CY24292LFXCT

CY24292 Four Outputs PCI-Express Clock Generator Four Outputs PCI-Express Clock Generator Features Functional Description ■ 25 MHz Crystal or Clock Input CY24292 is a clock generator device intended for PCI-Express applications. The device includes: four 100 MHz differential clocks with HCSL Compatible outputs for PCI-Express, and one single-ended 25 MHz output. ■ Four Differential 100 MHz PCI-Express Clocks ■ Supports HCSL Compatible Output Levels ■ One Single-ended 25 MHz Output ■ Spread Spectrum Capability on all 100 MHz PCI-Express Clock Outputs ■ SMBus Interface with Read Back Capability Using a serially programmable SMBus interface, the CY24292 incorporates spread spectrum modulation on all four 100 MHz outputs. The device incorporates a Lexmark Spread Spectrum profile for maximum electromagnetic interference (EMI) reduction. The spread feature or individual outputs can also be disabled using the SMBus interface. ■ 32-pin QFN Package For a complete list of related documentation, click here. ■ Operating Voltage 3.3 V ■ Commercial and Industrial Operating Temperature Range Logic Block Diagram VDD PCIE0P XIN/EXCLKIN (25 MHz) XOUT PCIE0N Clock Buffer/ Crystal Oscillator PCIE1P PCIE1N PLL Clock (100 MHz) (100 MHz) Synthesizer, PCIE2P Dividers, Buffers PCIE2N (100 MHz) and SCLK Configuration SDATA PCIE3P PCIE3N Logic (100 MHz) PD_RESET# 25M (25 MHz) I REF R GND Cypress Semiconductor Corporation Document Number: 001-46142 Rev. *G • 198 Champion Court REF • = 475 Ohms 1% San Jose, CA 95134-1709 • 408-943-2600 Revised June 27, 2017 CY24292 Contents Pin Configuration ............................................................. 3 Pin Definitions .................................................................. 3 Functional Overview ........................................................ 4 SMBus Serial Data Interface ....................................... 4 Data Protocol ............................................................... 4 Control Registers ......................................................... 6 Application Information ................................................... 8 Crystal Recommendations .......................................... 8 Crystal Loading ........................................................... 8 Calculating Load Capacitors ....................................... 8 Current Source (Iref) Reference Resistor .................... 8 Output Termination ...................................................... 8 PCB Layout Recommendations .................................. 9 Decoupling Capacitors ................................................ 9 PCI-Express Layout Guidelines ...................................... 9 HCSL Compatible Layout Guidelines .......................... 9 Absolute Maximum Ratings .......................................... 10 Recommended Operation Conditions .......................... 10 DC Electrical Characteristics ........................................ 11 Document Number: 001-46142 Rev. *G Thermal Resistance ........................................................ 11 AC Electrical Characteristics ........................................ 12 Test and Measurement Setup ........................................ 14 Single-ended Signals ................................................ 14 Differential Signals .................................................... 14 Ordering Information ...................................................... 15 Ordering Code Definitions ......................................... 15 Package Diagram ............................................................ 16 Acronyms ........................................................................ 17 Document Conventions ................................................. 17 Units of Measure ....................................................... 17 Document History Page ................................................. 18 Sales, Solutions, and Legal Information ...................... 20 Worldwide Sales and Design Support ....................... 