SOT89-3

SUGGESTED PAD LAYOUT Based on IPC-7351A X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC C X Y G Z Dimensions Z G X Y C X1-DFN1006-2 / MiniMELF X2-DFN1006-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF 6.3 3.3 2.7 1.5 4.8 SOD123 4.9 2.5 0.7 1.2 3.7 SOD323 3.75 1.05 0.65 1.35 2.40 SOD523 2.3 1.1 0.8 0.6 1.7 SMA 6.5 1.5 1.7 2.5 4.0 SMB 6.8 1.8 2.3 2.5 4.3 SMC 9.4 4.4 3.3 2.5 6.8 X3-DFN0603-2 Z C X1-DFN1006-3 / X2-DFN1006-3 C X1 X G2 Y (2x) Dimensions Value (in mm) C 0.355 X 0.230 Y 0.300 Z 0.610 G1 Y X (2x) Dimensions Value (in mm) Z 1.1 G1 0.3 G2 0.2 X 0.7 X1 0.25 Y 0.4 C 0.7 Z X1-DFN1212-3 X Y Y2 Y1 (2x) C X1 (2x) Dimensions C X X1 Y Y1 Y2 Value (in mm) 0.80 0.42 0.32 0.50 0.50 1.50 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 1 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated X1-DFN1212-3 Type B X Y X2 Y3 Y2 X1(2x) Y1 (2x) C Dimensions C X X1 X2 Y Y1 Y2 Y3 Value (in mm) 0.80 0.42 0.32 0.90 0.50 0.50 0.20 1.50 X1-DFN1411-3 C X2 X1 G2 X Y Z G1 Dimensions Z G1 G2 X X1 X2 Y C Value (in mm) 1.38 0.15 0.15 0.95 0.75 0.40 0.75 0.76 X1-DFN1612-6 / X2-DFN1310-6 G2 X2 Y2 G1 b Y1 G3 a X1 Dimensions X1-DFN1612-6 X2- DFN1310-6 G1 0.15 0.16 G2 0.175 0.17 G3 0.15 0.15 X1 0.60 0.52 X2 0.25 0.20 Y1 0.65 0.52 Y2 0.45 0.375 a 0.10 0.09 b 0.15 0.06 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 2 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated U-DFN1616-6 Y X2 G X1 C X2 a G2 U-DFN1616-8 Dimensions Value (in mm) Z 1.3 G 0.175 X1 0.50 X2 0.525 Y 0.30 C 0.50 Y2 Y1 G1 Dimensions Value (in mm) G1 0.15 G2 0.20 X1 0.65 X2 0.25 Y1 1.25 Y2 0.50 C 0.40 a 0.10 Z X1 C U-DFN2018-6 X Y C Y1 G Dimensions C G X X1 Y Y1 Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20 X1 U-DFN2020-3 X X2 X4 Y3 Y4 R3 G Y1 X1 C Y2 Y5 X3 R2 Y R1 Dimensions C G X X1 X2 X3 X4 Y Value Value Dimensions (in mm) (in mm) 1.00 Y1 0.60 0.15 Y2 0.45 1.40 Y3 0.45 0.35 Y4 0.698 0.45 Y5 0.313 0.322 R1 0.225 0.60 R2 0.05 1.10 R3 0.20 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 3 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated U-DFN2020-3 Type B X Y1 U-DFN2020-6 Y C G Dimensions C G X X1 Y Y1 Y2 Y G X1 Y2 C Value (in mm) 1.30 0.24 0.35 1.52 1.09 0.47 0.50 X2 Dimensions Z G X1 X2 Y C X1 G Y Z Value (in mm) 1.67 0.15 0.90 0.45 0.37 0.65 U-DFN2020-6 Type B Y X2 G1 X1 C U-DFN2020-6 Type E Value (in mm) 1.67 0.20 0.40 1.0 0.45 0.37 0.70 0.65 Dimensions G Dimensions C X X1 X2 Y Y1 Y2 Y3 G Y1 Z Z G G1 X1 X2 Y Y1 C Y3 Y2 X2 Y1 X1 Value (in mm) 0.650 0.400 0.285 1.050 0.500 0.920 1.600 2.300 X (6x) C Y (2x) U-DFN2510-8 X1 X X1 U-DFN2523-6 Dimensions Y Y1 G c c1 c c1 G X X1 Y Y1 Value (in mm) 0.5 1.0 0.2 0.2 0.4 0.6 1.4 Y1 Y2 Y3 Y C X Dimensions Value (in mm) C 0.650 X 0.400 X1 1.700 Y 0.650 Y1 0.450 Y2 1.830 Y3 2.700 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 4 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated W-DFN3020-8 Type B C X Y1 G Y2 Y G1 X1 Dimensions Value (in mm) C 0.650 G 0.285 G1 0.090 X 0.400 X1 1.120 Y 0.730 Y1 0.500 Y2 0.365 U-DFN3030-4 Dimensions C G1 G2 G3 G4 G5 G6 G7 G8 R X X1 X2 X3 Y Y1 Y2 Y3 Value (in mm) 1.300 0.100 0.150 0.830 0.115 0.135 0.170 0.500 0.500 0.150 0.500 1.375 1.225 1.175 1.980 1.015 0.715 0.650 U-DFN3030-8 C Y3 (2x) G4 X3 G6 G1 R Y G2 Z Y2 G3 X1 Y1 G7 G5 X2 X1 G8 X2 Y C Dimensions Value (in mm) Z 2.59 G 0.11 X1 2.49 X2 0.65 Y 0.39 C 0.65 G X (4x) U-DFN3030-8 Type E X (x8) Y (x8) C Y1 Y2 Dimensions C C1 X Y Y1 Y2 Value (in mm) 0.65 2.35 0.30 0.65 1.60 2.75 C1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 5 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated U-DFN3030-10 Y C X1 G Y C U-DFN3030-12 X G Z Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.30 C 0.50 X1 G X G Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.28 C 0.45 Z DFN322 C C X (3x) Y (2x) G Y4 Y3 Y2 X1 Y1 Dimensions C G X X1 Y Y1 Y2 Y3 Y4 Value (in mm) 0.65 0.20 0.35 1.52 0.55 0.98 0.47 0.63 2.20 W-DFN5020-6 Z Y X X1 C Y2 Y3 X2 G W-DFN5060-4 C Dimensions Value (in mm) C 0.50 G 0.35 X 0.35 X1 0.90 X2 1.80 Y 0.70 Y2 1.60 Y3 3.20 Y1 Dimensions Value (in mm) C 4.00 X 0.75 Y 0.95 Y1 6.20 Z 4.75 X (4x) Y (4x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 6 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated DF-S / MiniDIP X MSOP-8 Z Dimensions DF-S MiniDIP Z 10.26 6.91 X 1.2 0.60 Y 1.52 0.76 C 5.2 2.67 Y X C1 C2 Dimensions Value (in mm) X 0.45 Y 1.4 C1 4.4 C2 0.65 Y C MSOP-8L-EP MSOP-10 X X1 Y1 C1 C2 Y Dimensions Value (in mm) C1 4.2 C2 0.65 X 0.32 X1 1.95 Y 0.8 Y1 1.65 Y X C1 Dimensions X Y C1 C2 Value (in mm) 0.30 1.4 4.4 0.50 C2 POWERDI 5 X ® POWERDI 123 / POWERDI 323 ® ® Y X1 G X2 Y2 X1 (2x) Y1 (2x) C Y1 G Dimensions C G X X1 Y Y1 Value (in mm) 1.840 0.852 3.360 1.390 4.860 1.400 Dimensions POWERDI®123 POWERDI®323 G 1.0 0.5 X1 2.2 2.0 X2 0.9 0.8 Y1 1.4 0.8 Y2 1.4 1.1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 7 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated POWERDI 123 Type B X ® Y Dimensions G X X1 Y G X1 Value (in mm) 2.000 1.050 4.100 1.500 POWERDI 3333-8 X G ® POWERDI 5060-8 X Y2 ® 8 Y2 G1 5 Y1 Y Y1 Y X1 1 Y3 X2 C 4 G1 C Y3 (4x) X2 (8x) G Dimensions C G G1 Y Y1 Y2 Y3 X X2 Value (in mm) 0.650 0.230 0.420 3.700 2.250 1.850 0.700 2.370 0.420 Dimensions C G G1 X X1 X2 Y Y1 Y2 Y3 Value (in mm) 1.270 0.660 0.820 4.420 4.100 0.610 6.610 3.810 1.020 1.270 SM-8 X SO-8 Y (8x) C1 Y1 Dimensions C C1 X Y Y1 C Value (in mm) 1.52 4.6 0.95 2.80 6.80 Y C1 C2 Dimensions Value (in mm) X 0.60 Y 1.55 C1 5.4 C2 1.27 X (8x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 8 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated SOD323F X1 Y (2x) Dimensions Value (in mm) X 0.710 X1 2.700 Y 0.403 X (2x) SOP-14 X C1 C2 Y Dimensions Value (in mm) X 0.60 Y 1.50 C1 5.4 C2 1.27 SOP-16 X C1 C2 Y