19-0892; Rev 3; 12/96
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
The MAX154/MAX158 are high-speed multi-channel
analog-to-digital converters (ADCs). The MAX154 has
four analog input channels while the MAX158 has eight
channels. Conversion time for both devices is 2.5µs.
The MAX154/MAX158 also feature a 2.5V on-chip reference, forming a complete high-speed data acquisition
system.
Both converters include a built-in track/hold, eliminating
the need for an external track/hold. The analog input
range is 0V to +5V, although the ADC operates from a
single +5V supply.
Microprocessor interfaces are simplified by the ADC’s
ability to appear as a memory location or I/O port without
the need for external logic. The data outputs use latched,
three-state buffer circuitry to allow direct connection to a
microprocessor data bus or system input port.
____________________________Features
♦ One-Chip Data Acquisition System
♦ Four or Eight Analog Input Channels
♦ 2.5µs per Channel Conversion Time
♦ Internal 2.5V Reference
♦ Built-In Track/Hold Function
♦ 1/2LSB Error Specification
♦ Single +5V Supply Operation
♦ No External Clock
♦ New Space-Saving SSOP Package
______________Ordering Information
TEMP. RANGE
MAX154ACNG
0°C to +70°C
24 Narrow
Plastic DIP
±1/2
MAX154BCNG
0°C to +70°C
24 Narrow
Plastic DIP
±1
MAX154BC/D
0°C to +70°C
Dice
±1/2
±1/2
________________________Applications
Digital Signal Processing
High-Speed Data Acquisition
PIN-PACKAGE
ERROR
(LSB)
PART
MAX154ACWG
0°C to +70°C
24 Wide SO
Telecommunications
MAX154BCWG
0°C to +70°C
24 Wide SO
High-Speed Servo Control
MAX154ACAG
0°C to +70°C
24 SSOP
±1/2
Audio Instrumentation
MAX154BCAG
0°C to +70°C
24 SSOP
±1
±1
Ordering Information continued at end of data sheet.
__________________________________________________________Pin Configurations
TOP VIEW
AIN4 1
24 VDD
AIN3 2
23 N.C.
AIN2 3
22 A0
AIN1 4
21 A1
REF OUT 5
MAX154
20 DB7
AIN6 1
28 AIN7
AIN5 2
27 AIN8
AIN4 3
26 VDD
AIN3 4
25 A0
AIN2 5
MAX158
AIN1 6
24 A1
23 A2
19 DB6
REF OUT 7
22 DB7
DB1 7
18 DB5
DB0 8
21 DB6
DB2 8
17 DB4
DB1 9
20 DB5
16 CS
DB2 10
19 DB4
15 RDY
DB3 11
18 CS
14 VREF+
RD 12
17 RDY
13 VREF-
INT 13
16 VREF+
GND 14
15 VREF-
DB0 6
DB3 9
RD 10
INT 11
GND 12
DIP/SO/SSOP
DIP/SO/SSOP
________________________________________________________________ Maxim Integrated Products
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800
MAX154/MAX158
_______________General Description
MAX154/MAX158
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VDD to GND.........................................0V, +10V
Voltage at Any Other Pins........................GND -0.3V, VDD +0.3V
Output Current (REF OUT)..................................................30mA
Power Dissipation (any package) to +75°C ....................450mW
Derate above +25°C by ..............................................6mW/°C
Operating Temperature Ranges
MAX15_ _C_ _.....................................................0°C to +70°C
MAX15_ _E_ _ ..................................................-40°C to +85°C
MAX15_ _M_ _ ...............................................-55°C to +125°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10sec) .............................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = +5V, VREF+ = +5V, VREF- = GND, Mode 0, TA = TMIN to TMAX, unless otherwise noted).