20 Products .................................................................... 20 PSoC® Solutions ...................................................... 20 Cypress Developer Community ................................. 20 Technical Support ..................................................... 20 Page 2 of 20 CY24292 Pin Configuration VDD GND VDD GND VDD GND 25M NC Figure 1. 32-pin QFN Pinout CY24292 32 31 30 29 28 27 26 25 GND 3 22 XIN/EXCLKIN IREF 4 CY24292 21 VDD PCIE2N 5 32 Pin QFN 20 PD_RESET# PCIE2P 6 19 GND GND 7 18 VDD VDD 8 17 GND 9 10 11 12 13 14 15 16 VDD XOUT SDATA 23 SCLK 2 PCIE0N PCIE1N PCIE0P VDD VDD 24 PCIE3P 1 PCIE3N PCIE1P Pin Definitions Pin Number 1 Pin Name PCIE1P Pin Type Description Output Differential 100 MHz PCI-Express true clock output. High impedance when disabled. Output Differential 100 MHz PCI-Express complementary clock output. High impedance when disabled. 2 PCIE1N 3 GND Power Ground 4 IREF Output Current set for all differential clock drivers. Connect 475  resistor to ground. 5 PCIE2N Output Differential 100 MHz PCI-Express complementary clock output. High impedance when disabled. 6 PCIE2P Output Differential 100 MHz PCI-Express true clock output. High impedance when disabled. 7 GND Power Ground 8 VDD Power 3.3 V Power supply 9 PCIE3N Output Differential 100 MHz PCI-Express complementary clock output. High impedance when disabled. 10 PCIE3P Output Differential 100 MHz PCI-Express true clock output. High impedance when disabled. 11 VDD Power 3.3 V Power supply 12 PCIE0P Output Differential 100 MHz PCI-Express true clock output. High impedance when disabled. 13 PCIE0N Output Differential 100 MHz PCI-Express complementary clock output. High impedance when disabled. 14 SCLK Input SMBus clock input 15 SDATA Input SMBus data input 16 VDD Power 3.3 V Power supply 17 GND Power Ground Document Number: 001-46142 Rev. *G Page 3 of 20 CY24292 Pin Definitions (continued) Pin Number Pin Name Pin Type Description 18 VDD Power 3.3 V Power supply 19 GND Power Ground 20 PD_RESET# Input Global reset pin. Powers down PLLs, disables outputs and sets the SMBus tables to their default state when pulled low. Has internal weak pull up. 21 VDD Power 3.3 V Power supply 22 XIN/EXCLKIN Input Crystal or clock input. Connect to 25 MHz fundamental mode crystal or clock. 23 XOUT Output Crystal output. Connect to 25 MHz fundamental mode crystal. Float for clock input. 24 VDD Power 3.3 V Power supply 25 NC – No connect. Pin has no internal connection. 26 25M Output 25 MHz Single-ended LVCMOS output. Pull-down when disabled by PD_RESET#. Driven low when individually disabled (via SMBus byte 0, bit 0). 27 GND Power Ground 28 VDD Power 3.3 V Power supply 29 GND Power Ground 30 VDD Power 3.3 V Power supply 31 GND Power Ground 32 VDD Power 3.3 V Power supply Functional Overview SMBus Serial Data Interface A two-signal serial interface is provided to enhance the flexibility and function of the clock synthesizer. Through the serial data interface, various device functions such as clock output buffers can be individually enabled or disabled. The registers associated with the serial data interface initialize to their default setting upon power up, and therefore this interface is optional. Clock device register changes are normally made upon system initialization, if required. This is a RAM-based technology which does not keep its value when power is off or during a power transition. Data Protocol The clock driver serial protocol accepts byte write, byte read, block write, and block read operations from the controller. For block write and read operation, the bytes must be accessed in sequential order from lowest to highest byte (most significant bit first) with the ability to stop after any complete byte is transferred. For byte write and byte read operations, the system controller can access individually indexed bytes. The offset of the indexed byte is encoded in the command code, as described in Table 1. The block write and block read protocol is outlined in Table 2 on page 5, while Table 3 on page 5 outlines the corresponding byte