merging Memory & Logic Solutions Inc.
Document Title
256K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM
EM620FV8AT Series
Low Power, 256Kx8 SRAM
Revision History
Revision No.
0.0 0.1
History
Initial Draft 1’st Revision I CC2 value change ( @70ns product : 20mA -> 25mA ) ( @55ns product : 25mA -> 30mA ) I SB1 Max. value changed from 5uA to 15uA. I SB1 Typ. value deleted. I DR Max. value changed to 5uA. I DR Typ. value deleted.
Draft Date
May 31 , 2004 Dec 14 , 2004
Remark
0.2
2’nd Revision
Jan 4 , 2005
Emerging Memory & Logic Solutions Inc.
4F Korea Construction Financial Cooperative B/D, 301-1 Yeon-Dong, Jeju-Si, Jeju-Do, Rep.of Korea Tel : +82-64-740-1712 Fax : +82-64-740-1749~1750 / Homepage : www.emlsi.com Zip Code : 690-719
The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office. 1
Rev 0.2
merging Memory & Logic Solutions Inc.
FEATURES
• • • • • • Process Technology : 0.15µ m Full CMOS Organization : 256K x 8 bit Power Supply Voltage : 2.7V ~ 3.6V Low Data Retention Voltage : 1.5V(Min) Three state output and TTL Compatible Package Type : 32-TSOP1
EM620FV8AT Series
Low Power, 256Kx8 SRAM
GENERAL DESCRIPTION
The EM620FV8AT families are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current.
PRODUCT FAMILY
Power Dissipation Product Family Operating Temperature Industrial (-40 ~ 85oC) Vcc Range Speed Standby (ISB1 , Max) 15 µA Operating (I CC1.Max) 3 mA PKG Type
EM620FV8AT
2.7V~3.6V
551) / 70ns
32 TSOP1
1. The parameter is measured with 30pF test load.
PIN DESCRIPTION
A11 A9 A8 A13 WE CS2 A15 VCC A17 A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 OE A10 CS1 IO8 IO7 IO6 IO5 IO4 VSS I/O3 I/O2 I/O1 A0 A1 A2 A3
FUNCTIONAL BLOCK DIAGRAM
Pre-charge Circuit
R ow S elec t
32 - TSOP Type1 - Forward
26 25 24 23 22 21 20 19 18 17
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9
VC C VSS
Memory Array 1024 x 2048
I/O1 ~ I/O8
Data Cont
I/O Circuit Column Select
N ame CS 1 ,CS 2 OE A 0 ~A17 I/O1 ~I/O 8
Function Chip select inputs O utput Enable input A ddress Inputs D ata Inputs/outputs
Name WE Vcc Vss NC
Function
A A11 A12 A13 A A15 A A 10 14 16 17
Write Enable input Power Supply Ground No Connection
WE OE C1 S C2 S
Control Logic
2
Rev 0.2
merging Memory & Logic Solutions Inc.
ABSOLUTE MAXIMUM RATINGS * Parameter
Voltage on Any Pin Relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Operating Temperature
EM620FV8AT Series
Low Power, 256Kx8 SRAM
Symbol
VIN , VOUT VCC PD TA
Ratings
-0.2 to Vcc+0.3 (Max. 4.0V) -0.2 to 4.0V 1.0 -40 to 85
Unit
V V W
oC
* Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
FUNCTIONAL DESCRIPTION
CS 1 H X L L L CS 2 X L H H H OE X X H L X WE X X H H L I/O High-Z High-Z High-Z Data Out Data In Mode Deselected Deselected Output Disabled Read Write Power Stand by Stand by Active Active Active
Note: X means don’t care. (Must be low or high state)
3
Rev 0.2
merging Memory & Logic Solutions Inc.
RECOMMENDED DC OPERATING CONDITIONS 1)
Parameter Supply voltage Ground Input high voltage Input low voltage
1. 2. 3. 4.
EM620FV8AT Series
Low Power, 256Kx8 SRAM
Symbol VCC VSS VIH VIL
Min 2.7 0 2.2 -0.23)
Typ 3.3 0 -
Max 3.6 0 VCC + 0.22) 0.6
Unit V V V V
TA= -40 to 85oC, otherwise specified Overshoot: V CC +2.0 V in case of pulse width < 20ns Undershoot: -2.0 V in case of pulse width < 20ns Overshoot and undershoot are sampled, not 100% tested.
CAPACITANCE 1) (f =1MHz, TA=25oC)
Item Input capacitance Input/Ouput capacitance
1. Capacitance is sampled, not 100% tested
Symbol C IN CIO
Test Condition VIN=0V VIO =0V
Min -
Max 8 10
Unit pF pF
DC AND OPERATING CHARACTERISTICS
Parameter Input leakage current Output leakage current Operating power supply Symbol ILI ILO ICC I CC1 Average operating current I CC2 Output low voltage Output high voltage Standby Current (TTL) VOL VOH ISB
V IN=V SS t o V CC C S 1 = VIH , CS2 =VIL o r OE=V IH o r WE =VIL , VIO= VSS t o V CC I IO=0mA, CS 1=V IL, CS 2=WE = VIH , VI N=VI H or VIL C ycle time=1 µs, 100% duty, I IO=0mA, CS 1< 0.2V, CS2 >V CC -0.2V, V IN< 0.2V or VIN >V CC-0.2V C ycle time = Min, I IO =0mA, 100% duty, CS 1=V IL, CS2 =V IH, V IN=V IL or VI H I OL = 2 .1mA I O H = - 1.0mA C S 1 = VIH , CS2 =VIL , Other inputs=V IH or V IL C S 1 >V CC-0.2V, CS 2>V C C-0.2V (CS 1 c ontrolled) or 0V
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