CY7C1360C
CY7C1362C
9-Mbit (256K × 36/512K × 18)
Pipelined SRAM
9-Mbit (256K × 36/512K × 18) Pipelined SRAM
Features
Functional Description
■
Supports bus operation up to 200 MHz
■
Available speed grades: 200 MHz, and 166 MHz
■
Registered inputs and outputs for pipelined operation
■
3.3 V core power supply (VDD)
■
2.5 V/3.3 V I/O operation (VDDQ)
■
Fast clock-to-output times
❐ 3.0 ns (for 200 MHz device)
■
Provide high performance 3-1-1-1 access rate
■
User selectable burst counter supporting Intel Pentium®
interleaved or linear burst sequences
■
Separate processor and controller address strobes
■
Synchronous self-timed writes
■
Asynchronous output enable
■
Single cycle chip deselect
■
Available in Pb-free 100-pin TQFP package, non Pb-free
119-ball BGA package, and 165-ball FBGA package
■
TQFP available with 3-chip enable and 2-chip enable
■
IEEE 1149.1 JTAG-compatible boundary scan
The CY7C1360C/CY7C1362C SRAM integrates 256K × 36 and
512K × 18 SRAM cells with advanced synchronous peripheral
circuitry and a two-bit counter for internal burst operation. All
synchronous inputs are gated by registers controlled by a
positive-edge-triggered clock input (CLK). The synchronous
inputs include all addresses, all data inputs, address-pipelining
chip enable (CE1), depth-expansion chip enables (CE2 and
CE3[1]), burst control inputs (ADSC, ADSP, and ADV), write
enables (BWX, and BWE), and global write (GW). Asynchronous
inputs include the output enable (OE) and the ZZ pin.
Addresses and chip enables are registered at the rising edge of
clock when either address strobe processor (ADSP) or address
strobe controller (ADSC) are active. Subsequent burst
addresses can be internally generated as controlled by the
advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed write cycle.This part supports byte write
operations (see Pin Definitions on page 8 and Truth Table on
page 11 for further details). Write cycles can be one to two or four
bytes wide as controlled by the byte write control inputs. GW
when active LOW causes all bytes to be written.
The CY7C1360C/CY7C1362C operate from a +3.3 V core power
supply while all outputs may operate with either a +2.5 or +3.3 V
supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
For a complete list of related documentation, click here.
Selection Guide
Description
200 MHz
166 MHz
Unit
Maximum access time
3.0
3.5
ns
Maximum operating current
220
180
mA
Maximum CMOS standby current
40
40
mA
Note
1. CE3 is for A version of TQFP (3 Chip Enable option) and 165-ball FBGA package only. 119-ball BGA is offered only in 2 Chip Enable.
Cypress Semiconductor Corporation
Document Number: 38-05540 Rev. *T
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised March 28, 2018
CY7C1360C
CY7C1362C
Logic Block Diagram – CY7C1360C
A 0, A1, A
ADDRESS
REGISTER
2
A [1:0]
MODE
ADV
CLK
Q1
BURST
COUNTER
CLR AND
LOGIC
ADSC
Q0
ADSP
BW D
DQ D ,DQP D
BYTE
WRITE REGISTER
DQ D ,DQPD
BYTE
WRITE DRIVER
BW C
DQ C ,DQP C
BYTE
WRITE REGISTER
DQ C ,DQP C
BYTE
WRITE DRIVER
DQ B ,DQP B
BYTE
WRITE REGISTER
DQ B ,DQP B
BYTE
WRITE DRIVER
BW B
GW
CE 1
CE 2
CE 3
OE
ZZ
SENSE
AMPS
OUTPUT
REGISTERS
OUTPUT
BUFFERS
E
DQs
DQP A
DQP B
DQP C
DQP D
DQ A ,DQP A
BYTE
WRITE DRIVER
DQ A ,DQP A
BYTE
WRITE REGISTER
BW A
BWE
MEMORY
ARRAY
ENABLE
REGISTER
INPUT
REGISTERS
PIPELINED
ENABLE
SLEEP
CONTROL
Logic Block Diagram – CY7C1362C
A0, A1, A
ADDRESS
REGISTER
2
MODE
A[1:0]
BURST Q1
COUNTER AND
LOGIC
CLR
Q0
ADV
CLK
ADSC
ADSP
BW B
DQ B, DQP B
WRITE DRIVER
DQ B, DQP B
WRITE REGISTER
MEMORY
ARRAY
BW A
DQ A, DQP A
WRITE DRIVER
DQ A, DQP A
WRITE REGISTER
SENSE
AMPS
OUTPUT
REGISTERS
OUTPUT
BUFFERS
DQs
DQP A
DQP B
E
BWE
GW
CE 1
CE2
CE3
ENABLE
REGISTER
PIPELINED
ENABLE
INPUT
REGISTERS
OE
ZZ
SLEEP
CONTROL
Document Number: 38-05540 Rev. *T
Page 2 of 38
CY7C1360C
CY7C1362C
Contents
Pin Configurations ........................................................... 4
Pin Definitions .................................................................. 8
Functional Overview ........................................................ 9
Single Read Accesses ................................................ 9
Single Write Accesses Initiated by ADSP ................... 9
Single Write Accesses Initiated by ADSC ................. 10
Burst Sequences ....................................................... 10
Sleep Mode ............................................................... 10
Interleaved Burst Address Table ............................... 10
Linear Burst Address Table ....................................... 10
ZZ Mode Electrical Characteristics ............................ 10
Truth Table ...................................................................... 11
Partial Truth Table for Read/Write ................................ 12
Partial Truth Table for Read/Write ................................ 12
IEEE 1149.1 Serial Boundary Scan (JTAG) .................. 13
Disabling the JTAG Feature ...................................... 13
Test Access Port (TAP) ............................................. 13
PERFORMING A TAP RESET .................................. 13
TAP REGISTERS ...................................................... 13
TAP Instruction Set ................................................... 14
TAP Controller State Diagram ....................................... 15
TAP Controller Block Diagram ...................................... 16
TAP Timing ...................................................................... 16
TAP AC Switching Characteristics ............................... 17
3.3 V TAP AC Test Conditions ....................................... 17
3.3 V TAP AC Output Load Equivalent ......................... 17
2.5 V TAP AC Test Conditions ....................................... 17
2.5 V TAP AC Output Load Equivalent ......................... 17
TAP DC Electrical Characteristics
and Operating Conditions ............................................. 18
Document Number: 38-05540 Rev. *T
Identification Register Definitions ................................ 19
Scan Register Sizes ....................................................... 19
Instruction Codes ........................................................... 19
Boundary Scan Order .................................................... 20
Boundary Scan Order .................................................... 21
Maximum Ratings ........................................................... 22
Operating Range ............................................................. 22
Neutron Soft Error Immunity ......................................... 22
Electrical Characteristics ............................................... 22
Capacitance .................................................................... 23
Thermal Resistance ........................................................ 23
AC Test Loads and Waveforms ..................................... 24
Switching Characteristics .............................................. 25
Switching Waveforms .................................................... 26
Ordering Information ...................................................... 30
Ordering Code Definitions ......................................... 30
Package Diagrams .......................................................... 31
Acronyms ........................................................................ 34
Document Conventions ................................................. 34
Units of Measure ....................................................... 34
Document History Page ................................................. 35
Sales, Solutions, and Legal Information ...................... 38
Worldwide Sales and Design Support ....................... 38
Products .................................................................... 38
PSoC® Solutions ...................................................... 38
Cypress Developer Community ................................. 38
Technical Support ..................................................... 38
Page 3 of 38
CY7C1360C
CY7C1362C
Pin Configurations
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
CY7C1360C
(256K × 36)
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
DQPB
DQB
DQB
VDDQ
VSSQ
DQB
DQB
DQB
DQB
VSSQ
VDDQ
DQB
DQB
VSS
NC
VDD
ZZ
DQA
DQA
VDDQ
VSSQ
DQA
DQA
DQA
DQA
VSSQ
VDDQ
DQA
DQA
DQPA
MODE
A
A
A
A
A1
A0
NC/72M
NC/36M
VSS
VDD
NC/18M
A
A
A
A
A
A
A
A
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
DQPC
DQC
DQc
VDDQ
VSSQ
DQC
DQC
DQC
DQC
VSSQ
VDDQ
DQC
DQC
NC
VDD
NC
VSS
DQD
DQD
VDDQ
VSSQ
DQD
DQD
DQD
DQD
VSSQ
VDDQ
DQD
DQD
DQPD
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
A
A
CE1
CE2
BWD
BWC
BWB
BWA
CE3
VDD