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ACCURACY
Resolution
8
Bits
MAX15_A
MAX15_B
Total Unadjusted Error (Note 1)
No-Missing-Codes Resolution
±1/2
±1
8
LSB
Bits
Channel-to-Channel Mismatch
±1/4
LSB
REFERENCE INPUT
Reference Resistance
1
4
kΩ
VREF+ Input Voltage Range
VREF-
VDD
V
VREF- Input Voltage Range
GND
VREF+
V
REFERENCE OUTPUT (Note 2)
Output Voltage
2.50
2.53
V
Load Regulation
REF OUT
IL = 0mA to 10mA, TA = +25°C
-6
-10
mV
Power-Supply Sensitivity
VDD ±5%, TA = +25°C
±1
±3
mV
MAX15_ _C
40
70
MAX15_ _E
40
70
MAX15_ _M
60
100
Temperature Drift (Note 3)
Output Noise
TA = +25°C
2.47
eN
200
Capacitive Load
ppm/°C
µV/rms
0.01
µF
VREF+
V
±3
µA
0.157
V/µs
ANALOG INPUT
Analog Input Voltage Range
AINR
Analog Input Capacitance
CAIN
Analog Input Current
IAIN
VREF45
Any channel, AIN = 0V to 5V
Slew Rate, Tracking
SR
–—– –—–
LOGIC INPUTS ( RD , CS , A0, A1, A2)
0.7
pF
Input High Voltage
VINH
Input Low Voltage
VINL
0.8
V
Input High Current
IINH
1
µA
Input Low Current
IINL
-1
µA
Input Capacitance (Note 4)
CIN
8
pF
2
2.4
V
5
_______________________________________________________________________________________
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
(VDD = +5V, VREF+ = +5V, VREF- = GND, MODE 0, TA = TMIN to TMAX, unless otherwise noted).
PARAMETER
SYMBOL
CONDITIONS
MIN
DB0-DB7, INT; IOUT = -360µA
4.0
TYP
MAX
UNITS
LOGIC OUTPUTS
Output High Voltage
Output Low Voltage
VOH
VOL
Three-State Output Current
Output Capacitance (Note 4)
DB0-DB7, INT; RDY
V
IOUT = 1.6mA
0.4
IOUT = 2.6mA
0.4
DB0-DB7, RDY; VOUT = 0V to VDD
COUT
5
V
±3
µA
8
pF
POWER-SUPPLY
Supply Voltage
VDD
5V ±5% for specified performance
Supply Current
IDD
CS = RD = 2.4V
PSS
VDD = ±5%
4.75
Power Dissipation
Power-Supply Sensitivity
Note 1:
Note 2:
Note 3:
Note 4:
5.25
V
15
mA
25
75
mW
±1/16
±1/4
LSB
Total unadjusted error includes offset, full-scale, and linearity errors.
Specified with no external load unless otherwise noted.
Temperature drift is defined as change in output voltage from +25°C to TMIN or TMAX divided by (25 - TMIN) or (TMAX - 25).
Guaranteed by design.
TIMING CHARACTERISTICS (Note 5)
(VDD = +5V, VREF+ = +5V, VREF- = GND, MODE 0, TA = TMIN to TMAX, unless otherwise noted).
PARAMETER
SYMBOL
TA = +25°C
CONDITIONS
MIN
TYP
MAX
MAX15_C/E
MIN
MAX
MAX15_M
MIN
UNITS
MAX
CS to RD Setup Time
tCSS
0
0
0
ns
CS to RD Hold Time
tCSH
0
0
0
ns
Multiplexer Address
Setup Time
tAS
0
0
0
ns
Multiplexer Address
Hold Time
tAH
30
35
40
ns
CS to RDY Delay
tRDY
CL = 50pF, RL = 5kΩ
30
40
1.6
2.0
85
60
60
ns
2.4
2.8
µs
110
120
ns
Conversion Time (Mode 0)
tCRD
Data Access Time After RD
tACC1
(Note 6)
Data Access Time
After INT, Mode 0
tACC2
(Note 6)
20
50
60
70
ns
RD to INT Delay (Mode 1)
tINTH
CL = 50pF
40
75
100
100
ns
60
70
70
ns
Data Hold Time
tDH
Delay Time
Between Conversions
RD Pulse Width (Mode 1)
(Note 7)
tP
500
tRD
60
500
600
80
600
500
80
ns
400
ns
Note 5: All input control signals are specified with tR = tF = 20ns (10% to 90% of +5V) and timed from a 1.6V voltage level.
Note 6: Measured with load circuits of Figure 1 and defined as the time required for an output to cross 0.8V or 2.4V.
Note 7: Defined as the time required for the data lines to change 0.5V when loaded with the circuits of Figure 2.
_______________________________________________________________________________________
3
MAX154/MAX158
ELECTRICAL CHARACTERISTICS (continued)
__________________________________________Typical Operating Characteristics
(TA = +25°C, unless otherwise noted.)
