V, Fout = 66.67 MHz Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V Skew[6] All outputs equally loaded Min. 10 10 40.0 – – – – 1 – – – Typ. – 50.0 – – 85 0 5 – 70 – Max. 100 133.33 60.0 2.50 2.50 250 ±350 8.7 700 200 1.0 Unit MHz MHz % ns ns ps ps ns ps ps ms Fall Time[6] Output to Output Delay, REF Rising Edge to Measured at VDD/2 CLKOUT Rising Edge[6] Delay, REF Rising Edge to Measured at VDD/2. Measured in PLL CLKOUT Rising Edge[6] Bypass Mode, CY2309 device only. Device to Device Skew[6] Cycle to Cycle Jitter[6] PLL Lock Time[6] Measured at VDD/2 on the CLKOUT pins of devices Measured at 66.67 MHz, loaded outputs Stable power supply, valid clock presented on REF pin Notes: 5. REF input has a threshold voltage of VDD/2. 6. Parameter is guaranteed by design and characterization. Not 100% tested in production. 7. All parameters specified with loaded outputs. Document #: 38-07140 Rev. *G Page 4 of 14 CY2305 CY2309 Switching Characteristics for CY2305SC-1H and CY2309SC-1H Commercial Temperature Devices[7] Parameter t1 Name Output Frequency Duty Cycle[6] = t2 ÷ t1 Duty Cycle[6] = t2 ÷ t1 t3 t4 t5 t6A t6B t7 t8 tJ tLOCK Rise Time[6] Fall Time[6] Output to Output Skew [6] Description 30-pF load 10-pF load Measured at 1.4V, Fout = 66.67 MHz Measured at 1.4V, Fout < 50.0 MHz Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V All outputs equally loaded Min. 10 10 40.0 45.0 – – – – 1 – 1 – – Typ. – 50.0 50.0 – – 85 – 5 – – 60 – Max. 100 133.33 60.0 55.0 1.50 1.50 250 ±350 8.7 700 Unit MHz MHz % % ns ns ps ps ns ps V/ns Delay, REF Rising Edge to Measured at VDD/2 CLKOUT Rising Edge[6] Delay, REF Rising Edge to Measured at VDD/2. Measured in PLL CLKOUT Rising Edge[6] Bypass Mode, CY2309 device only. Device to Device Skew[6] Output Slew Rate[6] Cycle to Cycle Jitter[6] PLL Lock Time[6] Measured at VDD/2 on the CLKOUT pins of devices Measured between 0.8V and 2.0V using Test Circuit #2 Measured at 66.67 MHz, loaded outputs Stable power supply, valid clock presented on REF pin 200 1.0 ps ms Operating Conditions for CY2305SI-XX and CY2309SI-XX Industrial Temperature Devices Parameter VDD TA CL CL CIN Supply Voltage Operating Temperature (Ambient Temperature) Load Capacitance, below 100 MHz Load Capacitance, from 100 MHz to 133 MHz Input Capacitance Description Min. 3.0 –40 – – – Max. 3.6 85 30 10 7 Unit V °C pF pF pF Electrical Characteristics for CY2305SI-XX and CY2309SI-XX Industrial Temperature Devices Parameter VIL VIH IIL IIH VOL VOH IDD (PD mode) IDD Description Input LOW Voltage[5] Input HIGH Voltage[5] VIN = 0V VIN = VDD IOL = 8 mA (–1) IOH =12 mA (–1H) IOH = –8 mA (–1) IOL = –12 mA (–1H) REF = 0 MHz Unloaded outputs at 66.67 MHz, SEL inputs at VDD Input LOW Current Input HIGH Current Output LOW Voltage[6] Output HIGH Voltage[6] Power-down Supply Current Supply Current Test Conditions Min. – 2.0 – – – 2.4 – – Max. 0.8 – 50.0 100.0 0.4 – 25.0 35.0 Unit V V µA µA V V µA mA Document #: 38-07140 Rev. *G Page 5 of 14 CY2305 CY2309 Switching Characteristics for CY2305SI-1and CY2309SI-1 