Please note that Cypress is an Infineon Technologies Company.
The document following this cover page is marked as “Cypress” document as this is the
company that originally developed the product. Please note that Infineon will continue
to offer the product to new and existing customers as part of the Infineon product
portfolio.
Continuity of document content
The fact that Infineon offers the following product as part of the Infineon product
portfolio does not lead to any changes to this document. Future revisions will occur
when appropriate, and any changes will be set out on the document history page.
Continuity of ordering part numbers
Infineon continues to support existing part numbers. Please continue to use the
ordering part numbers listed in the datasheet for ordering.
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CY7C1366C
CY7C1367C
9-Mbit (256K × 36/512K × 18)
Pipelined DCD Sync SRAM
9-Mbit (256K × 36/512K × 18) Pipelined DCD Sync SRAM
Features
■
Supports bus operation up to 166 MHz
■
Available speed grade is 166 MHz
■
Registered inputs and outputs for pipelined operation
❐ Optimal for performance (double-cycle deselect)
• Depth expansion without wait state
❐ 3.3 V – 5% and + 10% core power supply (VDD)
■
2.5 V/3.3 V I/O power supply (VDDQ)
■
Fast clock-to-output times
❐ 3.5 ns (for 166 MHz device)
■
Provide high performance 3-1-1-1 access rate
■
User-selectable burst counter supporting Intel Pentium
interleaved or linear burst sequences
■
Separate processor and controller address strobes
■
Synchronous self-timed writes
■
Asynchronous output enable
■
Available in Pb-free 100-pin TQFP and non Pb-free 119-ball
BGA package
■
IEEE 1149.1 JTAG-compatible boundary scan
■
“ZZ” sleep mode option
circuitry and a two-bit counter for internal burst operation. All
synchronous inputs are gated by registers controlled by a
positive-edge-triggered clock input (CLK). The synchronous
inputs include all addresses, all data inputs, address-pipelining
chip enable (CE1), depth-expansion chip enables (CE2 and
CE3[1]), burst control inputs (ADSC, ADSP, and ADV), write
enables (BWX, and BWE), and global write (GW). Asynchronous
inputs include the output enable (OE) and the ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when either address strobe processor (ADSP) or address
strobe controller (ADSC) are active. Subsequent burst
addresses can be internally generated as controlled by the
advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed write cycle.This part supports byte write
operations (see Pin Definitions on page 6 and Partial Truth Table
for Read/Write on page 9 for further details). Write cycles can be
one to four bytes wide as controlled by the byte write control
inputs. GW active LOW causes all bytes to be written. This
device incorporates an additional pipelined enable register which
delays turning off the output buffers an additional cycle when a
deselect is executed. This feature enables depth expansion
without penalizing system performance.
The CY7C1366C/CY7C1367C operates from a +3.3 V core
power supply while all outputs operate with a +3.3 V or a +2.5 V
supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
For a complete list of related documentation, click here.
Functional Description
The CY7C1366C/CY7C1367C SRAM integrates 256K × 36 and
512K × 18 SRAM cells with advanced synchronous peripheral
Selection Guide
166 MHz
Unit
Maximum access time
Description
3.5
ns
Maximum operating current
180
mA
Maximum CMOS standby current
40
mA
Note
1. CE3 is for 100-pin TQFP. 119-ball BGA is offered only in 2 Chip Enable.
Cypress Semiconductor Corporation
Document Number: 38-05542 Rev. *O
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised March 28, 2019
CY7C1366C
CY7C1367C
Logic Block Diagram – CY7C1366C
ADDRESS
REGISTER
A 0,A1,A
2 A[1:0]
MODE
ADV
CLK
BURST
Q1
COUNTER AND
LOGIC
CLR
Q0
ADSC
ADSP
BW D
DQ D, DQP D
BYTE
WRITE REGISTER
DQ D, DQP D
BYTE
WRITE DRIVER
BW C
DQ c,DQP C
BYTE
WRITE REGISTER
DQ c,DQP C
BYTE
WRITE DRIVER
BW B
DQ B ,DQP B
BYTE
WRITE REGISTER
DQ B ,DQP B
BYTE
WRITE DRIVER
BW A
BWE
GW
CE 1
CE 2
CE 3
OE
ZZ
SENSE
AMPS
OUTPUT
REGISTERS
OUTPUT
BUFFERS
DQs
DQP A
DQP B
DQP C
DQP D
E
DQ A, DQP A
BYTE
WRITE DRIVER
DQ A, DQP A
BYTE
WRITE REGISTER
ENABLE
REGISTER
MEMORY
ARRAY
INPUT
REGISTERS
PIPELINED
ENABLE
SLEEP
CONTROL
Logic Block Diagram – CY7C1367C
A 0, A1, A
ADDRESS
REGISTER
2
MODE
ADV
CLK
A [1:0]
Q1
BURST
COUNTER AND
LOGIC
CLR
Q0
ADSC
ADSP
BW B
BW A
BWE
GW
CE 1
CE 2
CE 3
DQ B , DQP B
BYTE
WRITE DRIVER
DQ B, DQP B
BYTE
WRITE REGISTER
DQ A, DQP A
BYTE
WRITE DRIVER
DQ A , DQP A
BYTE
WRITE REGISTER
ENABLE
REGISTER
PIPELINED
ENABLE
MEMORY
ARRAY
SENSE
AMPS
OUTPUT
REGISTERS
OUTPUT
BUFFERS
DQ s,
DQP A
DQP B
E
INPUT
REGISTERS
OE
ZZ
SLEEP
CONTROL
Document Number: 38-05542 Rev. *O
Page 2 of 32
CY7C1366C
CY7C1367C
Contents
Pin Configurations ........................................................... 4
Pin Definitions .................................................................. 6
Functional Overview ........................................................ 7
Single Read Accesses ................................................ 7
Single Write Accesses Initiated by ADSP ................... 8
Single Write Accesses Initiated by ADSC ................... 8
Burst Sequences ......................................................... 8
Sleep Mode ................................................................. 8
Interleaved Burst Address Table ................................. 8
Linear Burst Address Table ......................................... 8
ZZ Mode Electrical Characteristics .............................. 8
Partial Truth Table for Read/Write .................................. 9
Partial Truth Table for Read/Write .................................. 9
IEEE 1149.1 Serial Boundary Scan (JTAG) .................. 10
Disabling the JTAG Feature ...................................... 10
Test Access Port (TAP) ............................................. 10
PERFORMING A TAP RESET .................................. 10
TAP REGISTERS ...................................................... 10
TAP Instruction Set ................................................... 11
TAP Controller State Diagram ....................................... 12
TAP Controller Block Diagram ...................................... 13
TAP Timing ...................................................................... 13
TAP AC Switching Characteristics ............................... 14
3.3 V TAP AC Test Conditions ....................................... 14
3.3 V TAP AC Output Load Equivalent ......................... 14
2.5 V TAP AC Test Conditions ....................................... 14
2.5 V TAP AC Output Load Equivalent ......................... 14
TAP DC Electrical Characteristics
and Operating Conditions ............................................. 15
Document Number: 38-05542 Rev. *O
Identification Register Definitions ................................ 16
Scan Register Sizes ....................................................... 16
Identification Codes ....................................................... 16
Boundary Scan Order .................................................... 17
Maximum Ratings ........................................................... 18
Operating Range ............................................................. 18
Neutron Soft Error Immunity ......................................... 18
Electrical Characteristics ............................................... 18
Capacitance .................................................................... 19
Thermal Resistance ........................................................ 19
AC Test Loads and Waveforms ..................................... 20
Switching Characteristics .............................................. 21
Switching Waveforms .................................................... 22
Ordering Information ...................................................... 26
Ordering Code Definitions ......................................... 26
Package Diagrams .......................................................... 27
