EP3C25F256C8N

1. Cyclone III Device Family Overview CIII51001-2.2 Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants: ■ Cyclone III: lowest power, high functionality with the lowest cost ■ Cyclone III LS: lowest power FPGAs with security With densities ranging from 5K to 200K logic elements (LEs) and 0.5 Mbits to 8 Mbits of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application. This chapter contains the following sections: ■ “Cyclone III Device Family Features” on page 1–1 ■ “Cyclone III Device Family Architecture” on page 1–6 ■ “Reference and Ordering Information” on page 1–12 Cyclone III Device Family Features Cyclone III device family offers the following features: Lowest Power FPGAs ■ ■ ■ © December 2009 Lowest power consumption due to: ■ TSMC low-power process technology ■ Altera® power-aware design flow Low-power operation offers the following benefits: ■ Extended battery life for portable and handheld applications ■ Reduced or eliminated cooling system costs ■ Operation in thermally-challenged environments Hot-socketing operation support Altera Corporation Cyclone III Device Handbook, Volume 1 1–2 Chapter 1: Cyclone III Device Family Overview Cyclone III Device Family Features Design Security Feature Cyclone III LS devices offer the following design security features: ■ Configuration security using advanced encryption standard (AES) with 256-bit volatile key ■ Routing architecture optimized for design separation flow with the Quartus® II software ■ Design separation flow achieves both physical and functional isolation between design partitions ■ Ability to disable external JTAG port ■ Error Detection (ED) Cycle Indicator to core ■ Provides a pass or fail indicator at every ED cycle ■ Provides visibility over intentional or unintentional change of configuration random access memory (CRAM) bits ■ Ability to clear contents of the FPGA logic, CRAM, embedded memory, and AES key ■ Internal oscillator enables system monitor and health check capabilities Increased System Integration ■ High memory-to-logic and multiplier-to-logic ratio ■ High I/O count, low-and mid-range density devices for user I/O constrained applications ■ ■ Adjustable I/O slew rates to improve signal integrity ■ Supports I/O standards such as LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, bus LVDS (BLVDS), LVDS, mini-LVDS, RSDS, and PPDS ■ Supports the multi-value on-chip termination (OCT) calibration feature to eliminate variations over process, voltage, and temperature (PVT) Four phase-locked loops (PLLs) per device provide robust clock management and synthesis for device clock management, external system clock management, and I/O interfaces ■ Five outputs per PLL ■ Cascadable to save I/Os, ease PCB routing, and reduce jitter ■ Dynamically reconfigurable to change phase shift, frequency multiplication or division, or both, and input frequency in the system without reconfiguring the device ■ Remote system upgrade without the aid of an external controller ■ Dedicated cyclical redundancy code checker circuitry to detect single-event upset (SEU) issues ■ Nios® II embedded processor for Cyclone III device family, offering low cost and custom-fit embedded processing solutions Cyclone III Device Handbook, Volume 1 © December 2009 Altera Corporation Chapter 1: Cyclone III Device Family Overview Cyclone III Device Family Features 1–3 ■ Wide collection of pre-built and verified IP cores from Altera and Altera Megafunction Partners Program (AMPP) partners ■ Supports high-speed external memory interfaces such as DDR, DDR2, SDR SDRAM, and QDRII SRAM ■ Auto-calibrating PHY feature eases the timing closure process and eliminates variations with PVT for DDR, DDR2, and QDRII SRAM interfaces Cyclone III device family supports vertical migration that allows you to migrate your device to other devices with the same dedicated pins, configuration pins, and power pins for a given package-across device densities. This allows you to optimize device density and cost as your design evolves. Table 1–1 lists