OUTPUT CURRENT
vs. TEMPERATURE
VDD = 5V
2.500
2.490
VDD = 5V
VREF = 5V
LINEARITY ERROR (LSB)
16
OUTPUT CURRENT (mA)
2.510
2.0
MX7824/28-2
20
MX7824/28-1
2.520
ACCURACY
vs. DELAY BETWEEN CONVERSIONS (tp)
ISOURCE VOUT = 2.4V
12
8
ISINK VOUT = 0.4V
4
1.5
1.0
0.5
0
2.480
0
50
0
-100
150
100
-50
0
300
400
500
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
ACCURACY vs. VREF
[VREF = VREF(+) - VREF(-)]
600
700
8
IDD – SUPPLY CURRENT (mA)
MX7824/28-4
VDD = 5V
1.5
1.0
0.5
0
7
VDD = 5.25V
6
5
VDD = 5V
4
VDD = 4.75V
3
2
0
1
2
3
4
5
-100
VREF (V)
-50
0
50
100
150
AMBIENT TEMPERATURE (°C)
+5V
+5V
3k
3k
10pF
100pF
DGND
a. High-Z to VOH
DGND
b. High-Z to VOL
Figure 1. Load Circuits for Data-Access Time Test
4
DBN
DBN
DBN
DBN
3k
800
tp (ns)
POWER-SUPPLY CURRENT vs. TEMPERATURE
(NOT INCLUDING REFERENCE LADDER)
2.0
LINEARITY ERROR (LSB)
150
100
50
MX7824/28-5
-50
MX7824/28-3
REFERENCE TEMPERATURE DRIFT
REF OUT VOLTAGE (V)
MAX154/MAX158
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
3k
10pF
100pF
DGND
a. High-Z to VOH
DGND
b. High-Z to VOL
Figure 2. Load Circuits for Data-Hold Time Test
_______________________________________________________________________________________
900
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
PIN
MAX154
NAME
FUNCTION
PIN
MAX158
NAME
FUNCTION
1
AIN4
Analog Input Channel 4
1
AIN6
Analog Input Channel 6
2
AIN3
Analog Input Channel 3
2
AIN5
Analog Input Channel 5
AIN4
Analog Input Channel 4
3
AIN2
Analog Input Channel 2
3
4
AIN1
Analog Input Channel 1
4
AIN3
Analog Input Channel 3
5
AIN2
Analog Input Channel 2
6
AIN1
Analog Input Channel 1
7
REF OUT
8
DB0
Three-State Data Output, bit 0 (LSB)
9
DB1
Three-State Data Output, bit 1
10
DB2
Three-State Data Output, bit 2
11
DB3
Three-State Data Output, bit 3
5
REF OUT
Reference Output (2.5V) for MAX154
6
DBO
Three-State Data Output, bit 0 (LSB)
Reference Output (2.5V) for MAX158
7
DB1
Three-State Data Output, bit 1
8
DB2
Three-State Data Output, bit 2
9
DB3
Three-State Data Output, bit 3
10
RD
Read Input. RD controls conversions and
data access. See Digital Interface section.
12
RD
11
INT
Interrupt Output. INT going low indicates the completion of a conversion.
See Digital Interface section.
Read Input. RD controls conversions
and data access.
See Digital Interface section.
12
GND
Ground
13
INT
13
VREF-
Lower Limit of Reference Span. Sets
the zero-code voltage.
Range: GND to VREF+.
Interrupt Output. INT going low indicates the completion of a conversion.
See Digital Interface section.
14
GND
Ground
VREF+
Upper Limit of Reference Span. Sets
the full-scale input voltage.
Range: VREF- to VDD.
15
VREF-
Lower Limit of Reference Span. Sets
the zero-code voltage.
Range: GND to VREF+.
Ready Output. Open-drain output with
no active pull-up device. Goes low
when CS goes low and high impedance at the end of a conversion.
16
VREF+
Upper Limit of Reference Span. Sets
the full-scale input voltage.
Range: VREF- to VDD.
17
RDY
Ready Output. Open-drain output with
no active pull-up device. Goes low
when CS goes low and high impedance at the end of a conversion.
18
CS
–
Chip-Select input. CS must be low for
the device to be selected.
14
15
RDY
Chip-Select Input. CS must be low for
the device to be selected.