Acronyms ........................................................................ 28
Document Conventions ................................................. 28
Units of Measure ....................................................... 28
Document History Page ................................................. 29
Sales, Solutions, and Legal Information ...................... 32
Worldwide Sales and Design Support ....................... 32
Products .................................................................... 32
PSoC® Solutions ...................................................... 32
Cypress Developer Community ................................. 32
Technical Support ..................................................... 32
Page 3 of 32
CY7C1366C
CY7C1367C
Pin Configurations
NC
NC
NC
CY7C1367C
(512K × 18)
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
VDDQ
VSSQ
NC
NC
DQB
DQB
VSSQ
VDDQ
DQB
DQB
NC
VDD
NC
VSS
DQB
DQB
VDDQ
VSSQ
DQB
DQB
DQPB
NC
VSSQ
VDDQ
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
MODE
A
A
A
A
A1
A0
NC/72M
NC/36M
VSS
VDD
NC/18M
A
A
A
A
A
A
A
A
DQPB
DQB
DQB
VDDQ
VSSQ
DQB
DQB
DQB
DQB
VSSQ
VDDQ
DQB
DQB
VSS
NC
VDD
ZZ
DQA
DQA
VDDQ
VSSQ
DQA
DQA
DQA
DQA
VSSQ
VDDQ
DQA
DQA
DQPA
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
CY7C1366C
(256K × 36)
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
MODE
A
A
A
A
A1
A0
NC/72M
NC/36M
VSS
VDD
NC/18M
A
A
A
A
A
A
A
A
DQPC
DQC
DQC
VDDQ
VSSQ
DQC
DQC
DQC
DQC
VSSQ
VDDQ
DQC
DQC
NC
VDD
NC
VSS
DQD
DQD
VDDQ
VSSQ
DQD
DQD
DQD
DQD
VSSQ
VDDQ
DQD
DQD
DQPD
A
A
CE1
CE2
NC
NC
BWB
BWA
CE3
VDD
VSS
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A
A
A
A
CE1
CE2
BWD
BWC
BWB
BWA
CE3
VDD
VSS
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A
A
Figure 1. 100-pin TQFP (14 × 20 × 1.4 mm) pinout (3 Chip Enables)
Document Number: 38-05542 Rev. *O
A
NC
NC
VDDQ
VSSQ
NC
DQPA
DQA
DQA
VSSQ
VDDQ
DQA
DQA
VSS
NC
VDD
ZZ
DQA
DQA
VDDQ
VSSQ
DQA
DQA
NC
NC
VSSQ
VDDQ
NC
NC
NC
Page 4 of 32
CY7C1366C
CY7C1367C
Pin Configurations (continued)
Figure 2. 119-ball BGA (14 × 22 × 2.4 mm) pinout (2 Chip Enable with JTAG)
1
CY7C1366C (256K × 36)
3
4
5
A
A
ADSP
A
VDDQ
2
A
B
C
NC/288M
NC/144M
CE2
A
A
A
ADSC
VDD
D
E
DQC
DQC
DQPC
DQC
VSS
VSS
NC
CE1
F
VDDQ
DQC
VSS
G
H
J
K
DQC
DQC
VDDQ
DQD
DQC
DQC
VDD
DQD
BWC
VSS
NC
VSS
NC
L
DQD
DQD
M
VDDQ
DQD
BWD
VSS
N
DQD
DQD
VSS
6
A
7
VDDQ
A
A
A
A
NC/576M
NC/1G
VSS
VSS
DQPB
DQB
DQB
DQB
OE
VSS
DQB
VDDQ
ADV
BWB
VSS
NC
VSS
DQB
DQB
VDD
DQA
DQB
DQB
VDDQ
DQA
BWA
VSS
DQA
DQA
DQA
VDDQ
VSS
DQA
DQA
GW
VDD
CLK
BWE
A1
P
DQD
DQPD
VSS
A0
VSS
DQPA
DQA
R
NC
A
MODE
VDD
NC
A
NC
T
U
NC
VDDQ
NC/72M
TMS
A
TDI
A
TCK
A
TDO
NC/36M
NC
ZZ
VDDQ
Document Number: 38-05542 Rev. *O
Page 5 of 32
CY7C1366C
CY7C1367C
Pin Definitions
Name
I/O
Description
A0, A1, A
InputAddress inputs used to select one of the address locations. Sampled at the rising edge of the CLK
synchronous if ADSP or ADSC is active LOW, and CE1, CE2, and CE3[2] are sampled active. A1:A0 are fed to the
two-bit counter.
BWA,BWB,
BWC,BWD
InputByte write select inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM. Sampled
synchronous on the rising edge of CLK.
GW
InputGlobal write enable input, active LOW. When asserted LOW on the rising edge of CLK, a global write
synchronous is conducted (All bytes are written, regardless of the values on BWX and BWE).
BWE
InputByte write enable input, active LOW. Sampled on the rising edge of CLK. This signal must be asserted
synchronous LOW to conduct a byte write.
CLK
Inputclock
Clock input. Used to capture all synchronous inputs to the device. Also used to increment the burst
counter when ADV is asserted LOW, during a burst operation.
CE1
InputChip enable 1 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2
synchronous and CE3[2] to select/deselect the device. ADSP is ignored if CE1 is HIGH. CE1 is sampled only when a
new external address is loaded.
CE2
InputChip enable 2 input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with CE1
synchronous and CE3[2] to select/deselect the device. CE2 is sampled only when a new external address is loaded.
CE3[2]
InputChip enable 3 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1
synchronous and CE2 to select/deselect the device. Not connected for BGA. Where referenced, CE3[2] is assumed
active throughout this document for BGA.
CE3 is sampled only when a new external address is loaded.
OE
InputOutput enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When LOW,
asynchronous the I/O pins behave as outputs. When deasserted HIGH, DQ pins are tristated, and act as input data
pins. OE is masked during the first clock of a read cycle when emerging from a deselected state.
ADV
InputAdvance input signal, sampled on the rising edge of CLK, active LOW. When asserted, it
synchronous automatically increments the address in a burst cycle.
ADSP
InputAddress strobe from processor, sampled on the rising edge of CLK, active LOW. When asserted
synchronous LOW, addresses presented to the device are captured in the address registers. A1:A0 are also loaded
into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is
ignored when CE1 is deasserted HIGH.
ADSC
InputAddress strobe from controller, sampled on the rising edge of CLK, active LOW. When asserted
synchronous LOW, addresses presented to the device are captured in the address registers. A1:A0 are also loaded
into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized.
ZZ
InputZZ “sleep” input, active HIGH. When asserted HIGH places the device in a non-time-critical “sleep”
asynchronous condition with data integrity preserved. For normal operation, this pin has to be LOW or left floating. ZZ
pin has an internal pull-down.
DQs,
DQPs
I/OBidirectional data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the
synchronous rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by the
addresses presented during the previous clock rise of the read cycle. The direction of the pins is
controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQs and DQPX
are placed in a tristate condition.
VDD
Power supply Power supply inputs to the core of the device.
VSS
Ground
Ground for the core of the device.
VSSQ
I/O ground
Ground for the I/O circuitry.
VDDQ
I/O power
supply
Power supply for the I/O circuitry.
Note
2. CE3 is for 100-pin TQFP. 119-ball BGA is offered only in 2 Chip Enable.
Document Number: 38-05542 Rev. *O
Page 6 of 32
CY7C1366C
CY7C1367C
Pin Definitions (continued)
Name
MODE
I/O
Description
Inputstatic
Selects burst order. When tied to GND selects linear burst sequence. When tied to VDD or left floating
selects interleaved burst sequence. This is a strap pin and should remain static during device operation.
Mode pin has an internal pull-up.
TDO
JTAG serial Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the JTAG feature is
output
not being used, this pin should be disconnected. This pin is not available on TQFP packages.
synchronous
TDI
JTAG serial Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not being
used, this pin can be disconnected or connected to VDD. This pin is not available on TQFP packages.
input
synchronous
TMS
JTAG serial Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not being
input
used, this pin can be disconnected or connected to VDD. This pin is not available on TQFP packages.
synchronous
TCK
JTAGclock
Clock input to the JTAG circuitry. If the JTAG feature is not being used, this pin must be connected
to VSS. This pin is not available on TQFP packages.
NC
–
No connects. Not internally connected to the die.18M, 36M, 72M, 144M, 288M, 576M, and 1G are
address expansion pins and are not internally connected to the die.
Functional Overview
selection and output tristate control. ADSP is ignored if CE1 is
HIGH.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. All data outputs pass through output
registers controlled by the rising edge of the clock.
Single Read Accesses
The CY7C1366C/CY7C1367C supports secondary cache in
systems using either a linear or interleaved burst sequence. The
interleaved burst order supports Pentium and i486™ processors.
