DS1386P-32-120+

DS1386/DS1386P RAMified Watchdog Timekeeper www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS1386 is a nonvolatile static RAM with a full-function real-time clock (RTC), alarm, watchdog timer, and interval timer that are all accessible in a byte-wide format. The DS1386 contains a lithium energy source and a quartz crystal, which eliminates the need for any external circuitry. Data contained within 8k or 32k by 8-bit memory and the timekeeping registers can be read or written in the same manner as byte-wide static RAM. The timekeeping registers are located in the first 14 bytes of memory space. Data is maintained in the RAMified timekeeper by intelligent control circuitry, which detects the status of VCC and write protects memory when VCC is out of tolerance. The lithium energy source can maintain data and real time for over ten years in the absence of VCC. Timekeeper information includes hundredths of seconds, seconds, minutes, hours, day, date, month, and year. The date at the end of the month is automatically adjusted for months with less than 31 days, including correction for leap year. The RAMified timekeeper operates in either 24hour or 12-hour format with an AM/PM indicator. The watchdog timer provides alarm interrupts and interval timing between 0.01 seconds and 99.99 seconds. The real-time alarm provides for preset times of up to one week. Interrupts for both watchdog and RTC operate when the system is powered down. Either can provide system “wakeup” signals. 8kB or 32kB of User NV RAM Integrated NV SRAM, Real-Time Clock, Crystal, Power-Fail Control Circuit, and Lithium Energy Source Totally Nonvolatile With Over 10 Years of Operation in the Absence of Power Watchdog Timer Restarts an Out-OfControl Processor Alarm Function Schedules Real-Time Related Activities such as System Wakeup Programmable Interrupts and SquareWave Output All Registers are Individually Addressable via the Address and Data Bus Interrupt Signals are Active in PowerDown Mode Pin Configurations appear at end of data sheet. ORDERING INFORMATION PART DS1386-8-120 DS1386-8-120+ DS1386-32-120 DS1386-32-120+ DS1386P-8-120 DS1386P-8-120+ DS1386P-32-120 DS1386P-32-120+ TEMP RANGE 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C VOLTAGE (V) 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 PIN-PACKAGE 32 EMOD (0.740″) 32 EMOD (0.740″) 32 EMOD (0.740″) 32 EMOD (0.740″) 34 PowerCap* 34 PowerCap* 34 PowerCap* 34 PowerCap* TOP MARK DS1386-8K-120 DS1386-8K+120 DS1386-32K-120 DS1386-32K+120 DS1386P-8K-120 DS1386P+8K-120 DS1386P-32K-120 DS1386P+32K-120 + Denotes a lead-free/RoHS-compliant device. * DS9034PCX PowerCap required (must be ordered separately). 1 of 21 REV: 010307 DS1386/1386P PIN DESCRIPTION PIN EMOD 8k x 8 32k x 8 1 1 2 2 3, 28 — 12 11 10 9 8 7 6 5 27 26 23 25 4 — — 16 12 11 10 9 8 7 6 5 27 26 23 25 4 28 3 16 13, 14, 15, 17– 21 13, 14, 15, 17– 21 22 24 29 30, 32 31 — — — 22 24 29 30, 32 31 — — — PowerCap 8k x 8 32k x 8 34 34 1 1 2, 3, 2, 3 31, 32 18 18 19 19 20 20 21 21 22 22 23 23 24 24 25 25 26 26 27 27 28 28 29 29 30 30 — 31 — 32 17 17 16–9 16–9 8 7 6 — 33 4 8 7 6 — 33 4 NAME FUNCTION INTA INTB Active-Low Interrupt Output A (Open Drain) Active-Low Interrupt Output B (Open Drain) N.C. No Connection A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 GND DQ0, DQ1, DQ2, DQ3– DQ7 CE OE WE VCC SQW PFO X1, X2 VBAT Address Inputs Ground Data Input/Output Active-Low Chip Enable Active-Low Output Enable Active-Low Write Enable +5V Power Supply Square-Wave Output Active-Low Power-Fail Output Crystal Connections Battery Connection 2 of 21 DS1386/1386P PACKAGES The DS1386 is available in two packages (32-pin encapsulated DIP module and 34-pin PowerCap module). The 32-pin DIP style module integrates the crystal, lithium energy source, and silicon all in one package. The 34-pin PowerCap Module Board is designed with contacts for connection to a separate PowerCap (DS9034PCX) that contains the crystal and battery. This design allows the PowerCap to be mounted on top of the DS1386P