S87C51FC1SF76

8XC51FX CHMOS SINGLE-CHIP 8-BIT MICROCONTROLLERS Commercial/Express 87C51FA/83C51FA/80C51FA/87C51FB/83C51FB/87C51FC/83C51FC *See Table 1 for Proliferation Options Y Y Y Y High Performance CHMOS EPROM/ROM/CPU Y 32 Programmable I/O Lines Y 7 Interrupt Sources 12/24/33 MHz Operation Y Four Level Interrupt Priority Three 16-Bit Timer/Counters Y Programmable Serial Channel with: Ð Framing Error Detection Ð Automatic Address Recognition Y TTL Compatible Logic Levels Y 64K External Program Memory Space 64K External Data Memory Space Programmable Counter Array with: Ð High Speed Output, Ð Compare/Capture, Ð Pulse Width Modulator, Ð Watchdog Timer Capabilities Y Up/Down Timer/Counter Y Y Three Level Program Lock System Y Y 8K/16K/32K On-Chip Program Memory MCSÉ 51 Controller Compatible Instruction Set Y Y 256 Bytes of On-Chip Data RAM Power Saving Idle and Power Down Modes Y Improved Quick Pulse Programming Algorithm Y ONCE (On-Circuit Emulation) Mode Y Extended Temperature Range Except for 33 MHz Offering ( b 40§ C to a 85§ C) Y Boolean Processor MEMORY ORGANIZATION ROM/ EPROM Bytes RAM Bytes 80C51FA 8K 256 80C51FA 16K 256 80C51FA 32K 256 ROM Device EPROM Version ROMLESS Version 83C51FA 87C51FA 83C51FB 87C51FB 83C51FC 87C51FC These devices can address up to 64 Kbytes of external program/data memory. The Intel 87C51FA/8XC51FB/8XC51FC is a single-chip control oriented microcontroller which is fabricated on Intel’s reliable CHMOS III-E technology. The Intel 83C51FA/80C51FA is fabricated on CHMOS III technology. Being a member of the MCSÉ 51 controller family, the 8XC51FA/8XC51FB/8XC51FC uses the same powerful instruction set, has the same architecture, and is pin-for-pin compatible with the existing MCS 51 controller products. The 8XC51FA/8XC51FB/8XC51FC is an enhanced version of the 8XC52/8XC54/8XC58. Its added features make it an even more powerful microcontroller for applications that require Pulse Width Modulation, High Speed I/O and up/down counting capabilities such as motor control. For the remainder of this document, the 8XC51FA, 8XC51FB, 8XC51FC will be referred to as the 8XC51FX, unless information applies to a specific device. *Other brands and names are the property of their respective owners. Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products. Intel retains the right to make changes to these specifications at any time, without notice. Microcomputer Products may have minor variations to this specification known as errata. COPYRIGHT © INTEL CORPORATION, 1996 April 1996 Order Number: 272322-004 8XC51FX Table 1. Proliferation Options Standard*1 -1 -2 -24 -33 80C51FA X X X X X 83C51FA X X X X X 87C51FA X X X X X 83C51FB X X X X X 87C51FB X X X X X 83C51FC X X X X X 87C51FC X X X X X NOTES: *1 3.5 -1 3.5 -2 0.5 -24 3.5 -33 3.5 MHz MHz MHz MHz MHz to to to to to 12 16 12 24 33 MHz; MHz; MHz; MHz; MHz; 5V 5V 5V 5V 5V g 20% g 20% g 20% g 20% g 10% 272322 – 1 Figure 1. 8XC51FX Block Diagram 2 8XC51FX PROCESS INFORMATION PACKAGES The 87C51FA/8XC51FB/8XC51FC is manufactured on P629.0, a CHMOS III-E process. Additional process and reliability information is available in the Intel® Quality System Handbook: http://developer.intel.com/design/quality/quality.htm Part Prefix Package Type 8XC51FX P D N S 40-Pin Plastic DIP 40-Pin CERDIP 44-Pin PLCC 44-Pin QFP 272322 – 23 PLCC 272322 – 2 DIP 272322 – 24 *Do not connect Reserved Pins. QFP Figure 2. Pin Connections 3 8XC51FX PIN DESCRIPTIONS In addition, Port 1 serves the functions of the following special features of the 8XC51FX: VCC: Supply voltage. Port Pin VSS: Circuit ground. VSS1: Secondary ground (not on DIP devices or any 83C51FA/80C51FA device). Provided to reduce ground bounce and improve power supply by-passing. NOTE: This pin is not a substitution for the VSS pin. (Connection not necessary for proper operation.) Port 0: Port 0 is an 8-bit, open drain, bidirectional I/O port. As an output port each pin can sink several LS TTL inputs. Port 0 pins that have 1’s written to them float, and in that state can be used as high-impedance inputs. P1.0 T2 (External Count Input to Timer/ Counter 2), Clock Out P1.1 T2EX (Timer/Counter 2 Capture/ Reload Trigger and Direction Control) ECI (External Count Input to the PCA) P1.2 P1.3 CEX0 (External I/O for Compare/ Capture Module 0) P1.4 CEX1 (External I/O for Compare/ Capture