write and byte read protocol. The slave receiver address is 11010010 (D2h) for write and 11010011 (D3h) for read. Table 1. Command Code Definition Bit 7 (6:0) Description 0 = block read or block write operation, 1 = byte read or byte write operation Byte offset for byte read or byte write operation. For block read or block write operations, these bits must be '0000000' Document Number: 001-46142 Rev. *G Page 4 of 20 CY24292 Table 2. Block Read and Block Write Protocol Block Write Protocol Bit 1 2:8 Description Start Block Read Protocol Bit 1 Slave address – 7 bits 2:8 Description Start Slave address – 7 bits 9 Write 9 Write 10 Acknowledge from slave 10 Acknowledge from slave 11:18 19 20:27 28 29:36 37 38:45 46 Command code – 8-bit ‘00000000’ stands for block operation Acknowledge from slave Byte count – 8 bits 11:18 19 20 Acknowledge from slave Data byte 0 – 8 bits Acknowledge from slave Data byte 1 – 8 bits 21:27 Data byte N/Slave acknowledge Data byte N – 8 bits Acknowledge from slave Stop Acknowledge from slave Repeat start Slave address – 7 bits 28 Read 29 Acknowledge from slave 30:37 Acknowledge from slave Command code – 8-bit ‘00000000’ stands for block operation 38 39:46 47 48:55 56 Byte count from slave – 8 bits Acknowledge Data byte from slave – 8 bits Acknowledge Data byte from slave – 8 bits Acknowledge Data bytes from slave/acknowledge Data byte N from slave – 8 bits Not acknowledge Stop Table 3. Byte Read and Byte Write Protocol Byte Write Protocol Bit 1 2:8 9 10 11:18 19 20:27 Description Start Slave address – 7 bits Write = 0 Acknowledge from slave Command code – 8 bits ‘1xxxxxxx’ stands for byte operation, bits[6:0] of bits[6:0] the command code represents the offset of the byte to be accessed Byte Read Protocol Bit 1 2:8 Description Start Slave address – 7 bits 9 Write = 0 10 Acknowledge from slave 11:18 Command code – 8 bits ‘1xxxxxxx’ stands for byte operation, of the command code represents the offset of the byte to be accessed Acknowledge from slave 19 Acknowledge from slave Data byte from master – 8 bits 20 Repeat start 28 Acknowledge from slave 29 Stop 21:27 28 Read = 1 29 Acknowledge from slave 30:37 Document Number: 001-46142 Rev. *G Slave address – 7 bits Data byte from slave – 8 bits 38 Not acknowledge 39 Stop Page 5 of 20 CY24292 Control Registers Table 4. Byte 0: Spread Spectrum Control Register Bit Type At Power up 7 R/W 1 6 R Undefined 5 R/W 1 4 R 3 2 1 0 Outputs Affected Description All 100 MHz PCI-Express outputs Spread select for 100 MHz PCI-Express clocks Not applicable Not used All outputs Global OE bit. Enables or disables all outputs. Undefined Not applicable Not used R Undefined Not applicable Not used R Undefined Not applicable Not used R Undefined R/W 1 Not applicable Not used Single-ended 25 MHz output, 25M OE for single-ended 25 MHz output, 25M. Output driven low when disabled. Notes 0 = spread off 1 = –0.5% down 0 = disabled 1 = enabled 0 = disabled 1 = enabled Table 5. Byte 1: Control Register Bit Type At Power up 0 to 7 R Undefined Outputs Affected Not applicable Description Notes Description Notes Description Notes Not used Table 6. Byte 2: Control Register Bit Type At Power up 0 to 7 R Undefined Outputs Affected Not applicable Not used Table 7. Byte 3: Control Register Bit Type At Power up Outputs Affected 6,7 R 0 Not applicable Not used OE for 100 MHz PCI-Express output PCIE3 0 = disabled 1 = enabled 0 = disabled 1 = enabled 5 R/W 1 100 MHz PCI-Express output PCIE3 4 R/W 1 100 MHz PCI-Express output PCIE2 OE for 100 MHz PCI-Express output PCIE2 3 R 0 Not applicable Not used 2 R/W 1 100 MHz PCI-Express output PCIE1 OE for 100 MHz PCI-Express output PCIE1 0 = disabled 1 = enabled 1 R/W 1 100 MHz PCI-Express output PCIE0 OE for 100 MHz PCI-Express output PCIE0 0 = disabled 1 = enabled 0 R Undefined Not applicable Not used Table 8. Byte 4: Control Register Bit Type At Power up 0 to 7 R Undefined Outputs Affected Not applicable Document Number: 001-46142 Rev. *G Description Notes Not used Page 6 of 20 CY24292 Table 9. Byte 5: Control Register Bit Type At