after the completion of the surface mount process. Mounting the PowerCap after the surface mount process prevents damage to the crystal and battery due to high temperatures required for solder reflow. The PowerCap is keyed to prevent reverse insertion. The PowerCap Module Board and PowerCap are ordered separately and shipped in separate containers. The part number for the PowerCap is DS9034PCX. OPERATION—READ REGISTERS The DS1386 executes a read cycle whenever WE (Write Enable) is inactive (High), CE (Chip Enable) and OE (Output Enable) are active (Low). The unique address specified by the address inputs (A0-A14) defines which of the registers is to be accessed. Valid data will be available to the eight data output drivers within tACC (Access Time) after the last address-input signal is stable, providing that CE and OE access times are also satisfied. If OE and CE access times are not satisfied, then data access must be measured from the latter occurring signal (CE or OE) and the limiting parameter is either tCO for CE or tOE for OE rather than address access. OPERATION—WRITE REGISTERS The DS1386 is in the write mode whenever the WE (Write Enable) and CE (Chip Enable) signals are in the active (Low) state after the address inputs are stable. The latter occurring falling edge of CE or WE will determine the start of the write cycle. The write cycle is terminated by the earlier rising edge of CE or WE. All address inputs must be kept valid throughout the write cycle. WE must return to the high state for a minimum recovery state (tWR) before another cycle can be initiated. Data must be valid on the data bus with sufficient Data Set-Up (tDS) and Data Hold Time (tDH) with respect to the earlier rising edge of CE or WE. The OE control signal should be kept inactive (High) during write cycles to avoid bus contention. However, if the output bus has been enabled (CE and OE active), then WE will disable the outputs in tODW from its falling edge. DATA RETENTION The RAMified Timekeeper provides full functional capability when VCC is greater than 4.5V and writeprotects the register contents at 4.25V typical. Data is maintained in the absence of VCC without any additional support circuitry. The DS1386 constantly monitors VCC. Should the supply voltage decay, the RAMified Timekeeper will automatically write-protect itself and all inputs to the registers become “don’t care.” The two interrupts INTA and INTB (INTB) and the internal clock and timers continue to run regardless of the level of VCC. However, it is important to insure that the pull-up resistors used with the interrupt pins are never pulled up to a value that is greater than VCC + 0.3V. As VCC falls below approximately 3.0V, a power-switching circuit turns the internal lithium energy source on to maintain the clock and timer data and functionality. It is also required to insure that during this time (battery backup mode), the voltage present at INTA and INTB (INTB) never exceeds 3.0V. During power-up, when VCC rises above approximately 3.0V, the power switching circuit connects external VCC and disconnects the internal lithium energy source. Normal operation can resume after VCC exceeds 4.5V for a period of 200ms. 3 of 21 DS1386/1386P RAMIFIED TIMEKEEPER REGISTERS The RAMified Timekeeper has 14 registers, which are 8 bits wide that contain all of the timekeeping, alarm, and watchdog and control information. The clock, calendar, alarm, and watchdog registers are memory locations, which contain external (user-accessible) copies of the timekeeping data. The external copies are independent of internal functions except that they are updated periodically by the simultaneous transfer of the incremented internal copy (see Figure 1). The Command Register bits are affected by both internal and external functions. This register will be discussed later. The 8 or 32kbytes of RAM and the 14 external timekeeping registers are accessed from the external address and data bus. Registers 0, 1, 2, 4, 6, 8, 9, and A contain time of day and date information (see Figure 2). Time of day information is stored in BCD. Registers 3, 5, and 7 contain the Time of Day Alarm information. Time of Day Alarm information is stored in BCD. Register B is the Command Register and information in this register is binary. Registers C and D are the Watchdog Alarm Registers and information, which is stored in these two registers, is in BCD. Registers E through 1FFF or 7FFF are user bytes and can be used to maintain data at the user’s discretion. CLOCK ACCURACY (DIP MODULE) The DS1386 is guaranteed to keep time accuracy to within ±1 minute per month at +25°C. CLOCK ACCURACY (POWERCAP MODULE) The DS1386P and DS9034PCX are each individually tested for accuracy. Once mounted together, the module is guaranteed to keep time accuracy to within ±1.53 minutes per month (35ppm) at +25°C. 4 of 21 DS1386/1386P Figure 1. Block Diagram 5 of 21 DS1386/1386P TIME-OF-DAY REGISTERS Registers 0 through A contain time, date, and alarm data in BCD. Fifteen bits within these 11 registers are not used and will always read 0 regardless of how they are written. Bits 6 and 7 in the Months Register (9) are binary bits. When set to logic 0, EOSC (Bit 7) enables the RTC oscillator. This bit is set to logic 1 as shipped from Dallas Semiconductor to prevent lithium energy consumption during storage and shipment (DIP Module only). This bit will normally be turned on by the user during device initialization. However, the oscillator can be turned on and off as necessary by setting this bit to the appropriate level. Bit 6 of this same byte controls the square wave output. When set to logic 0, the square wave output pin will output a 1024Hz square wave signal. When set to logic 1 the square wave output pin is in a high impedance state. Bit 6 of the Hours Register is defined as the 12- or 24-hour select bit. When set to logic 1, the 12-hour format is selected. In the 12-hour format, bit 5 is the AM/PM bit with logic 1 being PM. In the 24-hour mode, bit 5 is the second 10-hour bit (20-23 hours). The Time of Day Registers are updated every 0.01 seconds from the Real Time Clock, except when the TE bit (bit 7 of Register B) is set low or the clock oscillator is not running. The preferred method of synchronizing data access to and from the RAMified Timekeeper is to access the Command Register by doing a write cycle to address location 0B and setting the TE bit (transfer enable bit) to a logic 0. This will freeze the External Time of Day Registers at the present recorded time, allowing access to occur without danger of simultaneous update. When the watch registers have been read or written, a second write cycle to location 0B, setting the TE bit to a logic 1, will put the Time of Day Registers back to being updated every 0.01 second. No time is lost in the Real Time Clock because the internal copy of the Time of Day Register buffers is continually incremented while the external memory registers are frozen. An alternate method of reading and writing the Time of Day Registers is to ignore synchronization. However, any single read may give erroneous data as the Real Time Clock may be in the process of updating the external memory registers as data is being read. The internal copies of seconds through years are incremented, and the time of day alarm is checked during the period that hundreds of seconds reads 99 and are transferred to the external register when hundredths of seconds roll from 99 to 00. A way of making sure data is valid is to do multiple reads and compare. Writing the registers can also produce erroneous results for the same reasons. A way of making sure that the write cycle has caused proper update is to do read verifies and re-execute the write cycle if data is not correct. While the possibility of erroneous results from reads and write cycles has been stated, it is worth noting that the probability of an incorrect result is kept to a minimum due to the redundant structure of the RAMified Timekeeper. TIME-OF-DAY ALARM REGISTERS Registers 3, 5, and 7 contain the Time of Day Alarm