The linear burst sequence is suited for processors that use a
linear burst sequence. The burst order is user selectable, and is
determined by sampling the MODE input. Accesses can be
initiated with either the processor address strobe (ADSP) or the
controller address strobe (ADSC). Address advancement
through the burst sequence is controlled by the ADV input. A
two-bit on-chip wraparound burst counter captures the first
address in a burst sequence and automatically increments the
address for the rest of the burst access.
Byte write operations are qualified with the byte write enable
(BWE) and byte write select (BWX) inputs. A global write enable
(GW) overrides all byte write inputs and writes data to all four
bytes. All writes are simplified with on-chip synchronous
self-timed write circuitry.
Synchronous chip selects CE1, CE2, CE3[3] and an
asynchronous output enable (OE) provide for easy bank
This access is initiated when the following conditions are
satisfied at clock rise: (1) ADSP or ADSC is asserted LOW,
(2) chip selects are all asserted active, and (3) the write signals
(GW, BWE) are all deasserted HIGH. ADSP is ignored if CE1 is
HIGH. The address presented to the address inputs is stored into
the address advancement logic and the address register while
being presented to the memory core. The corresponding data is
allowed to propagate to the input of the output registers. At the
rising edge of the next clock the data is allowed to propagate
through the output register and on the data bus within tco if OE
is active LOW. The only exception occurs when the SRAM is
emerging from a deselected state to a selected state, its outputs
are always tristated during the first cycle of the access. After the
first cycle of the access, the outputs are controlled by the OE
signal. Consecutive single read cycles are supported.
The CY7C1366C/CY7C1367C is a double-cycle deselect part.
Once the SRAM is deselected at clock rise by the chip select and
either ADSP or ADSC signals, its output will tristate immediately
after the next clock rise.
Note
3. CE3 is for 100-pin TQFP. 119-ball BGA is offered only in 2 Chip Enable.
Document Number: 38-05542 Rev. *O
Page 7 of 32
CY7C1366C
CY7C1367C
Single Write Accesses Initiated by ADSP
Burst Sequences
This access is initiated when both of the following conditions are
satisfied at clock rise: (1) ADSP is asserted LOW, and (2) chip
select is asserted active. The address presented is loaded into
the address register and the address advancement logic while
being delivered to the memory core. The write signals (GW,
BWE, and BWX) and ADV inputs are ignored during this first
cycle.
The CY7C1366C/CY7C1367C provides a two-bit wraparound
counter, fed by A[1:0], that implements either an interleaved or
linear burst sequence. The interleaved burst sequence is
designed specifically to support Intel Pentium applications. The
linear burst sequence is designed to support processors that
follow a linear burst sequence. The burst sequence is user
selectable through the MODE input. Both read and write burst
operations are supported.
ADSP triggered write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQx inputs is written into the
corresponding address location in the memory core. If GW is
HIGH, then the write operation is controlled by BWE and BWX
signals. The CY7C1366C/CY7C1367C provides byte write
capability that is described in the Write Cycle Description table.
Asserting the byte write enable input (BWE) with the selected
byte write input will selectively write to only the desired bytes.
Bytes not selected during a byte write operation remain
unaltered. A synchronous self-timed write mechanism is
provided to simplify the write operations.
Because the CY7C1366C/CY7C1367C is a common I/O device,
the output enable (OE) must be deasserted HIGH before
presenting data to the DQ inputs. Doing so tristates the output
drivers. As a safety precaution, DQ are automatically tristated
whenever a write cycle is detected, regardless of the state of OE.
Asserting ADV LOW at clock rise automatically increments the
burst counter to the next address in the burst sequence. Both
read and write burst operations are supported.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ places
the SRAM in a power conservation ‘sleep’ mode. Two clock
cycles are required to enter into or exit from this ‘sleep’ mode.
While in this mode, data integrity is guaranteed. Accesses
pending when entering the ‘sleep’ mode are not considered valid
nor is the completion of the operation guaranteed. The device
must be deselected prior to entering the ‘sleep’ mode. CEs,
ADSP, and ADSC must remain inactive for the duration of tZZREC
after the ZZ input returns LOW.
Interleaved Burst Address Table
(MODE = Floating or VDD)
Single Write Accesses Initiated by ADSC
ADSC write accesses are initiated when the following conditions
are satisfied: (1) ADSC is asserted LOW, (2) ADSP is deasserted
HIGH, (3) chip select is asserted active, and (4) the appropriate
combination of the write inputs (GW, BWE, and BWX) are
asserted active to conduct a write to the desired byte(s). ADSC
triggered write accesses require a single clock cycle to complete.
The address presented is loaded into the address register and
the address advancement logic while being delivered to the
memory core. The ADV input is ignored during this cycle. If a
global write is conducted, the data presented to the DQX is
written into the corresponding address location in the memory
core. If a byte write is conducted, only the selected bytes are
written. Bytes not selected during a byte write operation remain
unaltered. A synchronous self-timed write mechanism is
provided to simplify the write operations.
First
Address
A1:A0
Second
Address
A1:A0
Third
Address
A1:A0
Fourth
Address
A1:A0
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
Fourth
Address
A1:A0
Linear Burst Address Table
(MODE = GND)
Because the CY7C1366C/CY7C1367C is a common I/O device,
the output enable (OE) must be deasserted HIGH before
presenting data to the DQX inputs. Doing so tristates the output
drivers. As a safety precaution, DQX are automatically tristated
whenever a write cycle is detected, regardless of the state of OE.
First
Address
A1:A0
Second
Address
A1:A0
Third
Address
A1:A0
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
ZZ Mode Electrical Characteristics
Parameter
Description
Test Conditions
Min
Max
Unit
IDDZZ
Sleep mode standby current
ZZ > VDD– 0.2 V
–
50
mA
tZZS
Device operation to ZZ
ZZ > VDD – 0.2 V
–
2tCYC
ns
tZZREC
ZZ recovery time
ZZ < 0.2 V
2tCYC
–
ns
tZZI
ZZ active to sleep current
This parameter is sampled
–
2tCYC
ns
tRZZI
ZZ inactive to exit sleep current
This parameter is sampled
0
–
ns
Document Number: 38-05542 Rev. *O
Page 8 of 32
CY7C1366C
CY7C1367C
Partial Truth Table for Read/Write
The Partial Truth Table for Read/Write for CY7C1366C follows. [4, 5]
Function (CY7C1366C)
GW
BWE
BWD
BWC
BWB
BWA
Read
H
H
X
X
X
X
Read
H
L
H
H
H
H
Write byte A – (DQA and DQPA)
H
L
H
H
H
L
Write byte B – (DQB and DQPB)
H
L
H
H
L
H
Write bytes B, A
H
L
H
H
L
L
Write byte C – (DQC and DQPC)
H
L
H
L
H
H
Write bytes C, A
H
L
H
L
H
L
Write bytes C, B
H
L
H
L
L
H
Write bytes C, B, A
H
L
H
L
L
L
Write byte D – (DQD and DQPD)
H
L
L
H
H
H
Write bytes D, A
H
L
L
H
H
L
Write bytes D, B
H
L
L
H
L
H
Write bytes D, B, A
H
L
L
H
L
L
Write bytes D, C
H
L
L
L
H
H
Write bytes D, C, A
H
L
L
L
H
L
Write bytes D, C, B
H
L
L
L
L
H
Write all bytes
H
L
L
L
L
L
Write all bytes
L
X
X
X
X
X
Partial Truth Table for Read/Write
The Partial Truth Table for Read/Write for CY7C1367C follows. [4, 5]
Function (CY7C1367C)
GW
BWE
BWB
BWA
Read
H
H
X
X
Read
H
L
H
H
Write byte A – (DQA and DQPA)
H
L
H
L
Write byte B – (DQB and DQPB)
H
L
L
H
Write all bytes
H
L
L
L
Write all bytes
L
X
X
X
Notes
4. All voltages referenced to VSS (GND).
5. This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD(minimum) initially before a read or write operation can
be initiated.
Document Number: 38-05542 Rev. *O
Page 9 of 32
CY7C1366C
CY7C1367C
IEEE 1149.1 Serial Boundary Scan (JTAG)
The CY7C1366C incorporates a serial boundary scan test
access port (TAP) in the BGA package only. The TQFP package
does not offer this functionality. This part operates in accordance
with IEEE Standard 1149.1-1900, but does not have the set of
functions required for full 1149.1 compliance. These functions
from the IEEE specification are excluded because their inclusion
places an added delay in the critical speed path of the SRAM.