Module 1) CEX2 (External I/O for Compare/ Capture Module 2) CEX3 (External I/O for Compare/ Capture Module 3) CEX4 (External I/O for Compare/ Capture Module 4) P1.5 P1.6 P1.7 Port 0 is also the multiplexed low-order address and data bus during accesses to external Program and Data Memory. In this application it uses strong internal pullups when emitting 1’s, and can source and sink several LS TTL inputs. Port 0 also receives the code bytes during EPROM programming, and outputs the code bytes during program verification. External pullup resistors are required during program verification. Port 1: Port 1 is an 8-bit bidirectional I/O port with internal pullups. The Port 1 output buffers can drive LS TTL inputs. Port 1 pins that have 1’s written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, Port 1 pins that are externally pulled low will source current (IIL, on the data sheet) because of the internal pullups. Alternate Function Port 1 receives the low-order address bytes during EPROM programming and verifying. Port 2: Port 2 is an 8-bit bidirectional I/O port with internal pullups. The Port 2 output buffers can drive LS TTL inputs. Port 2 pins that have 1’s written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, Port 2 pins that are externally pulled low will source current (IIL, on the data sheet) because of the internal pullups. Port 2 emits the high-order address byte during fetches from external Program Memory and during accesses to external Data Memory that use 16-bit addresses (MOVX @ DPTR). In this application it uses strong internal pullups when emitting 1’s. During accesses to external Data Memory that use 8-bit addresses (MOVX @ Ri), Port 2 emits the contents of the P2 Special Function Register. Some Port 2 pins receive the high-order address bits during EPROM programming and program verification. Port 3: Port 3 is an 8-bit bidirectional I/O port with internal pullups. The Port 3 output buffers can drive LS TTL inputs. Port 3 pins that have 1’s written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, Port 3 pins that are externally pulled low will source current (IIL, on the data sheet) because of the pullups. 4 8XC51FX Port 3 also serves the functions of various special features of the MCS-51 Family, as listed below: Port Pin Alternate Function P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 RXD (serial input port) TXD (serial output port) INT0 (external interrupt 0) INT1 (external interrupt 1) T0 (Timer 0 external input) T1 (Timer 1 external input) WR (external data memory write strobe) RD (external data memory read strobe) RST: Reset input. A high on this pin for two machine cycles while the oscillator is running resets the device. The port pins will be driven to their reset condition when a minimum VIH1 voltage is applied whether the oscillator is running or not. An internal pulldown resistor permits a power-on reset with only a capacitor connected to VCC. ALE: Address Latch Enable output pulse for latching the low byte of the address during accesses to external memory. This pin (ALE/PROG) is also the program pulse input during EPROM programming for the 87C51FX. In normal operation ALE is emitted at a constant rate of (/6 the oscillator frequency, and may be used for external timing or clocking purposes. Note, however, that one ALE pulse is skipped during each access to external Data Memory. When the 8XC51FX is executing code from external Program Memory, PSEN is activated twice each machine cycle, except that two PSEN activations are skipped during each access to external Data Memory. EA/VPP: External Access enable. EA must be strapped to VSS in order to enable the device to fetch code from external Program Memory locations 0000H to 0FFFH. Note, however, that if either of the Program Lock bits are programmed, EA will be internally latched on reset. EA should be strapped to VCC for internal program executions. This pin also receives the programming supply voltage (VPP) during EPROM programming. XTAL1: Input to the inverting oscillator amplifier. XTAL2: Output from the inverting oscillator amplifier. OSCILLATOR CHARACTERISTICS XTAL1 and XTAL2 are the input and output, respectively, of a inverting amplifier which can be configured for use as an on-chip oscillator, as shown in Figure 3. Either a quartz crystal or ceramic resonator may be used. More detailed information concerning the use of the on-chip oscillator is available in Application Note AP-155, ‘‘Oscillators for Microcontrollers.’’ If desired, ALE operation can be disabled by setting bit 0 of SFR location 8EH. With this bit set, the pin is weakly pulled high. However, the ALE disable feature will be suspended during a MOVX or MOVC instruction, idle mode, power down mode and ICE mode. The ALE disable feature will be terminated by reset. When the ALE disable feature is suspended or terminated, the ALE pin will no longer be pulled up weakly. Setting the ALE-disable bit has no affect if the microcontroller is in external execution mode. To drive the device from an external clock source, XTAL1 should be driven, while XTAL2 floats, as shown in Figure 4. There are no requirements on the duty cycle of the external clock signal, since the input to the internal clocking circuitry is through a divide-by-two flip-flop, but minimum and maximum high and low times specified on the data sheet must be observed. Throughout the remainder of this data sheet, ALE will refer to the signal coming out of the ALE/PROG pin, and the pin will be referred to as the ALE/PROG pin. An external oscillator may encounter as much as a 100 pF load at XTAL1 when it starts up. This is due to interaction between the amplifier and its feedback capacitance. Once the external signal meets the VIL and VIH specifications the capacitance will not exceed 20 pF. PSEN: Program Store Enable is the read strobe to external Program Memory. 5 8XC51FX Down is the last instruction executed. The on-chip RAM and Special Function Registers retain their values until the Power Down mode is terminated. On the 8XC51FX either hardware reset or external interrupt can cause an exit from Power Down. Reset redefines all the SFRs but does not change the onchip RAM. An external interrupt allows both the SFRs and the on-chip RAM to retain their values. 272322 – 3 C1, C2 e 30 pF g 10 pF for Crystals For Ceramic Resonators, contact resonator manufacturer. To properly terminate Power Down the reset or external interrupt should not be executed before VCC is restored to its normal operating level and must be held active long enough for the oscillator to restart and stabilize (normally less than 10 ms). Figure 3. Oscillator Connections 272322 – 4 Figure 4. External Clock Drive Configuration With an external interrupt, INT0 or INT1 must be enabled and configured as level-sensitive. Holding the pin low restarts the oscillator but bringing the pin back high completes the exit. Once the interrupt is serviced, the next instruction to be executed after RETI will be the one following the instruction that put the device into Power Down. DESIGN CONSIDERATION # Ambient light is known to affect the internal RAM IDLE MODE The user’s software can invoke the Idle Mode. When the microcontroller is in this mode, power consumption is reduced. The Special Function Registers and the onboard RAM retain their values during Idle, but the processor stops executing instructions. Idle Mode will be exited if the chip is reset or if an enabled interrupt occurs. The PCA timer/counter can optionally be left running or paused during Idle Mode. POWER DOWN MODE contents during operation. If the 87C51FX application requires the part to be run under ambient lighting, an opaque label should be placed over the window to exclude light. # When the idle mode is terminated by a hardware reset, the device normally resumes program execution, from where it left off, up to two machine cycles before the internal reset algorithm takes control. On-chip hardware inhibits access to internal RAM in this event, but access to the port pins is not inhibited. To eliminate the possibility of an unexpected write when Idle is terminated by reset, the instruction following the one that invokes Idle should not be one that writes to a port pin or to external memory. To save even more power, a Power Down mode can be invoked by software. In this mode, the oscillator is stopped and the instruction that invoked Power Table 2. Status of the External Pins during Idle and Power Down Program Memory ALE PSEN Idle Internal 1 1 Data Data Data Data Idle External 1 1 Float Data Address Data Power Down Internal 0 0 Data Data Data Data Power Down External 0 0 Float Data Data Data Mode PORT0 PORT1 PORT2 PORT3 