EM6321FS16AS-70S

merging Memory & Logic Solutions Inc. Document Title 512K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM EM641FV8FS Series Low Power, 512Kx8 SRAM Revision History Revision No. 0.0 0.1 History Initial Draft 2’nd Draft Add Pb-free part number Draft Date May 25 , 2003 February 13 , 2004 Remark Preliminary Emerging Memory & Logic Solutions Inc. IT Venture Tower Eastside 11F, 78, Karac-Dong, Songpa-Ku, Seoul, Rep.of Korea Zip Code : 138-160 Tel : +82-2-2142-1759~1766 Fax : +82-2-2142-1769 / Homepage : www.emlsi.com The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office. 1 merging Memory & Logic Solutions Inc. FEATURES • • • • • • Process Technology : 0.18µ m Full CMOS Organization : 512K x 8 bit Power Supply Voltage : 2.7V ~ 3.6V Low Data Retention Voltage : 1.5V(Min) Three state output and TTL Compatible Package Type : 32-sTSOP1 EM641FV8FS Series Low Power, 512Kx8 SRAM GENERAL DESCRIPTION The EM641FV8FS families are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current. PRODUCT FAMILY Power Dissipation Product Family EM641FV8FS Operating Temperature Industrial (-40 ~ 85oC) Vcc Range Speed Standby (ISB1 , Typ) 1 µA2) Operating (I CC1.Max) 3 mA PKG Type 2.7V~3.6V 551) / 70ns 32- sTSOP1 1. The parameter is measured with 30pF test load. 2. Typical values are measured at Vcc=3.3V, T A =25o C and not 100% tested. PIN DESCRIPTION A11 A9 A8 A13 WE A17 A15 VCC A18 A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 OE A10 CS IO8 IO7 IO6 IO5 IO4 VSS I/O3 I/O2 I/O1 A0 A1 A2 A3 FUNCTIONAL BLOCK DIAGRAM Pre-charge Circuit 23 22 21 20 19 18 17 R ow S elec t 32 - sTSOP Type1 - Forward 26 25 24 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 VC C VSS Memory Array 2048 x 2048 I/O1 ~ I/O4 I/O5 ~ I/O8 Data Cont Data Cont I/O Circuit Column Select N ame CS OE A 0 ~A18 I/O1 ~I/O 8 Function Chip select inputs O utput Enable input A ddress Inputs D ata Inputs/outputs Name WE Vcc Vss NC Function Write Enable input Power Supply Ground W E A A A13 A1 A A A A 11 12 4 15 16 17 18 No Connection O E CS Control Logic 2 merging Memory & Logic Solutions Inc. ABSOLUTE MAXIMUM RATINGS * Parameter Voltage on Any Pin Relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Operating Temperature EM641FV8FS Series Low Power, 512Kx8 SRAM Symbol VIN , VOUT VCC PD TA Ratings -0.2 to Vcc+0.3(Max.4.0V) -0.2 to 4.0V 1.0 -40 to 85 Unit V V W oC * Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability. FUNCTIONAL DESCRIPTION CS H L L L OE X H L X WE X H H L I/O High-Z High-Z Data Out Data In Mode Deselected Output Disabled Read Write Power Stand by Active Active Active Note: X means don’t care. (Must be low or high state) 3 merging Memory & Logic Solutions Inc. RECOMMENDED DC OPERATING CONDITIONS 1) Parameter Supply voltage Ground Input high voltage Input low voltage 1. 2. 3. 