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MAX5217GUA+T

MAX5217GUA+T

  • 厂商:

    AD(亚德诺)

  • 封装:

    TSSOP8

  • 描述:

    IC DAC 16BIT V-OUT 8UMAX

  • 数据手册
  • 价格&库存
MAX5217GUA+T 数据手册
EVALUATION KIT AVAILABLE MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface General Description The MAX5215/MAX5217 are pin-compatible 14-bit and 16-bit digital-to-analog converters (DACs). The MAX5215/MAX5217 are single-channel, low-powered, buffered voltage-output DACs. The devices use a precision external reference applied through the high resistance input for rail-to-rail operation and low system power consumption. The MAX5215/MAX5217 accept a wide 2.7V to 5.5V supply voltage range. Power consumption is extremely low to accommodate most low-power and low-voltage applications. The MAX5215/MAX5217 have an I2C-compatible, 2-wire serial interface that operates at clock rates up to 400kHz. On power-up, the MAX5215/MAX5217 reset the DAC output to zero, providing additional safety for applications that drive valves or other transducers that need to be off on power-up. The DAC output is buffered resulting in a low supply current of 80µA (max) and a low offset error of ±0.25mV. An asynchronous active-low input, AUX, is provided. This input can be programmed to support clear or load DAC operations, independent of the serial interface. The MAX5215/MAX5217 are available in an ultra-small (3mm x 5mm), 8-pin µMAXM package and are specified over the -40°C to +105°C extended industrial temperature range. Applications Remote Sensing Portable Instrumentation Communication Systems Automatic Tuning Gain and Offset Adjustment Power Amplifier Control Automatic Test Equipment Process Control and Servo Loops Data Acquisition Programmable Voltage and Current Sources Features S Low-Power Consumption (80µA, max) S 18µs Settling Time S 16-/14-Bit Resolution in a 3mm x 5mm, 8-Pin µMAX Package S Relative Accuracy  ±0.4 LSB INL (MAX5215, 14 Bit) typ, 1 LSB (max)  ±1.2 LSB INL (MAX5217, 16 Bit) typ, 4 LSB (max) S Guaranteed Monotonic Over All Operating Range S Low Gain and Offset Error S Wide 2.7V to 5.5V Supply Range S Rail-to-Rail Buffered Output Operation S Safe Power-Up-Reset to Zero DAC Output S I2C-Compatible 400kHz Serial Interface S User-Programmable AUX Input Functions  CLR, Clear to 0, Midscale, or Full Scale  LDAC, Asynchronous Load DAC S 256kI Reference Input Resistance for Low-Power Operation S Buffered Voltage Output Directly Drives 10kI Loads S Output Power-Down Terminated with 1kI or 100kI to Ground or Left High Impedance Ordering Information appears at end of data sheet. µMAX is a registered trademark of Maxim Integrated Products, Inc. Functional Block Diagram VDD REF POR ADDR I2C SERIAL INTERFACE SCL SDA CODE REGISTER DAC REGISTER 14-/16-BIT DAC OUT BUFFER MAX5215 MAX5217 100kI 1kI GND ( ) FOR AUX CONFIGURED AS CLR AUX = CLR /LDAC For related parts and recommended products to use with this part, refer to: www.maximintegrated.com/MAX5215.related For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com. 19-6469; Rev 0; 11/12 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface ABSOLUTE MAXIMUM RATINGS VDD to GND..............................................................-0.3V to +6V ADDR, REF, OUT, AUX to GND........-0.3V to the lower of (VDD + 0.3V) and +6V SCL, SDA, to GND...................................................-0.3V to +6V Continuous Power Dissipation (TA = +70NC) FMAX (derate at 4.8mW/NC above 70NC).....................387mW Maximum Current into Any Input or Output..................... Q50mA Operating Temperature Range......................... -40NC to +105NC Storage Temperature Range............................. -65NC to +150NC Lead Temperature (soldering, 10s).................................+300NC Soldering Temperature (reflow).......................................+260NC Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) FMAX Junction-to-Ambient Thermal Resistance (BJA).........206NC/W Junction-to-Case Thermal Resistance (BJC)................42NC/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (VDD = 2.7V to 5.5V, VREF = 2.5V to VDD, CL = 60pF, RL = 10kI, TA = -40NC to 105NC, unless otherwise noted. Typical values are at TA = +25NC.)(Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS STATIC ACCURACY (Note 3) Resolution Integral Nonlinearity Differential Nonlinearity Offset Error N INL DNL OE MAX5215 14 MAX5217/MAX5217B 16 MAX5215 (14 bit) (Note 4) -1 Q0.4 +1 MAX5217 (16 bit) (Note 4) -4 Q1.2 +4 +8 MAX5217B (16 bit) (Note 4) -8 Q3 MAX5215 (14 bit) (Note 4) -1 Q0.1 +1 MAX5217/5217B (16 bit) (Note 4) -1 Q0.25 +1 -1.25 Q0.25 +1.25 -3 Q0.5 -3 MAX5215/5217 (Note 5) -0.06 -0.04 0 MAX5217B (Note 5) -0.10 -0.04 0 MAX5215/5217 (Note 5) MAX5217B (Note 5) Offset-Error Drift Gain Error Bits Q1.6 GE Gain Temperature Coefficient LSB LSB mV FV/NC %FS ppm FS/ NC Q2 REFERENCE INPUT Reference-Input Voltage Range VREF 2 Reference-Input Impedance RREF 200 VDD 256 V kI DAC OUTPUT Output Voltage Range (Note 6) DC Output Impedance Maxim Integrated No load 0 10kI load to GND 0 10kI load to VDD 0.2 VDD VDD - 0.2 V VDD 0.1 I   2 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface ELECTRICAL CHARACTERISTICS (continued) (VDD = 2.7V to 5.5V, VREF = 2.5V to VDD, CL = 60pF, RL = 10kI, TA = -40NC to 105NC, unless otherwise noted. Typical values are at TA = +25NC.)(Note 2) PARAMETER SYMBOL Maximum Capacitive Load (No Sustained Oscillations) CL Resistive Load (Note 7) RL CONDITIONS MIN Series resistance = 0I TYP MAX 0.1 Series resistance = 1kI UNITS nF 15 FF 5 kI Short-Circuit Current VDD = 5.5V Power-Up Time From power-down mode 25 Fs Positive and negative 0.5 V/Fs ¼ scale to ¾ scale, to Q0.5 LSB, 14 bit. 18 Fs Hex code = 2000 (MAX5215), Hex code = 8000 (MAX5217) 100 kHz Digital Feedthrough Code = 0, all digital inputs from 0V to VDD, SCL < 400kHz 1.0 nV·s DAC Glitch Impulse Major code transition 5 nV·s 1kHz 73 10kHz 70 0.1Hz to 10Hz 3.5 -25 Q6 +25 mA DYNAMIC PERFORMANCE (Note 7) Voltage-Output Slew Rate SR Voltage-Output Settling Time Reference –3dB Bandwidth BW Output Noise Integrated Output Noise nV/√Hz FVP-P POWER REQUIREMENTS Supply Voltage VDD Supply Current IDD Power-Down Supply Current PDIDD 2.7 5.5 V No load; all digital inputs at 0V or VDD, supply current only; excludes reference input current. 