Registers. Bits 3, 4, 5, and 6 of Register 7 will always read 0 regardless of how they are written. Bit 7 of Registers 3, 5, and 7 are mask bits (Table 1). When all of the mask bits are logic 0, a Time of Day Alarm will only occur when Registers 2, 4, and 6 match the values stored in Registers 3, 5, and 7. An alarm will be generated every day when bit 7 of Register 7 is set to a logic 1. Similarly, an alarm is generated every hour when bit 7 of Registers 7 and 5 is set to a logic 1. When bit 7 of Registers 7, 5, and 3 is set to a logic 1, an alarm will occur every minute when Register 1 (seconds) rolls from 59 to 00. Time of Day Alarm Registers are written and read in the same format as the Time of Day Registers. The Time of Day Alarm Flag and Interrupt are always cleared when Alarm Registers are read or written. 6 of 21 DS1386/1386P WATCHDOG ALARM REGISTERS Registers C and D contain the time for the watchdog alarm. The two registers contain a time count from 00.01 to 99.99 seconds in BCD. The value written into the Watchdog Alarm Registers can be written or read in any order. Any access to Register C or D will cause the watchdog alarm to reinitialize and clears the watchdog flag bit and the watchdog interrupt output. When a new value is entered or the Watchdog Registers are read, the watchdog timer will start counting down from the entered value to zero. When zero is reached, the watchdog interrupt output will go to the active state. The watchdog timer countdown is interrupted and reinitialized back to the entered value every time either of the registers are accessed. In this manner, controlled periodic accesses to the watchdog timer can prevent the watchdog alarm from going to an active level. If access does not occur, countdown alarm will be repetitive. The Watchdog Alarm Registers always read the entered value. The actual countdown register is internal and is not readable. Writing registers C and D to 0 will disable the watchdog alarm feature. 7 of 21 DS1386/1386P Figure 2. DS1386 RAMified Watchdog Timekeeper Registers Table 1. Time-of-Day Alarm Mask Bits (3) MINUTES 1 0 0 0 REGISTER (5) HOURS 1 1 0 0 (7) DAYS 1 1 1 0 DESCRIPTION Alarm Once Per Minute Alarm When Minutes Match Alarm When Hours and Minutes Match Alarm When Hours, Minutes and Days Match Note: Any other bit combinations of mask bit settings produce illogical operation. 8 of 21 DS1386/1386P COMMAND REGISTER Address location 0Bh is the Command Register where mask bits, control bits and flag bits reside. The operation of each bit is as follows: Bit 7: TE (Transfer Enable). This bit when set to a logic 0 will disable the transfer of data between internal and external clock registers. The contents in the external clock registers are now frozen and reads or writes will not be affected with updates. This bit must be set to a logic 1 to allow updates. Bit 6: IPSW (Interrupt Switch). When set to a logic 1, INTA is the Time of Day Alarm and INTB/(INTB) is the Watchdog Alarm. When set to logic 0, this bit reverses the output pins. INTA is now the watchdog alarm output and INTB/(INTB) is the time of day alarm output. Bit 5: IBH/LO (Interrupt B Sink or Source Current). When this bit is set to a logic 1 and VCC is applied, INTB/(INTB) will source current (see DC characteristics IOH). When this bit is set to a logic 0, INTB will sink current (see DC characteristics IOL). Bit 4: PU/LVL (Interrupt Pulse Mode or Level Mode). This bit determines whether both interrupts will output a pulse or level signal. When set to a logic 0, INTA and INTB/(INTB) will be in the level mode. When this bit is set to a logic 1, the pulse mode is selected and INTA will sink current for a minimum of 3ms and then release. INTB/(INTB) will either sink or source current, depending on the condition of Bit 5, for a minimum of 3ms and then release. INTB will only source current when there is a voltage present on VCC. Bit 3: WAM (Watchdog Alarm Mask). When this bit is set to a logic 0, the watchdog interrupt output will be activated. The activated state is