Note that the TAP controller functions in a manner that does not
conflict with the operation of other devices using 1149.1 fully
compliant TAPs. The TAP operates using JEDEC-standard 3.3 V
or 2.5 V I/O logic levels.
The CY7C1366C contains a TAP controller, instruction register,
boundary scan register, bypass register, and ID register.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are
internally pulled up and may be unconnected. They may
alternately be connected to VDD through a pull-up resistor. TDO
should be left unconnected. Upon power-up, the device comes
up in a reset state which does not interfere with the operation of
the device.
Performing a TAP Reset
A RESET is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This RESET does not affect the operation of the
SRAM and may be performed while the SRAM is operating.
At power up, the TAP is reset internally to ensure that TDO
comes up in a high Z state.
TAP Registers
Registers are connected between the TDI and TDO balls and
enable data to be scanned into and out of the SRAM test circuitry.
Only one register can be selected at a time through the
instruction register. Data is serially loaded into the TDI ball on the
rising edge of TCK. Data is output on the TDO ball on the falling
edge of TCK.
Instruction Register
Three-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the TDI
and TDO balls as shown in the TAP Controller Block Diagram on
page 13. Upon power-up, the instruction register is loaded with
the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state as described
in the previous section.
Test Access Port (TAP)
When the TAP controller is in the Capture-IR state, the two least
significant bits are loaded with a binary “01” pattern to enable
fault isolation of the board-level serial test data path.
Test Clock (TCK)
Bypass Register
The test clock is used only with the TAP controller. All inputs are
captured on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between the
TDI and TDO balls. This enables data to be shifted through the
SRAM with minimal delay. The bypass register is set LOW (VSS)
when the BYPASS instruction is executed.
Test Mode Select (TMS)
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. It is allowable to leave
this ball unconnected if the TAP is not used. The ball is pulled up
internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI ball is used to serially input information into the registers
and can be connected to the input of any of the registers. The
register between TDI and TDO is chosen by the instruction that
is loaded into the TAP instruction register. For information about
loading the instruction register, see the TAP Controller State
Diagram on page 12. TDI is internally pulled up and can be
unconnected if the TAP is unused in an application. TDI is
connected to the most significant bit (MSB) of any register.
Test Data-Out (TDO)
The TDO output ball is used to serially clock data-out from the
registers. The output is active depending upon the current state
of the TAP state machine (see Identification Codes on page 16).
The output changes on the falling edge of TCK. TDO is
connected to the least significant bit (LSB) of any register.
Document Number: 38-05542 Rev. *O
Boundary Scan Register
The boundary scan register is connected to all the input and
bidirectional balls on the SRAM.
The boundary scan register is loaded with the contents of the
RAM I/O ring when the TAP controller is in the Capture-DR state
and is then placed between the TDI and TDO balls when the
controller is moved to the Shift-DR state. The EXTEST,
SAMPLE/PRELOAD and SAMPLE Z instructions can be used to
capture the contents of the I/O ring.
The Boundary Scan Order on page 17 show the order in which
the bits are connected. Each bit corresponds to one of the bumps
on the SRAM package. The MSB of the register is connected to
TDI and the LSB is connected to TDO.
Identification (ID) Register
The ID register is loaded with a vendor-specific, 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired into
the SRAM and can be shifted out when the TAP controller is in
the Shift-DR state. The ID register has a vendor code and other
information described in Identification Register Definitions on
page 16.
Page 10 of 32
CY7C1366C
CY7C1367C
TAP Instruction Set
Overview
Eight different instructions are possible with the three-bit
instruction register. All combinations are listed in Identification
Codes on page 16. Three of these instructions are listed as
RESERVED and should not be used. The other five instructions
are described in detail in this section.
The TAP controller used in this SRAM is not fully compliant to the
1149.1 convention because some of the mandatory 1149.1
instructions are not fully implemented.
The TAP controller cannot be used to load address data or
control signals into the SRAM and cannot preload the I/O buffers.
The SRAM does not implement the 1149.1 commands EXTEST
or INTEST or the PRELOAD portion of SAMPLE/PRELOAD;
rather, it performs a capture of the I/O ring when these
instructions are executed.
Instructions are loaded into the TAP controller during the Shift-IR
state when the instruction register is placed between TDI and
TDO. During this state, instructions are shifted through the
instruction register through the TDI and TDO balls. To execute
the instruction once it is shifted in, the TAP controller needs to be
moved into the Update-IR state.
EXTEST
EXTEST is a mandatory 1149.1 instruction which is to be
executed whenever the instruction register is loaded with all 0s.
EXTEST is not implemented in this SRAM TAP controller, and
therefore this device is not compliant to 1149.1. The TAP
controller does recognize an all-0 instruction.
When an EXTEST instruction is loaded into the instruction
register, the SRAM responds as if a SAMPLE/PRELOAD
instruction has been loaded. There is one difference between the
two instructions. Unlike the SAMPLE/PRELOAD instruction,
EXTEST places the SRAM outputs in a high Z state.
controller is in a Shift-DR state. It also places all SRAM outputs
into a high Z state.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the inputs and output pins is
captured in the boundary scan register.
The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because there
is a large difference in the clock frequencies, it is possible that
during the Capture-DR state, an input or output undergoes a
transition. The TAP may then try to capture a signal while in
transition (metastable state). This does not harm the device, but
there is no guarantee as to the value that is captured.
Repeatable results may not be possible.
To guarantee that the boundary scan register captures the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller’s capture setup plus hold
times (tCS and tCH). The SRAM clock input might not be captured
correctly if there is no way in a design to stop (or slow) the clock
during a SAMPLE/PRELOAD instruction. If this is an issue, it is
still possible to capture all other signals and simply ignore the
value of the CK and CK# captured in the boundary scan register.
Once the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO pins.
PRELOAD enables an initial data pattern to be placed at the
latched parallel outputs of the boundary scan register cells prior
to the selection of another boundary scan test operation.
The shifting of data for the SAMPLE and PRELOAD phases can
occur concurrently when required - that is, while data captured
is shifted out, the preloaded data can be shifted in.
IDCODE
BYPASS
The IDCODE instruction causes a vendor-specific, 32-bit code
to be loaded into the instruction register. It also places the
instruction register between the TDI and TDO balls and allows
the IDCODE to be shifted out of the device when the TAP
controller enters the Shift-DR state.
When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO balls. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
The IDCODE instruction is loaded into the instruction register
upon power up or whenever the TAP controller is given a test
logic reset state.
SAMPLE Z
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
The SAMPLE Z instruction causes the boundary scan register to
be connected between the TDI and TDO balls when the TAP
Document Number: 38-05542 Rev. *O
Page 11 of 32
CY7C1366C
CY7C1367C
TAP Controller State Diagram
1
TEST-LOGIC
RESET
0
0
RUN-TEST/
IDLE
1
SELECT
DR-SCA N
1
SELECT
IR-SCAN
0
1
0
1
CAPTURE-DR
CAPTURE-IR
0
0
SHIFT-DR
0
SHIFT-IR
1
1
EXIT1-IR
0
1
0
PAUSE-DR
0
PAUSE-IR
1
0
1
EXIT2-DR
0
EXIT2-IR
1
1
UPDATE-DR
1
0
1
EXIT1-DR
0
1
0
UPDATE-IR
1
0
The 0/1 next to each state represents the value of TMS at the rising edge of TCK.