70 80 FA No load, all digital inputs at 0V or VDD 0.4 2 FA DIGITAL INPUTS (SCL, SDA, AUX, ADDR ) Input High Voltage VIH Input Low Voltage VIL Hysteresis Voltage VHYS Input Leakage Current IIN Input Capacitance (Note 7) CIN ADDR Pullup/Pulldown Strength 0.7 x VDD V 0.3 x VDD 0.15 VIN = 0V or VDD (Note 8) Q0.1 30 50 V V Q1 FA 10 pF 90 kI 0.2 V DIGITAL OUTPUT (SDA) Output Low Voltage Maxim Integrated VOL ISINK = 3mA   3 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface ELECTRICAL CHARACTERISTICS (continued) (VDD = 2.7V to 5.5V, VREF = 2.5V to VDD, CL = 60pF, RL = 10kI, TA = -40NC to 105NC, unless otherwise noted. Typical values are at TA = +25NC.)(Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 400 kHz TIMING CHARACTERISTICS SCL Clock Frequency fSCL sBus Free Time Between a STOP and a START Condition tBUF 1.3 Fs Hold Time for a Repeated START Condition tHD;STA 0.6 Fs SCL Pulse Width Low tLOW 1.3 Fs SCL Pulse Width High tHIGH 0.6 Fs Setup Time for Repeated START Condition tSU;STA 0.6 Fs Data Hold Time tHD;DAT 0 Data Setup Time tSU;DAT 100 900 ns ns SDA and SCL Receiving Rise Time tr 20 + CB/10 300 ns SDA and SCL Receiving Fall Time tf 20 + CB/10 300 ns tf 20 + CB/10 250 SDA Transmitting Fall Time Setup Time for STOP Condition tSU;STO Bus Capacitance Allowed CB Pulse Width of Suppressed Spike tSP CLR Removal Time Prior to a Recognized START 0.6 VDD = 2.7V to 5.5V ns Fs 10 400 50 pF ns tCLRSTA 100 ns CLR Pulse Width Low tCLPW 20 ns LDAC Pulse Width Low tLDPW 20 ns 400 ns SCLK Rise to LDAC Fall Hold tLDH Applies to execution edge Note 2: Electrical specifications are production tested at TA = +25°C and TA = +105°C. Specifications over the entire operating temperature range are guaranteed by design and characterization. Typical specifications are at TA = +25°C and are not guaranteed. Note 3: Static accuracy tested without load. Note 4: Linearity is tested within 20mV of GND and VDD. Note 5: Gain and offset is tested within 20mV of GND and VDD. Note 6: Subject to offset and gain error limits and VREF settings. Note 7: Specification is guaranteed by design and characterization. Note 8: Unconnected conditions on the ADDR_ inputs are sensed through a resistive pullup and pulldown operation; for proper operation, the ADDR_ inputs must be connected to VDD, GND, or left unconnected with minimal capacitance. Maxim Integrated   4 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface SDA tLOW tf tSU;DAT tr tHD;STA tf tSP tBUF tr SCL tHD;STA tCLPW S tHIGH tSU;STA tHD;DAT tSU;STO Sr P CLR tLDPW tLDH tCLRSTA S LDAC Figure 1. I2C Serial Interface Timing Diagram Typical Operating Characteristics (VDD = 5V, TA = +25°C, unless otherwise noted.) 0.4 0.2 0.2 0 -0.2 0 -0.4 -0.6 -0.6 -0.8 -0.8 -1.0 4096 8192 12288 DIGITAL INPUT CODE (LSB) Maxim Integrated 16384 0 -1 -2 -1.0 0 MAX5217 VREF = 5V 2 1 -0.2 -0.4 3 MAX5215 toc02a 0.6 0.4 INL (LSB) INL (LSB) 0.6 MAX5215 VREF = 2.5V 0.8 INTEGRAL NONLINEARITY vs. DIGITAL INPUT CODE INL (LSB) MAX5215 VREF = 5V 0.8 1.0 MAX5215 toc01a 1.0 INTEGRAL NONLINEARITY vs. DIGITAL INPUT CODE MAX5215 toc01b INTEGRAL NONLINEARITY vs. DIGITAL INPUT CODE -3 0 4096 8192 12288 DIGITAL INPUT CODE (LSB) 16384 0 16384 32768 49152 65536 DIGITAL INPUT CODE (LSB)   5 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface Typical Operating Characteristics (continued) (VDD = 5V, TA = +25°C, unless otherwise noted.) 1.5 0 -1 MAX5217 0 -0.5 -1.0 0 MIN -0.50 -0.75 -1.00 2.7 DEVICE NUMBER 3.5 3.9 4.3 4.7 SUPPLY VOLTAGE (V) INTEGRAL NONLINEARITY vs. SUPPLY VOLTAGE INTEGRAL NONLINEARITY vs. TEMPERATURE INTEGRAL NONLINEARITY vs. TEMPERATURE 65536 MAX5217 2 1.00 MIN 7 9 11 13 15 17 19 MAX5215 0.50 INL (LSB) 0 5 0.75 MAX 1 3 3 0 MIN -0.25 -1 5.1 5.5 MAX5217 MAX 1 MAX 0.25 3.1 2 INL (LSB) 3 1 MAX5215 toc05a 49152 MAX5215 toc04b 32768 MAX5215 toc05b DIGITAL INPUT CODE (LSB) 16384 0 INL (LSB) MAX 0.25 -0.25 -2.0 -2.5 -3.0 -3 MAX5215 0.75 0.50 1.0 0.5 -1.5 -2 1.00 INL (LSB) INL MIN/MAX (LSB) INL (LSB) 1 VREF = 5.0V VREF = 2.5V VREF = 5.0V VREF = 2.5V 2.5 2.0 MAX5215 toc03 MAX5217 VREF = 2.5V 2 3.0 MAX5215 toc02b 3 INTEGRAL NONLINEARITY vs. SUPPLY VOLTAGE INL MIN/MAX (VREF = 5.0V/2.5V) MAX5215 toc04a INTEGRAL NONLINEARITY vs. DIGITAL INPUT CODE 0 MIN -1 -0.50 -2 -0.75 -1.00 -3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 -3 -40 5.5 SUPPLY VOLTAGE (V) -20 0 20 40 60 TEMPERATURE (°C) 80 -40°C +25°C +105°C COUNT (units) 60 50 40 30 80 100 MAX5217 -40°C +25°C +105°C 60 50 40 30 10 10 Maxim Integrated 20 40 60 TEMPERATURE (°C) 20 20 0 0 70 COUNT (units) 70 -20 80 MAX5215 toc06a MAX5215 -40 MAX(ABS(INL)) DISTRIBUTION vs. TEMPERATURE MAX(ABS(INL)) DISTRIBUTION vs. TEMPERATURE 80 100 MAX5215 toc06b -2 0 0 0.10 0.20 0.30 0.40 0.50 0.60 0.70 LSB 0 0.4 0.8 1.2 1.6 LSB 2.0 2.4 2.8   6 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface Typical Operating Characteristics (continued) (VDD = 5V, TA = +25°C, unless otherwise noted.) MAX5215 VREF = 5V 0.3 DIFFERENTIAL NONLINEARITY vs. DIGITAL INPUT CODE MAX5215 VREF = 2.5V 0.5 0.3 MAX5215 toc07c 0.5 MAX5215 toc07a 0.5 DIFFERENTIAL NONLINEARITY vs. DIGITAL INPUT CODE MAX5215 toc07b DIFFERENTIAL NONLINEARITY vs. DIGITAL INPUT CODE MAX5217 VREF = 5V 0.4 0.3 -0.1 0.1 DNL (LSB) DNL (LSB) DNL (LSB) 0.2 0.1 -0.1 0.1 0 -0.1 -0.2 -0.3 -0.3 -0.5 -0.5 -0.3 -0.4 12288 16384 16384 16384 32768 65536 49152 DIFFERENTIAL NONLINEARITY vs. DIGITAL INPUT CODE DNL MIN/MAX (VREF = 5.0V/2.5V) DIFFERENTIAL NONLINEARITY vs. SUPPLY VOLTAGE VREF = 5.0V VREF = 2.5V VREF = 5.0V VREF = 2.5V 0.8 0.6 MAX5217 0.5 MAX5215 toc08 1.0 0.3 0.2 0.1 -0.1 DNL (LSB) 0.2 0.1 DNL (LSB) 0.4 0 0 -0.2 -0.2 -0.3 -0.6 -0.3 -0.4 -0.8 -0.4 -0.5 -1.0 32768 49152 65536 MIN -0.1 -0.4 16384 MAX 0 -0.2 0 MAX5215 0.4 0.2 -0.5 3 1 5 7 9 11 13 15 17 19 3.1 2.7 3.5 3.9 4.3 4.7 5.1 DEVICE NUMBER SUPPLY VOLTAGE (V) DIFFERENTIAL NONLINEARITY vs. SUPPLY VOLTAGE DIFFERENTIAL NONLINEARITY vs. TEMPERATURE DIFFERENTIAL NONLINEARITY vs. TEMPERATURE 0.2 0.4 0.3 MAX DNL (LSB) 0.1 0 -0.1 -0.2 MAX5215 0.4 0.2 0.1 0.1 MAX 0 -0.1 MIN 0 -0.3 -0.4 -0.4 -0.4 -0.5 -0.5 3.9 4.3 4.7 SUPPLY VOLTAGE (V) Maxim Integrated 5.1 5.5 MIN -0.2 -0.3 3.5 MAX -0.1 -0.3 3.1 MAX5217 0.3 0.2 -0.2 MIN 0.5 DNL (LSB) 0.3 0.5 MAX5215 toc10a MAX5217 0.4 5.5 MAX5215 toc10b DIGITAL INPUT CODE (LSB) 0.5 2.7 0 DIGITAL INPUT CODE (LSB) MAX5215 toc09b DNL (LSB) 12288 DIGITAL INPUT CODE (LSB) 0.3 DNL (LSB) 8192 DIGITAL INPUT CODE (LSB) MAX5217 VREF = 2.5V 0.4 -0.5 4096 0 MAX5215 toc07d 0.5 8192 MAX5215 toc09a 4096 0 -0.5 -40 -20 0 20 40 60 TEMPERATURE (°C) 80 100 -40 -20 0 20 40 60 80 100 TEMPERATURE (°C)   7 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface Typical Operating Characteristics (continued) (VDD = 5V, TA = +25°C, unless otherwise noted.) 