MX7542TQ/883B

SCOPE: CMOS, µP-Compatible, 12-Bit D/A Converter Device Type: -01 -02 -03 Generic Number: MX7542S(x)/883B MX7542T(x)/883B MX7542GT(x)/883B Case Outline(s). Outline Letter Q E Mil-Std-1835 GDIP1-T16 or CDIP2-T16 CQCC1-N20 Case Outline Package Code 16 Lead CERDIP J16 20-Pin Ceramic LCC L20 Absolute Maxi mum Ratings: (TA=+25°C, unless otherwise noted.) VDD to AGND ........................................................................................……….... 0V, +7V VDD to DGND ......................................................................................…..….…... 0V, +7V AGND to DGND …………………………………………………………………….... VDD DGND to AGND …………………………………………………………………….... VDD Digital Input Voltage to DGND .....................................................……………. -0.3V, VDD VOUT1, VOUT2 to AGND ...............................................……………………….... -0.3V, VDD VREF to AGND ......................................................................................…... -25V to +25V VRFB to AGND ......................................................................................…..... -25V to +25V Lead Temperature (soldering, 10 seconds) ................................................................. +300°C Storage Temperature .................................................................................... -65°C to +150°C Continuous Power Dissipation ........................................................................….. TA=+70°C 16 pin CERDIP(derate 10mW/°C above +70°C) .................................….............….. 800mW 20 pin LCC(derate 9.09mW/°C above +70°C) .....................................................…... 727mW Junction Temperature TJ .....................................................................................….. +150°C Thermal Resistance, Junction to Case, ΘJC 16 pin CERDIP................................................................................................…... 50°C/W 20 pin LCC .....................................................................................................…... 20°C/W Thermal Resistance, Junction to Ambient, ΘJA: 16 pin CERDIP..............................................................................................…... 100°C/W 20 pin LCC ...................................................................................................…... 110°C/W Recommended Operating Conditions Ambient Operating Range (TA) ...........................................................….. -55°C to +125°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ------------------------------------- Electrical Characteristics of MX7542/883B 19-2439 Page 2 of Rev. B 6 TABLE 1. ELECTRICAL TESTS: TEST Symbol Resolution Relative Accuracy RES RA Differential Nonlinearity Gain Error NOTE 3 Gain Error NOTE 3 Gain Tempco Power-Supply Rejection OUT1 Leakage Current OUT2 Leakage Current Output Current Settling Time NOTE 2 Feedthrough Error NOTE 2 Reference Input Resistance Digital Input High Voltage Digital Input Low Voltage Digital Input Leakage Current Digital Input Capacitance NOTE 2 Output Capacitance NOTE 2 DNL CONDITIONS 1/ -55°C≤TA≤+125°C Unless otherwise specified NOTE 2 GROUP A Subgroup 1,2,3 All 01 02,03 01 02,03 01,02 Limits Min Limits Max 12 -1 -0.5 -2 -1 -12.3 -14.5 -1 -2 -5 -0.005 -0.01 -1 -200 -1 -200 Units Bits LSB All 1 0.5 2 1 12.3 14.5 1 2 5 0.005 0.01 1 200 1 200 2 4 All 2.5 mVp-p RIN 1,2,3 All 8 25 kΩ VIH 1,2,3 All 3.0 VIL 1,2,3 All 1,2,3 All 4 All Monotonic to 11 bits Monotonic to 12 bits AE 1 2,3 1 2,3 AE TCAE PSRR IOUT1 IOUT2 tSL FT IIN NOTE 2 VDD=4.75V to 5.25V (∆Gain/∆VDD) DAC register loaded with