Document Number: 38-05542 Rev. *O
Page 12 of 32
CY7C1366C
CY7C1367C
TAP Controller Block Diagram
0
Bypass Register
2 1 0
Selection
Circuitry
TDI
Instruction Register
Selection
Circuitry
TDO
5
6
31 30 29 . . . 2 1 0
Identification Register
x . . . . . 2 1 0
Boundary Scan Register
TCK
TAP CONTROLLER
TM S
TAP Timing
1
2
Test Clock
(TCK )
3
t TH
t TM SS
t TM SH
t TDIS
t TDIH
t
TL
4
t CY C
Test M ode Select
(TM S)
Test Data-In
(TDI)
t TDOV
t TDOX
Test Data-Out
(TDO)
DON’T CA RE
Document Number: 38-05542 Rev. *O
UNDEFINED
Page 13 of 32
CY7C1366C
CY7C1367C
TAP AC Switching Characteristics
Over the Operating Range
Parameter [6, 7]
Description
Min
Max
Unit
Clock
tTCYC
TCK clock cycle time
50
–
ns
tTF
TCK clock frequency
–
20
MHz
tTH
TCK clock HIGH time
20
–
ns
tTL
TCK clock LOW time
20
–
ns
tTDOV
TCK clock LOW to TDO valid
–
10
ns
tTDOX
TCK clock LOW to TDO invalid
0
–
ns
tTMSS
TMS setup to TCK clock rise
5
–
ns
tTDIS
TDI setup to TCK clock rise
5
–
ns
tCS
Capture setup to TCK rise
5
–
ns
tTMSH
TMS hold after TCK clock rise
5
–
ns
tTDIH
TDI hold after clock rise
5
–
ns
tCH
Capture hold after clock rise
5
–
ns
Output Times
Setup Times
Hold Times
3.3 V TAP AC Test Conditions
2.5 V TAP AC Test Conditions
Input pulse levels ...............................................VSS to 3.3 V
Input rise and fall times ...................................................1 ns
Input pulse levels ............................................... VSS to 2.5 V
Input rise and fall time ....................................................1 ns
Input timing reference levels ......................................... 1.5 V
Input timing reference levels ....................................... 1.25 V
Output reference levels ................................................ 1.5 V
Output reference levels .............................................. 1.25 V
Test load termination supply voltage ............................ 1.5 V
Test load termination supply voltage .......................... 1.25 V
3.3 V TAP AC Output Load Equivalent
2.5 V TAP AC Output Load Equivalent
1.5V
1.25V
50Ω
TDO
50Ω
TDO
Z O= 50Ω
20pF
Z O= 50Ω
20pF
Notes
6. tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.
7. Test conditions are specified using the load in TAP AC test Conditions. tR/tF = 1 ns.
Document Number: 38-05542 Rev. *O
Page 14 of 32
CY7C1366C
CY7C1367C
TAP DC Electrical Characteristics and Operating Conditions
(0 °C < TA < +70 °C; VDD = 3.3 V ± 0.165 V unless otherwise noted)
Parameter [8]
VOH1
Description
Output HIGH voltage
Min
Max
Unit
IOH = –4.0 mA
Conditions
VDDQ = 3.3 V
2.4
–
V
IOH = –1.0 mA
VDDQ = 2.5 V
2.0
–
V
–
V
VOH2
Output HIGH voltage
IOH = –100 µA
VDDQ = 3.3 V
2.9
VDDQ = 2.5 V
2.1
–
V
VOL1
Output LOW voltage
IOL = 8.0 mA
VDDQ = 3.3 V
–
0.4
V
IOL = 8.0 mA
VDDQ = 2.5 V
–
0.4
V
IOL = 100 µA
VDDQ = 3.3 V
–
0.2
V
VOL2
Output LOW voltage
VIH
Input HIGH voltage
VIL
Input LOW voltage
IX
Input load current
GND < VIN < VDDQ
VDDQ = 2.5 V
–
0.2
V
VDDQ = 3.3 V
2.0
VDD + 0.3
V
VDDQ = 2.5 V
1.7
VDD + 0.3
V
VDDQ = 3.3 V
–0.5
0.7
V
VDDQ = 2.5 V
–0.3
0.7
V
–5
5
µA
Notes
8. All voltages referenced to VSS (GND).
Document Number: 38-05542 Rev. *O
Page 15 of 32
CY7C1366C
CY7C1367C
Identification Register Definitions
CY7C1366C
(256K × 36)
Instruction Field
Description
Revision number (31:29)
000
Device depth (28:24) [9]
01011
Reserved for Internal Use
Device width (23:18) 119-ball BGA
101110
Defines memory type and architecture
Cypress device ID (17:12)
100110
Defines width and density
Cypress JEDEC ID code (11:1)
00000110100
ID register presence indicator (0)
1
Describes the version number.
Allows unique identification of SRAM vendor.
Indicates the presence of an ID register.
Scan Register Sizes
Register Name
Bit Size (× 36)
Instruction
3
Bypass
1
ID
32
Boundary scan order (119-ball BGA package)
71
Identification Codes
Instruction
Code
Description
EXTEST
000
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces
all SRAM outputs to high Z state.
IDCODE
001
Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operations.
SAMPLE Z
010
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces
all SRAM output drivers to a high Z state.
RESERVED
011
Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD
100
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Does
not affect SRAM operation.
RESERVED
101
Do Not Use: This instruction is reserved for future use.
RESERVED
110
Do Not Use: This instruction is reserved for future use.
BYPASS
111
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
Note
9. Bit #24 is “1” in the Register Definitions for both 2.5 V and 3.3 V versions of this device.
Document Number: 38-05542 Rev. *O
Page 16 of 32
CY7C1366C
CY7C1367C
Boundary Scan Order
119-ball BGA
CY7C1366C (256K × 36)
Bit #
Ball ID
Signal Name
Bit #
Ball ID
Signal Name
1
K4
CLK
37
P4
A0
2
H4
GW
38
N4
A1
3
M4
BWE
39
R6
A
4
F4
OE
40
T5
A
5
B4
ADSC
41
T3
A
6
A4
ADSP
42
R2
A
7
G4
ADV
43
R3
MODE
8
C3
A
44
P2
DQPD
9
B3
A
45
P1
DQD
10
D6
DQPB
46
L2
DQD
11
H7
DQB
47
K1
DQD
12
G6
DQB
48
N2
DQD
13
E6
DQB
49
N1
DQD
14
D7
DQB
50
M2
DQD
15
E7
DQB
51
L1
DQD
16
F6
DQB
52
K2
DQD
17
G7
DQB
53
Internal
Internal
18
H6
DQB
54
H1
DQC
19
T7
ZZ
55
G2
DQC
20
K7
DQA
56
E2
DQC
21
L6
DQA
57
D1
DQC
22
N6
DQA
58
H2
DQC
23
P7
DQA
59
G1
DQC
24
N7
DQA
60
F2
DQC
25
M6
DQA
61
E1
DQC
26
L7
DQA
62
D2
DQPC
27
K6
DQA
63
C2
A
28
P6
DQPA
64
A2
A
29
T4
A
65
E4
CE1
30
A3
A
66
B2
CE2
31
C5
A
67
L3
BWD
32
B5
A
68
G3
BWC
33
A5
A
69
G5
BWB
34
C6
A
70
L5
BWA
35
A6
A
71
Internal
Internal
36
B6
A
Document Number: 38-05542 Rev. *O
Page 17 of 32
CY7C1366C
CY7C1367C
Maximum Ratings
Operating Range
Range
Ambient
Temperature
VDD
VDDQ
Commercial
0 °C to +70 °C
3.3 V– 5% /
+ 10%
2.5 V – 5% to
VDD
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage temperature ................................ –65 °C to +150 °C
Ambient temperature with
power applied .......................................... –55 °C to +125 °C
Supply voltage on VDD relative to GND .......–0.5 V to +4.6 V
Supply voltage on VDDQ relative to GND ...... –0.5 V to +VDD
DC voltage applied to outputs
in tristate ...........................................–0.5 V to VDDQ + 0.5 V
DC input voltage ................................. –0.5 V to VDD + 0.5 V
Current into outputs (LOW) ........................................ 20 mA
Static discharge voltage
(per MIL-STD-883, method 3015) .......................... > 2001 V
Latch-up current .................................................... > 200 mA
Neutron Soft Error Immunity
Description
Test
Conditions
Typ
Max*
Unit
LSBU
Logical
single-bit
upsets
25 °C
361
394
FIT/
Mb
LMBU
Logical
multi-bit
upsets
25 °C
0
0.01
FIT/
Mb
Single event
latch-up
85 °C
0
0.1
FIT/
Dev
Parameter
SEL
* No LMBU or SEL events occurred during testing; this column represents a
statistical 2, 95% confidence limit calculation. For more details refer to
Application Note AN54908 “Accelerated Neutron SER Testing and Calculation of
Terrestrial Failure Rates”.