0.75 0.50 MAX5215 0 2 0 0 3.5 3.9 4.3 4.7 5.1 5.5 -40 -20 0 GAIN ERROR vs. SUPPLY -0.02 -0.03 MAX5215 -0.04 DRIFT (µV/°C) GAIN ERROR vs. TEMPERATURE VREF = 2.5V 14 10 -0.02 -0.03 MAX5215 -0.04 3.5 3.9 4.7 5.1 -0.06 5.5 -40 -20 0 0 20 40 60 80 SUPPLY VOLTAGE (V) TEMPERATURE (°C) FULL-SCALE OUTPUT vs. SUPPLY VOLTAGE FULL-SCALE OUTPUT vs. TEMPERATURE 2.498 MAX5215 2.496 2.494 2.492 MAX5217 MAX5215 2.496 2.494 2.492 VREF = 2.5V 2.490 2.7 3.1 3.5 3.9 4.3 4.7 SUPPLY VOLTAGE (V) Maxim Integrated 5.1 5.5 -20 0 20 40 60 TEMPERATURE (°C) 0.50 78 76 80 100 VDD = 5V VDD = 5.25V 74 72 70 68 66 62 60 -40 0.20 0.30 0.40 DRIFT (ppmFS/°C) 80 64 VREF = 2.5V 2.490 0.10 0 SUPPLY CURRENT vs. TEMPERATURE 2.498 OUTPUT VOLTAGE (V) MAX5217 100 2.500 MAX5215 toc17 2.500 6 2 MAX5217 4.3 8 4 SUPPLY CURRENT (µA) 3.1 -40°C TO +105°C BOX METHOD 12 MAX5215 toc18 2.7 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 GAIN ERROR DRIFT vs. TEMPERATURE DISTRIBUTION MAX5217 OUTPUT VOLTAGE (V) 0 100 -0.05 -0.05 -0.06 80 -0.01 GAIN ERROR (%FS) GAIN ERROR (%FS) -0.01 60 0 MAX5215 toc14 VREF = 2.5V 40 TEMPERATURE (°C) SUPPLY VOLTAGE (V) 0 20 COUNT (UNITS) 3.1 MAX5215 toc15 2.7 6 4 MAX5217 0.25 8 MAX5215 toc16 0.2 10 MAX5215 toc19a MAX5215 -40°C TO +105°C BOX METHOD 12 COUNT (UNITS) 0.6 MAX5217 1.00 OFFSET ERROR (mV) OFFSET ERROR (mV) 0.8 14 MAX5215 toc12 VREF = 2.5V 0.4 1.25 MAX5215 toc11 1.0 OFFSET ERROR DRIFT vs. TEMPERATURE DISTRIBUTION OFFSET ERROR vs. TEMPERATURE MAX5215 toc13 OFFSET ERROR vs. SUPPLY VOLTAGE VDD = 2.7V MAX5215/MAX5217 NO LOAD VDD = VREF VOUT = MIDSCALE -40 -20 0 20 40 VDD = 4V 60 80 100 TEMPERATURE (°C)   8 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface Typical Operating Characteristics (continued) (VDD = 5V, TA = +25°C, unless otherwise noted.) 55 MAX5215/MAX5217 NO LOAD VDD = VREF VOUT = ZEROSCALE 40 -40 -20 0 20 40 60 80 68 MAX5215 66 64 2.7 TEMPERATURE (°C) SUPPLY CURRENT (µA) 3.1 3.5 3.9 4.3 0.3 0.2 0.1 NO LOAD VDD = VREF 75 SUPPLY CURRENT (µA) -40°C 0°C +25°C +85°C +105°C 4.7 5.1 MAX5215 70 65 VREF = 5.0V VREF = 2.5V 60 55 3.5 3.9 4.3 3.1 4.7 5.1 5.5 MAX5215 toc20b 3.5 3.9 4.3 4.7 SUPPLY VOLTAGE (V) 5.1 5.5 SUPPLY CURRENT vs. DAC CODE 80 MAX5217 NO LOAD VDD = VREF 75 70 65 VREF = 5.0V VREF = 2.5V 60 55 50 45 0 3.1 MAX5217 2.7 5.5 50 2.7 50 SUPPLY CURRENT vs. DAC CODE 80 MAX5215 toc21 0.6 0.4 55 SUPPLY VOLTAGE (V) SUPPLY CURRENT vs. SUPPLY VOLTAGE (POWER-DOWN MODE) 0.5 MAX5215 60 40 60 100 65 45 62 SUPPLY CURRENT (µA) VDD = 2.7V 45 70 MAX5215 toc22a 50 MAX5217 72 70 MAX5215 toc22b 60 74 NO LOAD VDD = VREF VOUT = ZERO SCALE 75 SUPPLY CURRENT (µA) VDD = 4V 65 76 SUPPLY CURRENT (µA) VDD = 5.25V VDD = 5V NO LOAD VDD = VREF VOUT = MIDSCALE 78 80 MAX5215 toc20a 75 SUPPLY CURRENT (µA) 80 MAX5215 toc19b 80 70 SUPPLY CURRENT vs. SUPPLY VOLTAGE SUPPLY CURRENT vs. SUPPLY VOLTAGE SUPPLY CURRENT vs. TEMPERATURE 0 2500 5000 7500 10,000 12,500 15,000 45 0 10,000 20,000 30,000 40,000 50,000 60,000 CODE SUPPLY VOLTAGE (V) VOUT vs. TIME (EXITING POWER-DOWN MODE) CODE MAJOR CODE TRANSITION (0x7FFF TO 0x8000) MAX5215 toc24a MAX5215 toc23 MAX5215/MAX5217 RL = 10kI VREF = 5V OUT = MIDSCALE AC-COUPLED 1mV/div OUT = MIDSCALE 1V/div 0V MAX5217 VREF = 5V NO LOAD 10µs/div Maxim Integrated 4µs/div   9 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface Typical Operating Characteristics (continued) (VDD = 5V, TA = +25°C, unless otherwise noted.) MAJOR CODE TRANSITION (0x8000 TO 0x7FFF) MAJOR CODE TRANSITION (0x1FFF TO 0x2000) MAX5215 toc24b MAX5215 toc24c MAX5215 VREF = 5V NO LOAD MAX5217 VREF = 5V NO LOAD OUT = MIDSCALE AC-COUPLED 1mV/div OUT = MIDSCALE AC-COUPLED 1mV/div 4µs/div 4µs/div MAJOR CODE TRANSITION (0x2000 TO 0x1FFF) SETTLING TO ±0.5 LSB 14 BIT (VDD = VREF = 5V, CL = 100pF) MAX5215 toc24d MAX5215 toc25a MAX5215 VREF = 5V NO LOAD 18µs OUT = MIDSCALE AC-COUPLED 1mV/div MAX5215/MAX5217 1/4 SCALE TO 3/4 SCALE 4µs/div 4µs/div SETTLING TO ±0.5 LSB 14 BIT (VDD = VREF = 5V, CL = 100pF) DIGITAL FEEDTHROUGH MAX5215 toc26 MAX5215 toc25b MAX5215/MAX5217 3/4 SCALE TO 1/4 SCALE VOUT AC-COUPLED 50mV/div SCL 5V/div 17µs 4µs/div Maxim Integrated 400ns/div   10 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface Typical Operating Characteristics (continued) (VDD = 5V, TA = +25°C, unless otherwise noted.) OUTPUT VOLTAGE vs. OUTPUT CURRENT SUPPLY CURRENT vs. DIGITAL INPUT VOLTAGE 2.40 2.35 2.30 VDD = 5V VREF = 5V 2000 VDDI = 2.7V LOW T0 HIGH 1500 VDD = 2.7V HIGH T0 LOW 1000 0 0 1 2 3 4 5 6 0 -5 -10 -15 500 2.25 MAX5215 toc29 MAX5215 toc28 VDD = 5V LOW T0 HIGH VDD = 5V HIGH T0 LOW 2500 0 1 2 3 4 5 -20 10 1 DIGITAL INPUT VOLTAGE (V) OUTPUT CURRENT (mA) 100 1000 INPUT FREQUENCY (kHz) DAC OUPUT NOISE DENSITY vs. FREQUENCY INTEGRATED OUTPUT NOISE (0.1Hz TO 10Hz) MAX5215 toc30 200 MAX5215/MAX5217 OUT 1µV/div NOISE (nVRMS /√Hz) 175 MAX5215 toc31 2.45 3000 5 ATTENUATION (dB) OUTPUT VOLTAGE (V) 2.50 3500 DIGITAL SUPPLY CURRENT (µA) MAX5215 toc27 2.55 REFERENCE INPUT BANDWIDTH vs. FREQUENCY FULL-SCALE (CODE 0XFF00) 150 ZERO-SCALE (CODE 0x00FF) 125 MIDSCALE (CODE 0x8000) 100 75 50 1s/div 10 100 1k 10k 100k FREQUENCY (Hz) Maxim Integrated   11 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface Pin Configuration TOP VIEW REF 1 ADDR 2 SCL 3 SDA 4 + MAX5215 MAX5217 8 GND 7 VDD 6 OUT 5 AUX µMAX Pin Description PIN NAME 1 REF FUNCTION 2 ADDR 3 SCL I2C Serial Clock Input 4 SDA I2C Serial Data Input 5 AUX User-Configurable Active-Low Asynchronous Input. When configured as CLR mode: drive AUX low to clear the contents of the input CODE and the DAC registers and return the DAC to a user-selectable return state (default). When configured as LDAC mode: drive AUX low to load the pending CODE register content to the active DAC register. 