Industrial Temperature Devices [7] Parameter t1 Name Output Frequency Duty Cycle[6] = t2 ÷ t1 t3 t4 t5 t6A t6B t7 tJ tLOCK Rise Time [6] Test Conditions 30-pF load 10-pF load Measured at 1.4V, Fout = 66.67 MHz Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V [6] Min. 10 10 40.0 – – – – 1 Typ. – 50.0 – – 85 – 5 Max. 100 133.33 60.0 2.50 2.50 250 ±350 8.7 Unit MHz MHz % ns ns ps ps ns Fall Time[6] Output to Output Skew Delay, REF Rising Edge to CLKOUT Rising Edge[6] Delay, REF Rising Edge to CLKOUT Rising Edge[6] Device to Device Skew[6] Cycle to Cycle Jitter[6] PLL Lock Time[6] All outputs equally loaded Measured at VDD/2 Measured at VDD/2. Measured in PLL Bypass Mode, CY2309 device only. Measured at VDD/2 on the CLKOUT pins of devices Measured at 66.67 MHz, loaded outputs Stable power supply, valid clock presented on REF pin – – – – 70 – 700 200 1.0 ps ps ms Switching Characteristics for CY2305SI-1H and CY2309SI-1H Industrial Temperature Devices[7] Parameter t1 Name Output Frequency Duty Cycle[6] = t2 ÷ t1 Duty t3 t4 t5 t6A t6B t7 t8 tJ tLOCK Cycle[6] = t2 ÷ t1 Rise Time[6] Fall Time[6] Output to Output Skew[6] Delay, REF Rising Edge to CLKOUT Rising Edge[6] Delay, REF Rising Edge to CLKOUT Rising Edge[6] Device to Device Skew[6] Output Slew Rate[6] Cycle to Cycle Jitter[6] PLL Lock Time[6] 30-pF load 10-pF load Measured at 1.4V, Fout = 66.67 MHz Measured at 1.4V, Fout < 50.0 MHz Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V All outputs equally loaded Measured at VDD/2 Measured at VDD/2. Measured in PLL Bypass Mode, CY2309 device only. Measured at VDD/2 on the CLKOUT pins of devices Measured between 0.8V and 2.0V using Test Circuit #2 Measured at 66.67 MHz, loaded outputs Stable power supply, valid clock presented on REF pin Description Min. 10 10 40.0 45.0 – – – – 1 Typ. – 50.0 50.0 – – 85 – 5 Max. 100 133.33 60.0 55.0 1.50 1.50 250 ±350 8.7 Unit MHz MHz % % ns ns ps ps ns – 1 – – – – 60 – 700 – 200 1.0 ps V/ns ps ms Document #: 38-07140 Rev. *G Page 6 of 14 CY2305 CY2309 Switching Waveforms Duty Cycle Timing t1 t2 1.4V 1.4V 1.4V All Outputs Rise/Fall Time OUTPUT 2.0V 0.8V t3 2.0V 0.8V t4 3.3V 0V Output-Output Skew 1.4V OUTPUT OUTPUT t5 1.4V Input-Output Propagation Delay INPUT VDD/2 OUTPUT t6 VDD/2 Device-Device Skew CLKOUT, Device 1 VDD/2 CLKOUT, Device 2 t7 VDD/2 Document #: 38-07140 Rev. *G Page 7 of 14 CY2305 CY2309 Typical Duty Cycle[8] and IDD Trends[9] for CY2305-1 and CY2309-1 Duty Cycle Vs VDD (for 30 pF Loads over Frequency - 3.3V, 25C) 60 58 56 Duty Cycle (% ) Duty Cycle Vs VDD (for 15 pF Loads over Frequency - 3.3V, 25C) 60 58 56 Duty Cycle (% ) 54 52 50 48 46 44 42 40 33 MHz 66 MHz 100 MHz 133 MHz 54 52 50 48 46 44 42 40 3 3.1 3.2 3.3 VDD (V) 3.4 3.5 3.6 33 MHz 66 MHz 100 MHz 3 3.1 3.2 3.3 VDD (V) 3.4 3.5 3.6 Duty Cycle Vs Frequency (for 30 pF Loads over Temperature - 3.3V) 60 58 56 Duty Cycle (%) Duty Cycle Vs Frequency (for 15 pF Loads over Temperature - 3.3V) 60 58 56 Duty Cycle (%) -40C 0C 25C 70C 85C 54 52 50 48 46 44 42 40 20 40 60 80 Frequency (MHz) 100 120 140 54 52 50 48 46 44 42 40 20 40 60 80 Frequency (MHz) 100 120 140 -40C 0C 25C 70C 85C IDD vs Number of Loaded Outputs (for 30 pF Loads over Frequency - 3.3V, 25C) 140 120 100 IDD (mA) IDD vs Number of Loaded Outputs (for 15 pF Loads over Frequency - 3.3V, 25C) 140 120 100 IDD (mA) 33 MHz 66 MHz 100 MHz 80 60 40 20 0 0 1 2 3 4 5 6 7 8 9 # of Loaded Outputs 80 60 40 20 0 0 1 2 3 4 5 6 7 8 9 # of Loaded Outputs 33 MHz 66 MHz 100 MHz Notes: 8. Duty Cycle is taken from typical chip measured at 1.4V. 9. IDD data is calculated from IDD = ICORE + nCVf, where ICORE is the unloaded current. (n = # of outputs; C = Capacitance load per output (F); V = Supply Voltage (V); f = frequency (Hz)). Document #: 38-07140 Rev. *G Page 8 of 14 CY2305 CY2309 Typical Duty Cycle[8] and IDD Trends[9] for CY2305-1H and CY2309-1H Duty Cycle Vs VDD (for 30 pF Loads over Frequency - 3.3V, 25C) 60 58 56 Duty Cycle (% ) Duty Cycle (% ) 54 52 50 48 46 44 42 40 3 3.1 3.2 3.3 VDD (V) 3.4 3.5 3.6 33 MHz 66 MHz 100 MHz 60 58 56 54 52 50 48 46 44 42 40 3 3.1 3.2 3.3 VDD (V) 3.4 3.5 3.6 33 MHz 66 MHz 100 MHz 133 MHz Duty Cycle Vs VDD (for 15 pF Loads over Frequency - 3.3V, 25C) Duty Cycle Vs Frequency (for 30 pF Loads over Temperature - 3.3V) 60 58 56 Duty Cycle (%) Duty Cycle (%) 60 58 56 Duty Cycle Vs Frequency (for 15 pF Loads over Temperature - 3.3V) 54 52 50 48 46 44 42 40 20 40 60 80 Frequency (MHz) 100 120 140 -40C 0C 25C 70C 85C 54 52 50 48 46 44 42 40 20 40 60 80 Frequency (MHz) 100 120 140 -40C 0C 25C 70C 85C IDD vs Number of Loaded Outputs (for 30 pF Loads over Frequency - 3.3V, 25C) 160 140 120 IDD (mA) 33 MHz 66 MHz 100 MHz IDD (mA) 100 80 60 40 20 0 0 1 2 3 4 5 6 7 8 9 # of Loaded Outputs 160 140 120 100 80 60 40 20 0 0 1 IDD vs Number of Loaded Outputs (for 15 pF Loads over Frequency - 3.3V, 25C) 33 MHz 66 MHz 100 MHz 2 3 4 5 6 7 8 9 # of Loaded Outputs Document #: 38-07140 Rev. *G Page 9 of 14 CY2305 CY2309 Test Circuits Test Circuit # 1 V DD 0.1 µ F CLK OUTPUTS C LOAD V DD 0.1 µ F GND GND 0.1 µ F V DD GND GND out 0.1 µ F Test Circuit # 2 V DD OUTPUTS 1 kΩ 10 pF 1 kΩ For parameter t8 (output slew rate) on -1H devices Ordering Information Ordering Code CY2305SC-1 CY2305SC-1T CY2305SZC-1 CY2305SZC-1T CY2305SXC-1 CY2305SXC-1T CY2305SI-1 CY2305SI-1T CY2305SZI-1 CY2305SZI-1T CY2305SXI-1 CY2305SXI-1T CY2305SC-1H CY2305SC-1HT CY2305SZC-1H CY2305SZC-1HT CY2305SXC-1H CY2305SXC-1HT CY2305SI-1H CY2305SI-1HT CY2305SZI-1H CY2305SZI-1HT CY2305SXI-1H CY2305SXI-1HT CY2309SC-1 CY2309SC-1T CY2309SZC-1 CY2309SZC-1T CY2309SXC-1 CY2309SXC-1T Document #: 38-07140 Rev. *G 8-pin 150-mil SOIC 8-pin 150-mil SOIC – Tape and Reel 8-pin 150-mil SOIC – (Lead-free) 8-pin 150-mil SOIC – Tape and Reel – (Lead-free) 8-pin 150-mil SOIC – (Lead-free) 8-pin 150-mil SOIC – Tape and Reel – (Lead-free) 8-pin 150-mil SOIC 8-pin 150-mil SOIC – Tape and Reel 8-pin 150-mil SOIC – (Lead-free) 8-pin 150-mil SOIC – Tape and Reel – (Lead-free) 8-pin 150-mil SOIC – (Lead-free) 8-pin 150-mil SOIC – Tape and Reel – (Lead-free) 8-pin 