S1AB

S1A/B - S1M/B 1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER Features · · · · · · · · · · · · · Glass Passivated Die Construction Low Forward Voltage Drop and High Current Capability Surge Overload Rating to 30A Peak Ideally Suited for Automated Assembly A SMA Dim A B C D E G H Min 2.29 4.00 1.27 0.15 4.80 0.10 0.76 2.01 Max 2.92 4.60 1.63 0.31 5.59 0.20 1.52 2.62 SMB Min 3.30 4.06 1.96 0.15 5.00 0.10 0.76 2.00 Max 3.94 4.57 2.21 0.31 5.59 0.20 1.52 2.62 B Mechanical Data Case: Molded Plastic Case Material - UL Flammability Rating Classification 94V-0 Moisture sensitivity: Level 1 per J-STD-020A Terminals: Solder Plated Terminal Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band or Cathode Notch SMA Weight: 0.064 grams (approx.) SMB Weight: 0.093 grams (approx.) Marking: Type Number, See Page 2 Ordering Information: See Page 2 C D J H G E J All Dimensions in mm A, B, D, G, J, K, M Suffix Designates SMA Package AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package TA = 25°C unless otherwise specified Maximum Ratings and Electrical Characteristics Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current @ TT = 100°C Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) Forward Voltage Peak Reverse Leakage Current at Rated DC Blocking Voltage Typical Total Capacitance Operating and Storage Temperature Range @ IF = 1.0A @ TA = 25°C @ TA = 125°C (Note 1) Symbol VRRM VRWM VR VR(RMS) IO IFSM VFM IRM CT RqJT Tj, TSTG S1 A/AB 50 35 S1 B/BB 100 70 S1 D/DB 200 140 S1 G/GB 400 280 1.0 30 1.1 5.0 100 10 30 -65 to +150 S1 J/JB 600 420 S1 K/KB 800 560 S1 M/MB 1000 700 Unit V V A A V mA pF °C/W °C Typical Thermal Resistance, Junction to Terminal (Note 2) Notes: 1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC. 2. Thermal Resistance Junction to Terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pads as heat sink. DS16003 Rev. 8 - 2 1 of 2 S1A/B - S1M/B Ordering Information Device* S1x-7 S1xB-7 (Note 3) Packaging SMA SMB Shipping 5000/Tape & Reel 3000/Tape & Reel Notes: 3. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. * x = Device type, e.g. S1A-7 (SMA package); S1AB-7 (SMB package). Marking Information YWW XXX(X) XXX = Product type marking code, ex: S1A (SMA package) XXXX = Product type marking code, ex: S1AB (SMB package) = Manufacturers’ code marking YWW = Date code marking Y = Last digit of year ex: 2 for 2002 WW = Week code 01 to 52 0.8 IF, INSTANTANEOUS FORWARD CURRENT (A) 1.0 IO, AVERAGE OUTPUT CURRENT (A) 10 1.0 0.6 0.4 0.1 0.2 Resistive or inductive load 0 40 Tj = 25° C PULSE WIDTH = 300m s 2% DUTY CYCLE 0.01 0 0.4 0.8 1.2 1.6 60 80 100 120 140 160 180 TT, TERMINAL TEMPERATURE (° C) Fig. 1 Forward Current Derating Curve VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics 30 IFSM, PEAK FORWARD SURGE CURRENT (A) 8.3ms Single half sine-wave JEDEC Method 1000 25 100 Tj = 125° C 20 10 15 1.0 Tj = 25° C 10 0.1 5 1 10 NUMBER OF CYCLES @ 60Hz Fig. 3 Typical Forward Characteristics 100 0.01 0 40 80 120 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig. 4 Typical Reverse Characteristics DS16003 Rev. 8 - 2 2 of 2 S1A/B - S1M/B