16
CS
17
DB4
Three-State Data Output, bit 4
18
DB5
Three-State Data Output, bit 5
19
DB6
Three-State Data Output, bit 6
19
DB4
Three-State Data Output, bit 4
20
DB7
Three-State Data Output, bit 7 (MSB)
20
DB5
Three-State Data Output, bit 5
Channel Address 1 Input
21
DB6
Three-State Data Output, bit 6
22
DB7
Three-State Data Output, bit 7 (MSB)
23
A2
Channel Address 2 Input
24
A1
Channel Address 1 Input
25
A0
Channel Address 0 Input
26
VDD
Power-Supply Voltage, +5V
27
AIN8
Analog Input Channel 8
28
AIN7
Analog Input Channel 7
21
A1
22
A0
Channel Address 0 Input
23
NC
No Connect
24
VDD
Power-Supply Voltage, +5V
_______________________________________________________________________________________
5
MAX154/MAX158
_____________________________________________________________Pin Descriptions
MAX154/MAX158
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
_______________Detailed Description
___________________Digital Interface
Converter Operations
The MAX154/MAX158 use only Chip Select (CS) and
Read (RD) as control inputs. A READ operation, taking
CS and RD low, latches the multiplexer address inputs
and starts a conversion (Table 1).
The MAX154/MAX158 use what is commonly called a
"half-flash" conversion technique (Figure 3). Two 4-bit
flash ADC converter sections are used to achieve an 8bit result. Using 15 comparators, the upper 4-bit MS
(most significant) flash ADC compares the unknown
input voltage to the reference ladder and provides the
upper four data bits.
Table 1. Truth Table for Input Channel
Selection
MAX154/MX7824
A1
A0
0
0
0
1
1
0
1
1
An internal DAC uses the MS bits to generate an analog
signal from the first flash conversion. A residue voltage
representing the difference between the unknown input
and the DAC voltage is then compared to the reference
ladder by 15 LS (least significant) flash comparators to
obtain the lower four output bits.
Operating Sequence
The operating sequence is shown in Figure 4. A conversion is initiated by a falling edge of RD and CS. The
comparator inputs track the analog input voltage for
approximately 1µs. After this first cycle, the MS flash
result is latched into the output buffers and the LS conversion begins. INT goes low approximately 600ns later,
indicating the end of the conversion, and that the lower
four bits are latched into the output buffers. The data
can then be accessed using the CS and RD inputs.
VREF+
AIN1
VREF+
16
AIN8
REF OUT
DB7
DB6
2.5V
REF
*MAX154 – 4-Channel Mux
MAX158 – 8-Channel Mux
DB5
DB4
THREESTATE
DRIVERS
4-BIT
DAC
MUX*
A1
A2
DB3
4-BIT
FLASH
ADC
(4LSB)
ADDRESS
LATCH
DECODE
A0
DB2
DB1
DB0
TIMING AND CONTROL
CIRCUITRY
RDY
CS
INT
RD
Figure 3. Functional Diagram
6
SELECTED
CHANNEL
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
AIN8
There are two interface modes, which are determined
by the length of the RD input. Mode 0, implemented by
keeping RD low until the conversion ends, is designed
for microprocessors that can be forced into a WAIT
state. In this mode, a conversion is started with a READ
operation (taking CS and RD low), and data is read
when the conversion ends. Mode 1, on the other hand,
does not require microprocessor WAIT states. A READ
operation simultaneously initiates a conversion and
reads the previous conversion result.
4-BIT
FLASH
ADC
(4MSB)
VREF-
AIN4
MAX158/MX7828
A2
A1
A0
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
_______________________________________________________________________________________
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
500ns
1000ns
SETUP TIME REQUIRED
BY THE INTERNAL
COMPARATORS PRIOR TO
STARTING CONVERSION
600ns
VIN IS SAMPLED
AND THE FOUR MSBs
ARE LATCHED
Interface Mode 1
VIN IS TRACKED
BY INTERNAL
COMPARATORS
Figure 4. Operating Sequence
Interface Mode 0
Figure 5 shows the timing diagram for Mode 0 operation. This is used with microprocessors that have WAIT
state capability, whereby a READ instruction is extended to accommodate slow-memory devices. Taking CS
and RD low latches the analog multiplexer address and
starts a conversion. Data outputs DB0–DB7 remain in
the high-impedance condition until the conversion is
complete.