all 0s DAC register loaded with all 1s To ±0.5LSB, OUT1 load is 100 Ω || 13pF, output measured ___ from trailing edge of WR VREF=10V, 10kHz sine wave VIN=0V or VDD CIN COUT1 1,2,3 1 2,3 1 2,3 1 2,3 4 COUT2 03 All All All All -1 LSB ppm/°C %/%VDD nA nA µs V 1 µA 8 pF All pF 75 75 4 All pF 260 Digital inputs at VIL, DAC register loaded with all 0s Electrical Characteristics of MX7542/883B LSB 260 Digital inputs at VIL, DAC register loaded with all 0s Digital inputs at VIH, DAC register loaded with all 1s ------------------------------------- LSB V 0.8 Digital inputs at VIH, DAC register loaded with all 1s 4 Output Capacitance NOTE 2 Device type 19-2439 Page 3 of Rev. B 6 TABLE 1. ELECTRICAL TESTS: TEST Symbol Write Pulse Width Address to WriteHold Time Chip Select to Write-Hold Time Minimum Clear Pulse Width Chip Select to Write-Setup Time Address Valid to Write-Setup Time Data-Setup Time Data-Hold Time Chip Select to Write-Setup Time Address Valid to Write-Setup Time Supply Current tWR tAWH CONDITIONS 1/ -55°C≤TA≤+125°C Unless otherwise specified NOTE 4 NOTE 4 tCWH NOTE 1: NOTE 2: NOTE 3: NOTE 4: GROUP A Subgroup Device type Units All All 220 80 ns ns NOTE 4 9 All 100 ns tCLR NOTE 4 9 All 300 ns tCWS Byte loading, NOTE 4 9 All 130 ns tAWS Byte loading, NOTE 4 9 All 180 ns tDS tDH tCWS NOTE 4 NOTE 4 DAC loading, NOTE 4 9 9 9 All All All 350 65 150 ns ns ns tAWS DAC loading, NOTE 4 9 All 240 ns IDD Digital inputs = VIH or VIL 1,2,3 All 2.5 VDD=+5V, VOUT1=VOUT2=0V, VREF=+10V, unless otherwise noted. Characteristics supplied for use as a typical design limit but not production tested. Measured using internal feedback resistor; includes effects of leakage current and gain TC. Timing shown in commercial datasheet. J16 A1 DGND AGND OUT2 13 4 5 6 7 D3 D2 D1 D0 AGND D3 NC D2 14 15 16 17 8 ___ CS ___ WR A0 D1 18 A1 DGND NC ____ CLR VDD D0 19 VREF ___ CS 20 RFB ------------------------------------- ____ CLR VDD VREF RFB L20 NC ___ WR A0 3 10 Limits Max 9 9 TERMINAL CONNECTIONS: MX7542 J16 L20 1 OUT1 NC 11 2 OUT2 OUT1 12 9 Limits Min Electrical Characteristics of MX7542/883B 19-2439 Page 4 of Rev. B 6 mA ORDERING INFORMATION: 01 J16 MX7542SQ/883B 01 L20 MX7542SE/883B 02 J16 MX7542TQ/883B 02 L20 MX7542TE/883B 03 J16 MX7542GTQ/883B 03 L20 MX7542GTE/883B QUALITY ASSURANCE Sampling and inspection procedures shall be in accordance with Mil-Prf-38535, Appendix A as Specified in Mil-Std-883. Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015: 1. Test Condition, A, B, C, or D. 2. TA = +125°C, minimum. 3. Interim and final electrical test requirements shall be specified in Table 2. Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, Including Groups A, B, C, and D inspection. Group A inspection: 1. Tests as specified in Table 2. 2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted. Group C and D inspections: a. End-point electrical parameters shall be specified in Table 1. b. Steady-state life test, Method 1005 of Mil-Std-883. 1. Test condition A, B, C, D. 2. TA = +125°C, minimum. 3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883. TABLE 2. ELECTRICAL TEST REQUIREMENTS Mil-Std-883 Test Requirements Interim Electric Parameters Method 5004 Final Electrical Parameters Method 5005 Group A Test Requirements Method 5005 Group C and D End-Point Electrical Parameters Method 5005 Subgroups Per Method 5005, Table 1 1 1*, 2, 3 1, 2, 3, 4** 9 1 * PDA applies to Subgroup 1 only. ** Subgroup 4 shall be tested at initial qualification and upon redesign. Sample size will be 116 units. ------------------------------------- Electrical Characteristics of MX7542/883B 19-2439 Page 5 of Rev. B 6