Power up Outputs Affected 7 R 0 Not applicable Revision ID bit 3 6 R 0 Not applicable Revision ID bit 2 5 R 0 Not applicable Revision ID bit 1 4 R 1 Not applicable Revision ID bit 0 3 R 1 Not applicable Vendor ID bit 3 2 R 0 Not applicable Vendor ID bit 2 1 R 0 Not applicable Vendor ID bit 1 0 R 0 Not applicable Vendor ID bit 0 Description Notes Description Notes Table 10. Byte 6: Control Register Bit Type At Power up 0 to 7 R Undefined Outputs Affected Not applicable Not used The state of the clock outputs upon assertion of the PD_RESET# signal from input pin or Global OE control bit from byte 0, bit 5 of the SMBus is shown in the following table. Table 11. Power Down Reset Table H/W PD_RESET# (pin 24) S/W PD_RESET# (Byte 0 bit 5) All Clock Outputs 0 0 Disabled, Hi-Z. 25M has weak pull-down. 0 1 Disabled, Hi-Z. 25M has weak pull-down. 1 0 Disabled, Hi-Z. 25M has weak pull-down. 1 1 Enabled Document Number: 001-46142 Rev. *G Page 7 of 20 CY24292 Application Information Crystal Recommendations The CY24292 requires a parallel resonance crystal. Substituting a series resonance crystal causes the CY24292 to operate at the wrong frequency and violate the ppm specification. For most applications there is a 300 ppm frequency shift between the series and parallel crystals due to incorrect loading. Table 12. Crystal Recommendations Frequency Cut Load Cap (max) Eff Series Rest (max) 25.00 MHz Parallel 30  16 pF Crystal Loading Crystal loading plays a critical role in achieving low ppm performance. To realize low ppm performance, consider the total capacitance the crystal sees to calculate the appropriate capacitive loading (CL). Figure 2 shows a typical crystal configuration using two trim capacitors. It is important to note that the trim capacitors in series with the crystal are not parallel. It is a common misconception that load capacitors are in parallel with the crystal and are approximately equal to the load capacitance of the crystal. This is not true. Drive (max) Tolerance (max) Stability (max) Aging (max) 1.0 mW 30 ppm 10 ppm 5 ppm/yr Use the following formulas to calculate the trim capacitor values for Ce1 and Ce2. Load capacitance (each side) Ce = 2 * CL – (Cs + Ci) Total capacitance (as seen by the crystal) CLe = 1 1 ( Ce1 + Cs1 + Ci1 + 1 Ce2 + Cs2 + Ci2 ) Calculating Load Capacitors CL .................................................. Crystal load capacitance In addition to the standard external trim capacitors, the trace capacitance and pin capacitance must also be considered to correctly calculate crystal loading. CLe ........................................ Actual loading seen by crystal using standard value trim capacitors As mentioned in the previous section, the capacitance on each side of the crystal is in series with the crystal. This means the total capacitance on each side of the crystal must be twice the specified crystal load capacitance (CL). While the capacitance on each side of the crystal is in series with the crystal, the trim capacitors (Ce1, Ce2) must be calculated to provide equal capacitive loading on both sides. Figure 2. Crystal Loading Example Ci2 Pin 3 to 6 pF X2 X1 Cs1 Current Source (Iref) Reference Resistor If the board target trace impedance (Z) is 50 , then for RREF = 475  (1%) provides IREF of 2.32 mA. The output current (IOH) is equal to 6 × IREF. The PCI-Express differential clock outputs of CY24292 are open source drivers and require an external series resistor and a resistor to ground. These resistor values and their allowable locations are explained in detail in the section PCI-Express Layout Guidelines on page 9. Cs2 Trace 2.8 pF XTAL Ce1 Cs .............................................Stray capacitance (terraced) Ci .......................................................... Internal capacitance Output Termination Clock Chip Ci 1 Ce .................................................... External trim capacitors Ce2 Document Number: 001-46142 Rev. *G Trim 26 pF Page 8 of 20 CY24292 4. An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers (any ferrite beads and bulk decoupling capacitors can be mounted on the back). Other signal traces must be routed away from the CY24292. This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. PCB Layout Recommendations For optimum device performance and lowest phase noise, the following guidelines must be observed. 