There are two status outputs: Interrupt (INT) and Ready
(RDY). RDY, an open-drain output (no internal pull-up
Mode 1 is designed for applications where the microprocessor is not forced into a WAIT state. Taking CS
and RD low latches the multiplexer address and starts
a conversion (Figure 6). Data from the previous
conversion is immediately read from the outputs
(DB0–DB7).
INT goes high at the rising edge of CS or RD and goes
low at the end of the conversion. A second READ operation is required to read the result of this conversion.
The second READ latches a new multiplexer address
and starts another conversion. A delay of 2.5µs must
be allowed between READ operations. RDY goes low
on the falling edge of CS and goes high impedance at
the rising edge of CS. If RDY is not needed, its external
pull-up resistor can be omitted.
CS
tCSH
tCSS
tCSS
RD
tP
tAS
tAS
ANALOG
CHANNEL
ADDRESS
ADDR
VALID
ADDR
VALID
tAH
RDY
tRDY
INT
tINTH
tCRD
tACC2
HIGH IMPEDANCE
DATA
tDH
DATA
VALID
Figure 5. Mode 0 Timing Diagram
_______________________________________________________________________________________
7
MAX154/MAX158
INT GOING LOW INDICATES
THAT CONVERSION IS
COMPLETE AND THAT
DATA CAN BE READ
RD
device), is connected to the processor’s READY/WAIT
input. RDY goes low on the falling edge of CS and goes
high impedance at the end of the conversion, when the
conversion result appears on the data outputs. If the
RDY output is not required, its external pull-up resistor
can be omitted. INT goes low when the conversion is
complete and returns high on the rising edge of CS or
RD.
MAX154/MAX158
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
CS
tRD
tCSS
tCSH
tCSS
tCSH
tRD
RD
tP
tAS
tAS
ANALOG
CHANNEL
ADDRESS
ADDR
VALID
ADDR
VALID
tAH
tAH
RDY
tRDY
tRDY
tCRD
tINTH
INT
tACCI
tINTH
tDH
tDH
tACCI
OLD
DATA
DATA
NEW
DATA
Figure 6. Mode 1 Timing Diagram
_____________Analog Considerations
Reference and Input
The VREF+ and VREF- inputs of the converter define the
zero and the full-scale of the ADC. In other words, the
voltage at VREF- is equal to the input voltage that produces an output code of all zeros, and the voltage at
VREF+ is equal to input voltage that produces an output
code of all ones (Figure 7).
Figure 8 shows some possible reference configurations. A 0.01µF bypass capacitor to GND should be
used to reduce the high-frequency output impedance
of the internal reference. Larger capacitors should not
be used, as this degrades the stability of the reference
buffer. The 2.5V reference output is with respect to the
GND pin.
Bypassing
A 47µF electrolytic and 0.1µF ceramic capacitor should
be used to bypass the VDD pin to GND. These capacitors must have minimum lead length, since excess lead
length may contribute to conversion errors and instability. If the reference inputs are driven by long lines,
they should be bypassed to GND with 0.1µF capacitors at the reference input pins.
8
OUTPUT
CODE
FULL-SCALE
TRANSITION
11111111
11111110
11111101
1LSB = F8 = VREF+ - VREF256
256
00000011
00000010
VREF+
00000001
00000000
VREF-
1
2
3
FS
AIN INPUT VOLTAGE
(IN TERMS OF LSBs)
Figure 7. Transfer Function
_______________________________________________________________________________________
FS–1LSB
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
AINx(+)
VIN
AINx(-)
GND
MAX154
MAX158
VDD
+5V
REFOUT
0.1µF
47µF
VREF+
0.01µF
VREF-
Figure 8a. Internal Reference
AINx(+)
VIN
AINx(-)
GND
VDD
+5V
0.1µF
MAX154
MAX158
VREF-
Figure 8b. Power Supply as Reference
* Current path must
still exist from
VIN(-) to Ground
Sinusoidal Inputs
AINx(+)
VIN
GND
VDD
+5V
0.1µF
Input Filtering
The transients in the analog input caused by the sampled data comparators do not degrade the converter’s
performance, since the ADC does not “look” at the
input when these transients occur. The comparator’s
outputs track the input during the first 1µs of the conversion, and are then latched. Therefore, at least 1µs
will be provided to charge the ADC’s input capacitance. It is not necessary to filter these transients with
an external capacitor on the AIN terminals.