VSS
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A
A
Figure 1. 100-pin TQFP (14 × 20 × 1.4 mm) pinout (3 Chip Enables - A Version)
Document Number: 38-05540 Rev. *T
Page 4 of 38
CY7C1360C
CY7C1362C
Pin Configurations (continued)
NC
NC
NC
VDDQ
VSSQ
NC
NC
DQB
DQB
VSSQ
VDDQ
DQB
DQB
NC
VDD
NC
VSS
DQB
DQB
VDDQ
VSSQ
DQB
DQB
DQPB
NC
VSSQ
VDDQ
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
CY7C1362C
(512K × 18)
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
DQPB
DQB
DQB
VDDQ
VSSQ
DQB
DQB
DQB
DQB
VSSQ
VDDQ
DQB
DQB
VSS
NC
VDD
ZZ
DQA
DQA
VDDQ
VSSQ
DQA
DQA
DQA
DQA
VSSQ
VDDQ
DQA
DQA
DQPA
MODE
A
A
A
A
A1
A0
NC/72M
NC/36M
VSS
VDD
NC/18M
NC
A
A
A
A
A
A
A
CY7C1360C
(256K × 36)
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
MODE
A
A
A
A
A1
A0
NC/72M
NC/36M
VSS
VDD
NC/18M
NC
A
A
A
A
A
A
A
DQPC
DQC
DQC
VDDQ
VSSQ
DQC
DQC
DQC
DQC
VSSQ
VDDQ
DQC
DQC
NC
VDD
NC
VSS
DQD
DQD
VDDQ
VSSQ
DQD
DQD
DQD
DQD
VSSQ
VDDQ
DQD
DQD
DQPD
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
A
A
CE1
CE2
NC
NC
BWB
BWA
A
VDD
VSS
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A
A
A
A
CE1
CE2
BWD
BWC
BWB
BWA
A
VDD
VSS
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A
A
Figure 2. 100-pin TQFP (14 × 20 × 1.4 mm) pinout (2 Chip Enables - AJ Version)
Document Number: 38-05540 Rev. *T
A
NC
NC
VDDQ
VSSQ
NC
DQPA
DQA
DQA
VSSQ
VDDQ
DQA
DQA
VSS
NC
VDD
ZZ
DQA
DQA
VDDQ
VSSQ
DQA
DQA
NC
NC
VSSQ
VDDQ
NC
NC
NC
Page 5 of 38
CY7C1360C
CY7C1362C
Pin Configurations (continued)
Figure 3. 119-ball BGA (14 × 22 × 2.4 mm) pinout (2 Chip Enables with JTAG)
1
CY7C1360C (256K × 36)
3
4
5
A
A
ADSP
A
VDDQ
2
A
6
A
7
VDDQ
B
C
NC/288M
NC/144M
CE2
A
A
A
ADSC
VDD
A
A
A
A
NC/576M
NC/1G
D
E
DQC
DQC
DQPC
DQC
VSS
VSS
NC
CE1
VSS
VSS
DQPB
DQB
DQB
DQB
F
VDDQ
DQC
VSS
OE
VSS
DQB
VDDQ
G
H
J
K
DQC
DQC
VDDQ
DQD
DQC
DQC
VDD
DQD
BWC
VSS
NC
VSS
ADV
BWB
VSS
NC
VSS
DQB
DQB
VDD
DQA
DQB
DQB
VDDQ
DQA
L
DQD
DQD
NC
DQA
VDDQ
DQD
BWA
VSS
DQA
M
BWD
VSS
DQA
VDDQ
N
DQD
DQD
VSS
VSS
DQA
DQA
P
DQD
DQPD
VSS
A0
VSS
DQPA
DQA
R
NC
A
MODE
VDD
NC
A
NC
T
U
NC
VDDQ
NC/72M
TMS
A
TDI
A
TCK
A
TDO
NC/36M
NC
ZZ
VDDQ
Document Number: 38-05540 Rev. *T
GW
VDD
CLK
BWE
A1
Page 6 of 38
CY7C1360C
CY7C1362C
Pin Configurations (continued)
Figure 4. 165-ball FBGA (13 × 15 × 1.4 mm) pinout (3 Chip Enables with JTAG)
CY7C1360C (256K × 36)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
NC/288M
R
2
3
4
5
6
7
8
9
10
11
NC
CE1
BWC
BWB
CE3
BWE
ADSC
ADV
A
NC/144M
A
CE2
BWD
BWA
CLK
GW
OE
ADSP
A
DQPC
DQC
NC
DQC
VDDQ
VSS
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDDQ
VDDQ
VDDQ
NC/1G
DQB
DQPB
DQB
DQC
DQC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQB
DQB
DQC
DQC
NC
DQD
DQC
VDDQ
VDD
VSS
VSS
VSS
VDD
DQB
VDDQ
NC
VDDQ
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD
VDDQ
VDDQ
NC
VDDQ
DQB
DQC
VSS
DQD
DQB
NC
DQA
DQB
ZZ
DQA
DQD
DQD
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
DQA
DQD
DQD
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
DQA
DQD
DQPD
DQD
NC
VDDQ
VDDQ
VDD
VSS
VSS
NC
VSS
NC/18M
VSS
NC
VDD
VSS
VDDQ
VDDQ
DQA
NC
DQA
DQPA
NC
NC/72M
A
A
TDI
A1
TDO
A
A
A
A
MODE
NC/36M
A
A
TMS
TCK
A
A
A
A
A
Document Number: 38-05540 Rev. *T
A0
NC/576M
Page 7 of 38
CY7C1360C
CY7C1362C
Pin Definitions
Name
I/O
Description
A0, A1, A
InputAddress inputs used to select one of the address locations. Sampled at the rising edge of the CLK
synchronous if ADSP or ADSC is active LOW, and CE1, CE2, and CE3[2]are sampled active. A1:A0 are fed to the
two-bit counter.
BWA, BWB,
BWC, BWD
InputByte write select inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM. Sampled
synchronous on the rising edge of CLK.
GW
InputGlobal write enable input, active LOW. When asserted LOW on the rising edge of CLK, a global write
synchronous is conducted (all bytes are written, regardless of the values on BWX and BWE).
BWE
InputByte write enable input, active LOW. Sampled on the rising edge of CLK. This signal must be asserted
synchronous LOW to conduct a byte write.
CLK
Inputclock
Clock input. Used to capture all synchronous inputs to the device. Also used to increment the burst
counter when ADV is asserted LOW, during a burst operation.
CE1
InputChip enable 1 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2
synchronous and CE3[2] to select/deselect the device. ADSP is ignored if CE1 is HIGH. CE1 is sampled only when a
new external address is loaded.
CE2
InputChip enable 2 input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with CE1
synchronous and CE3[2] to select/deselect the device. CE2 is sampled only when a new external address is loaded.
CE3[2]
InputChip enable 3 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1
synchronous and CE2 to select/deselect the device. Not available for AJ package version. Not connected for BGA.
Where referenced, CE3[2] is assumed active throughout this document for BGA. CE3 is sampled only
when a new external address is loaded.
OE
InputOutput enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When LOW,
asynchronous the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tristated, and act as input data
pins. OE is masked during the first clock of a read cycle when emerging from a deselected state.
ADV
InputAdvance input signal, sampled on the rising edge of CLK, active LOW. When asserted, it
synchronous automatically increments the address in a burst cycle.
ADSP
InputAddress strobe from processor, sampled on the rising edge of CLK, active LOW. When asserted
synchronous LOW, addresses presented to the device are captured in the address registers. A1:A0 are also loaded
into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is
ignored when CE1 is deasserted HIGH.
ADSC
InputAddress strobe from controller, sampled on the rising edge of CLK, active LOW. When asserted
synchronous LOW, addresses presented to the device are captured in the address registers. A1:A0 are also loaded
into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized.
ZZ
InputZZ “sleep” input, active HIGH. When asserted HIGH places the device in a non-time-critical “sleep”
asynchronous condition with data integrity preserved. For normal operation, this pin has to be LOW or left floating. ZZ
pin has an internal pull-down.
DQs, DQPX
I/OBidirectional data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the
synchronous rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by the
addresses presented during the previous clock rise of the read cycle. The direction of the pins is
controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQs and DQPX
are placed in a tristate condition.
VDD
Power supply Power supply inputs to the core of the device.
VSS
Ground
Ground for the core of the device.
VSSQ
I/O ground
Ground for the I/O circuitry.
VDDQ
I/O power
supply
Power supply for the I/O circuitry.
MODE
Inputstatic
Selects burst order. When tied to GND selects linear burst sequence. When tied to VDD or left floating
selects interleaved burst sequence. This is a strap pin and should remain static during device operation.
Mode pin has an internal pull-up.
Note
2. CE3 is for A version of 100-pin TQFP (3 Chip Enable option) and 165-ball FBGA package only. 119-ball BGA is offered only in 2 Chip Enable.
Document Number: 38-05540 Rev. *T
Page 8 of 38
CY7C1360C
CY7C1362C
Pin Definitions (continued)
Name
I/O
Description
TDO
JTAG serial Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the JTAG feature is
output
not being used, this pin should be disconnected. This pin is not available on TQFP packages.
synchronous
TDI
JTAG serial Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not being
input
used, this pin can be disconnected or connected to VDD. This pin is not available on TQFP packages.
synchronous
TMS
JTAG serial Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not being
used, this pin can be disconnected or connected to VDD. This pin is not available on TQFP packages.
input
synchronous
TCK
JTAGclock
Clock input to the JTAG circuitry. If the JTAG feature is not being used, this pin must be connected
to VSS. This pin is not available on TQFP packages.
NC
–
No connects. Not internally connected to the die
NC (18, 36,
72, 144,
288, 576,
1G)
–
These pins are not connected. They will be used for expansion to the 18M, 36M, 72M, 144M 288M,
576M, and 1G densities.
Functional Overview
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. All data outputs pass through output
registers controlled by the rising edge of the clock. Maximum
access delay from the clock rise (tCO) is 3.0 ns (200 MHz device).
The CY7C1360C/CY7C1362C supports secondary cache in
systems using either a linear or interleaved burst sequence. The
interleaved burst order supports Pentium and i486 processors.