Dimensions X Y C1 C2 Value (in mm) 0.60 1.50 5.4 1.27 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 9 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated SOT143 X Y1 SOT223 X1 X2 Y G Z C C1 Y2 X1 X2 C2 X2 Dimensions Z G X X1 X2 Y C Value (in mm) 2.70 1.30 2.50 1.0 0.60 0.70 2.0 Dimensions X1 X2 Y1 Y2 C1 C2 Value (in mm) 3.3 1.2 1.6 1.6 6.4 2.3 SOT523 / SOT323 / SOT23 / SC59 Y Z C X E Dimensions Z X Y C E SOT523 1.8 0.4 0.51 1.3 0.7 SOT323 2.8 0.7 0.9 1.9 1.0 SOT23 2.9 0.8 0.9 2.0 1.35 SC59 3.4 0.8 1.0 2.4 1.35 SOT23F C Y1 Y (3x) Dimensions Value (in mm) C 0.95 X 0.60 Y 0.80 Y1 1.80 X (3x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 10 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated SC74R / SOT26 / SOT363 / SOT563 C2 C2 SOT25 / SOT353 / SOT553 C2 C2 Z G C1 Z G C1 Y X Y X Dimensions Z G X Y C1 C2 SC74R / SOT26 3.20 1.60 0.55 0.80 2.40 0.95 SOT363 2.5 1.3 0.42 0.6 1.9 0.65 SOT563 2.2 1.2 0.375 0.5 1.7 0.5 Dimensions Z G X Y C1 C2 SOT25 3.20 1.60 0.55 0.80 2.40 0.95 SOT353 2.5 1.3 0.42 0.6 1.9 0.65 SOT553 2.2 1.2 0.375 0.5 1.7 0.5 SOT666 C Y (6x) G Dimensions Value (in mm) C 0.50 G 0.80 X 0.35 Y 0.50 X (6x) SOT953 C C Y1 Y (5X) Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100 X (5X) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 11 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated SOT963 C C Y1 Y (6X) Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100 X (6X) SOT89-3 X1 X1 SOT89-5 X2 (2x) Y1 Y3 Y Y2 C X (3x) Y4 Dimensions Value (in mm) X 0.900 X1 1.733 X2 0.416 Y 1.300 Y1 4.600 Y2 1.475 Y3 0.950 Y4 1.125 C 1.500 Y4 Y1 X2 Y2 X3 C Y3 Dimensions Value (in mm) X1 1.7 X2 0.55 X3 0.4 Y1 4.6 Y2 1.2 Y3 0.5 Y4 1.1 C 3.0 TO252 (DPAK) / TO263 (D PAK) X2 2 Y2 C Y1 Z Dimensions Z X1 X2 Y1 Y2 C E1 TO252 / DPAK TO263 / D PAK 11.6 16.9 1.5 1.1 7.0 10.8 2.5 3.5 7.0 11.4 6.9 9.5 2.3 2.5 2 X1 E1 TO252-4 X1 Y1 Y2 c1 Y3 Y X (4x) c Dimensions c c1 X X1 Y Y1 Y2 Y3 Value (in mm) 1.27 2.54 1.00 5.73 2.00 6.17 1.64 2.66 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 12 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated TO252-5 X TO263-5 X Y1 Y Y C1 Y1 Y2 X1 C2 Y2 X1 C Dimensions X X1 Y Y1 Y2 C1 C2 Value (in mm) 5.6 0.6 11.0 5.6 2.0 7.2 1.27 Dimensions X X1 Y Y1 Y2 C Value (in mm) 10.9 1.05 15.7 9.1 2.5 1.7 TSOT25 C C Y1 Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199 Y (5x) X (5x) TSOT26 C C Y1 Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199 Y (6x) X (6x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 13 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated TSSOP-14 X C1 C2 Y Dimensions Value (in mm) X 0.45 Y 1.45 C1 5.9 C2 0.65 U-WLB1010-4 ØD C Dimensions C D Value (in mm) 0.50 0.25 C U-WLB1510-6 D Dimensions C1 C C C1 D Value (in mm) 0.50 1.00 0.25 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 14 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated