PKF4713SI

PKF 4000 I 3–7 W DC/DC Power Modules 48 V Input Series • SMD and through-hole versions with ultra low component height 8.0 mm (0.315 in) • 83% efficiency (typ at 5V) • 1,500 V dc isolation voltage • MTBF > 4.9 million hours at +50°C pin temperature (+40°C ambient) • Low EMI in conformance with class A in CISPR 22 and FCC part 15J Patents US: D357901 DE: M94022763 The MacroDensÔ 3 –7 W PKF 4000 I series true component level on-board DC/DC power modules are intended as distributed power sources in decentralized – 48 V and – 60 V DC power systems. Utilization of thick film technology and a high degree of silicon integration has made it possible to achieve a MTBF of more than 4.9 million hours. The high reliability and the very low height of these DC/DC power modules makes them particularly suited for Information Technology and Telecom (IT&T) applications, with board spacing down to 15 mm or 0.6 in. The over-moulded rugged design makes them also suitable for other demanding industrial applications. They are optimized for free convection cooling and have an operational ambient temperature range in compliance with present and future application needs, including non temperature controlled environments. The mechanical design offers the choice of surface mount or through-hole versions, delivered in ready-to-use tubes, trays or tape & reel package and compatibility with semi and fully aqueous cleaning processes. The PKF series is manufactured using highly automated manufacturing lines with a world-class quality commitment and a five-year warranty. Ericsson Microelectronics AB has been an ISO 9001 certified supplier since 1991. For a complete product program please reference the back cover. E General Absolute Maximum Ratings Characteristics TP TS VI VISO Wtr VRC Vadj Pin temperature at full output power1) Storage temperature Continuous input voltage2) Isolation voltage (input to output test voltage) Transient input energy 3) Remote control voltage pin 10, 11 Output adjust voltage pin 8, 9 –5 –5 min –45 – 55 – 0.5 1,500 0.1 + 40 + 40 max +95 +125 + 75 Unit °C °C V dc V dc Ws V dc V dc Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and performance may degrade in an unspecified manner. Input TP < TP max unless otherwise specified NOTES: Characteristics VI VI off VI on CI PIi PRC Input voltage range2) 4) Turn-off input voltage (See typical characteristics) Turn-on input voltage (See typical characteristics) Input capacitance Input idling power IO = 0, TP = –30...+85°C TP = –30... +85 °C, RC connected to pin 17 (VI = 53 V) (VI = 67 V) (VI = 53 V) (VI = 67 V) 25 30 Conditions min 38 30 34.5 36.5 1.4 130 170 typ max 72 36 38 Unit V V V mF 2) 1) mW Input stand-by power mW Environmental Characteristics Characteristics Vibration (Sinusoidal) JESD 22-B103 (IEC 68-2-6 Fc) 3) 4) Test procedure & conditions Frequency Amplitude Acceleration Number of cycles Frequency Acceleration density spectrum Duration Reproducability Peak acceleration Shock duration Temperature Number of cycles Temperature Humidity Duration Temperature, solder Duration Duration Temperature Concentration 10…500 Hz 0.75 mm 10 g 10 in each axis 10…500 Hz 0.5 g2/Hz 10 min in 3 directions medium (IEC 62-2-36) 200 g 3 ms –40°C…+125°C 500 85°C 85% RH 1000 hours 260°C 10…13 s 96 h 35°C 5% 5) TP, is defined as the maximum temperature on the connection pins at the PB (Printed Board) solder joint, mounted on a 5– 8 dm2 (1 dm2=15.5 in2) multi-layer PB (>4 layers), with 20 mm (0.8 in) board-pitch and free convection cooling. Corresponding ambient temperature range (TA) at full output power is – 45…+85°C. The input voltage range 38…72 V dc meets the European Telecom Standard prETS 300 132-2 Nominal input voltage range in 48V and 60 Vdc power systems, –40.5… –57.0V and –50.0... –72.0V respectively. At input voltages exceeding 72V (abnormal voltage) the power loss will be higher than at normal input voltage and TP must be limited to max +85°C. Absolute max continuous input voltage is 75 Vdc. Output characteristics will be marginally affected at input voltages exceeding 72 V. For more information see page 5. The power modules will operate down to VI £36 V, when VI decreases, but will turn on at VI £38 V, when VI increases (see also Operating information). The test is applicable for through-hole versions. Random vibration MIL-STD-883 Method 2026 (IEC 68-2-34 Ed) Shock (Half sinus) Temperature change Accelerated damp heat Solder resistability5) Aggressive environment JESD 22-B104 (IEC 68-2-27 Ea) JESD 22-A104 (IEC 68-2-14 Na) JESD 22-A101 (IEC 68-2-3 Ca with bias) JESD 22-B106 (IEC 68-2-20 Tb 1A) IEC 68-2-11 Ka 2 EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000 Mechanical Data Through-hole version Surface-mount version Foot print Component side Foot print