determined by bits 1,4,5, and 6 of the Command Register. When this bit is set to a logic 1, the watchdog interrupt output is deactivated. Bit 2: TDM (Time-of-Day Alarm Mask). When this bit is set to a logic 0, the time of day alarm interrupt output will be activated. The activated state is determined by bits 0,4,5, and 6 of the Command Register. When this bit is set to a logic 1, the time of day alarm interrupt output is deactivated. Bit 1: WAF (Watchdog Alarm Flag). This bit is set to a logic 1 when a watchdog alarm interrupt occurs. This bit is read only. The bit is reset when any of the watchdog alarm registers are accessed. When the interrupt is in the pulse mode (see bit 4 definition), this flag will be in the logic 1 state only during the time the interrupt is active. Bit 0: TDF (Time-of-Day Flag). This is a read-only bit. This bit is set to a logic 1 when a time of day alarm has occurred. The time the alarm occurred can be determined by reading the time of day alarm registers. This bit is reset to a logic 0 state when any of the time of day alarm registers are accessed. When the interrupt is in the pulse mode (see bit 4 definition), this flag will be in the logic 1 state only during the time the interrupt is active. 9 of 21 DS1386/1386P ABSOLUTE MAXIMUM RATINGS Voltage Range on Any Pin Relative to Ground……………………………………………..-0.3V to +7.0V Operating Temperature Range………………………………………………………………...0°C to +70°C Storage Temperature Range………………………………………………………………...-40°C to +70°C Soldering Temperature…………………………..See IPC/JEDEC J-STD-020 Specification (See Note 14) This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. RECOMMENDED DC OPERATING CONDITIONS (TA = 0°C to +70°C) PARAMETER SYMBOL MIN TYP MAX UNITS NOTES Supply Voltage VCC 4.5 5.0 5.5 V 10 Input Logic 1 VIH 2.2 VCC + 0.3 V 10 Input Logic 0 VIL -0.3 +0.8 V 10 MAX UNITS NOTES DC ELECTRICAL CHARACTERISTICS (VCC = 5.0V ±10%, TA = 0°C to +70°C.) PARAMETER SYMBOL MIN TYP Input Leakage Current IIL -1.0 +1.0 µA Output Leakage Current ILO -1.0 +1.0 µA I/O Leakage Current ILIO -1.0 +1.0 µA Output Current at 2.4V IOH -1.0 Output Current at 0.4V IOL mA 2.1 mA Standby Current CE = 2.2V ICCS1 3.0 7.0 mA Standby Current CE = VCC 0.5 ICCS2 2.0 4.0 mA 85 mA Active Current ICC Write Protection Voltage VTP 4.0 4.25 4.5 V MIN TYP MAX UNITS CIN 7 15 pF Output Capacitance COUT 7 15 pF Input/Output Capacitance CI/O 7 15 pF 13 CAPACITANCE (TA = 25°C) PARAMETER Input Capacitance SYMBOL 10 of 21 NOTES DS1386/1386P AC ELECTRICAL CHARACTERISTICS (VCC = 5.0V ±10%, TA = 0°C to 70°C.) PARAMETER Read Cycle Time SYMBOL tRC DS1386XX-120 MIN MAX 120 UNITS ns NOTES 1 Address Access Time tACC 120 ns CE Access Time tCO 120 ns OE Access Time tOE 100 ns OE or CE to Output Active tCOE Output High-Z from Deselect tOD Output Hold from Address Change tOH 10 ns Write Cycle Time tWC 120 ns Write Pulse Width tWP 110 ns Address Setup Time tAW 0 ns Write Recovery Time tWR 10 ns Output High-Z from WE tODW Output Active from WE tOEW 10 ns Data Setup Time tDS 85 ns 4 Data Hold Time tDH 10 ns 4, 5 INTA, INTB Pulse Width tIPW 3 ms 11, 12 10 ns 40 40 11 of 21 ns 3 ns DS1386/1386P READ CYCLE (Note 1) WRITE CYCLE 1 (Notes 2, 6, 7) WRITE CYCLE 2 (Notes 2, 8) 12 of 21 DS1386/1386P TIMING DIAGRAM—INTERRUPT OUTPUTS PULSE MODE (See Notes 11 and 12) POWER-DOWN/POWER-UP TIMING 13 of 21 DS1386/1386P AC ELECTRICAL CHARACTERISTICS POWER-UP/POWER-DOWN TIMING (TA = 0°C to +70°C) PARAMETER SYMBOL MIN MAX UNITS CE High to Power Fail tPF 0 ns Recovery at Power-Up tREC 200 ms VCC Slew Rate Power-Down VCC Slew Rate Power-Down tF 300 tFB 3.0 ≤ VCC ≤ 4.25V 10 4.0 ≤ VCC ≤ 4.5V VCC Slew Rate Power-Up tR 4.5V ≥ VCC ≥ 4.0V 0 Expected Data Retention tDR 10 NOTES µs µs µs Years 9 WARNING: Under no circumstances are negative undershoots, of any amplitude, allowed when device is in battery-backup mode. 14 of 21 DS1386/1386P NOTES: 1) WE is high for a read cycle. 2) OE = VIH or VIL. If OE = VIH during write cycle, the output buffers remain in a high impedance state. 