1. Each 0.01 µF decoupling capacitor must be mounted on the component side of the board as close to the VDD pin as possible. 2. No vias must be used between the decoupling capacitor and the VDD pin. 3. The PCB trace to the VDD pin and the ground via must be kept as short as possible. The distance of the ferrite bead and bulk decoupling from the device is less critical. Decoupling Capacitors Decoupling capacitors of 0.01 µF must be connected between VDD and GND as close to the device as possible. Do not share ground vias between components. Route power from power source through the capacitor pad, and then into the CY24292 pin. PCI-Express Layout Guidelines HCSL Compatible Layout Guidelines Table 13. Common Recommendations for Differential Routing Differential Routing[1] Dimension or Value Unit L1 length, route as non-coupled 50  trace 0.5 max inch L2 length, route as non-coupled 50  trace 0.2 max inch L3 length, route as non-coupled 50  trace 0.2 max inch RS 33  RT 49.9  Differential Routing [1] Dimension or Value Unit L4 length, route as coupled microstrip 100  differential trace 2 to 32 inch 1.8 to 30 inch Table 14. Differential Routing for PCI-Express Load or Connector L4 length, route as coupled stripline 100  differential trace Figure 3. PCI-Express Device Routing Rs L1 L2 L4 L2 L4 RS L1 RT Output Buffer L3 RT L3 PCI Express Load or Connector Note 1. Refer to Figure 3. Document Number: 001-46142 Rev. *G Page 9 of 20 CY24292 Absolute Maximum Ratings Parameter Description Condition Min Max Unit VDD Supply voltage –0.5 4.6 V VIN Input voltage Relative to VSS –0.5 VDD + 0.5 V TS Temperature, Storage Non Operating –65 150 °C TJ Temperature, Junction – 125 °C ESDHBM ESD Protection (Human Body Model) 2000 – V UL-94 Flammability rating MSL Moisture sensitivity level JEDEC EIA/JESD22-A114-E V-0 at 1/8 in. 3 Recommended Operation Conditions Parameter Description Min Typ Max Unit 3.0 – 3.6 V 0 – 70 °C VDD Supply voltage TAC Commercial ambient temperature TAI Industrial ambient temperature –40 – 85 °C tPU Power up time for all VDD to reach minimum specified voltage (power ramps must be monotonic) 0.05 – 500 ms tPD Minimum pulse width of PD_RESET# input 100 – – ns VSMB SMBus Voltage 3.0 – 3.6 V RREFTOL Tolerance on the 475RREF resistor that sets output currents on 100MHz ports – – 1 % Document Number: 001-46142 Rev. *G Page 10 of 20 CY24292 DC Electrical Characteristics Unless otherwise stated, VDD = 3.3 V ± 0.3 V, ambient temperature = –40 °C to 85 °C Industrial, 0 °C to 70 °C Commercial, RREF = 475  Parameter[2] Description Condition Min Typ Max Unit – – 0.4 V VDD – 0.4 – – V VOL1 Low level output voltage of 25M IOL = 8 mA clock VOH1 High level output voltage of 25M IOH = –8 mA clock VOL2 Low level output voltage of 100M HCSL termination clocks (RS = 33 , RT = 49.9 ) –0.2 0 0.05 V VOH2 High level output voltage of 100M HCSL termination clocks (RS = 33 RT49.9 0.65 0.71 0.95 V VOL3 Low level output voltage SDATA IOL = 4 mA – – 0.4 V IOH Output high current for differential IOH = 6 × IREF clocks –13 –15.2 –17 mA VIL1 Low level input voltage of SCLK, SDATA –0.3 – 0.8 V VIH1 High level input voltage of SCLK, SDATA 2.1 – VDD + 0.3 V VIL2 Low level input voltage of XIN/EXCLKIN, PD_RESET# pins –0.3 – 0.8 V VIH2 High level input voltage of XIN/EXCLKIN, PD_RESET# pins 2.0 – VDD + 0.3 V IDD Operating supply current IDDPD No load, PD_RESET# pin = 1 – 50 70 mA Full load, PD_RESET# pin = 1 – 135 170 mA Power down current PD_RESET# pin = 0 – 250 350 A CIN Input capacitance All input pins – 5 – pF RPU Pull up resistor, PD_RESET# – 90 – k RPD Pull down resistor, 25M output PD_RESET# = 0 50 – 150 k Thermal Resistance Parameter[3] Description θJA Thermal resistance (junction to ambient) θJC Thermal resistance (junction to case) Test Conditions 32-pin QFN Unit Test conditions follow standard test methods and procedures for measuring thermal impedance, in accordance with EIA/JESD51. 