Cyclone III device family features. Table 1–1. Cyclone III Device Family Features Family Device Logic Elements Number of M9K Blocks Total RAM Bits 18 x 18 Multipliers PLLs Global Clock Networks Maximum User I/Os EP3C5 5,136 46 423,936 23 2 10 182 EP3C10 10,320 46 423,936 23 2 10 182 EP3C16 15,408 56 516,096 56 4 20 346 EP3C25 24,624 66 608,256 66 4 20 215 EP3C40 39,600 126 1,161,216 126 4 20 535 EP3C55 55,856 260 2,396,160 156 4 20 377 EP3C80 81,264 305 2,810,880 244 4 20 429 EP3C120 119,088 432 3,981,312 288 4 20 531 EP3CLS70 70,208 333 3,068,928 200 4 20 413 EP3CLS100 100,448 483 4,451,328 276 4 20 413 EP3CLS150 150,848 666 6,137,856 320 4 20 413 EP3CLS200 198,464 891 8,211,456 396 4 20 413 Cyclone III Cyclone III LS © December 2009 Altera Corporation Cyclone III Device Handbook, Volume 1 1–4 Chapter 1: Cyclone III Device Family Overview Cyclone III Device Family Features Table 1–2 lists Cyclone III device family package options, I/O pins, and differential channel counts. Table 1–2. Cyclone III Device Family Package Options, I/O pin and Differential Channel Counts (Note 1), (2), (3), (4), (5) Family Cyclone III (8) Cyclone III LS Package E144 (7) M164 P240 F256 U256 F324 F484 U484 F780 EP3C5 94, 22 106, 28 — 182, 68 182, 68 — — — — EP3C10 94, 22 106, 28 — 182, 68 182, 68 — — — — EP3C16 84, 19 92, 23 160, 47 168, 55 168, 55 — 346, 140 346, 140 — EP3C25 82, 18 — 148, 43 156, 54 156, 54 215, 83 — — — EP3C40 — — 128, 26 — — 195, 61 331, 127 331, 127 535, 227 (6) EP3C55 — — — — — — 327, 135 327, 135 377, 163 EP3C80 — — — — — — 295, 113 295, 113 429, 181 EP3C120 — — — — — — 283, 106 — 531, 233 EP3CLS70 — — — — — — 278, 113 278, 113 413, 181 EP3CLS100 — — — — — — 278, 113 278, 113 413, 181 EP3CLS150 — — — — — — 210, 87 — 413, 181 EP3CLS200 — — — — — — 210, 87 — 413, 181 Notes to Table 1–2: (1) For each device package, the first number indicates the number of the I/O pin; the second number indicates the differential channel count. (2) For more information about device packaging specifications, refer to the Altera Device Package Information Data Sheet. (3) The I/O pin numbers are the maximum I/O counts (including clock input pins) supported by the device package combination and can be affected by the configuration scheme selected for the device. (4) All packages are available in lead-free and leaded options. (5) Vertical migration is not supported between Cyclone III and Cyclone III LS devices. (6) The EP3C40 device in the F780 package supports restricted vertical migration. Maximum user I/Os are restricted to 510 I/Os if you enable migration to the EP3C120 and are using voltage referenced I/O standards. If you are not using voltage referenced I/O standards, you can increase the maximum number of I/Os. (7) The E144 package has an exposed pad at the bottom of the package. This exposed pad is a ground pad that must be connected to the ground plane on your PCB. Use this exposed pad for electrical connectivity and not for thermal purposes. (8) All Cyclone III device UBGA packages are supported by the Quartus II software version 7.1 SP1 and later, with the exception of the UBGA packages of EP3C16, which are supported by the Quartus II software version 7.2. Cyclone III Device Handbook, Volume 1 © December 2009 Altera Corporation Chapter 1: Cyclone III Device Family Overview Cyclone III Device Family Features 1–5 Table 1–3 lists Cyclone III device family package sizes. Table 1–3. Cyclone III Device Family Package Sizes Family Package Pitch (mm) Nominal Area (mm2) Length x Width (mm  mm) Height (mm) E144 0.5 484 22  22 1.60 M164 0.5 64 88 1.40 P240 0.5 1197 34.6  34.6 4.10 F256 1.0 289 17  17 1.55 U256 0.8 196 14  14 2.20 F324 1.0 361 19  19 2.20 F484 1.0 529 23 23 2.60 U484 0.8 361 19  19 2.20 F780 1.0 841 29  29 2.60 F484 1.0 529 23  23 2.60 U484 0.8 361 19  19 2.20 F780 1.0 841 29  29 2.60 Cyclone III Cyclone III LS Table 1–4 lists Cyclone III device family speed grades. Table 1–4. Cyclone III Device Family Speed Grades Family Device E144 M164 P240 F256 U256 F324 F484 U484 F780 EP3C5 