2815A

DEVELOPMENTAL TECHNICAL DATASHEET THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal resistance between the chip and substrate. This adhesive is FEATURES • Excellent thermal and electrical conductivity • Good dispensability and good fillet formation • Good performance on Ag/Cu leadframes • Low moisture absorption ABLEBOND® 2815A designed to provide improved workability for applications requiring high heat extraction from die. Typical Uncured Properties Filler Type Viscosity @ 25ºC Thixotropic Index Work Life @ 25ºC Est Storage Life @ -40ºC Cure Process Data Weight Loss on Cure Recommended Cure Condition PHYSIOCHEMICAL PROPERTIES - Post Cure Ionics Chloride Sodium Potassium ABLEBOND 2815A Silver 8000 cP 5.6 24 hours 1 year ABLEBOND 2815A 6.8% Test Description Test Method ATM-0018 ATM-0089 ATM-0087 ATM-0068 Test Method ATM-0031 Test Method ATM-0007 ATM-0044 ATM-0002 ATM-0058 ATM-0055 Brookfield CP51 @ 5 rpm Viscosity @ 0.5/Viscosity @ 5 rpm 25% increase in viscosity @ RT Test Description 10 x 10 mm Si die on glass slide 30 min ramp RT to 200ºC + 30 min @ 200ºC in N2 oven ABLEBOND 2815A < 10 ppm < 10 ppm < 10 ppm 70 µmhos/cm 3.5 63ºC 64 ppm/ºC 122 ppm/ºC Test Description Teflon flask, 5 gm sample/20-40 mesh, 50 gm DI water, 100ºC for 24 hours Conductometer pH meter TMA penetration mode TMA expansion mode Water Extract Conductivity pH Glass Transition Temperature Coefficient of Thermal Expansion Below Tg Above Tg Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our Standard Release Specification. This is a developmental product that has been converted to high volume manufacturing and is being monitored for process stability. During this monitoring period, certain properties may be adjusted slightly. 09/03 Page 1 of 3 2815A PHYSIOCHEMICAL PROPERTIES - Post Cure Dynamic Tensile Modulus @-65ºC @ 25ºC @ 150ºC @ 250ºC Moisture Absorption @ Saturation THERMAL/ELECTRICAL PROPERTIES - Post Cure Thermal Conductivity Volume Resistivity Bond Joint Resistance MECHANICAL PROPERTIES Post Cure Die Shear Strength @ 25ºC Die Shear Strength (kgf/die) vs. Temperature Chip Warpage @ 25ºC vs. Chip Size ABLEBOND 2815A Test Description Test Method 9900 MPa (1,400,000 psi) Dynamic mechanical thermal 5700 MPa (830,000 psi) analysis (DMTA) using