Electrical Characteristics
Over the Operating Range
Parameter [10, 11]
Description
Min
Max
Unit
3.135
3.6
V
for 3.3 V I/O
3.135
VDD
V
for 2.5 V I/O
2.375
2.625
V
for 3.3 V I/O, IOH =4.0 mA
2.4
–
V
for 2.5 V I/O, IOH =1.0 mA
2.0
–
V
for 3.3 V I/O, IOL=8.0 mA
–
0.4
V
for 2.5 V I/O, IOL= 1.0 mA
–
0.4
V
for 3.3 V I/O
2.0
VDD + 0.3
V
for 2.5 V I/O
1.7
VDD + 0.3
V
for 3.3 V I/O
–0.3
0.8
V
for 2.5 V I/O
–0.3
0.7
V
Input leakage current except ZZ GND VI VDDQ
and MODE
–5
5
µA
Input current of MODE
Input = VSS
–30
–
µA
Input = VDD
–
5
µA
Input current of ZZ
Input = VSS
–5
–
µA
Input = VDD
–
30
µA
GND VI VDDQ, output disabled
–5
5
µA
VDD
Power supply voltage
VDDQ
I/O supply voltage
VOH
VOL
VIH
VIL
IX
IOZ
Output HIGH voltage
Output LOW voltage
Input HIGH voltage
Input LOW voltage
[10]
[10]
Output leakage current
Test Conditions
Notes
10. Overshoot: VIH(AC) < VDD + 1.5 V (Pulse width less than tCYC/2), undershoot: VIL(AC) > –2 V (Pulse width less than tCYC/2).
11. TPower-up: Assumes a linear ramp from 0 V to VDD(min) within 200 ms. During this time VIH < VDD and VDDQ VDD.
Document Number: 38-05542 Rev. *O
Page 18 of 32
CY7C1366C
CY7C1367C
Electrical Characteristics (continued)
Over the Operating Range
Parameter [10, 11]
Description
Test Conditions
Min
Max
Unit
IDD
VDD operating supply current
VDD = Max, IOUT = 0 mA,
f = fMAX = 1/tCYC
6 ns cycle,
166 MHz
–
180
mA
ISB1
Automatic CE power-down
current – TTL inputs
VDD = Max, device deselected,
VIN VIH or VIN VIL
f = fMAX = 1/tCYC
6 ns cycle,
166 MHz
–
110
mA
ISB2
Automatic CE power-down
current – CMOS inputs
VDD = Max, device deselected, 6 ns cycle,
VIN 0.3 V or VIN > VDDQ – 0.3 V, 166 MHz
f=0
–
40
mA
ISB3
Automatic CE power-down
current – CMOS inputs
VDD = Max, device deselected, or 6 ns cycle,
VIN 0.3 V or VIN > VDDQ – 0.3 V, 166 MHz
f = fMAX = 1/tCYC
–
100
mA
ISB4
Automatic CE power-down
current – TTL inputs
VDD = Max, device deselected,
VIN VIH or VIN VIL,
f=0
6 ns cycle,
166 MHz
–
40
mA
Capacitance
Parameter [12]
Description
CIN
Input capacitance
CCLK
Clock input capacitance
CI/O
Input/output capacitance
Test Conditions
TA = 25 °C, f = 1 MHz,
VDD = 3.3 V, VDDQ = 2.5 V
100-pin TQFP 119-ball BGA
Max
Max
Unit
5
5
pF
5
5
pF
5
7
pF
Thermal Resistance
Parameter [12]
Description
JA
Thermal resistance
(junction to ambient)
JC
Thermal resistance
(junction to case)
Test Conditions
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA/JESD51.
100-pin TQFP 119-ball BGA
Package
Package
Unit
29.41
34.1
°C/W
6.31
14.0
°C/W
Note
12. Tested initially and after any design or process change that may affect these parameters
Document Number: 38-05542 Rev. *O
Page 19 of 32
CY7C1366C
CY7C1367C
AC Test Loads and Waveforms
Figure 3. AC Test Loads and Waveforms
3.3 V I/O Test Load
R = 317
3.3 V
OUTPUT
OUTPUT
RL = 50
Z0 = 50
GND
5 pF
R = 351
VT = 1.5 V
INCLUDING
JIG AND
SCOPE
(a)
2.5 V I/O Test Load
OUTPUT
RL = 50
Z0 = 50
Document Number: 38-05542 Rev. *O
INCLUDING
JIG AND
SCOPE
1ns
1ns
(c)
ALL INPUT PULSES
VDDQ
GND
5 pF
R =1538
(b)
90%
10%
90%
(b)
VT = 1.25 V
(a)
10%
R = 1667
2.5 V
OUTPUT
ALL INPUT PULSES
VDDQ
10%
90%
10%
90%
1ns
1ns
(c)
Page 20 of 32
CY7C1366C
CY7C1367C
Switching Characteristics
Over the Operating Range
Parameter [13, 14]
tPOWER
Description
VDD(typical) to the first access [15]
-166
Unit
Min
Max
1
–
ms
Clock
tCYC
Clock cycle time
6.0
–
ns
tCH
Clock HIGH
2.4
–
ns
tCL
Clock LOW
2.4
–
ns
Output Times
tCO
Data output valid after CLK rise
–
3.5
ns
tDOH
Data output hold after CLK rise
1.25
–
ns
1.25
–
ns
1.25
3.5
ns
–
3.5
ns
0
–
ns
–
3.5
ns
[16, 17, 18]
tCLZ
Clock to low Z
tCHZ
Clock to high Z [16, 17, 18]
tOEV
OE LOW to output valid
tOELZ
tOEHZ
OE LOW to output low Z
[16, 17, 18]
OE HIGH to output high Z
[16, 17, 18]
Setup Times
tAS
Address setup before CLK rise
1.5
–
ns
tADS
ADSC, ADSP setup before CLK rise
1.5
–
ns
tADVS
ADV setup before CLK rise
1.5
–
ns
tWES
GW, BWE, BWX setup before CLK rise
1.5
–
ns
tDS
Data input setup before CLK rise
1.5
–
ns
tCES
Chip enable setup before CLK rise
1.5
–
ns
tAH
Address hold after CLK rise
0.5
–
ns
tADH
ADSP, ADSC hold after CLK rise
0.5
–
ns
tADVH
ADV hold after CLK rise
0.5
–
ns
tWEH
GW, BWE, BWX hold after CLK rise
0.5
–
ns
tDH
Data input hold after CLK rise
0.5
–
ns
tCEH
Chip enable hold after CLK rise
0.5
–
ns
Hold Times
Notes
13. Timing reference level is 1.5 V when VDDQ = 3.3 V and is 1.25 V when VDDQ = 2.5 V.
14. Test conditions shown in (a) of Figure 3 on page 20 unless otherwise noted.
15. This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD(minimum) initially before a read or write operation can
be initiated.
16. tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of Figure 3 on page 20. Transition is measured ±200 mV from steady-state voltage.
17. At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data
bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve
high Z prior to low Z under the same system conditions.
18. This parameter is sampled and not 100% tested.
Document Number: 38-05542 Rev. *O
Page 21 of 32
CY7C1366C
CY7C1367C
Switching Waveforms
Figure 4. Read Cycle Timing [19]
tCYC
CLK
tCH
t ADS
tCL
tADH
ADSP
t ADS
tADH
ADSC
t AS
ADDRESS
tAH
A1
A2
t WES
GW, BWE,BW
A3
Burst continued with
new base address
tWEH
X
t CES
Deselect
cycle
tCEH
CE
t ADVS tADVH
ADV
ADV suspends burst
OE
t
Data Out (DQ)
High-Z
CLZ
t OEHZ
Q(A1)
t OEV
t CO
t OELZ
t DOH
Q(A2)
t CHZ
Q(A2 + 1)
Q(A2 + 2)
Q(A2 + 3)
Q(A2)
Q(A2 + 1)
Q(A3)
t CO
Single READ
BURST READ
DON’T CARE
Burst wraps around
to its initial state
UNDEFINED
Note
19. In this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
Document Number: 38-05542 Rev. *O
Page 22 of 32
CY7C1366C
CY7C1367C
Switching Waveforms (continued)
Figure 5. Write Cycle Timing [20, 21]
t CYC
CLK
tCH
t ADS
tCL
tADH
ADSP
t ADS
ADSC extends burst
tADH
t ADS
tADH
ADSC
t AS
tAH
A1
ADDRESS
A2
A3
Byte write signals are ignored for first cycle when
ADSP initiates burst
t WES tWEH
BWE,
BWX
t WES tWEH
GW
t CES
tCEH
CE
t ADVS tADVH
ADV
ADV suspends burst
OE
t
Data in (D)
High-Z
t
OEHZ
DS
t
DH
D(A1)
D(A2)
D(A2 + 1)
D(A2 + 1)
D(A2 + 2)
D(A2 + 3)
D(A3)
D(A3 + 1)
D(A3 + 2)
Data Out (Q)