NOTE: For more detailed information on the reduced power modes refer to current Embedded Microcontrollers and Processors Handbook Volume I, and Application Note AP-252 (Embedded Applications Handbook), ‘‘Designing with the 80C51BH.’’ 6 8XC51FX ONCE MODE The ONCE (‘‘On-Circuit Emulation’’) Mode facilitates testing and debugging of systems using the 8XC51FX without the 8XC51FX having to be removed from the circuit. The ONCE Mode is invoked by: 1) Pull ALE low while the device is in reset and PSEN is high; 2) Hold ALE low as RST is deactivated. While the device is in ONCE Mode, the Port 0 pins float, and the other port pins and ALE and PSEN are weakly pulled high. The oscillator circuit remains active. While the 8XC51FX is in this mode, an emulator or test CPU can be used to drive the circuit. Normal operation is restored when a normal reset is applied. 8XC51FX EXPRESS The Intel EXPRESS system offers enhancements to the operational specifications of the MCS-51 family of microcontrollers. These EXPRESS products are designed to meet the needs of those applications whose operating requirements exceed commercial standards. The EXPRESS program includes the commercial standard temperature range with burn-in and an extended temperature range with or without burn-in. With the commercial standard temperature range, operational characteristics are guaranteed over the temperature range of 0§ C to 70§ C. With the extended temperature range option, operational characteristics are guaranteed over the range of b 40§ C to a 85§ C. The optional burn-in is dynamic for a minimum time of 168 hours at 125§ C with VCC e 6.9V g 0.25V, following guidelines in MlL-STD-883, Method 1015. Package types and EXPRESS versions are identified by a one- or two-letter prefix to the part number. The prefixes are listed in Table 3. For the extended temperature range option, this data sheet specifies the parameters which deviate from their commercial temperature range limits. NOTE: Intel offers Express Temperature specifications for all 8XC51FX speed options except for 33 MHz. Table 3. Prefix Identification Prefix Package Type Temperature Range Burn-In D Cerdip Commercial No N PLCC Commercial No P Plastic Commercial No S QFP Commercial No LD Cerdip Extended Yes LN PLCC Extended Yes LP Plastic Extended Yes LS QFP Extended Yes TD Cerdip Extended No TN PLCC Extended No TP Plastic Extended No TS QFP Extended No NOTE: Contact distributor or local sales office to match EXPRESS prefix with proper device. EXAMPLES: P87C51FC indicates 87C51FC in a plastic package and specified for commercial temperature range, without burn-in. LD87C51FC indicates 87C51FC in a cerdip package and specified for extended temperature range with burn-in. 7 8XC51FX ABSOLUTE MAXIMUM RATINGS* NOTICE: This data sheet contains preliminary information on new products in production. It is valid for the devices indicated in the revision history. The specifications are subject to change without notice. Ambient Temperature Under Bias À b 40§ C to a 85§ C Storage Temperature ÀÀÀÀÀÀÀÀÀÀ b 65§ C to a 150§ C Voltage on EA/VPP Pin to VSS ÀÀÀÀÀÀÀ0V to a 13.0V Voltage on Any Other Pin to VSS ÀÀ b 0.5V to a 6.5V IOL per I/O Pin ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ15 mA *WARNING: Stressing the device beyond the ‘‘Absolute Maximum Ratings’’ may cause permanent damage. These are stress ratings only. Operation beyond the ‘‘Operating Conditions’’ is not recommended and extended exposure beyond the ‘‘Operating Conditions’’ may affect device reliability. Power DissipationÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ1.5W (based on PACKAGE heat transfer limitations, not device power consumption) OPERATING CONDITIONS Symbol TA VCC fOSC Description Min Max Units Ambient Temperature Under Bias Commercial Express 0 b 40 a 70 a 85 §C Supply Voltage 8XC51FX-33 All Others 4.5 4.0 5.5 6.0 V Oscillator Frequency 8XC51FX 8XC51FX-1 8XC51FX-2 8XC51FX-24 8XC51FX-33 3.5 3.5 0.5 3.5 3.5 12 16 12 24 33 MHz DC CHARACTERISTICS (Over Operating Conditions) All parameter values apply to all devices unless otherwise indicated. Symbol Parameter Min Typical (Note 4) Max Units b 0.5 0.2 VCC b 0.1 V Test Conditions VIL Input Low Voltage VIL1 Input Low Voltage EA 0 0.2 VCC b 0.3 V VIH Input High Voltage (Except XTAL1, RST) 0.2 VCC a 0.9 VCC a 0.5 V VIH1 Input High Voltage (XTAL1, RST) 