SMC

SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X Y G Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF 6.3 3.3 2.7 1.5 4.8 SOD-123 4.9 2.5 0.7 1.2 3.7 SOD-323 3.75 1.05 0.65 1.35 2.40 SOD-523 2.3 1.1 0.8 0.6 1.7 SMA 6.5 1.5 1.7 2.5 4.0 SMB 6.8 1.8 2.3 2.5 4.3 SMC 9.4 4.4 3.3 2.5 6.8 DFN1006-3 / DFN1006H4-3 C X1 X G2 G1 Y Z Dimensions Z G1 G2 X X1 Y C Value (in mm) 1.1 0.3 0.2 0.7 0.25 0.4 0.7 DFN1411-3 C X2 X1 G2 X Y Z G1 Dimensions Z G1 G2 X X1 X2 Y C Value (in mm) 1.38 0.15 0.15 0.95 0.75 0.40 0.75 0.76 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 1 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated DFN1612-6 / DFN1310H4-6 G2 X2 Y2 G1 b Y1 G3 a X1 Dimensions G1 G2 G3 X1 X2 Y1 Y2 a b DFN1612-6 0.15 0.175 0.15 0.60 0.25 0.65 0.45 0.10 0.15 DFN1310H4-6 0.16 0.17 0.15 0.52 0.20 0.52 0.375 0.09 0.06 DFN1616-6 Y X2 G X1 C X2 a G2 DFN1616-8 Dimensions Value (in mm) Z 1.3 G 0.175 X1 0.50 X2 0.525 Y 0.30 C 0.50 Y2 Y1 G1 Dimensions Value (in mm) G1 0.15 G2 0.20 X1 0.65 X2 0.25 Y1 1.25 Y2 0.50 C 0.40 a 0.10 Z X1 C DFN2018-6 X Y C Y1 G Dimensions C G X X1 Y Y1 Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20 X1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 2 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated DFN2020-3 Dimensions C G X X1 X2 X3 Y Y1 Y2 Y3 Y4 R1 R2 R3 Value (in mm) 1.00 0.15 1.40 0.35 0.45 0.322 1.10 0.60 0.45 0.45 0.698 0.225 0.05 0.20 DFN2020B-3 X X2 Y3 Y4 R3 G Y1 X1 C Y2 X3 R2 Y R1 X Y1 Y G X1 Y2 C Dimensions C G X X1 Y Y1 Y2 Value (in mm) 1.30 0.24 0.35 1.52 1.09 0.47 0.50 DFN2020-6 Y X2 C G Y C DFN2020B-6 X1 G Y Z Dimensions Value (in mm) Z 1.67 G 0.15 X1 0.90 X2 0.45 Y 0.37 C 0.65 X2 G1 G X1 G Y1 Z Dimensions Value (in mm) Z 1.67 G 0.20 G1 0.40 X1 1.0 X2 0.45 Y 0.37 Y1 0.70 C 0.65 DFN3020B-8 C X Y1 G Y2 Y G1 X1 Dimensions C G G1 X X1 Y Y1 Y2 Value (in mm) 0.650 0.285 0.090 0.400 1.120 0.730 0.500 0.365 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 3 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated DFN3030-4 Dimensions C G1 G2 G3 G4 G5 G6 G7 G8 R X X1 X2 X3 Y Y1 Y2 Y3 Value (in mm) 1.300 0.100 0.150 0.830 0.115 0.135 0.170 0.500 0.500 0.150 0.500 1.375 1.225 1.175 1.980 1.015 0.715 0.650 DFN3030-8 C Y3 (2x) G4 X3 G6 G1 R Y G2 Z Y2 G3 X1 Y1 G7 G5 X2 X1 G8 X2 Y C Dimensions Value (in mm) Z 2.59 G 0.11 X1 2.49 X2 0.65 Y 0.39 C 0.65 G X (4x) DFN3030E-8 X (x8) Y (x8) C Y1 Y2 Dimensions C C1 X Y Y1 Y2 Value (in mm) 0.65 2.35 0.30 0.65 1.60 2.75 C1 DFN3030-10 Y C X1 G Y C DFN3030-12 X G Z Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.30 C 0.50 X1 G X G Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.28 C 0.45 Z ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 4 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated DFN5020-6 Y X X1 C Y2 Y3 X2 G Dimensions Value (in mm) C 0.50 G 0.35 X 0.35 X1 0.90 X2 1.80 Y 0.70 Y2 1.60 Y3 3.20 DF-S / MiniDIP X X MSOP-8L Z Dimensions DF-S MiniDIP Z 10.26 6.91 X 1.2 0.60 Y 1.52 0.76 C 5.2 2.67 Y C1 C2 Dimensions Value (in mm) X 0.45 Y 1.4 C1 4.4 C2 0.65 Y C MSOP-8L-EP MSOP-10L X X1 Y1 C1 C2 Y Dimensions Value (in mm) C1 4.2 C2 0.65 X 0.32 X1 1.95 Y 0.8 Y1 1.65 Y X C1 Dimensions X Y C1 C2 Value (in mm) 0.30 1.4 4.4 0.50 C2 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 5 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated PowerDI 5 X ® PowerDI 123 / PowerDI 323 ® ® Y X1 G X2 Y2 X1 (2x) Y1 (2x) C Y1 G Dimensions C G X X1 Y Y1 Value (in mm) 1.840 0.852 3.360 1.390 4.860 1.400 Dimensions G X1 X2 Y1 Y2 PowerDI 123 1.0 2.2 0.9 1.4 1.4 ® PowerDI 323 0.5 2.0 0.8 0.8 1.1 ® PowerDI3333-8 X G PowerDI5060-8 X Y2 8 Y2 G1 5 Y1 Y Y1 Y X1 1 Y3 X2 C 4 G1 C Y3 (4x) X2 (8x) G Dimensions C G G1 Y Y1 Y2 Y3 X X2 Value (in mm) 0.650 0.230 0.420 3.700 2.250 1.850 0.700 2.370 0.420 Dimensions C G G1 X X1 X2 Y Y1 Y2 Y3 Value (in mm) 1.270 0.660 0.820 4.420 4.100 0.610 6.610 3.810 1.020 1.270 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 6 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated SM-8 X Y (8x) C1 Y1 SO-8 Dimensions C C1 X Y Y1 C Value (in mm) 1.52 4.6 0.95 2.80 6.80 Y C1 C2 Dimensions Value (in mm) X 0.60 Y 1.55 C1 5.4 C2 1.27 X (8x) SOD-323F X1 Y (2x) Dimensions Value (in mm) X 0.710 X1 2.700 Y 0.403 X (2x) SOP-14L X C1 C2 Y Dimensions Value (in mm) X 0.60 Y 1.50 C1 5.4 C2 1.27 SOP-16L X C1 C2 Y Dimensions X Y C1 C2 Value (in mm) 0.60 1.50 5.4 1.27 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 7 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated SOT-143 X SOT-223 X1 Y1 X2 Y G Z C C1 Y2 X1 X2 C2 X2 Dimensions Z G X X1 X2 Y C Value (in mm) 2.70 1.30 2.50 1.0 0.60 0.70 2.0 Dimensions X1 X2 Y1 Y2 C1 C2 Value (in mm) 3.3 1.2 1.6 1.6 6.4 2.3 SOT-523 / SOT-323 / SOT23 / SC-59 Y Z C X E Dimensions Z X Y C E SOT-523 1.8 0.4 0.51 1.3 0.7 SOT-323 2.8 0.7 0.9 1.9 1.0 SOT23 2.9 0.8 0.9 2.0 1.35 SC-59 3.4 0.8 1.0 2.4 1.35 SOT-23F C Y1 Y (3x) Dimensions Value (in mm) C 0.95 X 0.60 Y 0.80 Y1 1.80 X (3x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 8 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated SC-74R / SOT-26 / SOT-363 / SOT-563 C2 C2 SOT-25 / SOT-353 C2 C2 Z G C1 Z G C1 Y X Y X Dimensions Z G X Y C1 C2 SC-74R / SOT-26 3.20 1.60 0.55 0.80 2.40 0.95 SOT-363 2.5 1.3 0.42 0.6 1.9 0.65 SOT-563 2.2 1.2 0.375 0.5 1.7 0.5 Dimensions Z G X Y C1 C2 SOT-25 3.20 1.60 0.55 0.80 2.40 0.95 SOT-353 2.5 1.3 0.42 0.6 1.9 0.65 SOT-666 C Y (6x) G Dimensions Value (in mm) C 0.50 G 0.80 X 0.35 Y 0.50 X (6x) SOT-953 C C Y1 Y (5X) Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100 X (5X) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 9 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated SOT-963 C C Y1 Y (6X) Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100 X (6X) SOT89-3L X1 SOT89-5L X1 X2 (2x) Y1 Y3 Y Y2 C X (3x) Y4 Dimensions Value (in mm) X 0.900 X1 1.733 X2 0.416 Y 1.300 Y1 4.600 Y2 1.475 Y3 0.950 Y4 1.125 C 1.500 Y4 Y1 X2 Y2 X3 C Y3 Dimensions Value (in mm) X1 1.7 X2 0.55 X3 0.4 Y1 4.6 Y2 1.2 Y3 0.5 Y4 1.1 C 3.0 TO252-3L (DPAK) / TO263-3L (D PAK) X2 2 Dimensions Y2 C Y1 Z Z X1 X2 Y1 Y2 C E1 TO252-3L / DPAK 11.6 1.5 7.0 2.5 7.0 6.9 2.3 TO263-3L / 2 D PAK 16.9 1.1 10.8 3.5 11.4 9.5 2.5 X1 E1 TO252-4L X1 Y1 Y2 c1 Y3 Y X (4x) c Dimensions c c1 X X1 Y Y1 Y2 Y3 Value (in mm) 1.27 2.54 1.00 5.73 2.00 6.17 1.64 2.66 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 10 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated TO252-5L X TO263-5L X Y1 Y Y C1 Y1 Y2 X1 C2 Y2 X1 C Dimensions X X1 Y Y1 Y2 C1 C2 Value (in mm) 5.6 0.6 11.0 5.6 2.0 7.2 1.27 Dimensions X X1 Y Y1 Y2 C Value (in mm) 10.9 1.05 15.7 9.1 2.5 1.7 TSOT23-5 C C Y1 Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199 Y (5x) X (5x) TSOT23-6 C C Y1 Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199 Y (6x) X (6x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 11 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated TSSOP-14L X C1 C2 Y Dimensions Value (in mm) X 0.45 Y 1.45 C1 5.9 C2 0.65 WL-CSD1010H6-4 ØD C Dimensions C D Value (in mm) 0.50 0.25 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 12 of 12 www.diodes.com Suggested Pad Layout © Diodes Incorporated