150-mil SOIC 8-pin 150-mil SOIC – Tape and Reel 8-pin 150-mil SOIC – (Lead-free) 8-pin 150-mil SOIC – Tape and Reel – (Lead-free) 8-pin 150-mil SOIC – (Lead-free) 8-pin 150-mil SOIC – Tape and Reel – (Lead-free) 8-pin 150-mil SOIC 8-pin 150-mil SOIC – Tape and Reel 8-pin 150-mil SOIC – (Lead-free) 8-pin 150-mil SOIC – Tape and Reel – (Lead-free) 8-pin 150-mil SOIC – (Lead-free) 8-pin 150-mil SOIC – Tape and Reel – (Lead-free) 16-pin 150-mil SOIC 16-pin 150-mil SOIC – Tape and Reel 16-pin 150-mil SOIC – (Lead-free) 16-pin 150-mil SOIC – Tape and Reel – (Lead-free) 16-pin 150-mil SOIC – (Lead-free) 16-pin 150-mil SOIC – Tape and Reel – (Lead-free) Package Type Operating Range Commercial Commercial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Industrial Industrial Commercial Commercial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Industrial Industrial Commercial Commercial Commercial Commercial Commercial Commercial Page 10 of 14 CY2305 CY2309 Ordering Information (continued) Ordering Code CY2309SI-1 CY2309SI-1 CY2309SI-1T CY2309SZI-1 CY2309SZI-1T CY2309SXI-1 CY2309SXI-1T CY2309SC-1H CY2309SC-1HT CY2309SZC-1H CY2309SZC-1HT CY2309SXC-1H CY2309SXC-1HT CY2309SI-1H CY2309SI-1HT CY2309SZI-1H CY2309SZI-1HT CY2309SXI-1H CY2309SXI-1HT CY2309ZC-1H CY2309ZC-1HT CY2309ZXC-1H CY2309ZXC-1HT CY2309ZZC-1H CY2309ZZC-1HT CY2309ZI-1H CY2309ZI-1HT CY2309ZXI-1H CY2309ZXI-1HT CY2309ZZI-1H CY2309ZZI-1HT 16-pin 150-mil SOIC 16-pin 150-mil SOIC 16-pin 150-mil SOIC – Tape and Reel 16-pin 150-mil SOIC – (Lead-free) 16-pin 150-mil SOIC – Tape and Reel – (Lead-free) 16-pin 150-mil SOIC – (Lead-free) 16-pin 150-mil SOIC – Tape and Reel – (Lead-free) 16-pin 150-mil SOIC 16-pin 150-mil SOIC – Tape and Reel 16-pin 150-mil SOIC – (Lead-free) 16-pin 150-mil SOIC – Tape and Reel – (Lead-free) 16-pin 150-mil SOIC – (Lead-free) 16-pin 150-mil SOIC – Tape and Reel – (Lead-free) 16-pin 150-mil SOIC 16-pin 150-mil SOIC – Tape and Reel 16-pin 150-mil SOIC – (Lead-free) 16-pin 150-mil SOIC – Tape and Reel – (Lead-free) 16-pin 150-mil SOIC – (Lead-free) 16-pin 150-mil SOIC – Tape and Reel – (Lead-free) 16-pin 4.4-mm TSSOP 16-pin 4.4-mm TSSOP – Tape and Reel 16-pin 4.4-mm TSSOP – (Lead-free) 16-pin 4.4-mm TSSOP – Tape and Reel – (Lead-free) 16-pin 4.4-mm TSSOP – (Lead-free) 16-pin 4.4-mm TSSOP – Tape and Reel – (Lead-free) 16-pin 4.4-mm TSSOP 16-pin 4.4-mm TSSOP – Tape and Reel 16-pin 4.4-mm TSSOP – (Lead-free) 16-pin 4.4-mm TSSOP – Tape and Reel – (Lead-free) 16-pin 4.4-mm TSSOP – (Lead-free) 16-pin 4.4-mm TSSOP – Tape and Reel – (Lead-free) Package Type Operating Range Industrial Industrial Industrial Industrial Industrial Industrial Industrial Commercial Commercial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Industrial Industrial Commercial Commercial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Industrial Industrial Document #: 38-07140 Rev. *G Page 11 of 14 CY2305 CY2309 Package Drawing and Dimensions 8 Lead (150 Mil) SOIC - S08 8-lead (150-Mil) SOIC S8 PIN 1 ID 4 1 1. DIMENSIONS IN INCHES[MM] MIN. MAX. 