4. EM641FV8FS Series Low Power, 512Kx8 SRAM Symbol VCC VSS VIH VIL Min 2.7 0 2.2 -0.2 3) Typ 3.3 0 - Max 3.6 0 VCC + 0 .22) 0.6 Unit V V V V TA= -40 to 85oC, otherwise specified Overshoot: V CC +2.0 V in case of pulse width < 20ns Undershoot: -2.0 V in case of pulse width < 20ns Overshoot and undershoot are sampled, not 100% tested. CAPACITANCE 1) (f =1MHz, TA=25oC) Item Input capacitance Input/Ouput capacitance 1. Capacitance is sampled, not 100% tested Symbol C IN CIO Test Condition VIN=0V VIO =0V Min - Max 8 10 Unit pF pF DC AND OPERATING CHARACTERISTICS Parameter Input leakage current Output leakage current Operating power supply Symbol ILI ILO ICC I CC1 Average operating current I CC2 Output low voltage Output high voltage Standby Current (TTL) VOL VOH ISB C ycle time = Min, I IO =0mA, 100% duty, CS = VIL , V IN=V IL o r V IH I OL = 2 .1mA I O H = - 1.0mA C S =VIH , Other inputs=VIH o r VIL C S >V CC -0.2V, V IN=V SS t o V CC C S =VIH o r OE = VIH or WE =V IL, VIO =VSS t o V CC I IO=0mA, CS = VIL , VIN = VIH o r V IL C ycle time=1 µs, 100% duty, I IO=0mA, CS V cc-0.2V CS GND 8 merging Memory & Logic Solutions Inc. PACKAGE DIMENSIONS EM641FV8FS Series Low Power, 512Kx8 SRAM Unit : millimeters/Inches ( 32-sTSOP1-0813.4F ) +0.10 - 0.05 0.008 +0.004 - 0.002 0.20 13.40 +/-0.20 0.528 +/- 0.008 0.10 0.004 MAX #32 #1 ( 0.25 ) 0.010 8.40 0.331MAX 8.00 0.315 0.50 0.0197 #16 #17 1.00 +/-0.10 0.039 +/- 0.004 0.25 TYP 0.010 11.80 0.465 +/-0.10 +/- 0.004 +0.10 - 0.05 0.006 +0.004 - 0.002 0.05 0.002 MIN 0.15 1.20 MAX 0.047 0~8 0.45~0.75 0.018~0.030 0.50 ( 0.020 ) 9 merging Memory & Logic Solutions Inc. MEMORY FUNCTION GUIDE EM641FV8FS Series Low Power, 512Kx8 SRAM EM X XX X X X XX X X - XX XX 1. EMLSI Memory 2. Device Type 3. Density 4. Option 5. Technology 6. Operating Voltage 1. Memory Component 2. Device Type 6 ------------------------ Low Power SRAM 7 ------------------------ STRAM 3. Density 1 ------------------------- 1M 2 ------------------------- 2M 4 ------------------------- 4M 8 ------------------------- 8M 16 ----------------------- 16M 32 ----------------------- 32M 64 ----------------------- 64M 4. Mode Option 0 -------- Dual CS 1 -------- Single CS 2 -------- Multiplexed Address 3 -------- Single CS with LB ,UB (tBA=tOE) 4 -------- Single CS with LB ,UB (tBA=tCO) 5 -------- Dual CS with LB ,UB (tBA=tOE) 6 -------- Dual CS with LB ,UB (tBA=tCO) 5. Technology Blank ------------------ CMOS F ------------------------ Full CMOS 6. Operating Voltage Blank ------------------- 5V V ------------------------- 2.7V~3.6V U ------------------------- 3.0V S ------------------------- 2.5V R ------------------------- 2.0V P ------------------------- 1.8V 10 11. Power 10. Speed 9. Packages 8. Version 7. Orgainzation 7. Orginzation 8 ---------------------- x8 bit 16 ---------------------- x16 bit 32 ---------------------- x32 bit 8. Version Blank ----------------- Mother Die A ----------------------- First revision B ----------------------- Second revision C ----------------------- Third revision D ----------------------- Fourth revision E ----------------------- Fifth revision F ----------------------- Sixth revision 9. Package Blank ---------------------- FPBGA S ---------------------------- 32 sTSOP1 T ---------------------------- 32 TSOP1 U ---------------------------- 44 TSOP2 W ---------------------------- Wafer 10. Speed 45 ---------------------- 45ns 55 ---------------------- 55ns 70 ---------------------- 70ns 85 ---------------------- 85ns 10 --------------------- 100ns 12 --------------------- 120ns 11. Power LL ---------------------- Low Low Power LF ---------------------- Low Low Power (Pb-free) L ---------------------- Low Power S ---------------------- Standard Power