Component side 1 2 3 4 5 6 7 8 9 5.0 [0.197] 40.0 [1.575] 3.6 [0.142] Dimensions in mm (in) 24.0 [0.945] 29.6 [1.165] 18 17 16 15 14 13 12 11 10 2.8 [0.110] Dimensions in mm (in) Connections Pin 1 2 3 4–6 7 8 9 10 11 12–16 17 18 Designation Out 1 Rtn Out 2 NC Aux Vadj NOR TOA RC NC – In + In Function Output 1. Positive voltage ref. to Rtn. Output return. Output 2 (+ or –). Not connected in single output models. Galvanically isolated from input pins. Not connected. Not connected. Output voltage adjust. To set typical output voltage (VO i) connect pin 8 to pin 9. Connection of Nominal Output voltage Resistor. (See Operating Information, Output Voltage Adjust). Turn-on/off input voltage adjust (VIon/VIoff). Used to decrease the turn-on/off input voltage threshold. (See Operating Information). Remote control and turn-on/off input voltage adjust. Used to turn-on and turn-off output and to set the turn-on/off input voltage threshold. Not connected. Negative input. Positive input. Weight Maximum 20 g (0.71 oz). Case The case consists of semiconductor grade epoxy with embedded pins. Coefficient of thermal expansion (CTE) is typ. 15 ppm/°C. Connection Pins Base material is copper (Cu), first plating is nickel (Ni) and second (outer) plating is palladium (Pd). 3 EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000 Thermal Data Two-parameter model This model provides a more precise description of the thermal characteristics to be used for thermal calculations. Thermally the power module can be considered as a component and the case temperature can be used to characterize the properties. The thermal data for a power module with the substrate in contact with the case can be described with two thermal resistances. One from case to ambient air and one from case to PB (Printed circuit Board). The thermal characteristics temperature can be calculated from the following formula: TPB = (TC–TA)×(Rth C–PB+Rth C–A)/Rth C–A–Pd×Rth C–PB+TA Where: dissipated power, calculated as PO ×(l/h –1) max average case temperature ambient air temperature at the lower side of the power module temperature in the PB between the PKF connection pins TPB: Rth C-PB: thermal resistance from case to PB under the power module Rth C-A: thermal resistance from case to ambient air v: velocity of ambient air Rth C-PB is constant and Rth C-A is dependent on the air velocity. Pd: TC: TA: Free convection is equal to an air velocity of approx. 0.2 – 0.3 m/s. See figure below. Reflow Soldering Information The PKF series of DC/DC power modules are manufactured in surface mount technology. Extra precautions must therefore be taken when reflow soldering the surface mount version. Neglecting the soldering information given below may result in permanent damage or significant degradation of power module performance. The PKF series can be reflow soldered using IR, Natural Convection, Forced Convection or Combined IR/Convection Technologies. The high thermal mass of the component and its effect on DT (°C) requires that particular attention be paid to other temperature sensitive components. IR Reflow technology may require the overall profile time to be extended to approximately 8–10 minutes to ensure an acceptable DT. Higher activity flux may be more suitable to overcome the increase in oxidation and to avoid flux burn-up. The general profile parameters detailed in the diagram, with this extended time to reach peak temperatures, would then be suitable. Note! These are maximum parameters. Depending on process variations, an appropriate margin must be added. Palladium plating is used on the terminal pins. A pin temperature (Tp) in excess of the solder fusing temperature (+183°C for Sn/Pb 63/37) for more than 25 seconds and a peak temperature above 195°C, is required to guarantee a reliable solder joint. Both pin 1 and pin 9 must be monitored. No responsibility is assumed if these recommendations are not strictly followed. 4 EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000 Safety The PKF Series DC/DC power modules are designed in accordance with EN 60 950, Safety of information technology equipment including electrical business equipment. SEMKO certificate no. 9709166. The PKF power modules are recognized by UL and meet the applicable requirements in UL 1950 Safety of information technology equipment, the applicable Canadian safety requirements and UL 1012 Standard for power supplies. The DC/DC power module shall be installed in an end-use equipment and considerations should be given to measuring the pin temperature to comply with TPmax when in operation. Abnormal component tests are conducted with the input protected by an external 3 A fuse. The need for repeating these tests in the end-use appliance shall be considered if installed in a circuit having higher