C7,C8,I7, A7 C7,C8,I7 — C6,C7,C8, I7,A7 C6,C7,C8, I7,A7 — — — — EP3C10 C7,C8,I7, A7 C7,C8,I7 — C6,C7,C8, I7,A7 C6,C7,C8, I7,A7 — — — — EP3C16 C7,C8,I7, A7 C7,C8,I7 C8 C6,C7,C8, I7,A7 C6,C7,C8, I7,A7 — C6,C7,C8, I7,A7 C6,C7,C8, I7,A7 — EP3C25 C7,C8,I7, A7 — C8 C6,C7,C8, I7,A7 C6,C7,C8, I7,A7 C6,C7,C8, I7,A7 — — — EP3C40 — — C8 — — C6,C7,C8, I7,A7 C6,C7,C8, I7,A7 C6,C7,C8, I7,A7 C6,C7,C8, I7 EP3C55 — — — — — — C6,C7,C8, I7 C6,C7,C8, I7 C6,C7,C8, I7 EP3C80 — — — — — — C6,C7,C8, I7 C6,C7,C8, I7 C6,C7,C8, I7 EP3C120 — — — — — — C7,C8,I7 — C7,C8,I7 EP3CLS70 — — — — — — C7,C8,I7 C7,C8,I7 C7,C8,I7 EP3CLS100 — — — — — — C7,C8,I7 C7,C8,I7 C7,C8,I7 EP3CLS150 — — — — — — C7,C8,I7 — C7,C8,I7 EP3CLS200 — — — — — — C7,C8,I7 — C7,C8,I7 Cyclone III Cyclone III LS © December 2009 Altera Corporation Cyclone III Device Handbook, Volume 1 1–6 Chapter 1: Cyclone III Device Family Overview Cyclone III Device Family Architecture Table 1–5 lists Cyclone III device family configuration schemes. Table 1–5. Cyclone III Device Family Configuration Schemes Configuration Scheme Cyclone III Cyclone III LS Active serial (AS) v v Active parallel (AP) v — Passive serial (PS) v v Fast passive parallel (FPP) v v Joint Test Action Group (JTAG) v v Cyclone III Device Family Architecture Cyclone III device family includes a customer-defined feature set that is optimized for portable applications and offers a wide range of density, memory, embedded multiplier, and I/O options. Cyclone III device family supports numerous external memory interfaces and I/O protocols that are common in high-volume applications. The Quartus II software features and parameterizable IP cores make it easier for you to use the Cyclone III device family interfaces and protocols. The following sections provide an overview of the Cyclone III device family features. Logic Elements and Logic Array Blocks The logic array block (LAB) consists of 16 logic elements and a LAB-wide control block. An LE is the smallest unit of logic in the Cyclone III device family architecture. Each LE has four inputs, a four-input look-up table (LUT), a register, and output logic. The four-input LUT is a function generator that can implement any function with four variables. f For more information about LEs and LABs, refer to the Logic Elements and Logic Array Blocks in Cyclone III Devices chapter. Memory Blocks Each M9K memory block of the Cyclone III device family provides nine Kbits of on-chip memory capable of operating at up to 315 MHz for Cyclone III devices and up to 274 MHz for Cyclone III LS devices. The embedded memory structure consists of M9K memory blocks columns that you can configure as RAM, first-in first-out (FIFO) buffers, or ROM. The Cyclone III device family memory blocks are optimized for applications such as high throughout packet processing, embedded processor program, and embedded data storage. The Quartus II software allows you to take advantage of the M9K memory blocks by instantiating memory using a dedicated megafunction wizard or by inferring memory directly from the VHDL or Verilog source code. M9K memory blocks support single-port, simple dual-port, and true dual-port operation modes. Single-port mode and simple dual-port mode are supported for all port widths with a configuration of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32, and ×36. True dual-port is supported in port widths with a configuration of ×1, ×2, ×4, ×8, ×9, ×16, and ×18. Cyclone III Device Handbook, Volume 1 © December 2009 Altera Corporation Chapter 1: Cyclone III Device Family Overview Cyclone III Device Family Architecture f 1–7 For more information about memory blocks, refer to the Memory Blocks in Cyclone III Devices chapter. Embedded Multipliers and Digital Signal Processing Support Cyclone III devices support up to 288 embedded multiplier blocks and Cyclone III LS devices support up to 396 embedded multiplier blocks. Each block supports one individual 18 × 18-bit multiplier or two individual 9 × 9-bit multipliers. The Quartus II software includes megafunctions