6 OUT Buffered DAC Voltage Output 7 VDD Supply Voltage. Bypass VDD with a 0.1FF capacitor to GND. 8 GND Ground Reference Voltage Input. Bypass REF with a 0.1FF capacitor to GND. I2C Device Address Input. Pull high, low, or do not connect to set the two LSBs of the device address. Detailed Description The MAX5215/MAX5217 are 14-bit and 16-bit singlechannel, low-power, high reference input resistance, buffered voltage-output DACs. These devices feature a fast 400kHz I2C serial interface. The MAX5215/MAX5217 include a serial-in/parallel-out shift register, internal CODE and DAC registers, a power-on-reset (POR) circuit to initialize the DAC output to code zero, and an output buffer to allow rail-to-rail operation. The 2.7V to 5.5V wide supply voltage range and low-power consumption accommodate most low-power and low-voltage applications. On power-up, the MAX5215/MAX5217 reset the DAC output to zero, providing additional safety for applications that drive valves or other transducers that need to be off during power-up. The MAX5215/MAX5217 feature a configurable asynchronous active-low input (AUX) that can be programmed Maxim Integrated by the user to act as either an asynchronous clear input (CLR) or a load DAC input (LDAC). By default, the devices operate in CLR mode on power-up. DAC Output (OUT) The MAX5215/MAX5217 include an internal buffer on the DAC output. The internal buffer provides improved load regulation and transition glitch suppression for the DAC output. The output buffer slews at 0.5V/Fs and drives up to 10kI in parallel with 100pF. The analog supply voltage (VDD) determines the maximum output voltage range of the device as VDD powers the output buffer. Under no-load condi­tions, the output buffer drives from GND to VDD, subject to offset and gain errors. With a 10kI load to GND, the output buffer drives from GND to within 200mV of VDD. With a 10kI load to VDD, the output buffer drive from VDD to within 200mV of GND.   12 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface The DAC ideal output voltage is defined by: VOUT = VREF x D/2N where D = code loaded into the DAC register, VREF = reference voltage, N = resolution DAC Reference (REF) The external reference input features a typical input impedance of 256kI (independent of the DAC code) and accepts an input voltage from +2V to VDD. Connect an external voltage supply between REF and GND to apply an external reference. Visit www.maximintegrated.com/ products/references for a list of available voltagereference devices. Internal Register Structure The user interface is separated from the DAC logic to minimize digital feedthrough. Within the serial interface is an input shift register, the contents of which can be routed to the control register or DAC, as determined by the user command. Within the device, there is a CODE register followed by a DAC Latch register (see the Functional Diagram). The contents of the CODE register hold pending DAC output settings which can later be loaded into the DAC register. The CODE register can be updated using both CODE and CODE_LOAD user commands. The contents of the DAC register hold the current DAC output settings. The DAC register can be updated directly from the serial interface using the CODE_LOAD commands or can upload the current contents of the CODE register using LOAD commands or the LDAC logic input. The contents of both CODE and DAC registers are maintained during power-down states, so that when the DAC is powered on, the previously stored output setting is restored. Any CODE or LOAD commands issued during power-down states continue to update the register contents. AUX Configured as Clear Input, CLR When configured in CLR mode, the AUX input performs an asynchronous level sensitive CLEAR operation. If CLR is pulled low, the CODE and DAC data registers are reset to their clear values as defined by the user configuration settings (see Table 9). User configuration settings are not affected. If CLR is asserted at any point during an I2C write sequence, from that point on, and until CLR is deasserted, all I2C commands attempting to modify CODE or DAC register contents are ignored. The CLR activity is Maxim Integrated given precedence and the commands are gated. In all cases, the I2C interface continues to function according to protocol, however slave ACK pulses beyond the command byte acknowledge will not be sent for gated command sequences (notifying the FP that the gated instructions are being ignored). This gating condition remains in effect until the CLR condition is removed and a subsequent I2C START condition is recognized (beginning a new I2C write sequence), meeting tCLRSTA requirements (Figure 1). If CLR is driven low during an I2C command read sequence, the exchange continues as normal, however the data being read back may be stale, having since been cleared. The user may determine the state of the CLR pin by issuing a Part ID read command. An equivalent software clear operation is provided through the SW_CLEAR command. AUX Configured as Load DAC Input, LDAC When configured in LDAC mode, the AUX input performs an asynchronous level sensitive LOAD operation when it is pulled low. Internally, a dual register system is provided, with pending DAC output settings stored in a CODE register, while the current output settings are stored in the DAC latches. When LDAC is pulled low, the DAC latches are held in a transparent state, and the CODE register contents are loaded and stored. This allows several DACs to be updated simultaneously using a common LDAC line, or allows the DAC to be quickly updated to a pending setting via a single pin operation. Users wishing to load new DAC data in direct response to I2C activity can enable and connect LDAC permanently low. Users wishing to control the DAC update instance independently of the I2C instruction should hold LDAC high during programming cycles. Once the programming is complete, LDAC may be strobed and the new DAC codes will be loaded (this method allows simultaneous updates of several devices). Be sure to observe the tLDH timing requirements (Figure 1). A software load operation is provided through the LOAD or CODE_LOAD command. With the software load operation, the content of the CODE register will be latched into the DAC register regardless of the status and configuration of the LDAC pin. Multiple MAX5215/MAX5217 can be loaded synchronously using software load commands in conjunction with the Broadcast ID.   13 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface I2C Serial Interface is required on SCL if there are multiple masters on the bus, or if the single master has an open-drain SCL output. The MAX5215/MAX5217 feature an I2C/SMBusKcompatible 2-wire serial interface consisting of a serial data line (SDA) and a serial clock line (SCL). SDA and SCL enable communication between the part and the master at clock rates up to 400kHz. Figure 1 shows the 2-wire interface timing diagram. The master generates SCL and initiates data transfer on the bus. The master device writes data to the MAX5215/MAX5217 by transmitting the proper slave address followed by the register address and then the data word. Each transmit sequence is framed by a START (S) or Repeated START (Sr) condition and a STOP (P) condition. Each word transmitted to the part is 8 bits long and is followed by an acknowledge clock pulse. Series resistors in line with SDA and SCL are optional. Series resistors protect the digital inputs of the MAX5215/ MAX5217 from high voltage spikes on the bus lines, and minimize crosstalk and undershoot of the bus signals. The MAX5215/MAX5217 can accommodate bus voltages higher than VDD up to a limit of 5.5V; bus voltages lower than VDD are not recommended and may result in significantly increased interface currents. A master reading data from the MAX5215/MAX5217 must transmit the proper slave address followed by a series of nine SCL pulses for each byte of data requested. The MAX5215/MAX5217 transmit data on SDA in sync with the master-generated SCL pulses. The master acknowledges receipt of each byte of data. Each read sequence is framed by a START or Repeated START condition, a not acknowledge, and a STOP condition. I2C START and STOP Conditions SDA operates as both an input and an open-drain output. A pullup resistor, typically 4.7kI, is required on SDA. SCL operates only as an input. A pullup resistor, typically 4.7kI, I2C Bit Transfer One data bit is transferred during each SCL cycle. The data on SDA must remain stable during the high period of the SCL pulse. Changes in SDA while SCL is high are control signals (see the I2C START and STOP Conditions section). SDA and SCL idle high when the bus is not in use. A master initiates communication by issuing a START condition. A START condition is a high-to-low transition on SDA with SCL high. A STOP condition is a low-to-high transition on SDA while SCL is high (Figure 2). A START condition from the master signals the beginning of a transmission to the MAX5215/MAX5217. The master terminates transmission, and frees the bus, by issuing a STOP condition. The bus remains active if a Repeated START condition is generated instead of a STOP condition. I2C Early STOP and Repeated START Conditions SMBus is a trademark of Intel Corp. S Sr P SCL SDA VALID START, REPEATED START, AND STOP PULSES P S S P P S P The MAX5215/MAX5217 recognize a STOP condition at any point during data transmission except if the STOP condition occurs in the same high pulse as a START condition. For proper operation, do not send a STOP condition during the same SCL high pulse as the START condition. Transmissions ending in an early STOP condition will not impact the internal device settings. If the STOP occurs during a readback byte, the transmission is terminated and a later read mode request will begin transfer of the requested register data from the beginning. Table 1. Two LSBs of the Slave Address Determined by the ADDR Input INVALID START/STOP PULSE PAIRINGS -ALL WILL BE RECOGNIZED AS STARTS Figure 2. I2C START, Repeated START, and STOP Conditions Maxim Integrated ADDR A1 A0 GND 0 0 N.C. 0 1 VDD 1 1   14 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface I2C Slave Address The slave address is defined as the seven most significant bits (MSBs) followed by the R/W bit (Figure 1). The 5 MSBs (A[6:2]) are 00111 with the two LSBs (A[1:0]) determined by the input ADDR as shown in Table 1. Setting the R/W bit to 1 configures the MAX5215/MAX5217 for read mode. Setting the R//W bit to 0 configures the MAX5215/ MAX5217 for write mode. The slave address is the first byte of information sent to the MAX5215/MAX5217 after the START condition. The MAX5215/MAX5217 have the ability to detect an unconnected state on the ADDR input for additional address flexibility; if leaving the ADDR input unconnected, be certain to minimize all loading on the pin (i.e. provide a landing for the pin, but do not any board traces. I2C Broadcast Address A broadcast address is provided for the purpose of updating or configuring all MAX5215/MAX5217 devices on a given I2C bus. All MAX5215/MAX5217 acknowledge and respond to the broadcast device address 01010100 regardless of the state of the address input pin. The broadcast is intended for use in write mode only (as indicated by R/W = 0 in the address given) I2C Acknowledge In write mode, the acknowledge bit (ACK) is a clocked 9th bit that the MAX5215/MAX5217 use to handshake receipt of each byte of data when in write mode as shown in Figure 3. The MAX5215/MAX5217 pull down SDA during the entire master-generated 9th clock pulse if the previous byte is successfully received. Monitoring ACK allows for detection of unsuccessful data transfers. An unsuccessful data transfer occurs if a receiving device is busy or if a system fault has occurred. In the event of an unsuccessful data transfer, the bus master will retry communication. I2C Write Operation (Standard Protocol) A master device communicates with the MAX5215/ MAX5217 by transmitting the proper slave address followed by command and data words. Each transmit sequence is framed by a START or Repeated START condition and a STOP condition as described above. Each word is 8 bits long and is always followed by an acknowledge clock (ACK) pulse as shown in Figure 4and Figure 5. The first byte contains the address of the MAX5215/MAX5217 with R/W = 0 to indicate a write. The second byte contains the register (or command) to be written and the third and fourth bytes contain the data to be written. By repeating register address plus data pairs (Byte #2 through Byte #4 in Figure 4 and Figure 5), the user can perform multiple register writes using a single I2C command sequence; there is no limit as to how many registers the user can write with a single command. The MAX5215/MAX5217 support this capability for all useraccessible write mode commands. I2C Write Operation (Multibyte Protocol) The MAX5215/MAX5217 support a multibyte transfer protocol for some commands. In multibyte mode, once a command is issued, that command is continuously executed based on two byte data blocks for the duration I2C operation. Essentially, bytes 1 to 4 are processed normally, but for every two bytes of data provided after CLOCK PULSE FOR ACKNOWLEDGMENT START CONDITION SCL In read mode, the master pulls down SDA during the 9th clock cycle to acknowledge receipt of data when the MAX5215/MAX5217 are in read mode. An acknowledge is sent by the master after each read byte to allow data transfer to continue. A not-acknowledge is sent when the master reads the final byte of data from the MAX5215/ MAX5217, followed by a STOP condition. 