The linear burst sequence is suited for processors that use a
linear burst sequence. The burst order is user selectable, and is
determined by sampling the MODE input. Accesses can be
initiated with either the processor address strobe (ADSP) or the
controller address strobe (ADSC). Address advancement
through the burst sequence is controlled by the ADV input. A
two-bit on-chip wraparound burst counter captures the first
address in a burst sequence and automatically increments the
address for the rest of the burst access.
Byte write operations are qualified with the byte write enable
(BWE) and byte write select (BWX) inputs. A global write enable
(GW) overrides all byte write inputs and writes data to all four
bytes. All writes are simplified with on-chip synchronous
self-timed write circuitry.
Three synchronous chip selects (CE1, CE2, CE3[3]) and an
asynchronous output enable (OE) provide for easy bank
selection and output tristate control. ADSP is ignored if CE1 is
HIGH.
Single Read Accesses
This access is initiated when the following conditions are
satisfied at clock rise: (1) ADSP or ADSC is asserted LOW,
(2) CE1, CE2, CE3[3] are all asserted active, and (3) the write
signals (GW, BWE) are all deasserted HIGH. ADSP is ignored if
CE1 is HIGH. The address presented to the address inputs (A)
is stored into the address advancement logic and the address
register while being presented to the memory array. The
corresponding data is allowed to propagate to the input of the
output registers. At the rising edge of the next clock, the data is
allowed to propagate through the output register and on the data
bus within 3.0 ns (200 MHz device) if OE is active LOW. The only
exception occurs when the SRAM is emerging from a deselected
state to a selected state, its outputs are always tristated during
the first cycle of the access. After the first cycle of the access,
the outputs are controlled by the OE signal. Consecutive single
read cycles are supported. After the SRAM is deselected at clock
rise by the chip select and either ADSP or ADSC signals, its
output tristates immediately.
Single Write Accesses Initiated by ADSP
This access is initiated when both of the following conditions are
satisfied at clock rise: (1) ADSP is asserted LOW and (2) CE1,
CE2, CE3[3] are all asserted active. The address presented to A
is loaded into the address register and the address advancement
logic while being delivered to the memory array. The write signals
(GW, BWE, and BWX) and ADV inputs are ignored during this
first cycle.
ADSP-triggered write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQs inputs is written into the
corresponding address location in the memory array. If GW is
HIGH, then the write operation is controlled by BWE and BWX
signals. The CY7C1360C/CY7C1362C provides byte write
capability that is described in the Write Cycle Descriptions table.
Asserting the byte write enable input (BWE) with the selected
byte write (BWX) input, will selectively write to only the desired
bytes. Bytes not selected during a byte write operation remain
unaltered. A synchronous self-timed write mechanism has been
provided to simplify the write operations.
Because the CY7C1360C/CY7C1362C is a common I/O device,
the output enable (OE) must be deasserted HIGH before
presenting data to the DQs inputs. Doing so tristates the output
drivers. As a safety precaution, DQs are automatically tristated
whenever a Write cycle is detected, regardless of the state of OE.
Note
3. CE3 is for A version of TQFP (3 Chip Enable option) and 165-ball FBGA package only. 119-ball BGA is offered only in 2 Chip Enable.
Document Number: 38-05540 Rev. *T
Page 9 of 38
CY7C1360C
CY7C1362C
Single Write Accesses Initiated by ADSC
Sleep Mode
ADSC write accesses are initiated when the following conditions
are satisfied: (1) ADSC is asserted LOW, (2) ADSP is deasserted
HIGH, (3) CE1, CE2, CE3[4] are all asserted active, and (4) the
appropriate combination of the write inputs (GW, BWE, and
BWX) are asserted active to conduct a write to the desired
byte(s). ADSC-triggered write accesses require a single clock
cycle to complete. The address presented to A is loaded into the
address register and the address advancement logic while being
delivered to the memory array. The ADV input is ignored during
this cycle. If a global write is conducted, the data presented to
the DQs is written into the corresponding address location in the
memory core. If a byte write is conducted, only the selected bytes
are written. Bytes not selected during a byte write operation
remains unaltered. A synchronous self-timed write mechanism
has been provided to simplify the write operations.
The ZZ input pin is an asynchronous input. Asserting ZZ places
the SRAM in a power conservation ‘sleep’ mode. Two clock
cycles are required to enter into or exit from this ‘sleep’ mode.
While in this mode, data integrity is guaranteed. Accesses
pending when entering the ‘sleep’ mode are not considered valid
nor is the completion of the operation guaranteed. The device
must be deselected prior to entering the ‘sleep’ mode. CE1, CE2,
CE3[4], ADSP, and ADSC must remain inactive for the duration
of tZZREC after the ZZ input returns LOW.
Interleaved Burst Address Table
(MODE = Floating or VDD)
Because the CY7C1360C/CY7C1362C is a common I/O device,
the output enable (OE) must be deasserted HIGH before
presenting data to the DQs inputs. Doing so tristates the output
drivers. As a safety precaution, DQs are automatically tristated
whenever a write cycle is detected, regardless of the state of OE.
Burst Sequences
The CY7C1360C/CY7C1362C provides a two-bit wraparound
counter, fed by A1:A0, that implements either an interleaved or
linear burst sequence. The interleaved burst sequence is
designed specifically to support Intel Pentium applications. The
linear burst sequence is designed to support processors that
follow a linear burst sequence. The burst sequence is user
selectable through the MODE input.
First
Address
A1:A0
Second
Address
A1:A0
Third
Address
A1:A0
Fourth
Address
A1:A0
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
Linear Burst Address Table
(MODE = GND)
Asserting ADV LOW at clock rise automatically increments the
burst counter to the next address in the burst sequence. Both
read and write burst operations are supported.
First
Address
A1:A0
Second
Address
A1:A0
Third
Address
A1:A0
Fourth
Address
A1:A0
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
ZZ Mode Electrical Characteristics
Parameter
Description
IDDZZ
Sleep mode standby current
Test Conditions
ZZ > VDD– 0.2 V
tZZS
Device operation to ZZ
ZZ > VDD – 0.2 V
tZZREC
ZZ recovery time
ZZ < 0.2 V
tZZI
ZZ active to sleep current
tRZZI
ZZ inactive to exit sleep current
Min
Max
Unit
–
50
mA
–
2tCYC
ns
2tCYC
–
ns
This parameter is sampled
–
2tCYC
ns
This parameter is sampled
0
–
ns
Note
4. CE3 is for A version of 100-pin TQFP (3 Chip Enable option) and 165-ball FBGA package only. 119-ball BGA is offered only in 2 Chip Enable.
Document Number: 38-05540 Rev. *T
Page 10 of 38
CY7C1360C
CY7C1362C
Truth Table
The Truth Table for CY7C1360C and CY7C1362C follows. [5, 6, 7, 8, 9, 10]
Operation
Address Used CE1 CE2 CE3 ZZ ADSP ADSC ADV WRITE OE CLK
DQ
Deselect cycle, power-down
None
H
X
X
L
X
L
X
X
X
L–H Tri-state
Deselect cycle, power-down
None
L
L
X
L
L
X
X
X
X
L–H Tri-state
Deselect cycle, power-down
None
L
X
H
L
L
X
X
X
X
L–H Tri-state
Deselect cycle, power-down
None
L
L
X
L
H
L
X
X
X
L–H Tri-state
Deselect cycle, power-down
None
L
X
H
L
H
L
X
X
X
L–H Tri-state
Sleep mode, power-down
None
X
X
X
H
X
X
X
X
X
X
Tri-state
READ cycle, begin burst
External
L
H
L
L
L
X
X
X
L
L–H
Q
READ cycle, begin burst
External
L
H
L
L
L
X
X
X
H
L–H Tri-state
WRITE cycle, begin burst
External
L
H
L
L
H
L
X
L
X
L–H
D
READ cycle, begin burst
External
L
H
L
L
H
L
X
H
L
L–H
Q
READ cycle, begin burst
External
L
H
L
L
H
L
X
H
H
L–H Tri-state
READ cycle, continue burst
Next
X
X
X
L
H
H
L
H
L
L–H
READ cycle, continue burst
Next
X
X
X
L
H
H
L
H
H
L–H Tri-state
READ cycle, continue burst
Next
H
X
X
L
X
H
L
H
L
L–H
READ cycle, continue burst
Next
H
X
X
L
X
H
L
H
H
L–H Tri-state
WRITE cycle, continue burst
Next
X
X
X
L
H
H
L
L
X
L–H
D
WRITE cycle, continue burst
Next
H
X
X
L
X
H
L
L
X
L–H
D
READ cycle, suspend burst
Current
X
X
X
L
H
H
H
H
L
L–H
Q
READ cycle, suspend burst
Current
X
X
X
L
H
H
H
H
H
L–H Tri-state
READ cycle, suspend burst
Current
H
X
X
L
X
H
H
H
L
L–H
READ cycle, suspend burst
Current
H
X
X
L
X
H
H
H
H
L–H Tri-state
WRITE cycle, suspend burst
Current
X
X
X
L
H
H
H
L
X
L–H
D
WRITE cycle, suspend burst
Current
H
X
X
L
X
H
H
L
X
L–H
D
Q
Q
Q
Notes
5. X = “Don't Care.” H = Logic HIGH, L = Logic LOW.
6. WRITE = L when any one or more byte write enable signals and BWE = L or GW = L. WRITE = H when all byte write enable signals, BWE, GW = H.
7. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.
8. CE1, CE2, and CE3 are available only in the TQFP package. BGA package has only two chip selects CE1 and CE2.
9. The SRAM always initiates a read cycle when ADSP is asserted, regardless of the state of GW, BWE, or BWX. Writes may occur only on subsequent clocks after the
ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the Write cycle to allow the outputs to tri-state. OE is a don't care for
the remainder of the write cycle.
10. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle all data bits are tri-State when OE is inactive
or when the device is deselected, and all data bits behave as output when OE is active (LOW).
Document Number: 38-05540 Rev. *T
Page 11 of 38
CY7C1360C
CY7C1362C
Partial Truth Table for Read/Write
The Partial Truth Table for Read/Write for CY7C1360C follows. [11, 12]
Function (CY7C1360C)
GW
BWE
BWD
BWC
BWB
BWA
Read
H
H
X
X
X
X
Read
H
L
H
H
H
H
Write byte A – (DQA and DQPA)
H
L
H
H
H
L
Write byte B – (DQB and DQPB)
H
L
H
H
L
H
Write bytes B, A
H
L
H
H
L
L
Write byte C – (DQC and DQPC)
H
L
H
L
H
H
Write bytes C, A
H
L
H
L
H
L
Write bytes C, B
H
L
H
L
L
H
Write bytes C, B, A
H
L
H
L
L
L
Write byte D – (DQD and DQPD)
H
L
L
H
H
H
Write bytes D, A
H
L
L
H
H
L
Write bytes D, B
H
L
L
H
L
H
Write bytes D, B, A
H
L
L
H
L
L
Write bytes D, C
H
L
L
L
H
H
Write bytes D, C, A
H
L
L
L
H
L
Write bytes D, C, B
H
L
L
L
L
H
Write all bytes
H
L
L
L
L
L
Write all bytes
L
X
X
X
X
X
Partial Truth Table for Read/Write
The Partial Truth Table for Read/Write for CY7C1362C follows. [11, 12]
Function (CY7C1362C)
GW
BWE
BWB
BWA
Read
H
H
X
X
Read
H
L
H
H
Write byte A – (DQA and DQPA)
H
L
H
L
Write byte B – (DQB and DQPB)
H
L
L
H
Write bytes B, A
H
L
L
L
Write all bytes
H
L
L
L
Write all bytes
L
X
X
X
Notes
11. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.
12. Table only lists a partial listing of the byte write combinations. Any combination of BWX is valid. Appropriate write will be done based on which byte write is active.
Document Number: 38-05540 Rev. *T
Page 12 of 38
CY7C1360C
CY7C1362C
IEEE 1149.1 Serial Boundary Scan (JTAG)
The CY7C1360C incorporates a serial boundary scan test
access port (TAP) in the BGA package only. The TQFP package
does not offer this functionality. This part operates in accordance
with IEEE Standard 1149.1-1900, but does not have the set of
functions required for full 1149.1 compliance. These functions
from the IEEE specification are excluded because their inclusion
places an added delay in the critical speed path of the SRAM.
Note that the TAP controller functions in a manner that does not
conflict with the operation of other devices using 1149.1 fully
compliant TAPs. The TAP operates using JEDEC-standard 3.3 V
or 2.5 V I/O logic levels.
The CY7C1360C contains a TAP controller, instruction register,
boundary scan register, bypass register, and ID register.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are
internally pulled up and may be unconnected. They may
alternately be connected to VDD through a pull-up resistor. TDO
should be left unconnected. Upon power-up, the device comes
up in a reset state which does not interfere with the operation of
the device.
Test Access Port (TAP)
At power-up, the TAP is reset internally to ensure that TDO
comes up in a high Z state.
TAP Registers
Registers are connected between the TDI and TDO balls and
enable data to be scanned into and out of the SRAM test circuitry.
Only one register can be selected at a time through the
instruction register. Data is serially loaded into the TDI ball on the
rising edge of TCK. Data is output on the TDO ball on the falling
edge of TCK.
Instruction Register
Three-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the TDI
and TDO balls as shown in the TAP Controller Block Diagram on
page 16. Upon power-up, the instruction register is loaded with
the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state as described
in the previous section.
When the TAP controller is in the Capture-IR state, the two least
significant bits are loaded with a binary “01” pattern to enable
fault isolation of the board-level serial test data path.
Bypass Register
The test clock is used only with the TAP controller. All inputs are
captured on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between the
TDI and TDO balls. This enables data to be shifted through the
SRAM with minimal delay. The bypass register is set LOW (VSS)
when the BYPASS instruction is executed.
Test Mode Select (TMS)
Boundary Scan Register
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. It is allowable to leave
this ball unconnected if the TAP is not used. The ball is pulled up
internally, resulting in a logic HIGH level.
The boundary scan register is connected to all the input and
bidirectional balls on the SRAM.
Test Clock (TCK)
Test Data-In (TDI)
The TDI ball is used to serially input information into the registers
and can be connected to the input of any of the registers. The
register between TDI and TDO is chosen by the instruction that
is loaded into the TAP instruction register. For information on
loading the instruction register, see TAP Controller State
Diagram on page 15. TDI is internally pulled up and can be
unconnected if the TAP is unused in an application. TDI is
connected to the most significant bit (MSB) of any register.
The boundary scan register is loaded with the contents of the
RAM I/O ring when the TAP controller is in the Capture-DR state
and is then placed between the TDI and TDO balls when the
controller is moved to the Shift-DR state. The EXTEST,
SAMPLE/PRELOAD and SAMPLE Z instructions can be used to
capture the contents of the I/O ring.
The Boundary Scan Order on page 20 and Boundary Scan Order
on page 21 show the order in which the bits are connected. Each
bit corresponds to one of the bumps on the SRAM package. The
MSB of the register is connected to TDI and the LSB is
connected to TDO.
Test Data-Out (TDO)
Identification (ID) Register
The TDO output ball is used to serially clock data-out from the
registers. The output is active depending upon the current state
of the TAP state machine (see Instruction Codes on page 19).
The output changes on the falling edge of TCK. TDO is
connected to the least significant bit (LSB) of any register.
The ID register is loaded with a vendor-specific, 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired into
the SRAM and can be shifted out when the TAP controller is in
the Shift-DR state. The ID register has a vendor code and other
information described in Identification Register Definitions on
page 19.
Performing a TAP Reset
A RESET is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This RESET does not affect the operation of the
SRAM and may be performed while the SRAM is operating.
Document Number: 38-05540 Rev. *T
Page 13 of 38
CY7C1360C
CY7C1362C
TAP Instruction Set
Overview
Eight different instructions are possible with the three-bit
instruction register. All combinations are listed in Instruction
Codes on page 19. Three of these instructions are listed as
RESERVED and should not be used. The other five instructions
are described in detail in this section.
The TAP controller used in this SRAM is not fully compliant to the
1149.1 convention because some of the mandatory 1149.1
instructions are not fully implemented.
The TAP controller cannot be used to load address data or
control signals into the SRAM and cannot preload the I/O buffers.
The SRAM does not implement the 1149.1 commands EXTEST
or INTEST or the PRELOAD portion of SAMPLE/PRELOAD;
rather, it performs a capture of the I/O ring when these
instructions are executed.
Instructions are loaded into the TAP controller during the Shift-IR
state when the instruction register is placed between TDI and
TDO. During this state, instructions are shifted through the
instruction register through the TDI and TDO balls. To execute
the instruction once it is shifted in, the TAP controller needs to be
moved into the Update-IR state.
EXTEST
EXTEST is a mandatory 1149.1 instruction which is to be
executed whenever the instruction register is loaded with all 0s.
EXTEST is not implemented in this SRAM TAP controller, and
therefore this device is not compliant to 1149.1. The TAP
controller does recognize an all-0 instruction.
When an EXTEST instruction is loaded into the instruction
register, the SRAM responds as if a SAMPLE/PRELOAD
instruction has been loaded. There is one difference between the
two instructions. Unlike the SAMPLE/PRELOAD instruction,
EXTEST places the SRAM outputs in a high Z state.
controller is in a Shift-DR state. It also places all SRAM outputs
into a high Z state.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the inputs and output pins is
captured in the boundary scan register.
The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because there
is a large difference in the clock frequencies, it is possible that
during the Capture-DR state, an input or output will undergo a
transition. The TAP may then try to capture a signal while in
transition (metastable state). This will not harm the device, but
there is no guarantee as to the value that will be captured.
Repeatable results may not be possible.
To guarantee that the boundary scan register will capture the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller’s capture setup plus hold
times (tCS and tCH). The SRAM clock input might not be captured
correctly if there is no way in a design to stop (or slow) the clock
during a SAMPLE/PRELOAD instruction. If this is an issue, it is
still possible to capture all other signals and simply ignore the
value of the CK and CK captured in the boundary scan register.
After the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO pins.
PRELOAD enables an initial data pattern to be placed at the
latched parallel outputs of the boundary scan register cells prior
to the selection of another boundary scan test operation.
The shifting of data for the SAMPLE and PRELOAD phases can
occur concurrently when required - that is, while data captured
is shifted out, the preloaded data can be shifted in.
IDCODE
BYPASS
The IDCODE instruction causes a vendor-specific, 32-bit code
to be loaded into the instruction register. It also places the
instruction register between the TDI and TDO balls and allows
the IDCODE to be shifted out of the device when the TAP
controller enters the Shift-DR state.
When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO balls. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
The IDCODE instruction is loaded into the instruction register
upon power up or whenever the TAP controller is given a test
logic reset state.