that are used to control the operation mode of the embedded multiplier blocks based on user parameter settings. Multipliers can also be inferred directly from the VHDL or Verilog source code. In addition to embedded multipliers, Cyclone III device family includes a combination of on-chip resources and external interfaces, making them ideal for increasing performance, reducing system cost, and lowering the power consumption of digital signal processing (DSP) systems. You can use Cyclone III device family alone or as DSP device co-processors to improve price-to-performance ratios of DSP systems. The Cyclone III device family DSP system design support includes the following features: ■ f DSP IP cores: ■ Common DSP processing functions such as finite impulse response (FIR), fast Fourier transform (FFT), and numerically controlled oscillator (NCO) functions ■ Suites of common video and image processing functions ■ Complete reference designs for end-market applications ■ DSP Builder interface tool between the Quartus II software and the MathWorks Simulink and MATLAB design environments ■ DSP development kits For more information about embedded multipliers and digital signal processing support, refer to the Embedded Multipliers in Cyclone III Devices chapter. Clock Networks and PLLs Cyclone III device family includes 20 global clock networks. You can drive global clock signals from dedicated clock pins, dual-purpose clock pins, user logic, and PLLs. Cyclone III device family includes up to four PLLs with five outputs per PLL to provide robust clock management and synthesis. You can use PLLs for device clock management, external system clock management, and I/O interfaces. You can dynamically reconfigure the Cyclone III device family PLLs to enable auto-calibration of external memory interfaces while the device is in operation. This feature enables the support of multiple input source frequencies and corresponding multiplication, division, and phase shift requirements. PLLs in Cyclone III device family may be cascaded to generate up to ten internal clocks and two external clocks on output pins from a single external clock source. f © December 2009 For more PLL specifications and information, refer to the Cyclone III Device Data Sheet, Cyclone III LS Device Data Sheet, and Clock Networks and PLLs in Cyclone III Devices chapters. Altera Corporation Cyclone III Device Handbook, Volume 1 1–8 Chapter 1: Cyclone III Device Family Overview Cyclone III Device Family Architecture I/O Features Cyclone III device family has eight I/O banks. All I/O banks support single-ended and differential I/O standards listed in Table 1–6. Table 1–6. Cyclone III Device Family I/O Standards Support Type I/O Standard Single-Ended I/O LVTTL, LVCMOS, SSTL, HSTL, PCI, and PCI-X Differential I/O SSTL, HSTL, LVPECL, BLVDS, LVDS, mini-LVDS, RSDS, and PPDS The Cyclone III device family I/O also supports programmable bus hold, programmable pull-up resistors, programmable delay, programmable drive strength, programmable slew-rate control to optimize signal integrity, and hot socketing. Cyclone III device family supports calibrated on-chip series termination (RS OCT) or driver impedance matching (Rs) for single-ended I/O standards, with one OCT calibration block per side. f For more information, refer to the Cyclone III Device I/O Features chapter. High-Speed Differential Interfaces Cyclone III device family supports high-speed differential interfaces such as BLVDS, LVDS, mini-LVDS, RSDS, and PPDS. These high-speed I/O standards in Cyclone III device family provide high data throughput using a relatively small number of I/O pins and are ideal for low-cost applications. Dedicated differential output drivers on the left and right I/O banks can send data rates at up to 875 Mbps for Cyclone III devices and up to 740 Mbps for Cyclone III LS devices, without the need for external resistors. This saves board space or simplifies PCB routing. Top and bottom I/O banks support differential transmission (with the addition of an external