3) tWP is specified as the logical AND of the CE and WE. tWP is measured from the latter of CE or WE going low to the earlier of CE or WE going high. 4) tDS or tDH are measured from the earlier of CE or WE going high. 5) tDH is measured from WE going high. If CE is used to terminate the write cycle, then tDH = 20ns for -120 parts and tDH = 25ns for -150 parts. 6) If the CE low transition occurs simultaneously with or later than the WE low transition in write cycle 1, the output buffers remain in a high impedance state during this period. 7) If the CE high transition occurs prior to or simultaneously with the WE high transition, the output buffers remain in a high impedance state during this period. 8) If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition, the output buffers remain in a high impedance state during this period. 9) Each DS1386 is marked with a four-digit date code AABB. AA designates the year of manufacture. BB designates the week of manufacture. The expected tDR is defined for DIP modules as starting at the date of manufacture. 10) All voltages are referenced to ground. 11) Applies to both interrupt pins when the alarms are set to pulse. 12) Interrupt output occurs within 100ns on the alarm condition existing. 13) Both INTA and INTB (INTB) are open-drain outputs. 14) Real-Time Clock modules (DIP) can be successfully processed through conventional wave-soldering techniques as long as temperature exposure to the lithium energy source contained within does not exceed +85°C. Post solder cleaning with water washing techniques is acceptable, provided that ultrasonic vibration is not used. In addition, for the PowerCap version: a. Dallas Semiconductor recommends that PowerCap module bases experience one pass through solder reflow oriented with the label side up (“live-bug”). b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to remove solder. 15 of 21 DS1386/1386P AC TEST CONDITIONS AC TEST CONDITIONS Input Levels: 0V to 3V Transition Times: 5ns Output Load: 50pF + 1TTL Gate Input Pulse Levels: 0 to 3.0V Timing Measurement Reference Levels Input: 1.5V Output: 1.5V Input Pulse Rise and Fall Times: 5ns PIN CONFIGURATIONS TOP VIEW INTA INTB N.C. A12 A7 A6 A5 A4 A3 A2 A1 A0 INTA INTB A14 A12 A7 A6 A5 A4 A3 A2 A1 VCC SQW VCC 32 1 31 2 3 DS1386 30 29 4 28 5 27 6 26 7 25 8 24 9 23 10 22 11 21 12 CE DQ7 WE N.C. A8 A9 A11 OE A10 A0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 32 31 30 29 28 27 26 25 24 23 22 21 VCC SQW VCC WE A13 A8 A9 A11 OE A10 CE DQ7 DQ0 13 20 DQ6 DQ0 13 20 DQ6 DQ1 DQ2 14 19 19 15 16 DQ3 GND 16 18 17 DQ5 DQ4 GND 18 17 DQ1 DQ2 14 15 DQ5 DQ4 8k x 8 Encapsulated Module INTB(INTB) N.C. N.C. PFO VCC WE OE CE DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 GND 1 2 3 DS1386 4 5 6 7 8 9 10 11 12 DS1386P X1 GND VBAT X2 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 DQ3 32k x 8 Encapsulated Module INTA SQW N.C. N.C. A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 INTB(INTB) N.C. N.C. PFO VCC WE OE CE DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 DS1386P X1 GND VBAT X2 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 32k x 8 PowerCap Module Board (Uses DS9034PCX PowerCap) 8k x 8 PowerCap® Module Board (Uses DS9034PCX PowerCap) 16 of 21 INTA SQW A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 DS1386/1386P PACKAGE INFORMATION (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/DallasPackInfo.) 17 of 21 DS1386/1386P PACKAGE INFORMATION (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/DallasPackInfo.) 18 of 21 DS1386/1386P PACKAGE INFORMATION (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/DallasPackInfo.) 19 of 21 DS1386/1386P PACKAGE INFORMATION (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/DallasPackInfo.) 20 of 21 DS1386/1386P PACKAGE INFORMATION (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/DallasPackInfo.) 21 of 21 Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product. No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2007 Maxim Integrated Products The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.