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MX7824UQ/883B

MX7824UQ/883B

  • 厂商:

    AD(亚德诺)

  • 封装:

    CDIP24

  • 描述:

    IC ADC 8BIT FLASH 24CDIP

  • 数据手册
  • 价格&库存
MX7824UQ/883B 数据手册
SCOPE: CMOS HIGHSPEED 8-BIT A/D CONVERTER WITH TRACK AND HOLD Device Type 01 02 Generic Number MX7824T(x)/883B MX7824U(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter Mil-Std-1835 MAXIM SMD Q L GDIP1-T24 or CDIP2-T24 Case Outline 24 LEAD CERDIP Package Code J24 Absolute Maximum Ratings Supply Voltage to GND ................................................................................….. 0V, +7V Digital Input Voltage ...............................................................................…... -0.3V, VDD Digital Output Voltage ................................................................................... -0.3V, VDD Positive Reference Voltage ...................................................................... VREF- to VDD Negative Reference Voltage ..................................................................... 0V to VREF+ Input Voltage (VIN) ..................................................................................... -0.3V to VDD Lead Temperature (soldering, 10 seconds) ............................................................... +300°C Storage Temperature .................................................................................. -65°C to +150°C Continuous Power Dissipation ............................................................................ TA=+70°C 24 pin CERDIP(derate 12.5mW/°C above +70°C) ................................................ 1000mW Junction Temperature TJ ........................................................................................ +150°C Thermal Resistance, Junction to Case, ΘJC 24 pin CERDIP.................................................................................................... 40°C/W Thermal Resistance, Junction to Ambient, ΘJA: 24 pin CERDIP................................................................................................... 80°C/W Recommended Operating Conditions Ambient Operating Range (TA) ......................................................….... -55°C to +125°C Supply Voltage Range (VDD) ............................................................…... +4.75V to 5.25V Positive Reference Voltage (VREF+) ................................................................…... +5.0V Negative Reference Voltage (VREF-) ....................................................................….... 0V Ground Potential (GND) .......................................................................................……. 0V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ---------------------------- Electrical Characteristics of MX7824/883B for /883B and SMD 5962-8876401 & 02 19-1036 Page 2 of Rev. C 9 TABLE 1. ELECTRICAL TESTS: TEST Resolution Total Unadjusted Error NOTE 3 Symbol RES TUE CONDITIONS -55 °C ≤TA≤ +125°C 1/ 2/ Unless otherwise specified Guaranteed but not tested Group A Subgroup 1,2,3 1,2,3 Device type Limits Min All 01 Limits Max 8 Units LSB ±1.0 LSB 02 VIN 1 All VREF- ±0.5 VREF+ IIN 1,2,3 All -3.0 +3.0 µA 4 1,2,3 1,2,3 All All All 1.0 2.4 45 4.0 pF kΩ V 1,2,3 All 0.8 V 1,2,3 All 1.0 µA 1,2,3 All 4 All 1,2,3 All Analog Input Voltage Range Analog Input Leakage Current Analog Input Capacitance Reference Input Resistance Digital Input High Level Voltage Digital Input Low Level Voltage Digital Input High Current IIH Digital Input Low Current IIL Digital Input Capacitance CIN2 Digital Output High Level Voltage Digital Output Low Level Voltage VOH CIN1 RIN VIH VIL VOL 0V, 5V, NOTE 4 NOTE 4 ___ __ A0, A1, RD, CS ___ __ A0, A1, RD, CS ___ __ A0, A1, RD, CS ___ __ A0, A1, RD, CS ___ __ NOTE 4 A0, A1, RD, CS ___ DB0-DB7, INT, ISOURCE=360µA ___ DB0-DB7, INT, ISINK=1.6mA Floating State Leakage Current Slew Rate, Tracking Capacitance NOTE 4 Digital Output Capacitance Supply Current IOUT Power Supply Sensitivity __ __ CS to RD Setup Time __ __ CS to RD Hold Time __ CS to RDY delay Conversion Time, Mode 0 Data Access Time __ After RD, Mode 1 tACC1 µA -1.0 8.0 4.0 pF V 0.4 1,2,3 RDY, ISINK=2.6mA, NOTE 5 DB0-DB7 only V All V 1,2,3 All 0.4 ±3.0 4 All 0.157 V/µs µA 4 1,2,3 