ECG015

ECG015 Product Features • 1800 – 2500 MHz • +24 dBm P1dB • +41 dBm OIP3 • 15 dB Gain • 5 dB Noise Figure • Single Positive Supply (+8V) The Communications Edge TM Product Information ¼ Watt, High Linearity InGaP HBT Amplifier Product Description The ECG015 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve performance over a broad range with +41 dBm OIP3 and +24 dBm of compressed 1dB power and is housed in a lead-free/green/RoHS-compliant SOT-89 SMT package. All devices are 100% RF and DC tested. The product is targeted for use as a gain block/driver amplifier for various current and next generation wireless technologies such as GPRS, UMTS and WCDMA, where high linearity and medium power is required. In addition, the ECG015 will work for numerous other applications within the 1800 to 2500 MHz frequency range. Functional Diagram GND 4 • Available in a lead-free / green SOT-89 Package Style 1 RF IN 2 GND 3 RF OUT ECG015B / ECG015B-G Applications • • • • • Mobile Infrastructure W-LAN / ISM RFID Defense / Homeland Security Fixed Wireless Specifications (1) Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current Typical Performance (3) Min 1800 13.5 2140 15 17 10 +24 +41 5 5 100 Units MHz MHz dB dB dB dBm dBm dB V mA Typ Max 2500 Parameter Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure Units MHz dB dB dB dBm dBm dB 1900 21 -15 -10 +24 +41 5 Typical 2140 15 -17 -10 +24 +41 5 2450 14 -19 -10 +23 +42 5 +22 +37.5 3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +8 V, Icc = 100 mA, +25° C, Rbias = 30 Ω. 85 135 1. Test conditions unless otherwise noted: 25 °C, Vsupply = +8V, in tuned application circuit with Rbias = 30 Ω. 2. 3OIP measured with two tones at an output power of +9Bm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature Device Current RF Input Power (continuous) Junction Temperature -40 to +85 °C -55 to +125 °C Ordering Information Part No. ECG015B ECG015B-G Rating 180 mA Description 0.2 Watt, High Linearity InGaP HBT Amplifier (leaded SOT-89 Pkg) 0.2 Watt, High Linearity InGaP HBT Amplifier (lead-free/green/RoHS-compliant SOT-89 Pkg) +15 dBm +250 °C ECG015B-PCB1900 1900 MHz Fully Assembled Eval. Board ECG015B-PCB2140 2140 MHz Fully Assembled Eval. Board Specifications and information are subject to change without notice Operation of this device above any of these parameters may cause permanent damage. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com September 2004 ECG015 Gain / Maximum Stable Gain 30 The Communications Edge TM Product Information ¼ Watt, High Linearity InGaP HBT Amplifier S-parameters (Vdevice = +5V, Icc = 100 mA, 25° C, unmatched 50 ohm system) S11 1.0 2. 0 Typical Device Data 0.8 S22 6 0. 0 3. 2. 0 DB(|S[2,1]|) 25 Gain (dB) DB(GMax) 0. 4 6 0. Swp Max 2.50123GHz 1.0 Swp Max 2.50123GHz 0.8 0 4. 5.0 0.2 10.0 10.0 10.0 0.2 0.4 0.6 0.8 1.0 2.0 3.0 4.0 5.0 0.2 0.4 0.6 0.8 1.0 2.0 3.0 4.0 5.0 20 0 0 15 -0.8 -0.8 1.8 1.9 2 Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in blue color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 1800 – 2500 MHz, with markers placed at 1.8 – 2.5 GHz in 0.1 GHz increments. S-Parameters (Vdevice = +5 V, Icc = 100 mA, T = 25° C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 1800 1900 2000 2100 2200 2300 2400 2500 -6.70 -7.55 -8.60 -9.85 -11.07 -11.69 -10.87 -9.15 80.76 68.30 53.47 35.06 10.07 -21.71 -56.13 -86.03 15.90 15.77 15.66 15.53 15.40 15.08 14.67 14.14 24.47 16.51 7.76 -1.19 -10.90 -20.90 -31.83 -43.53 -28.55 -28.96 -30.14 -31.49 -33.04 -36.28 -40.69 -42.21 -25.74 -32.29 -38.84 -45.79 -59.63 -78.21 -106.46 163.73 -5.34 -4.96 -4.56 -4.12 -3.67 -3.20 -2.80 -2.44 -1.0 -1.0 2.1 2.2 Frequency (GHz) 2.3 2.4 2.5 -0 .6 -0 .6 .0 -2 .0 -2 10 .4 -0 .4 -0 Swp Min 1.79083GHz Swp Min 1.79083GHz 156.39 156.21 155.58 155.07 153.49 150.85 147.22 142.35 Device S-parameters are available for download off of the website at: http://www.wj.com Application Circuit PC Board Layout Circuit Board Material: .014” Getek, 4 - layer, 1 oz copper, Microstrip line details: width = .026”, spacing = .026” The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning shunt capacitors. The markers and vias are spaced in .050” increments. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com September 2004 -4 .0 -5. 0 -3 .0 -4 .0 -5. 0 2 -0. -0. 2 -10.0 0. 4 0 3. 0 4. 5.0 -10.0 -3 .0 0.2 10.0 ECG015 The Communications Edge TM Product Information ¼ Watt, High Linearity InGaP HBT Amplifier Typical Device RF Performance Supply Bias = +8 V, Rbias = 30 Ω, Icc = 100 mA 1. Test conditions: T = 25º C, Supply Voltage = +8 V, Device Voltage = 5.0 V, Rbias = 30 Ω, Icc = 100 mA typical, 50 Ω System. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. Ssg & P1dB vs. Temperature @1.96GHz 24 22 20 18 16 14 12 -40°C 25°C 85°C 0 10 20 dBc 30 40 50 60 ACPR1 vs. Pout at 1.9GHz (IS95 9 Ch. Fwd) P1dB vs. Frequency 24.5 24 85°C -40°C 25°C dBm 23.5 23 22.5 Ssg OIP3 P1dB 70 11 13 15 17 Average power out(dBm) 22 1.96GHz 2.14GHz Ssg, OIP3 and P1dB vs. Temperature at 2.45GHz 2.45GHz ACPR1vs. Pout at 2.14GHz (IS95 9 Ch Fwd) 0 10 20 dBc Icc vs. Vde 140 120 100 Icc (mA) 80 60 40 20 0 4.5 25°C 4.7 4.9 Vde 5.1 38 5.3 -40°C 40 42 44 24 25°C -40°C 85°C 30 40 50 60 70 11 13 15 Average power out(dBm) 17 20 16 OIP3 Ssg 25°C P1dB 12 85°C Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com September 2004 ECG015 The Communications Edge TM Product Information ¼ Watt, High Linearity InGaP HBT Amplifier ECG015B (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. Outline Drawing Product Marking The component will be marked with an “E015” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes at between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +240 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes Land Pattern 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) MTTF vs. GND Tab Temperature 100000 Rating -40 to +85° C 128° C / W 149° C 10000 Notes: 1. The thermal resistance is referenced from the junction-to-case at a case temperature of 85° C. 2. This corresponds to the typical biasing condition of +5V, 100 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. 1000 100 60 70 80 90 100 110 120 Tab Temperature (°C) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com September 2004 ECG015 The Communications Edge TM Product Information ¼ Watt, High Linearity InGaP HBT Amplifier This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded (maximum 245°C reflow temperature) soldering processes. ECG015B (Green / Lead-free SOT-89 Package) Mechanical Information Outline Drawing Product Marking The component will be marked with an “E015G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes at between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Land Pattern Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) MTTF vs. GND Tab Temperature 100000 Rating -40 to +85° C 128° C / W 149° C 10000 Notes: 1. The thermal resistance is referenced from the junction-to-case at a case temperature of 85° C. 2. This corresponds to the typical biasing condition of +5V, 100 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. 1000 100 60 70 80 90 100 110 120 Tab Temperature (°C) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com September 2004