rated devices. When the supply to the DC/DC power module meets all the requirements for SELV (37 V): RIon = 100× (100.2 – VIon)/(VIon – 36.5) kW where 36.5 is the typical unadjusted turn-on input voltage (V). VIoff is the adjusted turn-off input voltage and is determined by VIon –VIoff = 2 V (typical value). To decrease VIon a resistor should be connected between pin 10 and 11 (see fig. 3). The resistance is given by the following equation (for 30 V < VIon > 36 V: RIon = 364 × (VIon – 29.9)/(36.5 – VIon) kW Remote Control (RC) Turn-on or turn-off can be realized by using the RC-pin. Normal operation is achieved if pin 11 is open (NC). If pin 11 is connected to pin 17 the power module turns off. To ensure safe turn-off the voltage difference between pin 11 and 17 shall be less than 1.0 V. RC is TTL open collector compatible output with a sink capacity >100 mA (see fig. 1). Increase VI on −In (pin 17) Decrease VI on TOA (pin 10) RIon RIon RC (pin 11) RC (pin 11) Figure 3 Output Voltage Adjust (Vadj) Output voltage, VO, can be adjusted by using an external resistor. Typical adjust range is ± 15%. If pins 8 and 9 are not connected together the output will decrease to a low value. To increase VO a resistor should be connected between pin 8/9 and 18, and to decrease VO a resistor should be connected between pin 8 and 9 (see fig. 4). Typical required resistor value to increase VO is given by: Radj = k1 × (k2 – VO)/(VO – VOi) kW where VO is the desired output voltage, VOi is the typical output voltage initial setting k1=0.684 k1=0.495 k1=0.495 k1=0.566 k1=0.495 k1=0.495 k1=0.495 k1=0.566 k2= 2.46 V k2= 3.93 V k2= 5.87 V k2=15.00 V k2= 5.87V k2= 3.93 V k2= 5.87 V k2=15.00 V PKF 4310 PKF 4510 PKF 4611 PKF 4621*) PKF 4622 PKF 4628 PKF 4629 PKF 4713*) Figure 1 Over Voltage Protection (OVP) The remote control can be utilized also for OVP by using the external circuitry in figure 2. Resistor values are for 5 V output applications, but can easily be adjusted for other output voltages and the desired OVP level. and Out 1 (pin 1) 15k 1.2k 1k TL431 10k 270 RC (pin 11) Typical required resistor value to decrease VO is given by: Radj = k1 × (VOi – VO)/(VO – k2) kW Rtn (pin 2) -In (pin 17) Figure 2 Turn-on/off Input Voltage The power module monitors the input voltage and will turn on and turn off at predetermined levels set by means of external resistors. To increase VIon a resistor should be connected between pin 11 and 17 (see fig. 3). where k1=2.751 k1=1.986 k1=1.986 k1=2.284 k1=1.986 k1=1.986 k1=1.986 k1=2.284 k2=1.75 V k2=2.59 V k2=4.12 V k2=9.52 V k2=4.12 V k2=2.59 V k2=4.12 V k2=9.52 V PKF 4310 PKF 4510 PKF 4611 PKF 4621 PKF 4622 PKF 4628 PKF 4629 PKF 4713 *) Over 13.8 V output voltage, the input voltage range is limited to 38...65 V. EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000 19 Increase VO +In (pin 18) Decrease VO Vadj (pin 8) Use an electrolytic capacitor across the input or output if the source or load inductance is larger than 10 mH. Their equivalent series resistance together with the capacitance acts as a lossless damping filter. Suitable capacitor values are in the range of 10–100 mF. Tantalum capacitors are not recommended due to their low ESRvalue. Radj Radj Delivery Package Information Vadj , NOR (pin 8, 9) NOR (pin 9) Tubes Figure 4 The PKF-series is delivered in tubes (designated by /A) with a length of 500 mm (19.69 in), see fig. 6. Voltage Margin For voltage controlled margining e.g. at final test, the following setup can be used. By increasing the control voltage V1 to +10 V the output voltage decreases 5% of VOi, and by decreasing V1 to –10 V the output voltage increases 5%. Figure 6 Specification Figure 5 Capacitive Load The PKF series has no maximum limit for capacitive load on the output. The power module may operate in current limiting mode during start-up, affecting the ramp-up and the start-up time. For optimum start performance we recommend maximum 100 mF/A of IO. Connect capacitors at the point of load for best performance. Material: Max surface resistance: Color: Capacity: Weight: End stops: Antistatic coated PVC 1011W/ Transparent 10 power modules/tube Typ. 60 g Pins Trays SMD versions, SI, can be delivered in standard JEDEC trays (designated by /B) on request, see fig. 7. For more information, please contact your local Ericsson sales office. Parallel Operation Paralleling of several converters is easily accomplished by direct connection of the output voltage terminal pins. The load regulation characteristic is specifically designed for optimal paralleling performance. Load sharing between converters will be within ±10%. It is recommended not to exceed PO = n × 0.9 × POmax, where POmax is the maximum converter output power and n the number of paralleled converters, to prevent overloading any of the converters and thereby decreasing the reliability performance. Current Limiting Protection (Ilim) The output power is limited at loads above the output current limiting threshold (Ilim), specified as a minimum value. Input and Output Impedance Both the source impedance of the power feeding and the load impedance will interact with the impedance of the DC/DC power module. It is most important to have the ratio between L and C as low as possible, i.e. a low characteristic impedance, both at the input and output, as the power modules have a low energy storage capability. 