1 2 9 NOT ACKNOWLEDGE SDA ACKNOWLEDGE Figure 3. I2C Acknowledge Maxim Integrated   15 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface START SDA WRITE BYTE #1: DEVICE ADDRESS WRITE BYTE #2: USER COMMAND WRITE BYTE #3: DATA BYTE #1 WRITE BYTE #4: DATA BYTE #2 0 0 1 1 1 A1 A0 W A R7 R6 R5 R4 R3 R2 R1 R0 A 15 14 13 12 11 10 9 SCL 8 A 7 6 5 4 3 2 A ACK. GENERATED BY MAX5215/MAX5217 STOP 1 0 A COMMAND EXECUTED Figure 4. I2C Single Register Write Sequence START SDA SCL WRITE ADDRESS BYTE #1: I2C SLAVE ADDRESS 0 0 1 1 WRITE COMMAND1 BYTE #2: COMMAND1 BYTE (B[23:16]) WRITE DATA1 BYTE #3: DATA1 HIGH BYTE (B[15:8]) 1 A1 A0 W A R7 R6 R5 R4 R3 R2 R1 R0 A 15 14 13 12 11 10 9 WRITE DATA1 BYTE #4: DATA1 LOW BYTE (B[7:0]) 8 A 7 6 5 4 3 2 1 0 A COMMAND1 EXECUTED ADDITIONAL COMMAND AND DATA PAIRS (3 BYTE BLOCKS) BYTE #5: COMMANDn BYTE (B[23:16]) BYTE #6: DATAn HIGH BYTE (B[15:8]) R7 R6 R5 R4 R3 R2 R1 R0 A 15 14 13 12 11 10 9 A ACK. GENERATED BY MAX5215/MAX5217 BYTE #7: DATAn LOW BYTE (B[7:0]) 8 A 7 6 5 4 3 2 1 STOP 0 A COMMANDn EXECUTED Figure 5. Multiple Register Write Sequence (Standard I2C Protocol) byte 4, the originally requested command is executed again with the latest byte pair provided as input data (Figure 6). Multibyte protocol is enforced until a STOP condition (or Repeated START) is encountered and this provides a higher speed transfer mode that is useful in servo DAC applications. I2C Readback Operation Each readback sequence is framed by a START or Repeated START condition and a STOP condition. Each word is 8 bits long and is followed by an acknowledge clock pulse (Figure 7). The first byte contains the address of the MAX5215/MAX5217 with R/W = 0 to indicate a write. The second byte contains the register that is to be read back. There is a Repeated START condition, followed by the device address with R/W = 1 to indicate a read and an acknowledge clock. The final two bytes in the frame contain the register data readback followed by a STOP Maxim Integrated condition. The master has control of the SCL line but the MAX5215/MAX5217 take over the SDA line. Following each byte of data read back from the MAX5215/MAX5217 the master must acknowledge the transfer by pulling SDA low. If additional bytes beyond those required to read back the requested data are provided, the MAX5215/5217 will continue to read back ones. A user can read back the device’s configuration, Part ID, CODE register, or DAC register contents using the readback programming sequence as shown in Figure 7. I2C Compatibility The MAX5215/MAX5217 are fully compatible with existing I2C systems. SCL and SDA are high-impedance inputs; SDA has an open drain which pulls the data line low during the 9th clock pulse or as required for data readback. Figure 8 shows a typical I2C application.   16 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface WRITE ADDRESS BYTE #1: DEVICE ADDRESS START SDA 0 SCL 0 1 1 WRITE REGISTER NO. BYTE #2: FIRST REG# = N WRITE DATA BYTE #3: REG(N)[15:8] DATA 1 A1 A0 W A R7 R6 R5 R4 R3 R2 R1 R0 A 15 14 13 12 11 10 9 WRITE DATA BYTE #4: REG(N)[7:0] DATA 8 A 7 6 5 4 3 2 1 0 A REG N UPDATED ADDITIONAL DATA BYTE PAIRS (2 BYTE BLOCKS) WRITE DATA BYTE #X-1: REG(N)[15:8] DATA 15 14 13 12 11 10 9 WRITE DATA BYTE #X: REG(N)[7:0] DATA 8 A 7 6 5 4 3 2 1 STOP 0 A REG N UPDATED A ACK. GENERATED BY MAX5215/MAX5217 Figure 6. Multiple Register Write Sequence (Multibyte Protocol) START SDA SCL WRITE ADDRESS BYTE #1: I2C SLAVE ADDRESS WRITE COMMAND1 BYTE #2: COMMAND1 BYTE READ ADDRESS REPEATED BYTE #3: I2C SLAVE START ADDRESS 0 0 1 1 1 A1 A0 W A R7 R6 R5 R4 R3 R2 R1 R0 A READ DATA BYTE #4: DATA1 HIGH BYTE (B[15:8]) 0 0 1 1 1 A1 A0 R A 15 14 13 12 11 10 9 A ACK. GENERATED BY MAX5215/MAX5217 READ DATA BYTE #5: DATA1 LOW BYTE (B[7:0]) STOP 8 A 7 6 5 4 3 2 1 0 -A A ACK. GENERATED BY I2C MASTER Figure 7. Standard I2C Read Sequence µC SDA SCL SCL SDA ADDR MAX5215 MAX5217 +5V SCL SDA ADDR MAX5215 MAX5217 Figure 8. Typical I2C Application Circuit Maxim Integrated   17 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface I2C User-Command Register Map This section lists the user-accessible commands and registers for the MAX5215/MAX5217. Table 2 provides detailed information about the Command Registers. No_Op Command (0x00) The No_Op command (Table 3) has no external effect on the device for I2C write. The asynchronous CLR input has no effect on the No_Op command. Table 2. I2C User Write Commands WRITE COMMAND COMMAND BYTE DATA BYTES R7 R6 R5 R4 R3 R2 R1 R0 No-Op (0x00) 0 0 0 0 0 0 0 0 Don’t Care CODE_LOAD (0x01) 0 0 0 0 0 0 0 1 CODE (0x02) 0 0 0 0 0 0 1 LOAD (0x03) 0 0 0 0 0 0 1 CODE_LOAD_m (0x05) 0 0 0 0 0 1 0 CLR GATED* DESCRIPTION No operation: DAC settings and modes unaffected N 14-/16-bit code Write and load data to the CODE and DAC registers Y 0 14-/16-bit code Write data to the CODE register Y 1 Don’t Care Load current CODE register content to the DAC register Y Multiple sets of 14-/16-bit codes Similar to CODE_LOAD command, but accepts multiple sets of dual-byte data following the initial command byte (see the I2C Write Operation (Multibyte Protocol) section) Y Y 1 CODE_m (0x06) 0 0 0 0 0 1 1 0 Multiple sets of 14-/16-bit codes Similar to CODE command, but accepts multiple sets of dual-byte data following the initial command byte (see the I2C Write Operation (Multibyte Protocol) section) USER_CONFIG (0x08) 0 0 0 0 1 0 0 0 16-bit configuration data User configuration command N SW_RESET (0x09) 0 0 0 0 1 0 0 1 Don’t Care Software Reset N SW_CLEAR (0x0A) 0 0 0 0 1 0 1 0 Don’t Care Software Clear N Reserved Any commands not specifically listed above are reserved for Maxim internal use only. *Note: If a user write command is gated by CLR, and CLR has been asserted during the I2C write sequence, the command is ignored and the associated data bytes will not be acknowledged. If a user write