22 °C/W 19.5 °C/W Notes 2. Parameters are guaranteed by design and characterization. Not 100% tested in production. 3. These parameters are guaranteed by design and are not tested. Document Number: 001-46142 Rev. *G Page 11 of 20 CY24292 AC Electrical Characteristics Unless otherwise stated, VDD = 3.3 V ± 0.3 V, ambient temperature = –40 °C to 85 °C Industrial, 0°C to 70°C Commercial, RREF = 475  Table 15. Single-Ended 25 MHz Output Parameter[4] Description Condition Min Typ Max Unit FIN Input clock frequency (crystal or external clock) – – 25 – MHz TINDC Input clock duty cycle – 40 – 60 % FOUT Output clock frequency, 25M – – 25 – MHz 20% to 80% of VDD – 0.5 1 ns 80% to 20% of VDD – 0.5 1 ns Measured at VDD/2 45 50 55 % – – 200 ps TR TF TDC [5] Output rise time Output fall time [5] Output clock duty cycle[5] TCCJ Cycle-to-cycle TOEPD Output enable from power down reset PD_RESET# going high to 99% of final frequency – – 2 ms TLOCK Clock stabilization from power up Measured from 90% of the applied power supply level – 1 2 ms jitter[5] – Notes 4. Parameters are guaranteed by design and characterization. Not 100% tested in production. 5. Measured with Cload = 15 pF lumped load. Document Number: 001-46142 Rev. *G Page 12 of 20 CY24292 Table 16. Differential 100 MHz, HCSL Terminated Outputs Parameter [6] Description Test Condition FOUT Output frequency SPPROFILE Spread modulation profile SPMOD Spread modulation frequency TCCJ TPHJ TDC ERR Cycle-to-cycle jitter [7] Peak-to-peak phase jitter [7, 8] [7] Output clock duty cycle Rising edge rate Min Typ Max Unit – – 100 MHz – – Lexmark type 30 32 33 kHz – – 90 ps – – 86 ps 45 50 55 % [7, 9] See notes 7 and 9 0.6 – 4.0 V/ns [7, 9] See notes 7 and 9 0.6 – 4.0 V/ns See notes 10, 11, and 12 0.25 0.35 0.55 V – – 140 mV ERF Falling edge rate VCROSS Absolute crossing point voltage [10, 11, 12] VXdelta Variation of VCROSS over all rising See notes 10, 11, and 13 clock edges[10, 11, 13] TPERIOD AVG Average clock period accuracy[7, 14] See notes 7 and 14 –300 – 2800 ppm TPERIOD ABS Absolute clock period[7, 15] See notes 7 and 15 pairs[16] 9.847 – 10.203 ns Measured at VCROSS point See note 16 – – 100 ps Measured at VCROSS point See note 16 – – 50 ps TOSKEW ALL Output skew, all TOSKEW P-P PCIE0P/N to PCIE3P/N skew and PCIE1P/N to PCIE2P/N skew[16] TOEPD Output enable from power down PD_RESET# going high to 99% of reset final frequency – – 2 ms TLOCK Clock stabilization from power up Measured from 90% of the applied power supply level – 1 2 ms Notes 6. Parameters are guaranteed by design and characterization. Not 100% tested in production. 7. Measurement taken from differential waveform (PCIEP minus PCIEN). Either single ended probes with math or a differential probe can be used. 8. Phase jitter is determined using data captured on an oscilloscope at a sample rate of 20 GS/sec, for a minimum 100,000 continuous clock periods. This data is then processed using the ClockJitter 1.3.0 software from PCISIG, using the PCI_E_1_1 template. 9. Measured from -150 mV to +150 mV on the differential waveform (derived from PCIEP minus PCIEN). The signal must be monotonic through the measurement region for rise and fall time. The 300 mV measurement window is centered on the differential zero crossing. 10. Measurement taken from a single-ended waveform. 11. Measured at crossing point where the instantaneous voltage value of the rising edge of PCIEP equals the falling edge of PCIEN. 12. Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing. Refers to all crossing points for this measurement. 13. Defined as the total variation of all crossing voltages of Rising PCIEP and Falling PCIEN. This is the maximum allowed variance in VCROSS for any particular system. 14. PPM refers to parts per million and is a DC absolute period accuracy specification. 