resistor network) data rates at up to 640 Mbps for both Cyclone III and Cyclone III LS devices. f For more information, refer to the High-Speed Differential Interfaces in Cyclone III Devices chapter. Auto-Calibrating External Memory Interfaces Cyclone III device family supports common memory types such as DDR, DDR2, SDR SDRAM, and QDRII SRAM. DDR2 SDRAM memory interfaces support data rates up to 400 Mbps for Cyclone III devices and 333 Mbps for Cyclone III LS devices. Memory interfaces are supported on all sides of Cyclone III device family. Cyclone III device family has the OCT, DDR output registers, and 8-to-36-bit programmable DQ group widths features to enable rapid and robust implementation of different memory standards. An auto-calibrating megafunction is available in the Quartus II software for DDR and QDR memory interface PHYs. This megafunction is optimized to take advantage of the Cyclone III device family I/O structure, simplify timing closure requirements, and take advantage of the Cyclone III device family PLL dynamic reconfiguration feature to calibrate PVT changes. f For more information, refer to the External Memory Interfaces in Cyclone III Devices chapter. Cyclone III Device Handbook, Volume 1 © December 2009 Altera Corporation Chapter 1: Cyclone III Device Family Overview Cyclone III Device Family Architecture 1–9 Support for Industry-Standard Embedded Processors To quickly and easily create system-level designs using Cyclone III device family, you can select among the ×32-bit soft processor cores: Freescale®V1 Coldfire, ARM® Cortex M1, or Altera Nios® II, along with a library of 50 other IP blocks when using the system-on-a-programmable-chip (SOPC) Builder tool. SOPC Builder is an Altera Quartus II design tool that facilitates system-integration of IP blocks in an FPGA design. The SOPC Builder automatically generates interconnect logic and creates a testbench to verify functionality, saving valuable design time. Cyclone III device family expands the peripheral set, memory, I/O, or performance of legacy embedded processors. Single or multiple Nios II embedded processors are designed into Cyclone III device family to provide additional co-processing power, or even replace legacy embedded processors in your system. Using the Cyclone III device family and Nios II together provide low-cost, high-performance embedded processing solutions, which in turn allow you to extend the life cycle of your product and improve time-to-market over standard product solutions. 1 Separate licensing of the Freescale and ARM embedded processors are required. Hot Socketing and Power-On-Reset Cyclone III device family features hot socketing (also known as hot plug-in or hot swap) and power sequencing support without the use of external devices. You can insert or remove a board populated with one or more Cyclone III device family during a system operation without causing undesirable effects to the running system bus or the board that was inserted into the system. The hot socketing feature allows you to use FPGAs on PCBs that also contain a mixture of 3.3-V, 2.5-V, 1.8-V, 1.5-V, and 1.2-V devices. The Cyclone III device family hot socketing feature eliminates power-up sequence requirements for other devices on the board for proper FPGA operation. f For more information about hot socketing and power-on-reset, refer to the Hot-Socketing and Power-on-Reset in Cyclone III Devices chapter. SEU Mitigation Cyclone III LS devices offer built-in error detection circuitry to detect data corruption due to soft errors in the CRAM cells. This feature allows CRAM contents to be read and verified to match a configuration-computed CRC value. The Quartus II software activates the built-in 32-bit CRC checker, which is part of the Cyclone III LS device. f © December 2009 For more information about SEU mitigation, refer to the SEU Mitigation in Cyclone III Devices chapter. Altera Corporation Cyclone III Device Handbook, Volume 1 1–10 Chapter 1: Cyclone III Device Family Overview Cyclone III Device Family