VREF+
47µF
VREF+
47µF
2.5V
VREF-
AINx(-)
*
Figure 8c. Inputs Not Referenced to GND
MAX154
MAX158
The MAX154/MAX158 can measure input signals with
slew rates as high as 157mV/µs to the rated specifications.
This means that the analog input frequency can be as
high as 10kHz without the aid of an external track/hold.
The maximum sampling rate is limited by the conversion
time (typical tCRD = 2µs) plus the time required between
conversions (tp = 500ns). It is calculated as:
fMAX =
1
1
=
= 400kHz
tCRD + tp
(2.0 + 0.5) µs
fMAX permits a maximum sampling rate of 50kHz per
channel when using the MAX158 and 100kHz per
channel when using the MAX154. These rates are well
above the Nyquist requirement of 20kHz sampling rate
for a 10kHz input bandwidth.
_______________________________________________________________________________________
9
MAX154/MAX158
Input Current
The converters’ analog inputs behave somewhat differently from conventional ADCs. The sampled data comparators take varying amounts of current from the input,
depending on the cycle they are in. The equivalent circuit of the converter is shown in Figure 9a. When the
conversion starts, AIN(n) is connected to the MS and
LS comparators. Thus, AIN(n) is connected to thirty-one
1pF capacitors.
To acquire the input signal in approximately 1µs, the input
capacitors must charge to the input voltage through the
on-resistance of the multiplexer (about 600Ω) and the
comparator’s analog switches (2kΩ to 5kΩ per comparator). In addition, about 12pF of stray capacitance must be
charged. The input can be modeled as an equivalent RC
network shown in Figure 9b. As RS (source impedance)
increases, the capacitors take longer to charge.
Since the length of the input acquisition time is internally set, large source resistances (greater than 100Ω) will
cause settling errors. The output impedance of an opamp is its open-loop output impedance divided by the
loop gain at the frequency of interest. It is important
that the amplifier driving the converter input have sufficient loop gain at approximately 1MHz to maintain low
output impedance.
MAX154/MAX158
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
Bipolar Input Operation
The circuit in Figure 10a can be used for bipolar input
operation. The input voltage is scaled by an amplifier
so that only positive voltages appear at the ADC’s
inputs. The analog input range is ±4V and the output
code is complementary offset binary. The ideal
input/output characteristic is shown in Figure 10b.
FS = 8V
1LSB = FS / 256
11111111
11111110
11111101
RS
AIN1
VIN
RMUX
CS
12pF
10000010
CS
2pF
RON
10000001
+FS
2
10000000
1pF
1pF
•
TO LS
•
LADDER
•
15 LSB COMPARATORS
01111111
-FS + 1LSB
2
01111110
00000010
00000001
00000000
RON
0V
1pF
1pF
•
TO MS
•
LADDER
•
16 MSB COMPARATORS
Figure 9a. Equivalent Input Circuit
RS
VIN
AIN1
B MUX
600Ω
Figure 10b. Transfer Function for ±4V Input Operation
RON
350Ω
CS2
2pF
CS1
2pF
AIN INPUT VOLTAGE (LSBs)
32pF
A15
ADDRESS BUS
A0
Figure 9b. RC Network Model
3.57k
VIN
CS
AIN1
10.0k
MAX154
MAX158
16.2k
RDY
RD
0.01µF
VREF+
INT
ADDRESS
DECODE
CS
5k
VDD
D0-D7
47µF
GND
ONLY CHANNEL 1 SHOWN
DATA BUS
DB0-DB7
*A2 ON MAX158.
