MTP2603G6

CYStech Electronics Corp. P-CHANNEL ENHANCEMENT MODE POWER MOSFET Spec. No. : C394G6 Issued Date : 2006.11.24 Revised Date :2009.03.16 Page No. : 1/5 MTP2603G6 Description The MTP2603G6 is a P-channel enhancement-mode MOSFET, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness. The TSOP-6 package is universally preferred for all commercial-industrial surface mount applications. Features • Simple drive requirement • Low on-resistance • Small package outline • Pb-free package Equivalent Circuit MTP2603G6 G：Gate S：Source D：Drain Absolute Maximum Ratings (Ta=25°C) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @TA=25 °C (Note 1) Continuous Drain Current @TA=70 °C (Note 1) Pulsed Drain Current (Note 2, 3) Total Power Dissipation @ TA=25 °C Linear Derating Factor Operating Junction Temperature Storage Temperature Thermal Resistance, Junction-to-Ambient (Note 1) Symbol VDS VGS ID ID IDM Pd Tj Tstg Rth,ja Limits -20 ±12 -5 -4 -20 2 0.016 -55~+150 -55~+150 62.5 Unit V V A A A W W / °C °C °C °C/W Note : 1.Surface mounted on 1 in² copper pad of FR-4 board. 156℃/W when mounted on minimum copper pad. 2.Pulse width limited by maximum junction temperature. 3.Pulse Width ≤300μs, Duty Cycle≤2% MTP2603Q6 CYStek Product Specification CYStech Electronics Corp. Electrical Characteristics (Ta=25°C, unless otherwisenoted) Symbol BVDSS ΔBVDSS/ΔTj VGS(th) IGSS IDSS IDSS *RDS(ON) *GFS Ciss Coss Crss td(ON) tr td(OFF) tf Qg Qgs Qgd Min. -20 -0.5 Typ. -0.1 9 740 167 126 5.9 3.6 32.4 2.6 10.6 2.32 3.68 Max. -1.2 ±100 -1 -10 53 65 120 250 1200 16 Unit V V/℃ V nA μA μA mΩ S pF ns ns ns ns nC nC nC Spec. No. : C394G6 Issued Date : 2006.11.24 Revised Date :2009.03.16 Page No. : 2/5 Test Conditions VGS=0, ID=-250μA Reference to 25℃, ID=-1mA VDS=VGS, ID=-250μA VGS=±12V, VDS=0 VDS=-20V, VGS=0, Tj=25℃ VDS=-16V, VGS=0, Tj=55℃ ID=-4.5A, VGS=-10V ID=-4.2A, VGS=-4.5V ID=-2.0A, VGS=-2.5V ID=-1.0A, VGS=-1.8V VDS=-5V, ID=-2.8A VDS=-15V, VGS=0, f=1MHz VDS=-15V, ID=-4.2A, VGS=-10V, RGEN=6Ω, RD=3.6Ω VDS=-16V, ID=-4.2A, VGS=-4.5V, *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Source Drain Diode Symbol *VSD *Trr Qrr Min. Typ. 27.7 22 Max. -1.2 Unit V ns nC Test Conditions IS=-1.2A,VGS=0V IS=-4.2A,VGS=0V,dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% MTP2603Q6 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Spec. No. : C394G6 Issued Date : 2006.11.24 Revised Date :2009.03.16 Page No. : 3/5 MTP2603Q6 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves(Cont.) Spec. No. : C394G6 Issued Date : 2006.11.24 Revised Date :2009.03.16 Page No. : 4/5 MTP2603Q6 CYStek Product Specification CYStech Electronics Corp. TSOP-6 Dimension Spec. No. : C394G6 Issued Date : 2006.11.24 Revised Date :2009.03.16 Page No. : 5/5 Marking: ● Style: Pin 1. Gate1 (G1) Pin 2. Source2 (S2) Pin 3. Gate2 (G2) Pin 4. Drain2 (D2) Pin 5. Source1 (S1) Pin 6. Drain1 (D1) Device Name Date Code 2603 □□□□ 6-Lead TSOP-6 Plastic Surface Mounted Package CYStek Package Code: G6 DIM A B C D d1 d2 E F Inches Min. Max. 0.1063 0.1220 0.1024 0.1181 0.0551 0.0709 0.0748 REF 0.0374 REF 0.0374 REF 0.0118 0.0197 0.0276 0.0394 Millimeters Min. Max. 2.70 3.10 2.60 3.00 1.40 1.80 1.90 REF 0.95 REF 0.95 REF 0.30 0.50 0.70 1.00 DIM G H I J K L M Inches Min. Max. 0 0.0039 0.0098 0.0047 REF 0.0177 REF 0.0236 REF 0° 10° 0.0433 Millimeters Min. Max. 0 0.10 0.25 0.12 REF 0.45 REF 0.60 REF 0° 10° 1.10 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; pure tin plated • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTP2603Q6 CYStek Product Specification