SAMPLE Z
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
The SAMPLE Z instruction causes the boundary scan register to
be connected between the TDI and TDO balls when the TAP
Document Number: 38-05540 Rev. *T
Page 14 of 38
CY7C1360C
CY7C1362C
TAP Controller State Diagram
1
TEST-LOGIC
RESET
0
0
RUN-TEST/
IDLE
1
SELECT
DR-SCA N
1
SELECT
IR-SCAN
0
1
0
1
CAPTURE-DR
CAPTURE-IR
0
0
SHIFT-DR
0
SHIFT-IR
1
1
EXIT1-IR
0
1
0
PAUSE-DR
0
PAUSE-IR
1
0
1
EXIT2-DR
0
EXIT2-IR
1
1
UPDATE-DR
1
0
1
EXIT1-DR
0
1
0
UPDATE-IR
1
0
The 0/1 next to each state represents the value of TMS at the rising edge of TCK.
Document Number: 38-05540 Rev. *T
Page 15 of 38
CY7C1360C
CY7C1362C
TAP Controller Block Diagram
0
Bypass Register
2 1 0
Selection
Circuitry
TDI
Selection
Circuitry
Instruction Register
TDO
31 30 29 . . . 2 1 0
Identification Register
x . . . . . 2 1 0
Boundary Scan Register
TCK
TAP CONTROLLER
TM S
TAP Timing
1
2
Test Clock
(TCK )
3
t TH
t TM SS
t TM SH
t TDIS
t TDIH
t
TL
4
5
6
t CY C
Test M ode Select
(TM S)
Test Data-In
(TDI)
t TDOV
t TDOX
Test Data-Out
(TDO)
DON’T CA RE
Document Number: 38-05540 Rev. *T
UNDEFINED
Page 16 of 38
CY7C1360C
CY7C1362C
TAP AC Switching Characteristics
Over the Operating Range
Parameter [13, 14]
Description
Min
Max
Unit
50
–
ns
Clock
tTCYC
TCK clock cycle time
tTF
TCK clock frequency
–
20
MHz
tTH
TCK clock HIGH time
20
–
ns
tTL
TCK clock LOW time
20
–
ns
tTDOV
TCK clock LOW to TDO valid
–
10
ns
tTDOX
TCK clock LOW to TDO invalid
0
–
ns
tTMSS
TMS setup to TCK clock rise
5
–
ns
tTDIS
TDI setup to TCK clock rise
5
–
ns
tCS
Capture setup to TCK rise
5
–
ns
tTMSH
TMS hold after TCK clock rise
5
–
ns
tTDIH
TDI hold after clock rise
5
–
ns
tCH
Capture hold after clock rise
5
–
ns
Output Times
Setup Times
Hold Times
3.3 V TAP AC Test Conditions
2.5 V TAP AC Test Conditions
Input pulse levels ...............................................VSS to 3.3 V
Input rise and fall times ...................................................1 ns
Input pulse levels ............................................... VSS to 2.5 V
Input rise and fall time ....................................................1 ns
Input timing reference levels ......................................... 1.5 V
Input timing reference levels ....................................... 1.25 V
Output reference levels ................................................ 1.5 V
Output reference levels .............................................. 1.25 V
Test load termination supply voltage ............................ 1.5 V
Test load termination supply voltage .......................... 1.25 V
3.3 V TAP AC Output Load Equivalent
2.5 V TAP AC Output Load Equivalent
1.5V
1.25V
50Ω
TDO
50Ω
TDO
Z O= 50Ω
20pF
Z O= 50Ω
20pF
Notes
13. tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.
14. Test conditions are specified using the load in TAP AC test Conditions. tR/tF = 1 ns.
Document Number: 38-05540 Rev. *T
Page 17 of 38
CY7C1360C
CY7C1362C
TAP DC Electrical Characteristics and Operating Conditions
(0 °C < TA < +70 °C; VDD = 3.3 V ± 0.165 V unless otherwise noted)
Parameter [15]
VOH1
Description
Output HIGH voltage
Min
Max
Unit
IOH = –4.0 mA
Conditions
VDDQ = 3.3 V
2.4
–
V
IOH = –1.0 mA
VDDQ = 2.5 V
2.0
–
V
–
V
VOH2
Output HIGH voltage
IOH = –100 µA
VDDQ = 3.3 V
2.9
VDDQ = 2.5 V
2.1
–
V
VOL1
Output LOW voltage
IOL = 8.0 mA
VDDQ = 3.3 V
–
0.4
V
IOL = 8.0 mA
VDDQ = 2.5 V
–
0.4
V
IOL = 100 µA
VDDQ = 3.3 V
–
0.2
V
VOL2
Output LOW voltage
VIH
Input HIGH voltage
VIL
Input LOW voltage
IX
Input load current
GND < VIN < VDDQ
VDDQ = 2.5 V
–
0.2
V
VDDQ = 3.3 V
2.0
VDD + 0.3
V
VDDQ = 2.5 V
1.7
VDD + 0.3
V
VDDQ = 3.3 V
–0.5
0.7
V
VDDQ = 2.5 V
–0.3
0.7
V
–5
5
µA
Note
15. All voltages referenced to VSS (GND).
Document Number: 38-05540 Rev. *T
Page 18 of 38
CY7C1360C
CY7C1362C
Identification Register Definitions
CY7C1360C
(256K × 36)
Instruction Field
Revision number (31:29)
000
Device depth (28:24) [16]
01011
Description
Describes the version number
Reserved for internal use
Device width (23:18) 119-ball BGA
101000
Defines memory type and architecture
Device width (23:18) 165-ball FBGA
000000
Defines memory type and architecture
100110
Defines width and density
Cypress device ID (17:12)
Cypress JEDEC ID code (11:1)
00000110100
ID register presence indicator (0)
1
Allows unique identification of SRAM vendor
Indicates the presence of an ID register
Scan Register Sizes
Register Name
Bit Size (× 36)
Instruction
3
Bypass
1
ID
32
Boundary scan order (119-ball BGA package)
71
Boundary scan order (165-ball FBGA package)
71
Instruction Codes
Code
Description
EXTEST
Instruction
000
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces
all SRAM outputs to high Z state.
IDCODE
001
Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operations.
SAMPLE Z
010
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces
all SRAM output drivers to a high Z state.
RESERVED
011
Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD
100
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Does
not affect SRAM operation.
RESERVED
101
Do Not Use: This instruction is reserved for future use.
RESERVED
110
Do Not Use: This instruction is reserved for future use.
BYPASS
111
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
Note
16. Bit #24 is “1” in the Register Definitions for both 2.5 V and 3.3 V versions of this device.
Document Number: 38-05540 Rev. *T
Page 19 of 38
CY7C1360C
CY7C1362C
Boundary Scan Order
165-ball FBGA
CY7C1360C (256K × 36)
Bit#
Ball ID
Signal Name
Bit#
Ball ID
Signal Name
1
B6
CLK
37
R6
A0
2
B7
GW
38
P6
A1
3
A7
BWE
39
R4
A
4
B8
OE
40
P4
A
5
A8
ADSC
41
R3
A
6
B9
ADSP
42
P3
A
7
A9
ADV
43
R1
MODE
8
B10
A
44
N1
DQPD
9
A10
A
45
L2
DQD
10
C11
DQPB
46
K2
DQD
11
E10
DQB
47
J2
DQD
12
F10
DQB
48
M2
DQD
13
G10
DQB
49
M1
DQD
14
D10
DQB
50
L1
DQD
15
D11
DQB
51
K1
DQD
16
E11
DQB
52
J1
DQD
17
F11
DQB
53
Internal
Internal
18
G11
DQB
54
G2
DQC
19
H11
ZZ
55
F2
DQC
20
J10
DQA
56
E2
DQC
21
K10
DQA
57
D2
DQC
22
L10
DQA
58
G1
DQC
23
M10
DQA
59
F1
DQC
24
J11
DQA
60
E1
DQC
25
K11
DQA
61
D1
DQC
26
L11
DQA
62
C1
DQPC
27
M11
DQA
63
B2
A
28
N11
DQPA
64
A2
A
29
R11
A
65
A3
CE1
30
R10
A
66
B3
CE2
31
P10
A
67
B4
BWD
32
R9
A
68
A4
BWC
33
P9
A
69
A5
BWB
34
R8
A
70
B5
BWA
71
A6
CE3
35
P8
A
36
P11
A
Document Number: 38-05540 Rev. *T
Page 20 of 38
CY7C1360C
CY7C1362C
Boundary Scan Order
119-ball BGA
CY7C1360C (256K × 36)
Bit#
Ball ID
Signal Name
Bit#
Ball ID
Signal Name
1
K4
CLK
37
P4
A0
2
H4
GW
38
N4
A1
3
M4
BWE
39
R6
A
4
F4
OE
40
T5
A
5
B4
ADSC
41
T3
A
6
A4
ADSP
42
R2
A
7
G4
ADV
43
R3
MODE
8
C3
A
44
P2
DQPD
9
B3
A
45
P1
DQD
10
D6
DQPB
46
L2
DQD
11
H7
DQB
47
K1
DQD
12
G6
DQB
48
N2
DQD
13
E6
DQB
49
N1
DQD
14
D7
DQB
50
M2
DQD
15
E7
DQB
51
L1
DQD
16
F6
DQB
52
K2
DQD
17
G7
DQB
53
Internal
Internal
18
H6
DQB
54
H1
DQC
19
T7
ZZ
55
G2
DQC
20
K7
DQA
56
E2
DQC
21
L6
DQA
57
D1
DQC
22
N6
DQA
58
H2
DQC
23
P7
DQA
59
G1
DQC
24
N7
DQA
60
F2
DQC
25
M6
DQA
61
E1
DQC
26
L7
DQA
62
D2
DQPC
27
K6
DQA
63
C2
A
28
P6
DQPA
64
A2
A
29
T4
A
65
E4
CE1
30
A3
A
66
B2
CE2
31
C5
A
67
L3
BWD
32
B5
A
68
G3
BWC
33
A5
A
69
G5
BWB
34
C6
A
70
L5
BWA
71
Internal
Internal
35
A6
A
36
B6
A
Document Number: 38-05540 Rev. *T
Page 21 of 38
CY7C1360C
CY7C1362C
Maximum Ratings
Operating Range
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Range
Ambient
Temperature
Storage temperature ................................ –65 °C to +150 °C
Commercial
0 °C to +70 °C
Ambient temperature with
power applied .......................................... –55 °C to +125 °C
Industrial
–40 °C to +85 °C
Supply voltage on VDD relative to GND .......–0.5 V to +4.6 V
Supply voltage on VDDQ relative to GND ...... –0.5 V to +VDD
DC voltage applied to outputs
in tri-state ..........................................–0.5 V to VDDQ + 0.5 V
DC input voltage ................................. –0.5 V to VDD + 0.5 V
Latch-up current .................................................... > 200 mA
VDDQ
3.3 V– 5 % / 2.5 V – 5% to
+ 10%
VDD
Neutron Soft Error Immunity
Parameter
Description
Test
Conditions Typ
Max*
Unit
LSBU
Logical
single-bit
upsets
25 °C
361
394
FIT/
Mb
LMBU
Logical
multi-bit
upsets
25 °C
0
0.01
FIT/
Mb
Single event
latch-up
85 °C
0
0.1
FIT/
Dev
Current into outputs (LOW) ........................................ 20 mA
Static discharge voltage
(per MIL-STD-883, method 3015) ......................... > 2001 V
VDD
SEL
* No LMBU or SEL events occurred during testing; this column represents a
statistical 2, 95% confidence limit calculation. For more details refer to Application
Note AN54908 “Accelerated Neutron SER Testing and Calculation of Terrestrial
Failure Rates”.