2. PIN 1 ID IS OPTIONAL, ROUND ON SINGLE LEADFRAME RECTANGULAR ON MATRIX LEADFRAME 3. REFERENCE JEDEC MS-012 0.230[5.842] 0.244[6.197] 0.150[3.810] 0.157[3.987] 4. PACKAGE WEIGHT 0.07gms PART # S08.15 STANDARD PKG. SZ08.15 LEAD FREE PKG. 5 8 0.189[4.800] 0.196[4.978] SEATING PLANE 0.010[0.254] 0.016[0.406] X 45° 0.061[1.549] 0.068[1.727] 0.004[0.102] 0.050[1.270] BSC 0.004[0.102] 0.0098[0.249] 0°~8° 0.016[0.406] 0.035[0.889] 0.0075[0.190] 0.0098[0.249] 51-85066-*C 0.0138[0.350] 0.0192[0.487] 16 Lead (150 Mil) SOIC 8 1 16-Lead (150-Mil) SOIC S16 PIN 1 ID DIMENSIONS IN INCHES[MM] MIN. MAX. REFERENCE JEDEC MS-012 0.150[3.810] 0.157[3.987] 0.230[5.842] 0.244[6.197] PACKAGE WEIGHT 0.15gms PART # S16.15 STANDARD PKG. 9 16 SZ16.15 LEAD FREE PKG. 0.386[9.804] 0.393[9.982] SEATING PLANE 0.010[0.254] 0.016[0.406] X 45° 0.061[1.549] 0.068[1.727] 0.004[0.102] 0.050[1.270] BSC 0.0138[0.350] 0.0192[0.487] 0.004[0.102] 0.0098[0.249] 0°~8° 0.016[0.406] 0.035[0.889] 0.0075[0.190] 0.0098[0.249] 51-85068-*B Document #: 38-07140 Rev. *G Page 12 of 14 CY2305 CY2309 Package Drawing and Dimensions (continued) 16-lead TSSOP 4.40 MM Body Z16.173 PIN 1 ID 1 DIMENSIONS IN MM[INCHES] MIN. MAX. REFERENCE JEDEC MO-153 6.25[0.246] 6.50[0.256] 4.30[0.169] 4.50[0.177] PACKAGE WEIGHT 0.05gms 16 0.65[0.025] BSC. 0.19[0.007] 0.30[0.012] 1.10[0.043] MAX. 0.25[0.010] BSC GAUGE PLANE 0°-8° 0.076[0.003] 0.85[0.033] 0.95[0.037] 4.90[0.193] 5.10[0.200] 0.05[0.002] 0.15[0.006] SEATING PLANE 0.50[0.020] 0.70[0.027] 51-85091-*A 0.09[[0.003] 0.20[0.008] Pentium is a registered trademark of Intel Corporation. All product and company names mentioned in this document may be the trademarks of their respective holders. Document #: 38-07140 Rev. *G Page 13 of 14 © Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY2305 CY2309 Document History Page Document Title: CY2305/CY2309 Low-Cost 3.3V Zero Delay Buffer Document Number: 38-07140 REV. ** *A ECN NO. 110249 111117 Issue Date 10/19/01 03/01/02 Orig. of Change SZV CKN Description of Change Change from Spec number: 38-00530 to 38-07140 Added t6B row to the Switching Characteristics Table; also added the letter “A” to the t6A row Corrected the table title from CY2305SC-IH and CY2309SC-IH to CY2305SI-IH and CY2309SI-IH Added eight-pin TSSOP packages (CY2305ZC-1 and CY2305ZC-1T) to the ordering information table. Added the Tape and Reel option to all the existing packages: CY2305SC-1T, CY2305SI-1T, CY2305SC-1HT, CY2305SI-1HT, CY2305ZC-1T, CY2309SC-1T, CY2309SI-1T, CY2309SC-1HT, CY2309SI-1HT, CY2309ZC-1HT, CY2309ZI-1HT Power-up requirements added to Operating Conditions information Added Lead-free for all the devices in the ordering information table Added a Lead-free with the new coding for all SOIC devices in the ordering information table Added TSSOP Lead-free devices Added typical values for jitter *B 117625 10/21/02 HWT *C *D *E *F *G 121828 131503 214083 291099 390582 12/14/02 12/12/03 See ECN See ECN See ECN RBI RGL RGL RGL RGL Document #: 38-07140 Rev. *G Page 14 of 14