20 Figure 7 EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000 Specification Quality Polypropylene (PP) 125 ºC 105W/ Black 15 power modules/tray 10.16 mm Typ. 130 g 150 pcs (one box contains 10 full trays) Material: Max temperature: Max surface resistance: Color: Capacity: Stacking pitch: Weight: Min. order quantity: Reliability Meantime between failure (MTBF) is calculated to >4.9 million hours at full output power and a pin temperature of +50 °C (TA = +40 °C), using the Ericsson failure rate data system. The Ericsson failure rate data system is based on field failure rates and is continously updated. The data corresponds to actual failure rates of components used in Information Technology and Telecom equipment in temperature controlled environments (TA = –5…+65 °C). The data is considered to have a confidence level of 90%. For more information see Design Note 002. Tape & Reel SMD versions, SI, can be delivered in standard tape & reel package (designated by /C) on request, see fig. 8. For more information, please contact your local Ericsson sales office. Quality Statement The products are designed and manufactured in an industrial environment where quality systems and methods like ISO 9000, 6 s and SPC are intensively in use to boost the continuous improvements strategy. Infant mortality or early failures in the products are screened out by a burn-in procedure and an ATE-based final test. Conservative design rules, design reviews and product qualifications, as well as high competence of an engaged work force, contribute to the high quality of our products. Warranty Ericsson Microelectronics warrants to the original purchaser or end user that the products conform to this Data Sheet and are free from material and workmanship defects for a period of five (5) years from the date of manufacture, if the product is used within specified conditions and not opened. In case the product is discontinued, claims will be accepted up to three (3) years from the date of the discontinuation. For additional details on this limited warranty we refer to Ericsson Microelectronics AB’s “General Terms and Conditions of Sales”, or individual contract documents. Limitation of liability Ericsson Microelectronics does not make any other warranties, expressed or implied including any warranty of merchantability or fitness for a particular purpose (including, but not limited to, use in life support applications, where malfunctions of product can cause injury to a person’s health or life). Figure 8 Specification Tape material: Tape width: Tape pitch: Max surface resistance: Tape color: Cover tape color: Reel diameter: Reel hub diameter: Reel capacity: Full reel weight: Min. order quantity: Conductive polystyrene (PS) 72 mm 36 mm 105W/ Black Transparent 13" 7" 150 power modules/reel Typ. 3.7 kg 300 pcs (one box contains two reels) Information given in this data sheet is believed to be accurate and reliable. No responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Ericsson Microelectronics. These products are sold only according to Ericsson Microelectronics’ general conditions of sale, unless otherwise confirmed in writing. Specifications subject to change without notice. EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000 21 Notes: Notes: Product Program VI VO/IO max Output 1 2.1 V/1.5 A 3.3 V/1.5 A 5 V/1.2 A 12 V/0.6 A1) +12 V/0.5 A1) + 5 V/1.0 A + 5 V/1.0 A + 5 V/1.2 A Output 2 3 5 6 7 6 6 6 7 W W W W W W W W *) PO max Ordering No.*) Through-hole PKF 4310 PI PKF 4510 PI PKF 4611 PI PKF 4713 PI PKF 4621 PI PKF 4622 PI PKF 4628 PI PKF 4629 PI2) SMD PKF 4310 SI PKF 4510 SI PKF 4611 SI PKF 4713 SI PKF 4621 SI PKF 4622 SI PKF 4628 SI PKF 4629 SI 48/60 V – 12 V/0.5 A – 5 V/1.0 A + 3.3 V/1.0 A – 12 V/0.5 A 1) Adjustable to 15 V, 2) On request. See also Delivery Package Information Ericsson Microelectronics AB SE-164 81 KISTA, Sweden Phone: +46 8 757 5000 www.ericsson.com/microelectronics For local sales contacts, please refer to our website or call: Int. +46 8 757 4700, Fax: +46 8 757 4776 The latest and most complete information can be found on our website! Preliminary Data Sheet EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000