Architecture JTAG Boundary Scan Testing Cyclone III device family supports the JTAG IEEE Std. 1149.1 specification. The boundary-scan test (BST) architecture offers the capability to test pin connections without using physical test probes and captures functional data while a device is operating normally. Boundary-scan cells in the Cyclone III device family can force signals onto pins or capture data from pins or from logic array signals. Forced test data is serially shifted into the boundary-scan cells. Captured data is serially shifted out and externally compared to expected results. In addition to BST, you can use the IEEE Std. 1149.1 controller for the Cyclone III LS device in-circuit reconfiguration (ICR). f For more information about JTAG boundary scan testing, refer to the IEEE 1149.1 (JTAG) Boundary Scan Testing for Cyclone III Devices chapter. Quartus II Software Support The Quartus II software is the leading design software for performance and productivity. It is the only complete design solution for CPLDs, FPGAs, and ASICs in the industry. The Quartus II software includes an integrated development environment to accelerate system-level design and seamless integration with leading third-party software tools and flows. The Cyclone III LS devices provide both physical and functional separation between security critical design partitions. Cyclone III LS devices offer isolation between design partitions. This ensures that device errors do not propagate from one partition to another, whether unintentional or intentional. The Quartus II software design separation flow facilitates the creation of separation regions in Cyclone III LS devices by tightly controlling the routing in and between the LogicLock regions. For ease of use, the separation flow integrates in the existing incremental compilation flow. f For more information about the Quartus II software features, refer to the Quartus II Handbook. Configuration Cyclone III device family uses SRAM cells to store configuration data. Configuration data is downloaded to Cyclone III device family each time the device powers up. Low-cost configuration options include the Altera EPCS family serial flash devices as well as commodity parallel flash configuration options. These options provide the flexibility for general-purpose applications and the ability to meet specific configuration and wake-up time requirements of the applications. Cyclone III device family supports the AS, PS, FPP, and JTAG configuration schemes. The AP configuration scheme is only supported in Cyclone III devices. f For more information about configuration, refer to the Configuration, Design Security, and Remote System Upgrades in Cyclone III Devices chapter. Cyclone III Device Handbook, Volume 1 © December 2009 Altera Corporation Chapter 1: Cyclone III Device Family Overview Cyclone III Device Family Architecture 1–11 Remote System Upgrades Cyclone III device family offers remote system upgrade without an external controller. The remote system upgrade capability in Cyclone III device family allows system upgrades from a remote location. Soft logic (either the Nios II embedded processor or user logic) implemented in Cyclone III device family can download a new configuration image from a remote location, store it in configuration memory, and direct the dedicated remote system upgrade circuitry to start a reconfiguration cycle. The dedicated circuitry performs error detection during and after the configuration process, and can recover from an error condition by reverting to a safe configuration image. The dedicated circuitry also provides error status information. Cyclone III devices support remote system upgrade in the AS and AP configuration scheme. Cyclone III LS devices support remote system upgrade in the AS configuration scheme only. f For more information, refer to the Configuration, Design Security, and Remote System Upgrades in Cyclone III Devices chapter. Design Security (Cyclone III LS Devices Only) Cyclone III LS devices offer design security features