Electrical Characteristics
Over the Operating Range
Parameter [17, 18]
Description
Min
Max
Unit
3.135
3.6
V
for 3.3 V I/O
3.135
VDD
V
for 2.5 V I/O
2.375
2.625
V
for 3.3 V I/O, IOH = –4.0 mA
2.4
–
V
for 2.5 V I/O, IOH = –1.0 mA
2.0
–
V
for 3.3 V I/O, IOL = 8.0 mA
–
0.4
V
for 2.5 V I/O, IOL = 1.0 mA
–
0.4
V
for 3.3 V I/O
2.0
VDD + 0.3 V
V
for 2.5 V I/O
1.7
VDD + 0.3 V
V
for 3.3 V I/O
–0.3
0.8
V
for 2.5 V I/O
–0.3
0.7
V
Input leakage current except ZZ GND VI VDDQ
and MODE
–5
5
A
Input current of MODE
Input = VSS
–30
–
A
Input = VDD
–
5
A
Input current of ZZ
Input = VSS
–5
–
A
Input = VDD
–
30
A
GND VI VDDQ, output disabled
–5
5
A
VDD
Power supply voltage
VDDQ
I/O supply voltage
VOH
VOL
VIH
VIL
IX
IOZ
Output HIGH voltage
Output LOW voltage
[17]
Input HIGH voltage
[17]
Input LOW voltage
Output leakage current
Test Conditions
Notes
17. Overshoot: VIH(AC) < VDD + 1.5 V (Pulse width less than tCYC/2), undershoot: VIL(AC) > –2 V (Pulse width less than tCYC/2).
18. TPower-up: Assumes a linear ramp from 0 V to VDD(min) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
Document Number: 38-05540 Rev. *T
Page 22 of 38
CY7C1360C
CY7C1362C
Electrical Characteristics (continued)
Over the Operating Range
Parameter [17, 18]
Description
Test Conditions
VDD operating supply current
IDD
ISB1
Automatic CE power-down
current – TTL inputs
VDD = Max, IOUT = 0 mA,
f = fMAX = 1/tCYC
VDD = Max, device deselected,
VIN VIH or VIN VIL,
f = fMAX = 1/tCYC
Min
Max
Unit
5 ns cycle,
200 MHz
–
220
mA
6 ns cycle,
166 MHz
–
180
mA
5 ns cycle,
200 MHz
–
120
mA
6 ns cycle,
166 MHz
–
110
mA
ISB2
Automatic CE power-down
current – CMOS inputs
VDD = Max, device deselected, All speeds
VIN 0.3 V or VIN > VDDQ – 0.3 V,
f=0
–
40
mA
ISB3
Automatic CE power-down
current – CMOS inputs
VDD = Max, device deselected, or 5 ns cycle,
VIN 0.3 V or VIN > VDDQ – 0.3 V, 200 MHz
f = fMAX = 1/tCYC
6 ns cycle,
166 MHz
–
110
mA
–
100
mA
–
40
mA
ISB4
Automatic CE power-down
current – TTL inputs
VDD = Max, device deselected,
VIN VIH or VIN VIL, f = 0
All speeds
Capacitance
Parameter [19]
Description
CIN
Input capacitance
CCLK
Clock input capacitance
CI/O
Input/output capacitance
Test Conditions
TA = 25 °C, f = 1 MHz,
VDD = 3.3 V, VDDQ = 2.5 V
100-pin TQFP
Max
119-ball BGA
Max
165-ball FBGA
Max
Unit
5
5
5
pF
5
5
5
pF
5
7
7
pF
Test Conditions
100-pin TQFP
Package
119-ball BGA
Package
165-ball FBGA
Package
Unit
Test
conditions
follow
standard test methods and
procedures for measuring
thermal
impedance,
according to EIA/JESD51.
29.41
34.1
16.8
°C/W
6.13
14.0
3
°C/W
Thermal Resistance
Parameter [19]
Description
JA
Thermal resistance
(junction to ambient)
JC
Thermal resistance
(junction to case)
Note
19. Tested initially and after any design or process change that may affect these parameters.
Document Number: 38-05540 Rev. *T
Page 23 of 38
CY7C1360C
CY7C1362C
AC Test Loads and Waveforms
Figure 5. AC Test Loads and Waveforms
3.3 V I/O Test Load
R = 317
3.3 V
OUTPUT
OUTPUT
RL = 50
Z0 = 50
VT = 1.5 V
(a)
INCLUDING
JIG AND
SCOPE
OUTPUT
RL = 50
VT = 1.25 V
(a)
Document Number: 38-05540 Rev. *T
R = 351
10%
(c)
ALL INPUT PULSES
VDDQ
INCLUDING
JIG AND
SCOPE
1 ns
(b)
GND
5 pF
R =1538
(b)
90%
10%
90%
1 ns
R = 1667
2.5 V
Z0 = 50
GND
5 pF
2.5 V I/O Test Load
OUTPUT
ALL INPUT PULSES
VDDQ
10%
90%
10%
90%
1 ns
1 ns
(c)
Page 24 of 38
CY7C1360C
CY7C1362C
Switching Characteristics
Over the Operating Range
Parameter [20, 21]
tPOWER
Description
VDD(typical) to the first access [22]
-200
-166
Unit
Min
Max
Min
Max
1
–
1
–
ms
Clock
tCYC
Clock cycle time
5.0
–
6.0
–
ns
tCH
Clock HIGH
2.0
–
2.4
–
ns
tCL
Clock LOW
2.0
–
2.4
–
ns
Output Times
tCO
Data output valid after CLK rise
–
3.0
–
3.5
ns
tDOH
Data output hold after CLK rise
1.25
–
1.25
–
ns
1.25
–
1.25
–
ns
1.25
3.0
1.25
3.5
ns
–
3.0
–
3.5
ns
0
–
0
–
ns
–
3.0
–
3.5
ns
[23, 24, 25]
tCLZ
Clock to low Z
tCHZ
Clock to high Z [23, 24, 25]
tOEV
OE LOW to output valid
tOELZ
tOEHZ
OE LOW to output low Z
[23, 24, 25]
OE HIGH to output high Z
[23, 24, 25]
Set-up Times
tAS
Address setup before CLK rise
1.5
–
1.5
–
ns
tADS
ADSC, ADSP setup before CLK rise
1.5
–
1.5
–
ns
tADVS
ADV setup before CLK rise
1.5
–
1.5
–
ns
tWES
GW, BWE, BWX setup before CLK rise
1.5
–
1.5
–
ns
tDS
Data input setup before CLK rise
1.5
–
1.5
–
ns
tCES
Chip enable setup before CLK rise
1.5
–
1.5
–
ns
tAH
Address hold after CLK rise
0.5
–
0.5
–
ns
tADH
ADSP, ADSC hold after CLK rise
0.5
–
0.5
–
ns
tADVH
ADV hold after CLK rise
0.5
–
0.5
–
ns
tWEH
GW, BWE, BWX hold after CLK rise
0.5
–
0.5
–
ns
tDH
Data input hold after CLK rise
0.5
–
0.5
–
ns
tCEH
Chip enable hold after CLK rise
0.5
–
0.5
–
ns
Hold Times
Notes
20. Timing reference level is 1.5 V when VDDQ = 3.3 V and is 1.25 V when VDDQ = 2.5 V.
21. Test conditions shown in (a) of Figure 5 on page 24 unless otherwise noted.
22. This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD(minimum) initially before a read or write operation can
be initiated.
23. tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of Figure 5 on page 24. Transition is measured ± 200 mV from steady-state voltage.
24. At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data
bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve
high Z prior to low Z under the same system conditions.
25. This parameter is sampled and not 100% tested.
Document Number: 38-05540 Rev. *T
Page 25 of 38
CY7C1360C
CY7C1362C
Switching Waveforms
Figure 6. Read Cycle Timing [26]
t CYC
CLK
t
t
ADS
CH
t
CL
t
ADH
ADSP
t ADS
tADH
ADSC
t AS
tAH
A1
ADDRESS
A2
t WES
A3
Burst continued with
new base address
tWEH
GW, BWE,
BWx
t CES
Deselect
cycle
tCEH
CE
t ADVS
tADVH
ADV
ADV
suspends
burst.
OE
t OEHZ
t CLZ
Data Out (Q)
High-Z
Q(A1)
t OEV
t CO
t OELZ
t DOH
Q(A2)
t CHZ
Q(A2 + 1)
Q(A2 + 2)
Q(A2 + 3)
Q(A2)
Q(A2 + 1)
t CO
Burst wraps around
to its initial state
Single READ
BURST READ
DON’T CARE
UNDEFINED
Note
26. On this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
Document Number: 38-05540 Rev. *T
Page 26 of 38
CY7C1360C
CY7C1362C
Switching Waveforms (continued)
Figure 7. Write Cycle Timing [27, 28]
t CYC
CLK
tCH
t ADS
tCL
tADH
ADSP
t ADS
ADSC extends burst
tADH
t ADS
tADH
ADSC
t AS
tAH
A1
ADDRESS
A2
A3
Byte write signals are
ignored for first cycle when
ADSP initiates burst
t WES tWEH
BWE,
BW X
t WES tWEH
GW
t CES
tCEH
CE
t
t
ADVS ADVH
ADV
ADV suspends burst
OE
t DS
Data In (D)
High-Z
t
OEHZ
tDH
D(A1)
D(A2)
D(A2 + 1)
D(A2 + 1)
D(A2 + 2)
D(A2 + 3)
D(A3)
D(A3 + 1)
D(A3 + 2)
Data Out (Q)
BURST READ
Single WRITE
BURST WRITE
DON’T CARE
Extended BURST WRITE
UNDEFINED
Notes
27. On this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
28. Full width write can be initiated by either GW LOW; or by GW HIGH, BWE LOW and BWX LOW.
Document Number: 38-05540 Rev. *T
Page 27 of 38
CY7C1360C
CY7C1362C
Switching Waveforms (continued)
Figure 8. Read/Write Cycle Timing [29, 30, 31]
tCYC
CLK
tCL
tCH
t ADS
tADH
t AS
tAH
ADSP
ADSC
ADDRESS
A1
A2
A3
A4
A5
A6
t WES tWEH
BWE,
BW X
t CES
tCEH
CE
ADV
OE
t DS
tCO
tDH
t OELZ
Data In (D)
High-Z
tCLZ
Data Out (Q)
High-Z
Q(A1)
Back-to-Back READs
tOEHZ
D(A5)
D(A3)
Q(A2)
Q(A4)
Single WRITE
Q(A4+1)
BURST READ
DON’T CARE
Q(A4+2)
D(A6)
Q(A4+3)
Back-to-Back
WRITEs
UNDEFINED
Notes
29. On this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
30. The data bus (Q) remains in high Z following a write cycle, unless a new read access is initiated by ADSP or ADSC.
31. GW is HIGH.
Document Number: 38-05540 Rev. *T
Page 28 of 38
CY7C1360C
CY7C1362C
Switching Waveforms (continued)
Figure 9. ZZ Mode Timing [32, 33]
CLK
t ZZ
ZZ
I
t ZZREC
t ZZI
SUPPLY
I DDZZ
t RZZI
ALL INPUTS
DESELECT or READ Only
(except ZZ)
Outputs (Q)
High-Z
DON’T CARE
Notes
32. Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device.
33. DQs are in high Z when exiting ZZ sleep mode.
Document Number: 38-05540 Rev. *T
Page 29 of 38
CY7C1360C
CY7C1362C
Ordering Information
The table below contains only the parts that are currently available. If you don’t see what you are looking for, please contact your
local sales representative. For more information, visit the Cypress website at www.cypress.com and refer to the product summary
page at http://www.cypress.com/products
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives and distributors. To find the
office closest to you, visit us at http://www.cypress.com/go/datasheet/offices
Speed
(MHz)
166
Package
Diagram
Ordering Code
Part and Package Type
CY7C1360C-166AXC
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free (3 chip enable)
CY7C1360C-166AJXC
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free (2 chip enable)
Operating
Range
Commercial
CY7C1362C-166AJXC
200
CY7C1360C-166BZC
51-85180 165-ball FBGA (13 × 15 × 1.4 mm)
CY7C1360C-166AXI
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free (3 chip enable)
Industrial
CY7C1360C-200AXC
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free (3 chip enable)
Commercial
CY7C1360C-200AJXC
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free (2 chip enable)
CY7C1360C-200BGC
51-85115 119-ball BGA (14 × 22 × 2.4 mm)
Ordering Code Definitions
CY
7
C 13XX C - XXX XX
X
X
Temperature range: X = C or I
C = Commercial; I = Industrial
Pb-free
Package Type: XX = A or AJ or BZ or BG
A = 100-pin TQFP (3 chip enable)
AJ = 100-pin TQFP (2 chip enable)
BZ = 165-ball FBGA
BG = 119-ball BGA
Speed Grade: XXX = 166 MHz or 200 MHz
Process Technology: C 90 nm
Part Identifier: 13XX = 1360 or 1362
1360 = SCD, 256K × 36 (9Mb)
1362 = SCD, 512K × 18 (9Mb)
Technology Code: C = CMOS
Marketing Code: 7 = SRAM
Company ID: CY = Cypress
Document Number: 38-05540 Rev. *T
Page 30 of 38
CY7C1360C
CY7C1362C
Package Diagrams
Figure 10. 100-pin TQFP (14 × 20 × 1.4 mm) A100RA Package Outline, 51-85050
ș2
ș1
ș
SYMBOL
DIMENSIONS
MIN. NOM. MAX.
A
1.60
0.15
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. BODY LENGTH DIMENSION DOES NOT
A1
0.05
A2
1.35 1.40 1.45
D
15.80 16.00 16.20
MOLD PROTRUSION/END FLASH SHALL
D1
13.90 14.00 14.10
E
21.80 22.00 22.20
NOT EXCEED 0.0098 in (0.25 mm) PER SIDE.
BODY LENGTH DIMENSIONS ARE MAX PLASTIC
E1
19.90 20.00 20.10
R1
0.08
0.20
R2
0.08
0.20
ș
0°
7°
ș1
0°
ș2
11°
13°
12°
b
0.22 0.30 0.38
L
0.45 0.60 0.75
L2
L3
e
BODY SIZE INCLUDING MOLD MISMATCH.
3. JEDEC SPECIFICATION NO. REF: MS-026.
0.20
c
L1
INCLUDE MOLD PROTRUSION/END FLASH.
1.00 REF
0.25 BSC
0.20
0.65 TYP
51-85050 *G
Document Number: 38-05540 Rev. *T
Page 31 of 38
CY7C1360C
CY7C1362C
Package Diagrams (continued)
Figure 11. 119-ball PBGA (14 × 22 × 2.4 mm) BG119 Package Outline, 51-85115
51-85115 *D
Document Number: 38-05540 Rev. *T
Page 32 of 38
CY7C1360C
CY7C1362C
Package Diagrams (continued)
Figure 12. 165-ball FBGA (13 × 15 × 1.4 mm) BB165D/BW165D (0.5 Ball Diameter) Package Outline, 51-85180
51-85180 *G
Document Number: 38-05540 Rev. *T
Page 33 of 38
CY7C1360C
CY7C1362C
Acronyms
Acronym
Document Conventions
Description
Units of Measure
BGA
Ball Grid Array
CE
Chip Enable
°C
degree Celsius
CMOS
Complementary Metal Oxide Semiconductor
MHz
megahertz
EIA
Electronic Industries Alliance
µA
microampere
FBGA
Fine-Pitch Ball Grid Array
mA
milliampere
I/O
Input/Output
mm
millimeter
JEDEC
Joint Electron Devices Engineering Council
ms
millisecond
JTAG
Joint Test Action Group
mV
millivolt
LMBU
Logical Multi-Bit Upsets
ns
nanosecond
LSB
Least Significant Bit
LSBU
Logical Single-Bit Upsets
MSB
Most Significant Bit
OE
Output Enable
PBGA
Plastic Ball Grid Array
SEL
Single Event Latch-up
SRAM
Static Random Access Memory
TAP
Test Access Port
TCK
Test Clock
TDI
Test Data-In
TDO
Test Data-Out
TMS
Test Mode Select
TQFP
Thin Quad Flat Pack
TTL
Transistor-Transistor Logic
Document Number: 38-05540 Rev. *T
Symbol
Unit of Measure
ohm
%
percent
pF
picofarad
V
volt
W
watt
Page 34 of 38
CY7C1360C
CY7C1362C
Document History Page
Document Title: CY7C1360C/CY7C1362C, 9-Mbit (256K × 36/512K × 18) Pipelined SRAM
Document Number: 38-05540
Rev.
ECN No.
Orig. of
Change
Submission
Date
**
241690
RKF
07/12/2004
New data sheet.