Figure 11. Simple Mode 0 Interface
Figure 10a. Bipolar ±4V Input Operation
10
MAX154
MAX158
RD
RD
VREF0.1µF
A1
RDY
WAIT
REFOUT
+5V
A0
5V
ZBO
0.01µF
EN
MREQ
11.5Ω
______________________________________________________________________________________
DB0-DB7
A2*
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
+5V
26
PART
VDD
BANDPASS
FILTER 1
6
BANDPASS
FILTER 2
MAX154AENG -40°C to +85°C
AIN1
CS
18
RD
12
BANDPASS
FILTER 8
±1/2
MAX154BEWG -40°C to +85°C
MAX154AEAG -40°C to +85°C
MAX154BEAG -40°C to +85°C
24 Wide SO
24 SSOP
24 SSOP
±1
±1/2
±1
23
MAX154AMRG -55°C to +125°C
MAX154BMRG -55°C to +125°C
MAX158ACPI
0°C to +70°C
0°C to +70°C
MAX158BCPI
MAX158BC/D
0°C to +70°C
24 CERDIP
24 CERDIP
28 Plastic DIP
28 Plastic DIP
Dice
±1/2
±1
±1/2
±1
±1/2
24
MAX158ACWI
0°C to +70°C
28 Wide SO
±1/2
MAX158BCWI
0°C to +70°C
28 Wide SO
±1
MAX158ACAI
0°C to +70°C
28 SSOP
MAX158BCAI
0°C to +70°C
28 SSOP
MAX158AEPI
-40°C to +70°C
28 Plastic DIP
±1/2
MAX158BEPI
-40°C to +85°C
28 Plastic DIP
±1
MAX158AEWI
-40°C to +85°C
28 Wide SO
DATA
AIN7
27 AIN8
16
+5V
A1
VREF+
A0
VREF15
25
GND
14
Figure 12. Speech Analysis Using Real-Time Filtering
VDD
16
CS
10
RD
4 AIN1
3 AIN2
2 AIN3
INT 11
12
±1
±1/2
-40°C to +85°C
28 Wide SO
-40°C to +85°C
28 SSOP
MAX158BEAI
-40°C to +85°C
28 SSOP
MAX158AMJI
-55°C to +125°C
28 CERDIP
±1/2
MAX158BMJI
-55°C to +125°C
28 CERDIP
±1
15
18
VDD
±1
+5V
VREF 4
WR
VOUT A 2
MAX506
DB0-DB7
±1
±1/2
+5V
VOUT B 1
VOUT C
DB0-DB7
14 V
REF+
13
±1/2
MAX158AEAI
MAX154
1 AIN4
±1
MAX158BEWI
SAMPLE
PULSE
+5V
24
±1/2
24 Plastic DIP
DB0-DB7
A2
24 Plastic DIP
24 Wide SO
AMP
28
ERROR
(LSB)
MAX154AEWG -40°C to +85°C
5 AIN2
BANDPASS
FILTER 7
PIN-PACKAGE
MAX154BENG -40°C to +85°C
MAX158
SPEECH
INPUT
TEMP. RANGE
VOUT D
VREF-
A1 21
16
A1
GND
A0
22
17
A0
DGND
20
19
6
AGND 5
VSS
A0
A1
3
Figure 13. 4-Channel Fast Sample and Infinite Hold
______________________________________________________________________________________
11
MAX154/MAX158
_Ordering Information (continued)
MAX154/MAX158
CMOS High-Speed 8-Bit ADCs with
Multiplexer and Reference
___________________Chip Topography
AIN4 AIN6 AIN8
(N.C.) (AIN2) (AIN4)
AIN3 AIN5 AIN7
(N.C.) (AIN1) (AIN3)
VDD A0
A1
A2 (N.C.)
AIN2 (N.C.)
AIN1 (N.C.)
TP (REF OUT)
0.127"
(3.228mm)
DB7
DB0
DB6
DB1
DB5
DB2
DB4
DB3
CS
A0
GND VREF+
INT VREF-
ADY
0.124"
(3.150mm)
( ) ARE FOR MAX154/MX7824
________________________________________________________Package Information
DIM
α
E
H
C
L
A
A1
B
C
D
E
e
H
L
α
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.068
0.078
1.73
1.99
0.002
0.008
0.05
0.21
0.010
0.015
0.25
0.38
0.004
0.008
0.09
0.20
SEE VARIATIONS
0.205
0.209
5.20
5.38
0.0256 BSC
0.65 BSC
0.301
0.311
7.65
7.90
0.025
0.037
0.63
0.95
0˚
8˚
0˚
8˚
DIM PINS
e
SSOP
SHRINK
SMALL-OUTLINE
PACKAGE
A
B
A1
D
D
D
D
D
14
16
20
24
28
INCHES
MILLIMETERS
MAX
MIN MAX MIN
6.33
0.239 0.249 6.07
6.33
0.239 0.249 6.07
7.33
0.278 0.289 7.07
8.33
0.317 0.328 8.07
0.397 0.407 10.07 10.33
21-0056A
D
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 __________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600
© 1996 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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