FCX1051ATA

FCX1051A SOT89 NPN medium power transistor Summary BVCEO > 40V IC(cont) = 3A VCE(sat) < 120mV @ 1A RCE(sat) = 57m PD = 2W Complimentary type - FCX1151A Description An NPN low voltage, high gain bipolar transistor offering very low saturation voltage and excellent current handling in the SOT89 package. C B Features • • • Very low saturation voltage High gain Small outline package E Applications • • • • Motor drive Strobe flash MOSFET and IGBT gate driving DC -DC converters E C C B Tape width (mm) 12 Quantity per reel 1,000 Ordering information Device FCX1051ATA Reel size (inches) 7 Pinout - top view Device mark 051 Issue 2 - July 2007 © Zetex Semiconductors plc 2007 1 www.zetex.com FCX1051A Absolute maximum ratings Parameter Collector-base voltage Collector-emitter voltage Emitter-base voltage Peak pulse current(a) Continuous collector current Power dissipation at Tamb = 25°C Operating and storage temperature range Symbol VCBO VCEO VEBO ICM IC Ptot Tj;Tstg Value 150 40 5 10 3 1(b) 2(c) -55 to +150 Unit V V V A A W W °C NOTES: (a) Measured under pulsed conditions. Pulse width=300 s. Duty cycle 2%. Spice parameter data is available upon request for these devices. Refer to the handling instructions for soldering surface mount components. (b) Recommended Ptot calculated using FR4 measuring 15x15x0.6mm. (c) Maximum power dissipation is calculated assuming that the device is mounted on FR4 substrate measuring 40x40x0.6mm and using comparable measurement methods adopted by other suppliers. Typical characteristics Issue 2 - July 2007 © Zetex Semiconductors plc 2007 2 www.zetex.com FCX1051A Electrical characteristics (@ Tamb = 25°C unless otherwise stated) Parameter Collector-base breakdown voltage Collector-emitter breakdown voltage Collector-emitter breakdown voltage Collector-emitter breakdown voltage Emitter-base breakdown voltage Collector cut-off current Emitter cut-off current Collector emitter cutoff current Collector-emitter saturation voltage Symbol V(BR)CBO VCES VCEO VCEV V(BR)EBO ICBO IEBO ICES VCE(sat) Min. 150 150 40 150 5 0.3 0.3 0.3 17 85 140 170 250 Base-emitter saturation VBE(sat) voltage Base-emitter turn-on voltage Static forward current transfer ratio VBE(on) hFE 290 270 270 130 40 Transition frequency Output capacitance Switching times fT Cobo ton toff 880 840 440 450 360 220 55 155 27 220 540 2%. Typ. Max. Unit V V V V V Conditions IC = 100µA IC = 100µA IC = 10mA IC =100µA, VEB = 1V IE = 100µA VCB = 120V VEB = 4V VCES = 120V IC = 0.2A, IB = 10mA (*) IC = 1A, IB = 10mA (*) IC = 2A, IB = 20mA (*) IC = 3A, IB = 40mA (*) IC = 5A, IB = 100mA (*) IC = 3A, IB = 40mA (*) IC = 3A, VCE = 2V (*) IC = 10mA, VCE = 2V (*) IC = 1A, VCE = 2V (*) IC = 3A, VCE = 2V (*) IC = 5A, VCE = 2V (*) IC = 10A, VCE = 2V (*) 10 10 10 25 120 180 250 340 1000 950 1200 nA nA nA mV mV mV mV mV mV mV MHz 40 pF ns ns IC = 50mA, VCE = 10V f = 100MHz VCB = 10V, f = 1MHz IC = 3A, IB = 30mA, VCC = 10V IC = 3A, IB = 30mA, VCC = 10V NOTES: (*) Measured under pulsed conditions. Pulse width=300 s. Duty cycle Issue 2 - July 2007 © Zetex Semiconductors plc 2007 3 www.zetex.com FCX1051A Typical characteristics 0.5 +25°C 0.5 IC/IB=100 0.4 0.4 IC/IB=50 IC/IB=100 IC/IB=200 VCE(sat) - (V) VCE(sat) - (V) 0.3 0.2 0.1 0 1m 0.3 0.2 0.1 0 -55°C +25°C +100°C +150°C 10m 100m 1 IC - Collector Current (A) 10 1m 10m 100m 1 10 VCE(sat) v IC IC - Collector Current (A) VCE(sat) v IC 750 VCE=2V 1.6 IC/IB=100 hFE - Typical gain 600 450 +100°C +25°C VBE(sat) - (V) 1.2 -55°C +25°C +100°C +150°C 300 -55°C 0.8 150 0 1m 10m 100m 1 IC - Collector Current (A) 10 0.4 0 1m 10m 100m 1 10 hFE v IC IC - Collector Current (A) VBE(sat) v IC 1.0 0.8 VBE(on) - (V) 0.6 0.4 0.2 0 1m 10m 100m 1 10 -55°C +25°C +100°C +150°C IC - Collector Current (A) VBE(on) v IC Issue 2 - July 2007 © Zetex Semiconductors plc 2007 4 www.zetex.com FCX1051A Package outline - SOT89 D D1 C A H E E1 L B B1 e e1 DIM A B B1 C D D1 Millimeters Min 1.40 0.44 0.36 0.35 4.40 1.52 Max 1.60 0.56 0.48 0.44 4.60 1.83 Inches Min 0.550 0.017 0.014 0.014 0.173 0.064 Max 0.630 0.022 0.019 0.017 0.181 0.072 DIM E E1 e e1 H L Millimeters Min 2.29 2.13 Max 2.60 2.29 Inches Min 0.090 0.084 Max 0.102 0.090 1.50 BSC 3.00 BSC 3.94 0.89 4.25 1.20 0.059 BSC 0.118 BSC 0.155 0.035 0.167 0.047 Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 2 - July 2007 © Zetex Semiconductors plc 2007 5 www.zetex.com FCX1051A Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. 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Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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