BURST READ
BURST WRITE
Single WRITE
DON’T CARE
Extended BURST WRITE
UNDEFINED
Notes
20. In this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
21. Full width write can be initiated by either GW LOW; or by GW HIGH, BWE LOW and BWX LOW.
Document Number: 38-05542 Rev. *O
Page 23 of 32
CY7C1366C
CY7C1367C
Switching Waveforms (continued)
Figure 6. Read/Write Cycle Timing [22, 23, 24]
t CYC
CLK
tCL
tCH
t ADS
tADH
t AS
tAH
ADSP
ADSC
ADDRESS
A1
A2
A3
A4
A5
A6
t WES tWEH
BWE, BW X
t CES
tCEH
CE
ADV
OE
t DS
tCO
Data In (D)
t OELZ
High-Z
tCLZ
Data Out (Q)
tDH
High-Z
Q(A1)
Back-to-Back READs
tOEHZ
D(A5)
D(A3)
Q(A2)
Q(A4)
BURST READ
Single WRITE
DON’T CARE
Q(A4+1)
Q(A4+2)
D(A6)
Q(A4+3)
Back-to-Back
WRITEs
UNDEFINED
Notes
22. In this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
23. The data bus (Q) remains in high Z following a WRITE cycle, unless a new read access is initiated by ADSP or ADSC.
24. GW is HIGH.
Document Number: 38-05542 Rev. *O
Page 24 of 32
CY7C1366C
CY7C1367C
Switching Waveforms (continued)
Figure 7. ZZ Mode Timing [25, 26]
CLK
t ZZ
ZZ
I
t ZZREC
t ZZI
SUPPLY
I
t RZZI
DDZZ
A LL INPUTS
(except ZZ)
Outputs (Q)
DESELECT or READ Only
High-Z
DON’T CARE
Notes
25. Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device.
26. DQs are in high Z when exiting ZZ sleep mode.
Document Number: 38-05542 Rev. *O
Page 25 of 32
CY7C1366C
CY7C1367C
Ordering Information
The table below contains only the parts that are currently available. If you don’t see what you are looking for, please contact your
local sales representative. For more information, visit the Cypress website at www.cypress.com and refer to the product summary
page at http://www.cypress.com/products
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives and distributors. To find the office
closest to you, visit us at http://www.cypress.com/go/datasheet/offices
Speed
(MHz)
166
Ordering Code
CY7C1366C-166AXC
Package
Diagram
Part and Package Type
Operating
Range
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free
Commercial
CY7C1367C-166AXC
Ordering Code Definitions
CY 7
C 13XX C - 166 A X C
Temperature Range:
C = Commercial
Pb-free
Package Type:
A = 100-pin TQFP
Speed Grade: 166 MHz
Process Technology: C 90 nm
Part Identifier: 13XX = 1366 or 1367
1366 = DCD, 256K × 36 (9Mb)
1367 = DCD, 512K × 18 (9Mb)
Technology Code: C = CMOS
Marketing Code: 7 = SRAM
Company ID: CY = Cypress
Document Number: 38-05542 Rev. *O
Page 26 of 32
CY7C1366C
CY7C1367C
Package Diagrams
Figure 8. 100-pin TQFP (16 × 22 × 1.6 mm) Package Outline, 51-85050
ș2
ș1
ș
SYMBOL
DIMENSIONS
MIN. NOM. MAX.
A
A1
1.60
0.05
0.15
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. BODY LENGTH DIMENSION DOES NOT
INCLUDE MOLD PROTRUSION/END FLASH.
A2
1.35 1.40 1.45
D
15.80 16.00 16.20
MOLD PROTRUSION/END FLASH SHALL
D1
13.90 14.00 14.10
E
21.80 22.00 22.20
NOT EXCEED 0.0098 in (0.25 mm) PER SIDE.
BODY LENGTH DIMENSIONS ARE MAX PLASTIC
E1
19.90 20.00 20.10
R1
0.08
0.20
R2
0.08
0.20
ș
0°
7°
ș1
0°
ș2
11°
12°
13°
0.20
c
b
0.22 0.30 0.38
L
0.45 0.60 0.75
L1
L2
L3
e
BODY SIZE INCLUDING MOLD MISMATCH.
3. JEDEC SPECIFICATION NO. REF: MS-026.
1.00 REF
0.25 BSC
0.20
0.65 TYP
51-85050 *G
Document Number: 38-05542 Rev. *O
Page 27 of 32
CY7C1366C
CY7C1367C
Acronyms
Acronym
Document Conventions
Description
Units of Measure
BGA
Ball Grid Array
CE
Chip Enable
°C
degree Celsius
CMOS
Complementary Metal Oxide Semiconductor
MHz
megahertz
EIA
Electronic Industries Alliance
µA
microampere
I/O
Input/Output
mA
milliampere
JEDEC
Joint Electron Devices Engineering Council
mm
millimeter
JTAG
Joint Test Action Group
ms
millisecond
LMBU
Logical Multi-Bit Upsets
mV
millivolt
LSB
Least Significant Bit
nm
nanometer
LSBU
Logical Single-Bit Upsets
Symbol
Unit of Measure
ns
nanosecond
ohm
%
percent
pF
picofarad
MSB
Most Significant Bit
OE
Output Enable
SEL
Single Event Latch-up
V
volt
SRAM
Static Random Access Memory
W
watt
TAP
Test Access Port
TCK
Test Clock
TMS
Test Mode Select
TDI
Test Data-In
TDO
Test Data-Out
TQFP
Thin Quad Flat Pack
TTL
Transistor-Transistor Logic
Document Number: 38-05542 Rev. *O
Page 28 of 32
CY7C1366C
CY7C1367C
Document History Page
Document Title: CY7C1366C/CY7C1367C, 9-Mbit (256K × 36/512K × 18) Pipelined DCD Sync SRAM
Document Number: 38-05542
Rev.
ECN No.
Orig. of
Change
Submission
Date
**
241690
RKF
07/12/2004
New data sheet.
*A
278969
RKF
10/18/2004
Updated Boundary Scan Order (Changed to match the B rev of these devices).
Updated Boundary Scan order (Changed to match the B rev of these devices).
*B
332059
PCI
03/11/2005
Updated Features (Changed frequency from 225 MHz to 250 MHz).
Updated Selection Guide (Changed frequency from 225 MHz to 250 MHz;
unshaded 200 MHz and 166 MHz frequency related information).
Updated Pin Configurations (Address expansion pins/balls in the pinouts for
all packages are modified as per JEDEC standard).
Updated Pin Definitions (Added Address Expansion pins).
Updated Functional Overview (Added ZZ Mode Electrical Characteristics).
Updated Identification Register Definitions (Splitted Device Width (23:18) into
two rows; retained the same values for 165-ball FBGA; Changed Device Width
(23:18) for 119-ball BGA from 000110 to 101110).
Updated Electrical Characteristics (Changed frequency from 225 MHz to
250 MHz; unshaded 200 MHz and 166 MHz frequency related information;
Updated Test Conditions of VOL, VOH parameters; changed maximum value of
ISB1 parameter from 50 mA to 130 mA, 120 mA, and 110 mA for 250 MHz,
200 MHz, and 166 MHz; changed maximum value of ISB3 parameter from
50 mA to 120 mA, 110 mA, and 100 mA for 250 MHz, 200 MHz, and 166 MHz).
Updated Thermal Resistance (Changed value of JA and JC parameters
from 25 C/W and 9 C/W to 29.41 C/W and 6.31 C/W respectively for 100-pin
TQFP Package; changed value of JA and JC parameters from 25 C/W and
6 C/W to 34.1 C/W and 14.0 C/W respectively for 119-ball BGA Package;
changed value of JA and JC parameters from 27 C/W and 6 C/W to
16.8 C/W and 3.0 C/W respectively for 165-ball FBGA Package).
Updated Switching Characteristics (Changed frequency from 225 MHz to
250 MHz, unshaded 200 MHz and 166 MHz frequency related information;
replaced minimum value of tCYC parameter from 4.4 ns to 4.0 ns for 250 MHz
frequency).