*A
278130
RKF
10/15/2004
Updated Boundary Scan Order (Changed to match the B rev of these devices).
Updated Boundary Scan Order (Changed to match the B rev of these devices).
Updated Ordering Information (Updated part numbers (Changed TQFP pkg to
Lead-free TQFP); added comment of Lead-free BG and BZ packages
availability).
*B
248929
VBL
11/01/2004
Updated Functional Overview (Updated ZZ Mode Electrical Characteristics
(Changed maximum value of IDDZZ parameter from 35 mA to 50 mA)).
Updated Electrical Characteristics:
Changed maximum value of ISB1 and ISB3 parameter from 50 mA to the values
as follows:
ISB1: 225 MHz -> 130 mA, 200 MHz -> 120 mA, 166 MHz -> 110 mA
ISB3: 225 MHz -> 120 mA, 200 MHz -> 110 mA, 166 MHz -> 100 mA.
Updated Ordering Information (Updated part numbers).
*C
323636
PCI
02/22/2005
Updated Features (Changed frequency from 225 MHz to 250 MHz).
Updated Selection Guide (Changed frequency from 225 MHz to 250 MHz).
Updated Pin Configurations (Modified address expansion as per JEDEC
Standard).
Updated Electrical Characteristics (Changed frequency from 225 MHz to
250 MHz).
Updated Thermal Resistance (Changed value of JA and JC parameters for
100-pin TQFP Package from 25 C/W and 9 C/W to 29.41 C/W and
6.13 C/W respectively; changed value of JA and JC parameters for 119-ball
BGA Package from 25 C/W and 6 C/W to 34.1 C/W and 14.0 C/W
respectively; changed value of JA and JC parameters for 165-ball FBGA
Package from 27 C/W and 6 C/W to 16.8 C/W and 3.0 C/W respectively).
Updated Switching Characteristics (Changed frequency from 225 MHz to
250 MHz; replaced minimum value of tCYC parameter from 4.4 ns to 4.0 ns for
250 MHz frequency).
Updated Ordering Information (No change in part numbers; removed comment
of Lead-free BG and BZ packages availability).
*D
332879
PCI
03/13/2005
Updated Selection Guide (Unshaded 200 and 166 MHz frequency
information).
Updated Pin Definitions (Added Address Expansion pins).
Updated Identification Register Definitions (Splitted Device Width (23:18) into
two rows; retained the same values for 165-ball FBGA, changed Device Width
(23:18) for 119-ball BGA from 000000 to 101000).
Updated Electrical Characteristics (Updated Test Conditions of VOH, VOL
parameters; unshaded 200 and 166 MHz frequency information).
Updated Switching Characteristics (Unshaded 200 and 166 MHz frequency
information).
Updated Ordering Information (Updated part numbers).
*E
357258
PCI
05/05/2005
Changed status from Preliminary to Final.
Updated Selection Guide (Unshaded 250 MHz frequency information).
Updated Electrical Characteristics (Unshaded 250 MHz frequency information,
changed maximum value of ISB2 parameter from 30 to 40 mA).
Updated Switching Characteristics (Unshaded 250 MHz frequency
information)
Updated Ordering Information (Updated part numbers).
*F
377095
PCI
06/10/2005
Updated Electrical Characteristics (Updated Note 18 (Modified test condition
from VDDQ < VDD to VDDQ VDD)).
Document Number: 38-05540 Rev. *T
Description of Change
Page 35 of 38
CY7C1360C
CY7C1362C
Document History Page (continued)
Document Title: CY7C1360C/CY7C1362C, 9-Mbit (256K × 36/512K × 18) Pipelined SRAM
Document Number: 38-05540
Rev.
ECN No.
Orig. of
Change
Submission
Date
Description of Change
*G
408298
RXU
11/16/2005
Changed address of Cypress Semiconductor Corporation from “3901 North
First Street” to “198 Champion Court”.
Updated Electrical Characteristics (Changed “Input Load Current except ZZ
and MODE” to “Input Leakage Current except ZZ and MODE” in the description
of IX parameter).
Updated Ordering Information (Updated part numbers; replaced Package
Name column with Package Diagram in the Ordering Information table).
Replaced three-state with tri-state in all instances across the document.
*H
501793
VKN
09/13/2006
Updated TAP AC Switching Characteristics (Changed minimum value of tTH,
tTL parameters from 25 ns to 20 ns, and maximum value of tTDOV parameter
from 5 ns to 10 ns).
Updated Maximum Ratings (Added Maximum Rating for Supply Voltage on
VDDQ Relative to GND).
Updated Ordering Information (Updated part numbers).
*I
2756340
VKN /
AESA
08/26/2009
Added Neutron Soft Error Immunity.
Updated Ordering Information (Updated part numbers; and modified the
disclaimer for the Ordering information).
Updated to new template.
*J
3046851
NJY
10/04/2010
Updated Ordering Information:
No change in part numbers.
Added Ordering Code Definitions.
Updated Package Diagrams
spec 51-85050 – Changed revision from *B to *C.
spec 51-85115 – Changed revision from *B to *C.
spec 51-85180 – Changed revision from *B to *C.
Added Acronyms and Units of Measure.
Minor edits.
Updated to new template.
Completing Sunset Review.
*K
3052882
NJY
10/11/2010
Updated Ordering Information (Updated part numbers).
*L
3367594
PRIT
09/09/2011
Updated Package Diagrams:
spec 51-85050 – Changed revision from *C to *D.
Updated to new template.
Completing Sunset Review.
*M
3612494
PRIT
05/09/2012
Updated Features (Removed 250 MHz frequency related information).
Updated Functional Description (Removed the Note “For best-practices
recommendations, refer to the Cypress application note System Design
Guidelines on www.cypress.com.” and its reference).
Updated Selection Guide (Removed 250 MHz frequency related information).
Updated Pin Configurations (Updated Figure 1 (Removed CY7C1362C related
information, updated Figure 3 (Removed CY7C1362C related information),
updated Figure 4 (Removed CY7C1362C related information)).
Updated Functional Overview (Removed 250 MHz frequency related
information).
Updated IEEE 1149.1 Serial Boundary Scan (JTAG) (Removed CY7C1362C
related information).
Updated Identification Register Definitions (Removed CY7C1362C related
information).
Updated Scan Register Sizes (Removed “Bit Size (× 18)” column).
Updated Boundary Scan Order (Removed CY7C1362C related information).
Updated Boundary Scan Order (Removed CY7C1362C related information).
Document Number: 38-05540 Rev. *T
Page 36 of 38
CY7C1360C
CY7C1362C
Document History Page (continued)
Document Title: CY7C1360C/CY7C1362C, 9-Mbit (256K × 36/512K × 18) Pipelined SRAM
Document Number: 38-05540
Rev.
ECN No.
Orig. of
Change
Submission
Date
*M (cont.)
3612494
PRIT
05/09/2012
Updated Electrical Characteristics (Removed 250 MHz frequency related
information).
Updated Switching Characteristics (Removed 250 MHz frequency related
information).
Updated Package Diagrams:
spec 51-85180 – Changed revision from *C to *E.
*N
3754566
PRIT
09/25/2012
Updated Package Diagrams:
spec 51-85115 – Changed revision from *C to *D.
spec 51-85180 – Changed revision from *E to *F.
Completing Sunset Review.
*O
4539022
PRIT
10/15/2014
Updated Package Diagrams:
spec 51-85050 – Changed revision from *D to *E.
Updated to new template.
Completing Sunset Review.
*P
4574263
PRIT
11/19/2014
Updated Functional Description:
Added “For a complete list of related documentation, click here.” at the end.
*Q
4973995
PRIT
10/19/2015
Updated Package Diagrams:
spec 51-85180 – Changed revision from *F to *G.
Updated to new template.
Completing Sunset Review.
*R
5515711
PRIT
11/09/2016
Updated Package Diagrams:
spec 51-85050 – Changed revision from *E to *F.
Updated to new template.
Completing Sunset Review.
*S
6026108
RMES
01/11/2018
Updated Package Diagrams:
spec 51-85050 – Changed revision from *F to *G.
Updated to new template.
Completing Sunset Review.
*T
6112808
NILE
03/28/2018
Updated Package Diagrams:
No change in revisions.
Replaced “16.0 × 22.0 × 1.6 mm” with “14.0 × 20.0 × 1.4 mm” in caption of spec
51-85050 *G.
Document Number: 38-05540 Rev. *T
Description of Change
Page 37 of 38
CY7C1360C
CY7C1362C
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
PSoC® Solutions
Products
Arm® Cortex® Microcontrollers
Automotive
cypress.com/arm
cypress.com/automotive
Clocks & Buffers
Interface
Internet of Things
Memory
cypress.com/clocks
cypress.com/interface
cypress.com/iot
cypress.com/memory
Microcontrollers
cypress.com/mcu
PSoC
cypress.com/psoc
Power Management ICs
Touch Sensing
USB Controllers
Wireless Connectivity
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 MCU
Cypress Developer Community
Community | Projects | Video | Blogs | Training | Components
Technical Support
cypress.com/support
cypress.com/pmic
cypress.com/touch
cypress.com/usb
cypress.com/wireless
© Cypress Semiconductor Corporation, 2004-2018. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation
of the Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 38-05540 Rev. *T
Revised March 28, 2018
i486 is a trademark, and Intel and Pentium are registered trademarks of Intel Corporation. PowerPC is a trademark of IBM Corporation.
Page 38 of 38
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