All All 8.0 20.0 pF mA PSS tCSS NOTE 4 __ ___ CS=RD=2.4V VDD=5.0V±5% Figure 3 1,2,3 9,10,11 All All ±0.25 0 LSB ns tCSH Figure 3 9,10,11 All 0 ns tRDY Pull-up resistor=5kΩ, CL=50pF, Figure 3 See Figure 3. NOTE 7 9 10,11 9 10,11 9 10,11 All COUT IDD tCRD ---------------------------- NOTE 6 and 7 Figure 3 and 5 Electrical Characteristics of MX7824/883B for /883B and SMD 5962-8876401 & 02 40 60 2.0 2.8 85 120 All All 19-1036 Page 3 of Rev. C 9 ns µs ns Symbol CONDITIONS -55 °C ≤TA≤ +125°C 1/ 2/ Unless otherwise specified __ ___ RD to INT Delay, NOTE 5 Data Hold Time tINTH CL=50pF tDH NOTE 8, Figure 3,4 Delay Time Between Conversion Read Pulse Width, Mode 1 tP Figure 3 tRD Figure 3 tACC2 NOTE 6, 7, Figure 3,5 tAS tAH TEST Data Access Time After ___ INT, Mode 0 Multiplexer Address Setup Time Multiplexer Address Hold Time Group A Subgroup Device type Limits Min Limits Max Units 9 10,11 9 10,11 9 10,11 9 10,11 9 10,11 All Figure 3 9,10,11 All 0 ns Figure 3 9 10,11 All 30 40 ns 75 100 60 70 All All All 500 600 60 80 All ns ns ns 600 400 50 70 ns ns NOTE 1: VDD=+5V, VREF(+)=+5V; VREF(-)=GND=0V, unless otherwise specified. Specifications apply for mode 0. All input control signals are specified with tr=tf=20ns (10 percent to 90 percent of +5.0V) and timed from a voltage level of 1.6V. NOTE 2: Subgroups 10 and 11, if not tested, shall be guaranteed to the limits specified in Table 1. NOTE 3: Total unadjusted error includes offset, full-scale, and linearity errors. NOTE 4: The (CIN1, CIN2, RIN, COUT, and SR measurements) are measured initially and after any process or design changes which may affect these tests. NOTE 5: RDY is an open-drain output. NOTE 6: Measured with load circuits of Figure 5 and defined as the time required for an output to cross 0.8V or 2.4V. NOTE 7: If not tested, it shall be guaranteed to the limits specified in Table 1. NOTE 8: Defined as the time required for the data lines to change 0.5V when loaded with the circuits of Figure 4 and is measured only for the initial test and after process or design change which may affect tDH. TERMINAL CONNECTIONS J24 J24 1 AIN4 13 VREF2 AIN3 14 VREF+ 3 AIN2 15 RDY 4 AIN1 16 __ CS 5 NC 17 DB4 6 DB0 18 DB5 7 DB1 19 DB6 8 DB2 20 DB7 9 DB3 21 A1 10 __ 22 A0 RD 11 ___ 23 NC INT 12 GND 24 VDD ---------------------------- Electrical Characteristics of MX7824/883B for /883B and SMD 5962-8876401 and 02 19-1036 Page 4 of Rev. C 9 01 02 Package 24 pin CERDIP 24 pin CERDIP ORDERING INFORMATION: MX7824TQ/883B MX7824UQ/883B MODE SELECTION TABLE CHANNEL A1 AIN1 0 AIN2 0 AIN3 1 AIN4 1 ---------------------------- SMD NUMBER 5962-8876401LA 5962-8876402LA A0 0 1 0 1 Electrical Characteristics of MX7824/883B for /883B and SMD 5962-8876401 and 02 19-1036 Page 5 of Rev. C 9 QUALITY ASSURANCE Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in MilStd-883. Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015: 1. Test Condition, A, B, C, or D. 2. TA = +125°C minimum. 3. Interim and final electrical test requirements shall be specified in Table 2. Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B, C, and D inspection. Group A inspection: 1. Tests as specified in Table 2. 2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted. Group C and D inspections: a. End-point electrical parameters shall be specified in Table 1. b. Steady-state life test, Method 1005 of Mil-Std-883: 1. Test condition A, B, C, D. 2. TA = +125°C, minimum. 3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883. TABLE 2. ELECTRICAL TEST REQUIREMENTS Mil-Std-883 Test Requirements Interim Electric Parameters Method 5004 Final Electrical Parameters Method 5005 Group A Test Requirements Method 5005 Group C and D End-Point Electrical Parameters Method 5005 Subgroups per Method 5005, Table 1 1 1*, 2, 3, 4**, 9, 10, 11*** 1, 2, 3, 4**, 9, 10, 11*** 1 * ** PDA applies to Subgroup 1 only. Subgroup 4, Capacitance tests are performed at initial qual and upon redesign. Sample size will be 116 units. *** Subgroups 10 and 11 if not tested, are guaranteed to the limits specified in Table 1. ---------------------------- Electrical Characteristics of MX7824/883B for /883B and SMD 5962-8876401 and 02 19-1036 Page 8 of Rev. C 9
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