0.7 VCC VCC a 0.5 V VOL Output Low Voltage (Note 5) (Ports 1, 2 and 3) 0.3 0.45 1.0 V IOL e 100 mA IOL e 1.6 mA (Note 1) IOL e 3.5 mA Output Low Voltage (Note 5) (Port 0, ALE/PROG, PSEN) 0.3 0.45 1.0 V IOL e 200 mA IOL e 3.2 mA (Note 1) IOL e 7.0 mA IOH e b 10 mA IOH e b 30 mA (Note 2) IOH e b 60 mA VOL1 VOH VOH1 Output High Voltage (Ports 1, 2 and 3 ALE/PROG and PSEN) VCC b 0.3 VCC b 0.7 VCC b 1.5 V Output High Voltage (Port 0 in External Bus Mode) VCC b 0.3 VCC b 0.7 VCC b 1.5 V 83C51FA/80C51FA (Express) IIL 8 Logical 0 Input Current (Ports 1, 2 and 3) b 50 mA IOH IOH IOH IOH e e e e b 200 mA b 3.2 mA (Note 2) b 7.0 mA b 6.0 mA VIN e 0.45V 8XC51FX DC CHARACTERISTICS (Over Operating Conditions) All parameter values apply to all devices unless otherwise indicated. (Continued) Symbol Parameter ILI Input leakage Current (Port 0) ITL Logical 1 to 0 Transition Current (Ports 1, 2 and 3) Express Commercial RRST RST Pulldown Resistor CIO Pin Capacitance ICC Power Supply Current: Active Mode At 12 MHz (Figure 5) At 16 MHz At 24 MHz At 33 MHz Idle Mode At 12 MHz (Figure 5) At 16 MHz At 24 MHz At 33 MHz Power Down Mode Min Typical (Note 4) Max Units Test Conditions g 10 mA VIN e VIL or VIH VIN e 2V 40 b 750 b 650 mA 225 KX 10 pF @ 1MHz, 25§ C (Note 3) 15 20 28 35 30 38 56 56 mA mA mA mA 5 6 7 7 5 7.5 9.5 13.5 15 75 mA mA mA mA mA NOTES: 1. Capacitive loading on Ports 0 and 2 may cause noise pulses above 0.4V to be superimposed on the VOLs of ALE and Ports 1, 2 and 3. The noise is due to external bus capacitance discharging into the Port 0 and Port 2 pins when these pins change from 1 to 0. In applications where capacitance loading exceeds 100 pF, the noise pulses on these signals may exceed 0.8V. It may be desirable to qualify ALE or other signals with a Schmitt Trigger, or CMOS-level input logic. 2. Capacitive loading on Ports 0 and 2 cause the VOH on ALE and PSEN to drop below the 0.9 VCC specification when the address lines are stabilizing. 3. See Figures 6–9 for test conditions. Minimum VCC for power down is 2V. 4. Typicals are based on limited number of samples, and are not guaranteed. The values listed are at room temperature and 5V. 5. Under steady state (non-transient) conditions, IOL must be externally limited as follows: 10 mA Maximum IOL per port pin: Maximum IOL per 8-bit port Port 0: 26 mA Ports 1, 2, and 3: 15 mA 71 mA Maximum total IOL for all output pins: If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test conditions. 272322 – 5 Note: ICC max at 33 MHz is at 5V g 10% VCC, while ICC max at 24 MHz and below is at 5V g 20% VCC. Figure 5. 8XC51FA/FB/FC ICC vs Frequency 9 8XC51FX 272322 – 6 All other pins disconnected TCLCH e TCHCL e 5 ns 272322 – 7 All other pins disconnected TCLCH e TCHCL e 5 ns Figure 6. ICC Test Condition, Active Mode Figure 7. ICC Test Condition Idle Mode 272322 – 8 All other pins disconnected Figure 8. ICC Test Condition, Power Down Mode. VCC e 2.0V to 6.0V. 272322 – 19 Figure 9. Clock Signal Waveform for ICC Tests in Active and Idle Modes. TCLCH e TCHCL e 5 ns. 10 8XC51FX L: Logic level LOW, or ALE EXPLANATION OF THE AC SYMBOLS P: PSEN Q: Output Data Each timing symbol has 5 characters. The first character is always a ‘T’ (stands for time). The other characters, depending on their positions, stand for the name of a signal or the logical status of that signal. The following is a list of all the characters and what they stand for. R: RD signal T: Time V: Valid W: WR signal A: Address X: No longer a valid logic level Z: Float C: Clock D: Input Data H: Logic level HIGH For example, I: Instruction (program memory contents) TAVLL e Time from Address Valid to ALE Low TLLPL e Time from ALE Low to PSEN Low AC CHARACTERISTICS (Over Operating Conditions, Load Capacitance for Port 0, ALE/PROG and PSEN e 100 pF, Load Capacitance for All Other Outputs e 80 pF) EXTERNAL MEMORY CHARACTERISTICS All parameter values apply to all devices unless otherwise indicated. In this table, 8XC51FX refers to 8XC51FX, 8XC51FX-1 and 8XC51FX-2. Oscillator Symbol Parameter 12 MHz 24 MHz 33 MHz Min Max Min Max Min Max 1/TCLCL Oscillator Frequency 8XC51FX 8XC51FX-1 8XC51FX-2 8XC51FX-24 8XC51FX-33 TLHLL ALE Pulse Width TAVLL Address Valid to ALE Low 8XC51FX 8XC51FX-24 8XC51FX-33 TLLAX TLLIV TLLPL 127 ALE Low to Valid Instr In 8XC51FX 8XC51FX-24 8XC51FX-33 3.5 3.5 0.5 3.5 3.5 