1 PPM is 1/1,000,000th of 100.000000 MHz exactly, or 100 Hz. For 300 PPM then we have an error budget of 30 kHz. The period is to be measured with a frequency counter with measurement window set to 100 ms or greater. The ±300 PPM applies to systems that do not employ Spread Spectrum or that use common clock source. For systems employing Spread Spectrum, there is an additional 2500 PPM nominal shift in maximum period resulting from the 0.5% down spread, resulting in a maximum average period specification of +2800 PPM. 15. Defined as the absolute minimum or maximum instantaneous period. This includes cycle-to-cycle jitter, relative PPM tolerance, and spread spectrum modulation. 16. Measured at the rising 0 V point of the differential signal. Skew is the time difference of the rising 0 V point between any two differential signal pairs. The measurement is taken over 1000 samples, and the average value is used. Document Number: 001-46142 Rev. *G Page 13 of 20 CY24292 Test and Measurement Setup Single-ended Signals Figure 4. Test Load Configuration for Single-ended Output Signal 453 Ohm 50 Ohm CLoad Differential Signals Figure 5. Test Load Configuration for Differential Output Signal 33 Ohm PCIEP CLoad 50 Ohm CLoad 50 Ohm 33 Ohm PCIEN 475 Ohm Document Number: 001-46142 Rev. *G Page 14 of 20 CY24292 Ordering Information Ordering Code Package Type Production Flow Pb-free CY24292LFXC 32-pin QFN Commercial, 0 °C to 70 °C CY24292LFXCT 32-pin QFN – Tape and Reel Commercial, 0 °C to 70 °C CY24292LFXI 32-pin QFN Industrial, –40 °C to 85 °C CY24292LFXIT 32-pin QFN – Tape and Reel Industrial, –40 °C to 85 °C Ordering Code Definitions CY 24292 L X X X -xxx T T = Tape and Reel, blank = tube Configuration specific identifier (Factory Programmed) Temperature Range: X = C or I C = Commercial = 0 °C to 70 °C; I = Industrial = –40 °C to 85 °C Pb-free X = F or blank F = Field Programmable; blank = Factory Programmed Package: L = 32-pin QFN Part Identifier Company ID: CY = Cypress Document Number: 001-46142 Rev. *G Page 15 of 20 CY24292 Package Diagram Figure 6. 32-pin QFN (5 × 5 × 0.55 mm) LQ32 3.5 × 3.5 E-Pad (Sawn) Package Outline, 001-42168 SEE NOTE 1 TOP VIEW BOTTOM VIEW SIDE VIEW DIMENSIONS NOTES: 1. SYMBOL HATCH AREA IS SOLDERABLE EXPOSED PAD MIN. NOM. MAX. 2. BASED ON REF JEDEC # MO-248 A 0.50 0.55 0.60 3. PACKAGE WEIGHT: 0.0388g A1 - 0.020 0.045 4. DIMENSIONS ARE IN MILLIMETERS A2 0.15 BSC 001-42168 *F D 4.90 5.00 5.10 D2 3.40 3.50 3.60 E 4.90 5.00 5.10 E2 3.40 3.50 3.60 L 0.30 0.40 0.50 b 0.18 0.25 0.30 e Document Number: 001-46142 Rev. *G 0.50 TYP Page 16 of 20 CY24292 Acronyms Document Conventions Table 17. Acronyms Used in this Document Units of Measure Acronym Description Table 18. Units of Measure EIA electronic industries alliance EMI electromagnetic interference °C degree Celsius ESD electrostatic discharge kHz kilohertz HCSL host clock signal level k kilohm JEDEC joint electron devices engineering council MHz megahertz F microfarad Symbol Unit of Measure LVCMOS low voltage complementary metal oxide semiconductor mA milliampere OE output enable ms millisecond PCI peripheral component interconnect mV millivolt PLL phase-locked loop ns nanosecond QFN quad-flat no-leads  ohm RAM random access memory % percent pF picofarad ppm parts per million ps picosecond V volt Document Number: 001-46142 Rev. *G Page 17 of 20 CY24292 Document History Page Document Title: CY24292, Four Outputs PCI-Express Clock Generator Document Number: 001-46142 Rev. ECN Orig. of Change Submission Date ** 2490167 PYG / DPF / AESA See ECN *A 2507681 DPF / AESA New data sheet. 05/23/2008 Updated Pin Configuration (Changed pinout based on PCIE_Bonding_Rev G). Updated DC Electrical Characteristics (Added Note 2 and referred the same note in parameter column, added HCSL termination in Condition column for VOL2, VOH2). Updated AC Electrical Characteristics (updated Note 5, added Note 11 and referred the same note in TDC parameter in Table 16, changed Cload from 2 pF to 4 pF in a Note below, added maximum value of VXdelta (140 mV) in the Table 16). Updated to new template. Changed status from Preliminary to Final. Updated Pin Definitions (Added explanation of 25M output disable feature). Updated Control Registers (Changed default setting (At Power up column) for bit 7 in Table 4 to ‘1’, changed description of bit 5 in Table 4 to ‘Global OE bit’, added explanation of 25M output disable feature in Table 4, changed unused bits (Type Column) from R/W to R in Table 7, changed default setting (At Power up column) for bit 4 in Table 9 to ‘1’, added explanation of 25M output disable feature in Table 11). Updated the sub-section Crystal Recommendations under the main section Application Information (Added “max” to Load Cap and Eff Series Rest columns in Table 12). Updated sub-section “LVDS Compatible Layout Guidelines” under the main section PCI-Express Layout Guidelines (changed “LVDS Down Device” to “LVDS Device” in all instances). Updated Absolute Maximum Ratings (Changed maximum value of TJ parameter to 125 °C). Updated Recommended Operation Conditions (Added VSMB and RREFTOL parameters and its details). Updated DC Electrical Characteristics (added RREF value to conditions at top, removed VOHSD and VOLSD parameters and their details, changed maximum value of VOH2 parameter from 0.85 V to 0.95 V, added VOL3 parameter and its details, changed typical value of IOH parameter from –14.2 mA to –15.2 mA, added minimum value of VIL1 parameter, changed maximum value of VIL1 parameter from 1 V to 0.8 V, changed minimum value of VIH1 parameter from 2.2 V to 2.1 V, added typical and maximum values for IDD no load and full load parameters, changed typical value of IDDPD parameter from TBD to 250 µA, changed maximum value of IDDPD parameter from TBD to 350 µA, added RPU parameter and its details, changed RPD parameter to apply to 25M output only). Updated AC Electrical Characteristics (added RREF value to conditions at top, removed FERR parameter and its details in Table 15, added SPPROFILE parameter and its details in Table 16, added minimum and maximum values for SPMOD parameter, changed maximum value of TCCJ parameter from 100 ps to 90 ps in Table 16, added TPHJ parameter and its details in Table 16, changed TR and TF parameters and its details into ERR and ERF parameters in Table 16, removed TRFMATCH parameter and its details in Table 16, splitted TOSKEW parameter into two parameters namely TOSKEW ALL and TOSKEW P-P parameter and also changed their details in Table 16, added minimum value of VCROSS parameter and also changed the description of the same parameter in Table 16, changed description of VXdelta parameter in Table 16). Updated Package Diagram (to spec 001-42168 Rev *C). Fixed various typos. *B 2811340 CXQ 12/03/2009 *C 2901711 KVM 05/14/10 Document Number: 001-46142 Rev. *G Description of Change Updated Package Diagram. Page 18 of 20 CY24292 Document History Page (continued) Document Title: CY24292, Four Outputs PCI-Express Clock Generator Document Number: 001-46142 Rev. ECN Orig. of Change Submission Date Description of Change *D 3448896 PURU 11/28/2011 Updated Features (Removed LVDS related information). Updated Functional Description (Removed LVDS related information). Updated Output Termination under Application Information (Removed LVDS related information). Removed the sub-section “LVDS Compatible Layout Guidelines” under the main section PCI-Express Layout Guidelines. Added Ordering Code Definitions. Added Acronyms and Units of Measure. Updated to new template. *E 4580588 TAVA 12/05/2014 Updated Functional Description: Added “For a complete list of related documentation, click here.” at the end. Updated Package Diagram. *F 5281281 PSR 04/26/2017 Added Thermal Resistance. Updated to new template. *G 5784045 PSR 06/27/2017 Updated AC Electrical Characteristics: Added FIN and TINDC parameters. Updated Figure 6 in Package Diagram (spec 001-42168 *E to *F). Document Number: 001-46142 Rev. *G Page 19 of 20 CY24292 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. 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You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 001-46142 Rev. *G Revised June 27, 2017 Page 20 of 20