which play a vital role in the large and critical designs in the competitive military and commercial environments. Equipped with the configuration bit stream encryption and anti-tamper features, Cyclone III LS devices protect your designs from copying, reverse engineering and tampering. The configuration security of Cyclone III LS devices uses AES with 256-bit security key. f © December 2009 For more information, refer to the Configuration, Design Security, and Remote System Upgrades in Cyclone III Devices chapter. Altera Corporation Cyclone III Device Handbook, Volume 1 1–12 Chapter 1: Cyclone III Device Family Overview Reference and Ordering Information Reference and Ordering Information Figure 1–1 and Figure 1–2 show the ordering codes for Cyclone III and Cyclone III LS devices. Figure 1–1. Cyclone III Device Packaging Ordering Information EP3C 25 F 324 C 7 N Family Signature Optional Suffix Indicates specific device options or shipment method. ES: Engineering sample N: Lead-free devices EP3C: Cyclone III Device Type 5 10 16 25 25E 40 55 80 120 Speed Grade 6 (fastest) 7 8 Operating Temperature C: Commercial temperature (TJ = 0°C to 85°C) I: Industrial temperature (TJ = -40°C to 100°C) A: Automotive temperature (TJ = -40°C to 125°C) Package Type Pin Count Number of pins for a particular package: 144 164 240 256 324 484 780 E: Plastic Enhanced Quad Flat Pack (EQFP) Q: Plastic Quad Flat Pack (PQFP) F: FineLine Ball-Grid Array (FBGA) U: Ultra FineLine Ball-Grid Array (UBGA) M: Micro FineLine Ball-Grid Array (MBGA) Figure 1–2. Cyclone III LS Device Packaging Ordering Information EP3CLS 70 F 484 C 7 N Family Signature Optional Suffix EP3CLS: Cyclone III LS Indicates specific device options or shipment method. ES: Engineering sample N: Lead-free devices Device Type 70 100 150 200 Speed Grade 7 (fastest) 8 Operating Temperature C: Commercial temperature (TJ = 0°C to 85°C) I: Industrial temperature (TJ = -40°C to 100°C) Package Type F: FineLine Ball-Grid Array (FBGA) U: Ultra FineLine Ball-Grid Array (UBGA) Cyclone III Device Handbook, Volume 1 Pin Count Number of pins for a particular package: 484 780 © December 2009 Altera Corporation Chapter 1: Cyclone III Device Family Overview Chapter Revision History 1–13 Chapter Revision History Table 1–7 lists the revision history for this chapter. Table 1–7. Chapter Revision History Date Version December 2009 2.2 July 2009 2.1 June 2009 October 2008 May 2008 July 2007 March 2007 © December 2009 Changes Made Minor text edits. Minor edit to the hyperlinks. ■ Added Table 1–5. ■ Updated Table 1–1, Table 1–2, Table 1–3, and Table 1–4. ■ Updated “Introduction”, “Cyclone III Device Family Architecture”, “Embedded Multipliers and Digital Signal Processing Support ”, “Clock Networks and PLLs ”, “I/O Features ”, “High-Speed Differential Interfaces ”, “AutoCalibrating External Memory Interfaces ”, “Quartus II Software Support”, “Configuration ”, and “Design Security (Cyclone III LS Devices Only)”. ■ Removed “Referenced Document” section. ■ Updated “Increased System Integration” section. ■ Updated “Memory Blocks” section. ■ Updated chapter to new template. ■ Added 164-pin Micro FineLine Ball-Grid Array (MBGA) details to Table 1–2, Table 1–3 and Table 1–4. ■ Updated Figure 1–2 with automotive temperature information. ■ Updated “Increased System Integration” section, Table 1–6, and “High-Speed Differential Interfaces” section with BLVDS information. ■ Removed the text “Spansion” in “Increased System. ■ Integration” and “Configuration” sections. ■ Removed trademark symbol from “MultiTrack” in “MultiTrack Interconnect”. ■ Removed registered trademark symbol from “Simulink” and “MATLAB” from “Embedded Multipliers and Digital. ■ Signal Processing Support” section. ■ Added chapter TOC and “Referenced Documents” section. 2.0 1.3 1.2 1.1 1.0 Altera Corporation Initial release. Cyclone III Device Handbook, Volume 1 1–14 Cyclone III Device Handbook, Volume 1 Chapter 1: Cyclone III Device Family Overview Chapter Revision History © December 2009 Altera Corporation