E1WCDA12-32.768K

E1WC Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Watch Crystal Resonator 2.1mm x 6.2mm Thru-Hole Metal Cylindrical 32.768KHz ELECTRICAL SPECIFICATIONS Nominal Frequency 32.768kHz Frequency Tolerance ±20ppm at 25°C Frequency Stability Temperature Coefficient Turn over Temperature -0.035±0.01ppm/(Change in °C)² Maximum Aging at 25°C ±3ppm/year Maximum Operating Temperature Range -10°C to +60°C (See options) Load Capacitance Shunt Capacitance 6 pF Parallel Resonant 7 pF Parallel Resonant 9 pF Parallel Resonant 12.5pF Parallel Resonant 0.8 to 1.7pF Typical Motional Capacitance 1.0 to 4.0fF Typical Equivalent Series Resistance 35,000 Ohms Maximum Mode of Operation Drive Level Fundamental 1µWatt Maximum Crystal Cut Storage Temperature Range Tuning Fork -40°C to +85°C Insulation Resistance (Measured at 100Vdc) 500 Megaohms Minimum 25°C ±5°C Revised C: 11/03/2020 Page 1 of 5 www.ecliptek.com E1WC Series PART NUMBERING GUIDE Revised C: 11/03/2020 Page 2 of 5 www.ecliptek.com E1WC Series MECHANICAL DIMENSIONS Revised C: 11/03/2020 Page 3 of 5 www.ecliptek.com E1WC Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS) 150°C 175°C 200°C 60 - 180 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 3°C/Second Maximum Peak Temperature (TP) 260°C Maximum for 10 Seconds Maximum Target Peak Temperature(TP Target) 250°C +0/-5°C Time within 5°C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6°C/Second Maximum Time 25°C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 217°C 60 - 150 Seconds High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised C: 11/03/2020 Page 4 of 5 www.ecliptek.com E1WC Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum Preheat - Temperature Minimum (Ts MIN) - Temperature Typical (Ts TYP) - Temperature Maximum(Ts MAX) - Time (ts) N/A 150°C N/A 30 - 60 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 5°C/Second Maximum Peak Temperature (TP) 245°C Maximum Target Peak Temperature (TP Target) 245°C Maximum 2 Times / 230˚C Maximum 1 Time Time within 5°C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 150°C 200 Seconds Maximum Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised C: 11/03/2020 Page 5 of 5 www.ecliptek.com