CY7C1021CV26-15ZSXEKJ

CY7C1021CV26 1-Mbit (64 K × 16) Static RAM 1-Mbit (64 K × 16) Static RAM Features Writing to the device is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is written into the location specified on the address pins (A0 through A15). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A15). ■ Temperature Range ❐ Automotive: –40 °C to 125 °C ■ High speed ❐ tAA = 15 ns ■ Optimized voltage range: 2.5 V to 2.7 V ■ Low active power: 220 mW (Max) ■ Automatic power-down when deselected ■ Independent control of upper and lower bits ■ CMOS for optimum speed/power ■ Available in Pb-free and non Pb-free 44-pin TSOP II, 44-pin (400-Mil) Molded SOJ and Pb-free 48-ball FBGA packages Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O8 to I/O15. See the truth table at the end of this data sheet for a complete description of Read and Write modes. The input/output pins (I/O0 through I/O15) are placed in a high-impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), the BHE and BLE are disabled (BHE, BLE HIGH), or during a Write operation (CE LOW, and WE LOW). Functional Description The CY7C1021CV26 is a high-performance CMOS static RAM organized as 65,536 words by 16 bits. This device has an automatic power-down feature that significantly reduces power consumption when deselected. For a complete list of related resources, click here. Logic Block Diagram 64 K × 16 RAM Array SENSE AMPS A7 A6 A5 A4 A3 A2 A1 A0 ROW DECODER DATA IN DRIVERS I/O0–I/O7 I/O8–I/O15 COLUMN DECODER A8 A9 A10 A11 A12 A13 A14 A15 BHE WE CE OE BLE Cypress Semiconductor Corporation Document Number: 38-05589 Rev. *J • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised November 5, 2015 CY7C1021CV26 Contents Selection Guide ................................................................ 3 Pin Configurations ........................................................... 3 Pin Definitions .................................................................. 4 Maximum Ratings ............................................................. 5 Operating Range ............................................................... 5 Electrical Characteristics ................................................. 5 Capacitance ...................................................................... 6 Thermal Resistance .......................................................... 6 AC Test Loads and Waveforms ....................................... 6 Switching Characteristics ................................................ 7 Switching Waveforms ...................................................... 8 Truth Table ...................................................................... 11 Ordering Information ...................................................... 12 Ordering Code Definitions ......................................... 12 Document Number: 38-05589 Rev. *J Package Diagrams .......................................................... 13 Acronyms ........................................................................ 15 Document Conventions ................................................. 15 Units of Measure ....................................................... 15 Document History Page ................................................. 16 Sales, Solutions, and Legal Information ...................... 17 Worldwide Sales and Design Support ....................... 17 Products .................................................................... 17 PSoC® Solutions ...................................................... 17 Cypress Developer Community ................................. 17 Technical Support ..................................................... 17 Page 2 of 17 CY7C1021CV26 Selection Guide Description [1] -15 Unit Maximum Access Time 15 ns Maximum Operating Current 80 mA Maximum CMOS Standby Current 10 mA Pin Configurations Figure 1. 44-pin SOJ/TSOP II pinout [2] A4 A3 A2 A1 A0 CE I/O0 I/O1 I/O2 I/O3 VCC VSS I/O4 I/O5 I/O6 I/O7 WE A15 A14 A13 A12 NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A5 A6 A7 OE BHE BLE I/O15 I/O14 I/O13 I/O12 VSS VCC I/O11 I/O10 I/O9 I/O8 NC A8 A9 A10 A11 NC Figure 2. 48-ball FBGA pinout [2] 1 2 3 4 5 6 BLE OE A0 A1 A2 NC A I/O8 BHE A3 A4 CE I/O0 B I/O9 I/O10 A5 A6 I/O2 I/O1 C VSS I/O11 NC A7 VCC D VCC NC NC I/O4 VSS E I/O14 I/O13 A14 A15 I/O5 I/O6 F I/O12 I/O3 I/O15 NC A12 A13 WE I/O7 G NC A8 A9 A10 A11 NC H Notes 1. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ.), TA = 25 °C. 2. NC pins are not connected on the die. Document Number: 38-05589 Rev. *J Page 3 of 17 CY7C1021CV26 Pin Definitions Pin Name Pin Number I/O Type Description A0–A15 1–5, 18–21, 24–27, 42–44 Input I/O0–I/O15 7–10, 13–16, 29–32, 35–38 Input/Output Bidirectional Data I/O lines. Used as input or output lines depending on operation. No Connect No Connects. This pin is not connected to the die. Address Inputs used to select one of the address locations. NC 22, 23, 28 WE 17 Input/Control Write Enable Input, active LOW. When selected LOW, a Write is conducted. When selected HIGH, a Read is conducted. CE 6 Input/Control Chip Enable Input, active LOW. When LOW, selects the chip. When HIGH, deselects the chip. BHE, BLE 40, 39 OE 41 VSS 12, 34 VCC 11, 33 Input/Control Byte Write Select Inputs, active LOW. BHE controls I/O15–I/O8, BLE controls I/O7–I/O0. Input/Control Output Enable, active LOW. Controls the direction of the I/O pins. When LOW, the I/O pins are allowed to behave as outputs. When de-asserted HIGH, I/O pins are tri-stated, and act as input data pins. Ground Ground for the device. Should be connected to ground of the system. Power Supply Power Supply inputs to the device. Document Number: 38-05589 Rev. *J Page 4 of 17 CY7C1021CV26 DC input voltage[3] .............................. –0.5 V to VCC + 0.5 V Maximum Ratings Current into outputs (LOW) ........................................ 20 mA Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Static discharge voltage (per MIL-STD-883, method 3015) .......................... > 2001 V Storage temperature ................................ –65 C to +150 C Latch-up current .................................................... > 200 mA Ambient temperature with power applied .......................................... –55 C to +125 C Operating Range Supply voltage on VCC to relative GND[3] .................................–0.5 V to +4.6 V Range DC voltage applied to outputs in high Z state[3] .................................. –0.5 V to VCC + 0.5 V Automotive Ambient Temperature VCC –40 C to +125 C 2.5 V–2.7 V Electrical Characteristics Over the Operating Range Parameter Description Test Conditions VOH Output HIGH voltage VCC = Min, IOH = –1.0 mA VOL Output LOW voltage VCC = Min, IOL = 1.0 mA VIH Input HIGH voltage voltage[3] -15 Unit Min Max 2.3 – V – 0.4 V 2.0 VCC + 0.3 V VIL Input LOW –0.3 0.8 V IIX Input leakage current GND < VI < VCC –3 +3 A IOZ Output leakage current GND < VI < VCC, output disabled –3 +3 A ICC VCC operating supply current VCC = Max, IOUT = 0 mA, f = fMAX = 1/tRC – 80 mA ISB1 Automatic CE power-down Current – TTL inputs Max VCC, CE > VIH, VIN > VIH or VIN < VIL, f = fMAX – 15 mA ISB2 Automatic CE power-down Current – CMOS inputs Max VCC, CE > VCC – 0.3 V, VIN > VCC – 0.3 V, or VIN < 0.3 V, f = 0 – 10 mA Note 3. VIL (min.) = –2.0V and VIH(max) = VCC + 0.5 V for pulse durations of less than 20 ns. Document Number: 38-05589 Rev. *J Page 5 of 17 CY7C1021CV26 Capacitance Parameter [4] Description Test Conditions Max Unit 8 pF 8 pF TA = 25 C, f = 1 MHz, VCC = 2.6 V CIN Input capacitance COUT Output capacitance Thermal Resistance Parameter [4] Description JA Thermal resistance (junction to ambient) JC Thermal resistance (junction to case) Test Conditions 44-pin TSOP II Unit Still Air, soldered on a 3 × 4.5 inch, four-layer printed circuit board 76.92 C/W 15.86 C/W AC Test Loads and Waveforms Figure 3. AC Test Loads and Waveforms [5] 2.6 V R1 1830  OUTPUT 30 pF INCLUDING JIG AND SCOPE R2 GND High Z characteristics: ALL INPUT PULSES 2.6 V 90% 90% 10% 10% Rise Time: 1 V/ns R 317  OUTPUT R2 351 5 pF 1976  (a) 2.6 V (b) Fall Time: 1 V/ns (c) Notes 4. Tested initially and after any design or process changes that may affect these parameters. 5. AC characteristics (except high Z) are tested using the Thevenin load shown in Figure 3 (a). High Z characteristics are tested for all speeds using the test load shown inFigure 3 (c). Document Number: 38-05589 Rev. *J Page 6 of 17 CY7C1021CV26 Switching Characteristics Over the Operating Range Parameter [6] Description -15 Min Max Unit Read Cycle tRC Read cycle time 15 – ns tAA Address to data valid – 15 ns tOHA Data hold from address change 3 – ns tACE CE LOW to data valid – 15 ns tDOE OE LOW to data valid – 7 ns 0 – ns – 7 ns tLZOE tHZOE OE LOW to low Z [7] OE HIGH to high Z [7, 8] [7] tLZCE CE LOW to low Z 3 – ns tHZCE CE HIGH to high Z [7, 8] – 7 ns tPU[9] tPD[9] CE LOW to power-up 0 – ns CE HIGH to power-down – 15 ns tDBE Byte enable to data valid – 7 ns tLZBE Byte enable to low Z 0 – ns Byte disable to high Z – 7 ns tHZBE Write Cycle [10, 11] tWC Write cycle time 15 – ns tSCE CE LOW to write end 10 – ns tAW Address set-up to write end 10 – ns tHA Address hold from write end 0 – ns tSA Address set-up to write start 0 – ns tPWE WE pulse width 10 – ns tSD Data set-up to write end 8 – ns tHD Data hold from write end 0 – ns [7] tLZWE WE HIGH to low Z 3 – ns tHZWE WE LOW to high Z [7, 8] – 7 ns tBW Byte enable to end of write 9 – ns Notes 6. Test conditions assume signal transition time of 2.6 ns or less, timing reference levels of 1.3 V, input pulse levels of 0 to 2.6 V. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 8. tHZOE, tHZBE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (c) of Figure 3. Transition is measured 500 mV from steady-state voltage. 9. This parameter is guaranteed by design and is not tested. 10. The internal Write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE/BLE LOW. CE, WE and BHE/BLE must be LOW to initiate a Write, and the transition of these signals can terminate the Write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the Write. 11. The minimum write pulse width for Write Cycle No. 3 (WE Controlled, OE LOW) should be sum of tSD and tHZWE. Document Number: 38-05589 Rev. *J Page 7 of 17 CY7C1021CV26 Switching Waveforms Figure 4. Read Cycle No. 1 [12, 13] tRC ADDRESS tOHA DATA OUT tAA PREVIOUS DATA VALID DATA VALID Figure 5. Read Cycle No. 2 (OE Controlled) [13, 14] ADDRESS tRC CE tACE OE tHZOE tDOE BHE, BLE tLZOE tHZCE tDBE tLZBE DATA OUT HIGH IMPEDANCE tLZCE VCC SUPPLY CURRENT tHZBE DATA VALID HIGH IMPEDANCE tPD tPU 50% 50% IICC CC IISB SB Notes 12. Device is continuously selected. OE, CE, BHE and/or BLE = VIL. 13. WE is HIGH for Read cycle. 14. Address valid prior to or coincident with CE transition LOW. Document Number: 38-05589 Rev. *J Page 8 of 17 CY7C1021CV26 Switching Waveforms (continued) Figure 6. Write Cycle No. 1 (CE Controlled) [15, 16] tWC ADDRESS CE tSA tSCE tAW tHA tPWE WE tBW BHE, BLE tSD tHD DATA I/O Figure 7. Write Cycle No. 2 (BLE or BHE Controlled) tWC ADDRESS BHE, BLE tSA tBW tAW tHA tPWE WE tSCE CE tSD tHD DATA I/O Notes 15. Data I/O is high-impedance if OE or BHE and/or BLE= VIH. 16. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state. Document Number: 38-05589 Rev. *J Page 9 of 17 CY7C1021CV26 Switching Waveforms (continued) Figure 8. Write Cycle No. 3 (WE Controlled, OE LOW) [17] tWC ADDRESS tSCE CE tAW tHA tSA tPWE WE tBW BHE, BLE tHZWE tSD tHD DATA I/O tLZWE Note 17. The minimum write pulse width for Write Cycle No. 3 (WE controlled, OE LOW) should be sum of tSD and tHZWE. Document Number: 38-05589 Rev. *J Page 10 of 17 CY7C1021CV26 Truth Table CE OE WE H X X X X High Z High Z Power-down Standby (ISB) L L H L L Data Out Data Out Read – All bits Active (ICC) L H Data Out High Z Read – Lower bits only Active (ICC) H L High Z Data Out Read – Upper bits only Active (ICC) L L Data In Data In Write – All bits Active (ICC) L H Data In High Z Write – Lower bits only Active (ICC) H L High Z Data In Write – Upper bits only Active (ICC) L X L BLE BHE I/O0–I/O7 I/O8–I/O15 Mode Power L H H X X High Z High Z Selected, Outputs Disabled Active (ICC) L X X H H High Z High Z Selected, Outputs Disabled Active (ICC) Document Number: 38-05589 Rev. *J Page 11 of 17 CY7C1021CV26 Ordering Information Cypress offers other versions of this type of product in many different configurations and features. The following table contains only the list of parts that are currently available. For a complete listing of all options, visit the Cypress website at http://www.cypress.com and refer to the product summary page at http://www.cypress.com/products or contact your local sales representative. Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives and distributors. To find the office closest to you, visit us at http://www.cypress.com/go/datasheet/offices. Speed (ns) 15 Ordering Code Package Name Package Type CY7C1021CV26-15ZSXE 51-85087 44-pin TSOP Type II (Pb-free) CY7C1021CV26-15ZSXET 51-85087 44-pin TSOP Type II (Pb-free) Operating Range Automotive Ordering Code Definitions CY 7 C 1021 C V26 - 15 XX X E X X = T or Blank T = Tape and Reel; Blank = Tube Temperature Range: E = Automotive Pb-free Package Type: XX = ZS ZS = 44-pin TSOP Type II Speed Grade: 15 ns V26 = 2.6 V Process Technology: C = 0.16 µm Part Identifier Technology Code: C = CMOS Marketing Code: 7 = SRAM Company ID: CY = Cypress Document Number: 38-05589 Rev. *J Page 12 of 17 CY7C1021CV26 Package Diagrams Figure 9. 44-pin TSOP Z44-II Package Outline, 51-85087 51-85087 *E Figure 10. 44-pin SOJ (400 Mils) V44.4 Package Outline, 51-85082 51-85082 *E Document Number: 38-05589 Rev. *J Page 13 of 17 CY7C1021CV26 Package Diagrams (continued) Figure 11. 48-ball FBGA (6 × 8 × 1 mm) BV48/BZ48 Package Outline, 51-85150 51-85150 *H Document Number: 38-05589 Rev. *J Page 14 of 17 CY7C1021CV26 Acronyms Acronym Document Conventions Description Units of Measure CMOS Complementary Metal Oxide Semiconductor CE Chip Enable °C degree Celsius FBGA Fine-Pitch Ball Grid Array MHz megahertz I/O Input/Output µA microampere OE Output Enable mA milliampere SOJ Small Outline J-lead mm millimeter SRAM Static Random Access Memory mW milliwatt TSOP Thin Small-Outline Package ns nanosecond TTL Transistor-Transistor Logic % percent WE Write Enable pF picofarad V volt W watt Document Number: 38-05589 Rev. *J Symbol Unit of Measure Page 15 of 17 CY7C1021CV26 Document History Page Document Title: CY7C1021CV26, 1-Mbit (64 K × 16) Static RAM Document Number: 38-05589 Rev. ECN No. Issue Date Orig. of Change ** 238454 See ECN RKF New data sheet for Automotive. *A 335861 See ECN SYT Added 44-pin SOJ Package related information in all instances across the document. Updated Ordering Information: Updated part numbers (Added Lead-Free Product Information). *B 493543 See ECN NXR Updated Electrical Characteristics: Changed description of IIX parameter from “Input Load Current” to “Input Leakage Current”. Removed IOS parameter and its details. Updated Ordering Information: Updated part numbers. *C 2897087 03/22/10 AJU Updated Ordering Information: Removed obsolete parts. Updated Package Diagrams. *D 3057593 10/13/2010 PRAS Updated Ordering Information: Updated part numbers. Added Ordering Code Definitions. Updated Package Diagrams. *E 3098812 12/01/2010 PRAS Minor edits across the document. Added Acronyms and Units of Measure. Updated to new template. *F 3277371 06/08/2011 AJU Updated Pin Configurations (Included pin configurations for 44-pin SOJ and 48-ball FBGA packages). *G 4141238 09/30/2013 VINI Updated Package Diagrams: spec 51-85087 – Changed revision from *C to *E. spec 51-85082 – Changed revision from *C to *E. spec 51-85150 – Changed revision from *F to *H. Updated to new template. Completing Sunset Review. *H 4567793 11/12/2014 VINI Updated Functional Description: Added “For a complete list of related resources, click here.” at the end. Updated Switching Characteristics: Added Note 11 and referred the same note in “Write Cycle”. Updated Switching Waveforms: Added Note 17 and referred the same note in Figure 8. Completing Sunset Review. *I 4573200 11/18/2014 VINI Updated Ordering Information: Removed prune part numbers namely CY7C1021CV26-15VXE, CY7C1021CV26-15BAE, CY7C1021CV26-15BAET, and CY7C1021CV26-15VXET. *J 5004033 11/05/2015 VINI Updated to new template. Completing Sunset Review. Document Number: 38-05589 Rev. *J Description of Change Page 16 of 17 CY7C1021CV26 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Automotive cypress.com/go/automotive Clocks & Buffers Interface Lighting & Power Control Memory cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/memory PSoC cypress.com/go/psoc Touch Sensing cypress.com/go/touch USB Controllers Wireless/RF psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Community | Forums | Blogs | Video | Training Technical Support cypress.com/go/support cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2004-2015. The information contained herein is subject to change without notice. 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Document Number: 38-05589 Rev. *J Revised November 5, 2015 All products and company names mentioned in this document may be the trademarks of their respective holders. Page 17 of 17