command is not gated by CLR, the command is executed as normal, regardless of the activity of the CLR pin. Table 3. No_Op Command (0x00) R7 R6 R5 R4 R3 R2 R1 R0 B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 0000_0000 No_Op Command Don’t Care Don’t Care COMMAND BYTE DATA HIGH BYTE DATA LOW BYTE Maxim Integrated B1 B0   18 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface CODE_LOAD Command (0x01) LOAD Command (0x03) The CODE_LOAD command (Table 4) is the combination of the CODE command and LOAD command. The CODE_LOAD command is executed on the SCL rising edge following the 2nd data byte. Upon its execution, the CODE_LOAD command updates the CODE register and the DAC latch with the user data content provided. The LOAD command (Table 6) is executed on the SCL rising edge following the 2nd data byte. The LOAD command loads the DAC latches with the current contents of the CODE register. Alternatively, a load operation can be achieved by driving the AUX input low (when configured as LDAC). The asynchronous CLR input gates this command if it is asserted during the I2C write sequence. The asynchronous CLR input gates this command if it is asserted during the I2C write sequence. CODE Command (0x02) The CODE command (Table 5) is executed on the SCL rising edge following the 2nd data byte. The CODE command updates the CODE register with the user data content provided. The asynchronous CLR input gates this command if it is asserted during the I2C write sequence. CODE_LOAD_m Command (0x05) The CODE_LOAD_m command (Table 7) is the multibyte version of the CODE_LOAD command. The CODE_ LOAD_m command is initially executed on the SCL rising edge following the 2nd data byte. The command is subsequently executed after each pair of data bytes which follow, for the duration of the operation (see the I2C Write Operation (Multibyte Protocol) section). The asynchronous CLR input gates this command if it is asserted during the I2C write sequence. Table 4. CODE_LOAD Command R7 R6 R5 R4 R3 R2 R1 R0 B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 0000_0001 16-bit CODE_LOAD Command CODE and DAC Registers Data CODE and DAC Registers Data 0000_0001 14-bit CODE_LOAD Command CODE and DAC Registers Data CODE and DAC Registers Data COMMAND BYTE DATA HIGH BYTE B0 Don’t Care DATA LOW BYTE Table 5. CODE Command R7 R6 R5 R4 R3 R2 R1 R0 B15 B14 B13 B12 B11 B10 B9 0000_0010 16-bit CODE Command CODE Register Data 0000_0010 14-bit CODE Command CODE Register Data COMMAND BYTE DATA HIGH BYTE B8 B7 B6 B5 B4 B3 B2 B1 B0 CODE Register Data Don’t Care CODE Register Data DATA LOW BYTE Table 6. Load Command R7 R6 R5 R4 R3 R2 R1 R0 B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 0000_0011 LOAD Command Don’t Care Don’t Care COMMAND BYTE DATA HIGH BYTE DATA LOW BYTE Maxim Integrated B1 B0   19 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface CODE_m Command (0x06) USER_CONFIG Command (0x08) The CODE_m command (Table 8) is the multibyte version of the CODE command. The CODE_m command is initially executed on the SCL rising edge following the 2nd data byte. The command is subsequently executed after each pair of data bytes which follow, for the duration of the operation (see the I2C Write Operation (Multibyte Protocol) section). This command is of practical use when the AUX pin is configured as LDAC and continuously asserted low. The USER_CONFIG command allows the user to select the configuration of the device: setting the clear value to which the DAC returns in response to a CLEAR event, configuring the input mode for AUX, and setting the power-down mode for the MAX5215/MAX5217. The USER_CONFIG command is executed on the SCL rising edge following the 2nd data byte. Table 9 and Table 10 describe the command and the configuration bits in detail. The asynchronous CLR input gates this command if it is asserted during the I2C write sequence. The asynchronous CLR input has no effect on the USER_ CONFIG command. Table 7. CODE_LOAD_m Command R7 R6 R5 R4 R3 R2 R1 R0 B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 0000_0101 16-bit CODE_LOAD_m Command CODE and DAC Registers Data CODE and DAC Registers Data 0000_0101 14-bit CODE_LOAD_m Command CODE and DAC Registers Data CODE and DAC Registers Data COMMAND BYTE DATA HIGH BYTE B0 Don’t Care DATA LOW BYTE Table 8. CODE_m Command R7 R6 R5 R4 R3 R2 R1 R0 B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 0000_0110 16-bit CODE_m Command CODE and DAC Registers Data CODE and DAC Registers Data 0000_0110 14-bit CODE_m Command CODE and DAC Registers Data CODE and DAC Registers Data COMMAND BYTE DATA HIGH BYTE B0 Don’t Care DATA LOW BYTE Table 9. USER_CONFIG Command R7 R6 R5 R4 R3 R2 R1 R0 B15 B14 B13 B12 B11 B10 B9 0000_1000 USER_CONFIG Command DATA DEFAULT VALUEg COMMAND BYTE Maxim Integrated B8 X X X X B6 Don’t Care Don’t Care X B7 X DATA HIGH BYTE X X X X B5 B4 Clear Value Mode: 00 = Default 01 = Zero 10 = Mid 11 = Full 0 0 B3 B2 AUX Input Mode: 00 = Disable 01 = LDAC 10 = CLR 11 = Disable 1 0 B1 B0 PowerDown Mode: 00 = DAC 01 = High-Z 10 = 100kI 11 = 1kI 0 0 DATA LOW BYTE   20 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface SW_RESET Command (0x09) The SW_RESET command (Table 11) resets the CODE register, the DAC latch, and all the configurations programmed via the USER_CONFIG command to the POR default values. The SW_RESET command is executed on the SCL rising edge following the second data byte. The asynchronous CLR input has no effect on the SW_RESET command. SW_CLEAR Command (0x0A) The SW_CLEAR command (Table 12) will clear the CODE register and the DAC latch to the clear value selected in the USER_CONFIG register. The SW_CLEAR command is executed on the SCL rising edge following the 2nd data byte. Alternatively, a clear operation can be achieved by driving the AUX input low (when configured as CLR). The asynchronous CLR input has no effect on the SW_CLEAR command. Table 10. User_Configuration Bits (B[5:0]) CONFIGURATION BITS CLEAR VALUE (B[5:4]) CONFIGURATION DETAIL The DAC value to be cleared to in response to a CLEAR event: 00: POR default value (zero scale) 01: Zero scale (ground) 10: Midscale 11: Full scale (reference) AUX MODE (B[3:2]) The mode in which the AUX input will operate: 00: Pin disabled 01: Enable LDAC functionality 10: Enable CLR functionality. Default after POR. 11: Pin disabled Power-Down Mode (PD) (B[1:0]) Power-down mode for the device: 00: Normal operation: The DAC will be powered up and returned to its previous setting. Default after POR. 01: Power-down: The DAC core will be powered down and VOUT is high-impedance. 10: Power-down: The DAC core will be powered down and VOUT is connected to ground via 100kI. 11: Power-down: The DAC core will be powered down and VOUT is connected to ground via 1kI. Table 11. SW_RESET Command R7 R6 R5 R4 R3 R2 R1 R0 B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 0000_1001 SW_RESET Command Don’t Care Don’t Care COMMAND BYTE DATA HIGH BYTE DATA LOW BYTE B1 B0 B1 B0 Table 12. SW_CLEAR Command R7 R6 R5 R4 R3 R2 R1 R0 B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 0000_1010 SW_CLEAR Command Don’t Care Don’t Care COMMAND BYTE DATA HIGH BYTE DATA LOW BYTE Maxim Integrated   21 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface User Read Command Descriptions The MAX5215/MAX5217 allow the user to read back the data for supported registers. Table 13 lists the User Readback commands and the 2 data byte contents being read back. For the MAX5215, CODE and DAC read back, the data content is left justified and the 2 LSBs ([1:0]) of the input 2-byte data are not used and read out as 0. Applications Information Power-On Reset (POR) When power is applied to VDD, the input registers are set to zero so the DAC output is set to code zero. Initially the device powers up to an untrimmed zero code setting. The device will operate in a fully trimmed mode following the first I2C operation which modifies DAC latch content. Power Supplies and Bypassing Consideations Bypass VDD with high-quality ceramic capacitors to a low-impedance ground as close as possible to the device. Minimize lead lengths to reduce lead inductance. Connect the GND input to the analog ground plane. Layout Considerations Digital and AC transient signals on GND can create noise at the output. Connect GND to form the star ground for the DAC system. Refer remote DAC loads to this system ground for the best possible performance. Use proper grounding techniques, such as a multilayer board with a low-inductance ground plane, or star connect all ground return paths back to the MAX5215/MAX5217 GND. Carefully lay out the traces to reduce AC cross-coupling. Do not use wire-wrapped boards and sockets. Use shielding to improve noise immunity. Do not run analog and digital signals parallel to one another, especially clock signals. Avoid routing digital lines underneath the MAX5215/MAX5217 package. Table 13. User Readback Command and Content R7 R6 R5 R4 R3 R2 R1 R0 READ COMMAND READ DATA1 HIGH BYTE D[15:8] READ DATA1 LOW BYTE D[7:0] 0 0 0 0 0 0 0 0 ID Readback (0x00) 0011100, CLEAR Status (0x11) 0 0 0 0 0 0 0 1 CODE_LOAD Readback (0x01) DAC_latch[15:8] DAC_latch[7:0] 0 0 0 0 0 0 1 0 CODE Readback (0x02) CODE_register[15:8] CODE_register[7:0] 0 0 0 0 0 0 1 1 LOAD Readback (0x03) DAC_latch[15:8] DAC_latch[7:0] 0 0 0 0 0 1 0 1 CODE_LOAD_m Readback (0x05) DAC_latch[15:8] DAC_latch[7:0] 0 0 0 0 0 1 1 0 CODE_m Readback (0x06) CODE_register[15:8] CODE_register[7:0] 0 0 0 0 1 0 0 0 CONFIG Readback (0x08) 0000_0000 00, CLEAR_VALUE[1:0], AUX_MODE[1:0], PD[1:0] Maxim Integrated   22 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface Definitions Integral Nonlinearity (INL) INL is the deviation of the measured transfer function from a straight line drawn between two codes once offset and gain errors have been nullified. Differential Nonlinearity (DNL) DNL is the difference between an actual step height and the ideal value of 1 LSB. If the magnitude of the DNL is greater than -1 LSB, the DAC guarantees no missing codes and is monotonic. Offset Error Offset error indicates how well the actual transfer function matches the ideal transfer function. The offset error is calculated from two measurements near zero code and near maximum code. Gain Error Gain error is the difference between the ideal and the actual full-scale output voltage on the transfer curve, after nullifying the offset error. This error alters the slope of the transfer function and corresponds to the same percentage error in each step. Maxim Integrated Settling Time The settling time is the amount of time required from the start of a transition, until the DAC output settles to the new output value within the measurment’s specified accuracy. Digital Feedthrough Digital feedthrough is the amount of noise that appears on the DAC output when the DAC digital control lines are toggled. Digital-to-Analog Glitch Impulse A major carry transition occurs at the midscale point where the MSB changes from low to high and all other bits change from high to low, or where the MSB changes from high to low and all other bits change from low to high. The duration of the magnitude of the switching glitch during a major carry transition is referred to as the digital-to-analog glitch impulse. Digital-to-Analog Power-Up Glitch Impulse The digital-to-analog power-up glitch is the duration of the magnitude of the switching glitch that occurs as the device exits power-down mode.   23 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface Typical Operating Circuit V+ VREF_IN 100nF 4.7µF VREF_OUT MAX6133 100nF VDD AUX V+ OUT DAC VOUT = -VREF TO +VREF VOUT ADDR µC SCL MAX5215 MAX5217 SDA V+ REF VR1 R2 R1 = R2 GND V- BIPOLAR OPERATION V+ VREF_IN 100nF 4.7µF MAX6133 VREF_OUT 100nF VDD AUX OUT DAC VOUT = 0V TO VREF VOUT ADDR µC SCL SDA MAX5215 MAX5217 REF GND UNIPOLAR OPERATION Maxim Integrated   24 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface Ordering Information PIN-PACKAGE RESOLUTION (BITS) INL MAX (LSB) MAX5215GUA+ PART 8 FMAX 14 Q1 MAX5217GUA+ 8 FMAX 16 Q4 MAX5217BGUA+ 8 FMAX 16 Q8 Note: All devices are specified over the -40°C to +105°C operating temperature range. +Denotes a lead(Pb)-free/RoHS-compliant package. R = Tape and reel. Chip Information PROCESS: BiCMOS Maxim Integrated Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 8 FMAX U8+3 21-0036 90-0092   25 MAX5215/MAX5217 14-/16-Bit, Low-Power, Buffered Output, Rail-to-Rail DACs with I2C Interface Revision History REVISION NUMBER REVISION DATE 0 11/12 DESCRIPTION Initial release PAGES CHANGED — Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 ©  2012 Maxim Integrated 26 Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
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