12 16 12 24 33 5 TCLCL b 40 TCLCL b 30 TCLCL b 25 ns ns ns 5 TCLCL b 30 TCLCL b 25 ns ns 12 4TCLCL b 100 4TCLCL b 75 4TCLCL b 65 91 56 TPLPH PSEN Pulse Width 205 TPLIV PSEN Low to Valid Instr In 8XC51FX 8XC51FX-24 8XC51FX-33 12 80 5 TCLCL b 30 TCLCL b 25 46 3TCLCL b 45 35 35 0 0 0 ns ns ns ns ns 3TCLCL b 105 3TCLCL b 90 3TCLCL b 55 145 0 MHz ns 234 53 Input Instr Hold after PSEN Max 2TCLCL b 40 12 Address Hold After ALE Low 8XC51FX/-24 53 8XC51FX-33 Min 21 43 ALE Low to PSEN Low 8XC51FX/-24 8XC51FX-33 TPXIX 43 Units Variable ns ns ns ns 11 8XC51FX EXTERNAL MEMORY CHARACTERISTICS (Continued) All parameter values apply to all devices unless otherwise indicated Oscillator Symbol Parameter 12 MHz 24 MHz 33 MHz Min Max Min Max Min Max TPXIZ TAVIV TPLAZ Input Instr Float After PSEN 8XC51FX 8XC51FX-24 8XC51FX-33 Min 59 312 PSEN Low to Address Float 5 ns ns ns 71 5TCLCL b 105 5TCLCL b 80 ns ns 10 ns 103 10 10 Max TCLCL-25 TCLCL-20 TCLCL-25 21 Address to Valid Instr In 8XC51FX/-24 8XC51FX-33 Units Variable 10 TRLRH RD Pulse Width 400 150 82 6TCLCL b 100 ns TWLWH WR Pulse Width 400 150 82 6TCLCL b 100 ns TRLDV RD Low to Valid Data In 8XC51FX 8XC51FX-24 8XC51FX-33 TRHDX Data Hold After RD 113 61 0 TRHDZ Data Float After RD 8XC51FX/24 8XC51FX-33 TLLDV TQVWX Data Valid to WR Transition 8XC51FX 8XC51FX-24/33 TWHQX Data Hold After WR 8XC51FX 8XC51FX-24 8XC51FX-33 TQVWH Data Valid to WR High 8XC51FX 8XC51FX-24/33 0 23 200 300 75 ns ns 243 150 8TCLCL b 150 8TCLCL b 90 ns ns 285 180 9TCLCL b 165 9TCLCL b 90 ns ns 140 3TCLCL b 50 3TCLCL a 50 ns 175 41 46 4TCLCL b 130 4TCLCL b 90 4TCLCL b 75 ns ns ns 0 TCLCL b 50 TCLCL b 30 ns ns 3 TCLCL b 50 TCLCL b 35 TCLCL b 27 ns ns ns 142 7TCLCL b 150 7TCLCL b 70 ns ns 77 33 12 33 7 433 222 0 0 0 123 12 ns 2TCLCL b 60 2TCLCL b 25 203 TWHLH RD or WR High to ALE High 8XC51FX 43 8XC51FX-24 8XC51FX-33 ns ns ns 35 585 TRLAZ RD Low to Address Float 12 0 517 TAVDV Address to Valid Data In 8XC51FX 8XC51FX-24/33 TAVWL Address to RD or WR Low 8XC51FX 8XC51FX-24 8XC51FX-33 0 107 ALE Low to Valid Data In 8XC51FX 8XC51FX-24/33 TLLWL ALE Low to RD or WR Low 5TCLCL b 165 5TCLCL b 95 5TCLCL b 90 252 71 5 55 TCLCL b 40 TCLCL b 30 TCLCL b 25 0 ns TCLCL a 40 TCLCL a 30 TCLCL a 25 ns ns ns 8XC51FX EXTERNAL PROGRAM MEMORY READ CYCLE 272322 – 9 EXTERNAL DATA MEMORY READ CYCLE 272322 – 10 EXTERNAL DATA MEMORY WRITE CYCLE 272322 – 11 13 8XC51FX SERIAL PORT TIMINGÐSHIFT REGISTER MODE Test Conditions: Over Operating Conditions; Load Capacitance e 80 pF Oscillator Symbol Parameter 12 MHz Min TXLXL Serial Port Clock Cycle Time TQVXH Output Data Setup to Clock Rising Edge TXHQX Output Data Hold After Clock Rising Edge 8XC51FX 8XC51FX-24/33 TXHDX Input Data Hold After Clock Rising Edge TXHDV Clock Rising Edge to Input Data Valid Max 24 MHz Min Max 33 MHz Min Max Units Variable Min Max 1 0.50 0.36 12TCLCL ms 700 284 167 10TCLCL b 133 ns 34 10 2TCLCL b 117 2TCLCL b 50 ns ns 0 ns 50 0 700 0 0 283 167 10TCLCL b 133 ns SHIFT REGISTER MODE TIMING WAVEFORMS 272322 – 12 14 8XC51FX EXTERNAL CLOCK DRIVE Symbol Parameter Min Max Units 1/TCLCL Oscillator Frequency 8XC51FX 8XC51FX-1 8XC51FX-2 8XC51FX-24 8XC51FX-33 3.5 3.5 0.5 3.5 3.5 12 16 12 24 33 MHz MHz MHz MHz MHz MHz High Time 8XC51FX-24/33 20 0.35 TOSC 0.65 TOSC ns ns Low Time 8XC51FX-24/33 20 0.35 TOSC 0.65 TOSC ns ns TCHCX TCLCX TCLCH Rise Time 8XC51FX-24 8XC51FX-33 20 10 5 ns ns ns TCHCL Fall Time 8XC51FX-24 8XC51FX-33 20 10 5 ns ns ns EXTERNAL CLOCK DRIVE WAVEFORM 272322 – 13 AC TESTING INPUT, OUTPUT WAVEFORMS 272322 – 14 AC Inputs during testing are driven at VCC b 0.5V for a Logic ‘‘1’’ and 0.45V for a Logic ‘‘0’’. Timing measurements are made at VIH min for a Logic ‘‘1’’ and VOL max for a Logic ‘‘0’’. FLOAT WAVEFORMS 272322 – 15 For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs, and begins to float when a 100 mV change from the loaded VOH/VOL level occurs. IOL/IOH e g 20 mA. 15 8XC51FX PROGRAMMING THE EPROM/OTP To be programmed, the part must be running with a 4 to 6 MHz oscillator. (The reason the oscillator needs to be running is that the internal bus is being used to transfer address and program data to appropriate internal EPROM locations.) The address of an EPROM location to be programmed is applied to Port 1 and pins P2.0 - P2.4 of Port 2, while the code byte to be programmed into that location is applied to Port 0. The other