B82473M1474K000

SMT power inductors Size 8.3 x 7.5 x 5.5 (mm) Series/Type: Ordering code: B82473M1 Date: June 2012 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! Identification/Classification 1 (header 1 + top left bar): SMT power inductors Identification/Classification 2 (header 2 + bottom left header bar): Size 8.3 x 7.5 x 5.5 (mm) Ordering code: (top right header bar) Series/Type: (bottom right header bar) B82473M1 Preliminary data (optional): (if necessary) Department: IN TCF PMD A  EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information Date: June 2012 contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company. SMT power inductors Size 8.3 x 7.5 x 5.5 (mm) B82473M1 Rated inductance 10 ... 470 µH Rated current 0.34 ... 2.3 A Construction ■ Ferrite core ■ Winding: enamel copper wire ■ Winding soldered to terminals ■ Injection molded base Features ■ High mechanical stability ■ Temperature range up to +150 °C ■ High rated current ■ Low DC resistance ■ Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D ■ Qualification to AEC-Q200 ■ RoHS-compatible Applications ■ Filtering of supply voltages ■ Coupling, decoupling ■ DC/DC converters ■ Automotive electronics Terminals ■ Base material CuSn6P ■ Layer composition Ni, Sn (lead-free) ■ Electro-plated Marking ■ Marking on component: L value (µH, coded), manufacturing date (YWWD) ■ Minimum data on reel: Manufacturer, ordering code, L value, quantity, date of packing Delivery mode and packing unit ■ 16-mm blister tape, wound on 330-mm reel ■ Packing unit: 1000 pcs./reel IN TCF PMD A Please read Cautions and warnings and Important notes at the end of this document. June 2012 Page 2 of 7 SMT power inductors Size 8.3 x 7.5 x 5.5 (mm) B82473M1 Dimensional drawing and layout recommendation 7.5 max. 3.9 2.8 2.3 2.8 1) 5.5 max. 1) 8.3 max. Marking Dimensions in mm 7.3 max. Component tolerances 0.2 mm unless otherwise noted. 1) Soldering area IND0482-K-E Taping and packing Blister tape Reel 21±0.5 75±1 1.0 330±1 1.5 min. 6.05 max. 2.5±0.5 13±0.2 7.5±0.1 2±0.1 16±0.3 1.5+0.1 8.4 Component 1.75±0.1 4±0.1 22.4 max. IND0347-5 12±0.1 Direction of unreeling IND0364-H-E Dimensions in mm IN TCF PMD A Please read Cautions and warnings and Important notes at the end of this document. June 2012 Page 3 of 7 SMT power inductors Size 8.3 x 7.5 x 5.5 (mm) B82473M1 Technical data and measuring conditions Rated inductance LR Measured with LCR meter Agilent 4284A at frequency fL, 0.1 V, +20 °C +85 °C Max. permissible DC with temperature increase of ≤40 K at rated temperature Max. permissible DC with inductance decrease ∆L/L0 of approx. 10%, Measured at +20 °C Dip and look method Sn95.5Ag3.8Cu0.7: +(245 5) °C, (3 0.3) s Wetting of soldering area 90% (based on IEC 60068-2-58) +260 °C, 40 s (as referenced in JEDEC J-STD 020D) 55/150/56 (to IEC 60068-1) Mounted: –55 °C … +150 °C Packaged: –25 °C … +40 °C, ≤75% RH Approx. 0.8 g Rated temperature TR Rated current IR Saturation current ISat DC resistance Rtyp Solderability (lead-free) Resistance to soldering heat Climatic category Storage conditions Weight Characteristics and ordering codes LR µH 10 15 22 33 47 68 100 150 220 330 470 Tolerance 10% = K fL MHz 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 IR A 2.30 1.80 1.50 1.20 1.10 0.85 0.72 0.58 0.49 0.40 0.34 Isat A 2.50 2.00 1.60 1.30 1.20 0.90 0.80 0.65 0.55 0.45 0.40 IN TCF PMD A Please read Cautions and warnings and Important notes at the end of this document. Rmax Ω 0.07 0.09 0.11 0.13 0.18 0.28 0.43 0.64 0.96 1.26 1.96 Ordering code B82473M1103K000 B82473M1153K000 B82473M1223K000 B82473M1333K000 B82473M1473K000 B82473M1683K000 B82473M1104K000 B82473M1154K000 B82473M1224K000 B82473M1334K000 B82473M1474K000 June 2012 Page 4 of 7 SMT power inductors Size 8.3 x 7.5 x 5.5 (mm) B82473M1 Impedance versus frequency (typical curve) 1000000.0 Z/Ohm 10000.0 100.0 1.0 0.0 0.0 0.1 1.0 10.0 f/MHz Inductance derating versus load current (typical curve) 100.0 Current derating Iop/IR versus ambient temperature TA (rated temperature TR = +85 °C) IND0602-K 1.2 1000 I op IR L/µH 100 1.0 0.8 0.6 10 0.4 0.2 1 0.1 1.0 I/A 10.0 IN TCF PMD A Please read Cautions and warnings and Important notes at the end of this document. 0 0 20 40 60 80 100 120 ˚C 150 TA June 2012 Page 5 of 7 SMT power inductors Size 8.3 x 7.5 x 5.5 (mm) B82473M1 Cautions and warnings ■ Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. – Particular attention should be paid to the derating curves given there. – The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. ■ If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. ■ The following points must be observed if the components are potted in customer applications: – Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. – It is necessary to check whether the potting material used attacks or destroys the wire insulation, plastics or glue. – The effect of the potting material can change the high-frequency behaviour of the components. ■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. ■ Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. IN TCF PMD A Please read Cautions and warnings and Important notes at the end of this document. June 2012 Page 6 of 7 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply. 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdkelectronics.tdk.com/trademarks. Release 2018-10 Page 7 of 7