Updated Ordering Information (Updated part numbers (Added lead-free
information for 100-pin TQFP, 119-ball BGA and 165-ball FBGA packages)).
*C
377095
PCI
06/10/2005
Updated Electrical Characteristics (Updated Note 11 (Modified Test Condition
from VIH < VDD to VIH VDD); changed maximum value of ISB2 parameter from
30 mA to 40 mA).
*D
408298
RXU
11/16/2005
Changed address of Cypress Semiconductor Corporation from “3901 North
First Street” to “198 Champion Court”.
Changed status from Preliminary to Final.
Updated Electrical Characteristics (Changed “Input Load Current except ZZ
and MODE” to “Input Leakage Current except ZZ and MODE” in the description
of IX parameter).
Updated Ordering Information (Updated part numbers; replaced Package
Name column with Package Diagram in the Ordering Information table).
*E
501793
VKN
09/13/2006
Updated TAP AC Switching Characteristics (Changed minimum value of tTH
and tTL parameters from 25 ns to 20 ns; changed maximum value of tTDOV
parameter from 5 ns to 10 ns).
Updated Maximum Ratings (Added the Maximum Rating for Supply Voltage
on VDDQ Relative to GND).
Updated Ordering Information (Updated part numbers).
*F
2756940
VKN
08/27/2009
Added Neutron Soft Error Immunity.
Updated Ordering Information (Updated part numbers; and modified the
disclaimer for the Ordering information).
Document Number: 38-05542 Rev. *O
Description of Change
Page 29 of 32
CY7C1366C
CY7C1367C
Document History Page (continued)
Document Title: CY7C1366C/CY7C1367C, 9-Mbit (256K × 36/512K × 18) Pipelined DCD Sync SRAM
Document Number: 38-05542
Rev.
ECN No.
Orig. of
Change
Submission
Date
*G
3046851
NJY
10/04/2010
Updated Ordering Information:
No change in part numbers.
Added Ordering Code Definitions.
Updated Package Diagrams:
spec 51-85050 – Changed revision from *B to *C.
spec 51-85115 – Changed revision from *B to *C.
spec 51-85180 – Changed revision from *B to *C.
Added Acronyms and Units of Measure.
Minor edits.
Updated to new template.
Completing Sunset Review.
*H
3370121
PRIT
09/13/2011
Updated Package Diagrams
spec 51-85050 – Changed revision from *C to *D.
Completing Sunset Review.
*I
3613540
PRIT
05/10/2012
Updated Features (Removed 250 MHz, 200 MHz frequencies related
information, removed 165-ball FBGA Package related information).
Updated Functional Description (Removed the Note “For best-practices
recommendations, refer to the Cypress application note System Design
Guidelines on www.cypress.com.” and its reference).
Updated Selection Guide (Removed 250 MHz, 200 MHz frequencies related
information).
Updated Pin Configurations (Updated Figure 2 (Removed CY7C1367C related
information), removed 165-ball FBGA Package related information).
Updated IEEE 1149.1 Serial Boundary Scan (JTAG) (Removed CY7C1367C
related information).
Updated Identification Register Definitions (Removed CY7C1367C related
information).
Updated Scan Register Sizes (Removed “Bit Size (× 18)” column).
Updated Boundary Scan Order (Removed CY7C1367C related information).
Removed Boundary Scan Order (Corresponding to 165-ball FBGA Package).
Updated Operating Range (Removed Industrial Temperature Range).
Updated Electrical Characteristics (Removed 250 MHz, 200 MHz frequencies
related information).
Updated Capacitance (Removed 165-ball FBGA Package related information).
Updated Thermal Resistance (Removed 165-ball FBGA Package related
information).
Updated Switching Characteristics (Removed 250 MHz, 200 MHz frequencies
related information).
Updated Package Diagrams:
Removed spec 51-85180 *C.
*J
3755966
PRIT
09/26/2012
Updated Package Diagrams:
spec 51-85115 – Changed revision from *C to *D.
Completing Sunset Review.
*K
4539022
PRIT
10/15/2014
Updated Ordering Information:
Updated part numbers.
Updated Package Diagrams:
spec 51-85050 – Changed revision from *D to *E.
Removed spec 51-85115 *D.
Updated to new template.
Completing Sunset Review.
*L
4575272
PRIT
11/20/2014
Updated Functional Description:
Added “For a complete list of related documentation, click here.” at the end.
Document Number: 38-05542 Rev. *O
Description of Change
Page 30 of 32
CY7C1366C
CY7C1367C
Document History Page (continued)
Document Title: CY7C1366C/CY7C1367C, 9-Mbit (256K × 36/512K × 18) Pipelined DCD Sync SRAM
Document Number: 38-05542
Rev.
ECN No.
Orig. of
Change
Submission
Date
*M
5515297
PRIT
11/09/2016
Updated Package Diagrams:
spec 51-85050 – Changed revision from *E to *F.
Updated to new template.
Completing Sunset Review.
*N
6028297
RMES
01/12/2018
Updated Package Diagrams:
spec 51-85050 – Changed revision from *F to *G.
Updated to new template.
Completing Sunset Review.
*O
6524754
RMES
03/28/2019
Updated to new template.
Document Number: 38-05542 Rev. *O
Description of Change
Page 31 of 32
CY7C1366C
CY7C1367C
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
PSoC® Solutions
Products
Arm® Cortex® Microcontrollers
Automotive
cypress.com/arm
cypress.com/automotive
Clocks & Buffers
Interface
Internet of Things
Memory
cypress.com/clocks
cypress.com/interface
cypress.com/iot
cypress.com/memory
Microcontrollers
cypress.com/mcu
PSoC
cypress.com/psoc
Power Management ICs
Touch Sensing
USB Controllers
Wireless Connectivity
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 MCU
Cypress Developer Community
Community | Projects | Video | Blogs | Training | Components
Technical Support
cypress.com/support
cypress.com/pmic
cypress.com/touch
cypress.com/usb
cypress.com/wireless
© Cypress Semiconductor Corporation, 2004–2019. This document is the property of Cypress Semiconductor Corporation and its subsidiaries (“Cypress”). This document, including any software or
firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress
reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property
rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants
you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and reproduce
the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either directly or
indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress’s patents that are infringed by the Software (as provided by
Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation of the
Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. No computing
device can be absolutely secure. Therefore, despite security measures implemented in Cypress hardware or software products, Cypress shall have no liability arising out of any security breach, such
as unauthorized access to or use of a Cypress product. CYPRESS DOES NOT REPRESENT, WARRANT, OR GUARANTEE THAT CYPRESS PRODUCTS, OR SYSTEMS CREATED USING
CYPRESS PRODUCTS, WILL BE FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE, HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION (collectively, “Security
Breach”). Cypress disclaims any liability relating to any Security Breach, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from any Security Breach. In
addition, the products described in these materials may contain design defects or errors known as errata which may cause the product to deviate from published specifications. To the extent permitted
by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or
circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the
responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. “High-Risk Device”
means any device or system whose failure could cause personal injury, death, or property damage. Examples of High-Risk Devices are weapons, nuclear installations, surgical implants, and other
medical devices. “Critical Component” means any component of a High-Risk Device whose failure to perform can be reasonably expected to cause, directly or indirectly, the failure of the High-Risk
Device, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from any use of
a Cypress product as a Critical Component in a High-Risk Device. You shall indemnify and hold Cypress, its directors, officers, employees, agents, affiliates, distributors, and assigns harmless from
and against all claims, costs, damages, and expenses, arising out of any claim, including claims for product liability, personal injury or death, or property damage arising from any use of a Cypress
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Cypress’s published data sheet for the product explicitly states Cypress has qualified the product for use in a specific High-Risk Device, or (ii) Cypress has given you advance written authorization to
use the product as a Critical Component in the specific High-Risk Device and you have signed a separate indemnification agreement.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 38-05542 Rev. *O
Revised March 28, 2019
i486 is a trademark, and Intel and Pentium are registered trademarks of Intel Corporation. PowerPC is a trademark of IBM Corporation.
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