Port 2 and 3 pins, RST PSEN, and EA/VPP should be held at the ‘‘Program’’ levels indicated in Table 4. ALE/PROG is pulsed low to program the code byte into the addressed EPROM location. The setup is shown in Figure 10. Normally EA/VPP is held at logic high until just before ALE/PROG is to be pulsed. Then EA/VPP is raised to VPP, ALE/PROG is pulsed low, and then EA/VPP is returned to a valid high voltage. The voltage on the EA/VPP pin must be at the valid EA/VPP high level before a verify is attempted. Waveforms and detailed timing specifications are shown in later sections of this data sheet. NOTE: # EA/VPP pin must not be allowed to go above the maximum specified VPP level for any amount of time. Even a narrow glitch above that voltage level can cause permanent damage to the device. The VPP source should be well regulated and free of glitches. Table 4. EPROM Programming Modes RST PSEN ALE/ PROG EA/ VPP Program Code Data H L ß Verify Code Data H L H Program Encryption Array Address 0–3FH H L Program Lock Bits Bit 1 H Bit 2 H Mode Bit 3 Read Signature Byte P2.6 P2.7 P3.3 P3.6 P3.7 12.75V L H H H H H L L L H H ß 12.75V L H H L H L ß 12.75V H H H H H L ß 12.75V H H H L L H L ß 12.75V H L H H L H L H H L L L L L 272322 – 20 *See Table 4 for proper input on these pins Figure 10. Programming the EPROM 16 8XC51FX PROGRAMMING ALGORITHM Refer to Table 4 and Figures 10 and 11 for address, data, and control signals set up. To program the 87C51FX the following sequence must be exercised. 1. Input the valid address on the address lines. 2. Input the appropriate data byte on the data lines. 3. Activate the correct combination of control signals. 4. Raise EA/VPP from VCC to 12.75V g 0.25V. 5. Pulse, ALE/PROG 5 times for the EPROM array, and 25 times for the encryption table and the lock bits. Repeat 1 through 5 changing the address and data for the entire array or until the end of the object file is reached. PROGRAM VERIFY Program verify may be done after each byte or block of bytes is programmed. In either case a complete verify of the programmed array will ensure reliable programming of the 87C51FX. The lock bits cannot be directly verified. Verification of the lock bits is done by observing that their features are enabled. 272322 – 21 Figure 11. Programming Signals Waveforms The 87C51FX program lock system, when programmed, protects the onboard program against software piracy. lock-bit and encryption array are programmed by the factory. The encryption array is not available without the lock bit. For the lock bit to be programmed, the user must submit an encryption table. The 83C51FA does not have protection features. The 83C51FX has a one-level program lock system and a 64-byte encryption table. See line 2 of Table 5. If program protection is desired, the user submits the encryption table with their code, and both the The 87C51FX has a 3-level program lock system and a 64-byte encryption array. Since this is an EPROM device, all locations are user-programmable. See Table 5. ROM and EPROM Lock System Table 5. Program Lock Bits and the Features Program Lock Bits ProtectIon Type LB1 LB2 LB3 1 U U U No Program Lock features enabled. (Code verify will still be encrypted by the Encryption Array if programmed.) 2 P U U MOVC instructions executed from external program memory are disabled from fetching code bytes from internal memory, EA is sampled and latched on Reset, and further programming of the EPROM is disabled. 3 P P U Same as 2, also verify is disabled. 4 P P P Same as 3, also external execution is disabled. Any other combination of the lock bits is not defined. 17 8XC51FX Encryption Array Within the EPROM array are 64 bytes of Encryption Array that are initially unprogrammed (all 1’s). Every time that a byte is addressed during a verify, 6 address lines are used to select a byte of the Encryption Array. This byte is then exclusive-NOR’ed (XNOR) with the code byte, creating an Encryption Verify byte. The algorithm, with the array in the unprogrammed state (all 1’s), will return the code in its original, unmodified form. For programming the Encryption Array, refer to Table 4 (Programming the EPROM). When using the encryption array, one important factor needs to be considered. If a code byte has the value 0FFH, verifying the byte will produce the encryption byte value. lf a large block ( l 64 bytes) of code is left unprogrammed, a verification routine will display the contents of the encryption array. For this reason all unused code bytes should be programmed with some value other than 0FFH, and not all of them the same value. This will ensure maximum program protection. Program Lock Bits The 87C51FX has 3 programmable lock bits that when programmed according to Table 5 will provide different levels of protection for the on-chip code and data. Erasing the EPROM also erases the encryption array and the program lock bits, returning the part to full functionality. Reading the Signature Bytes The 87C51FX has 3 signature bytes in locations 30H, 31H, and 60H. The 83C51FA has 2 signature 18 bytes in locations 30H and 31H. To read these bytes follow the procedure for EPROM verify, but activate the control lines provided in Table 4 for Read Signature Byte. Location Device Contents 30H All 89H 31H All 58H 60H 83C51FA 7AH/FAH 87C51FA FAH 83C51FB 7BH/FBH 87C51FB FBH 83C51FC 7CH/FCH 87C51FC FCH Erasure Characteristics (Windowed Packages Only) Erasure of the EPROM begins to occur when the chip is exposed to light with wavelength shorter than approximately 4,000 Angstroms. Since sunlight and fluorescent lighting have wavelengths in this range, exposure to these light sources over an extended time (about 1 week in sunlight, or 3 years in roomlevel fluorescent lighting) could cause inadvertent erasure. If an application subjects the device to this type of exposure, it is suggested that an opaque label be placed over the window. The recommended erasure procedure is exposure to ultraviolet light (at 2537 Angstroms) to an integrated dose of at least 15 W-sec/cm. Exposing the EPROM to an ultraviolet lamp of 12,000 mW/cm rating for 30 minutes, at a distance of about 1 inch, should be sufficient. Erasure leaves all the EPROM Cells in a 1’s state. 8XC51FX EPROM PROGRAMMING AND VERIFICATION CHARACTERISTICS (TA e 21§ C to 27§ C; VCC e 5V g 20%; VSS e 0V) Symbol Parameter Min Max VPP Programming Supply Voltage 12.5 13.0 V IPP Programming Supply Current 75 mA 6 MHz 4 Units 1/TCLCL Oscillator Frequency TAVGL Address Setup to PROG Low TGHAX Address Hold after PROG 48TCLCL TDVGL Data Setup to PROG Low 48TCLCL TGHDX Data Hold after PROG 48TCLCL TEHSH P2.7 (ENABLE) High to VPP 48TCLCL TSHGL VPP Setup to PROG Low 10 ms TGHSL VPP Hold after PROG 10 ms TGLGH PROG Width 90 TAVQV Address to Data Valid TELQV ENABLE Low to Data Valid TEHQZ Data Float after ENABLE 0 TGHGL PROG High to PROG Low 10 48TCLCL 110 ms 48TCLCL 48TCLCL 48TCLCL ms EPROM PROGRAMMING AND VERIFICATION WAVEFORMS 272322 – 18 NOTE: *5 pulses for the EPROM array, 25 pulses for the encryption table and lock bits. 19 8XC51FX Thermal Impedance Package All thermal impedance data is approximate for static air conditions at 1W of power dissipation. Values will change depending on operating conditions and applications. See the Intel Packaging Handbook (Order No. 240800) for a description of Intel’s thermal impedance test methodology. P D N S iJA iJC Device 45§ C/W 16§ C/W All 36§ C/W 13§ C/W 80C51FA, 83C51FA, 8XC51FC 45§ C/W 15§ C/W 87C51FA, 8XC51FB 46§ C/W 16§ C/W All 97§ C/W 24§ C/W FA 96§ C/W 24§ C/W FB 87§ C/W 18§ C/W FC DATA SHEET REVISION HISTORY Data sheets are changed as new device information becomes available. Verify with your local Intel sales office that you have the latest version before finalizing a design or ordering devices. The following differences exist between this datasheet (272322-003) and the previous version (272322-002): 1. Removed 8XC51FX-3 and 8XC51FX-20, replaced with 8XC51FX-24. 2. Included 8XC51FX-24 and 8XC51FX-33 devices. 3. 80C51FA and 83C51FA now have the same features as 87C51FA, 8XC51FB and 8XC51FC; same DC spec used for all devices. The following differences exist between the ‘‘-002’’ and ‘‘-001’’ version of 8XC51FX datasheet: 1. Removed 8XC51FX-L from datasheet. 2. Include VOH1 for 83C51FA (Express)/80C51FA (Express). This 8XC51FX datasheet (272322-001) replaces the following datasheets: 87C51FA/83C51FA/80C51FA 83C51FA/80C51FA EXPRESS 270258-007 270620-001 87C51FA EXPRESS 87C51FA-20/-3 87C51FB/83C51FB 270619-001 272081-002 270563-005 87C51FB-20/-3 83C51FB-20/-3 87C51FB/83C51FB EXPRESS 87C51FC/83C51FC 272080-002 270767-002 270789-004 87C51FC/83C51FC EXPRESS 87C51FC-20/-3 83C51FC-20/-3 270903-001 272028-002 20