NSCB100AT

No. STSE-CC2008A SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED MODEL : NSCB100AT NICHIA CORPORATION -0- Nichia STSE-CC2008A 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature Symbol IF IFP VR PD Topr Tstg Tsld Absolute Maximum Rating 25 80 5 100 -30 ~ + 85 -40 ~ +100 Reflow Soldering : 260°C Hand Soldering : 350°C (Ta=25°C) Unit mA mA V mW °C °C for 10sec. for 3sec. IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = = (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Reverse Current IR Rank T Iv Luminous Intensity Rank S Iv Rank R Iv Condition IF=20[mA] VR= 5[V] IF=20[mA] IF=20[mA] IF=20[mA] Min. 124 88 62 Typ. 3.6 148 104 74 (Ta=25°C) Max. Unit 4.0 V 50 µA 178 mcd 124 mcd 88 mcd ! Measurement Uncertainty of the Luminous Intensity : ± 10% Color Rank x y 0.11 0.04 (IF=20mA,Ta=25°C) Rank W 0.11 0.15 0.15 0.10 0.10 0.04 ! Measurement Uncertainty of the Color Coordinates : ± 0.01 ! One delivery will include up to one color rank and three luminous intensity ranks of the products. The quantity-ratio of the ranks is decided by Nichia. 2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure’s page. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure’s page. Material as follows ; Package : Encapsulating Resin : Electrodes : Ceramics Silicone Resin Au Plating -1- Nichia STSE-CC2008A 4.PACKAGING · The LEDs are packed in cardboard boxes after taping. According to the total delivery amount, cardboard boxes will be used to protect the LEDs from mechanical shocks during transportation. Please refer to figure’s page. The label on the minimum packing unit bag shows; Part Number, Lot Number, Ranking, Quantity · The boxes are not water resistant and therefore must be kept away from water and moisture. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; !"#### - !$ ! - Year ( 1 for 2001, 2 for 2002 ) " - Month ( 1 for Jan., 9 for Sep., A for Oct., #### - Nichia's Product Number ! - Ranking by Color Coordinates $ - Ranking by Luminous Intensity B for Nov.) -2- Nichia STSE-CC2008A 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Vibration Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260°C, 10sec. (Pre treatment 30°C,70%,168hrs.) Tsld=215 ± 5°C, 3sec. (Lead Solder) 0°C ~ 100°C 15sec. 15sec. -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle Ta=100°C Ta=60°C, RH=90% Ta=-40°C Ta=25°C, IF=20mA Ta=85°C, IF=5mA 60°C, RH=90%, IF=15mA Ta=-30°C, IF=20mA JEITA ED-4701 400 403 JEITA ED-4702 JEITA ED-4702 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3direction, 4cycles 3mm, 5 ± 1 sec. 5N, 10 ± 1 sec. Note 2 times Number of Damaged 0/50 1 time over 95% 20 cycles 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs. 48min. 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 Substrate Bending Stick 1 time 1 time 0/50 0/50 (2) CRITERIA FOR JUDGING THE DAMAGE Item Symbol Test Conditions Criteria for Judgement Min. Max. Forward Voltage VF Reverse Current IR Luminous Intensity IV *) U.S.L. : Upper Standard Level IF=20mA U.S.L.*)# 1.1 VR=5V U.S.L.*)# 2.0 IF=20mA L.S.L.**)# 0.7 **) L.S.L. : Lower Standard Level -3- Nichia STSE-CC2008A 7.CAUTIONS (1) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. · The moisture proof package is made of an aluminum moisture proof bag with a zipper. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 ± 5°C · Nichia LED electrode sections are comprised of a gold plated. The gold surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. · Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · The operating current should be decided after considering the ambient maximum temperature of LEDs. -4- Nichia STSE-CC2008A (4) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. · Recommended soldering conditions Pre-heat Pre-heat time Peak temperature Soldering time 10 sec. Max. Condition refer to Temperature - profile 1. Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200°C 120 ~ 150°C 120 sec. Max. 120 sec. Max. 240°C Max. 260°C Max. 10 sec. Max. refer to Temperature - profile 2. Temperature Soldering time Hand Soldering Lead Solder 300°C Max. 3 sec. Max. (one time only) Lead-free Solder 350°C Max. 3 sec. Max. (one time only) # After reflow soldering rapid cooling should be avoided. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. 2.5 ~ 5°C / sec. Pre-heating 120 ~ 150°C 60sec.Max. Above 200°C 240°C Max. 10sec. Max. 1 ~ 5°C / sec. 1 ~ 5°C / sec. Pre-heating 180 ~ 200°C 60sec.Max. Above 220°C 260°C Max. 10sec. Max. 2.5 ~ 5°C / sec. 120sec.Max. 120sec.Max. [Recommended soldering pad design] Use the following conditions shown in the figure. 2.2 1.5 4.4 (Unit : mm) · The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicon resin should be used. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. -5- Nichia STSE-CC2008A (5) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (6) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). · Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) (7) Others · Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. · The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -6- Nichia STSE-CC2008A ICI Chromaticity Diagram 0.9 520 0.8 530 510 540 550 560 0.7 0.6 570 500 0.5 580 590 y 0.4 600 610 620 630 0.3 490 0.2 480 0.1 470 460 0 0 0.1 W 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x -7- ! Forward Voltage vs. Forward Current 200 Forward Current IFP (mA) 100 50 20 10 5 Ta=25°C ! Forward Current vs. Relative Luminosity 3.5 Relative luminosity (a.u.) 3.0 2.5 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 120 Forward Current IFP (mA) Ta=25°C ! Duty Ratio vs. Allowable Forward Current Allowable Forward Current IFP (mA) 200 Ta=25°C 100 80 50 25 20 10 1 1 2.5 3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V) 5 10 20 50 100 Duty Ratio (%) ! Ambient Temperature vs. Forward Voltage 5.4 Forward Voltage VF (V) 5.0 4.6 4.2 3.8 3.4 3.0 2.6 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) IFP=60mA IFP=20mA IFP=5mA ! Ambient Temperature vs. Relative Luminosity 2.0 Relative Luminosity (a.u.) IFP=20mA 1.0 ! Ambient Temperature vs. Allowable Forward Current Allowable Forward Current IF (mA) 40 30 25 20 10 6 0 0 20 40 60 80 100 Ambient Temperature Ta (°C) -8- 0.5 0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Nichia Model NSCB100A STSE-CC2008A NICHIA CORPORATION Title TYP.CHARACTERISTICS No. 011003105322 ! Forward Current vs. Chromaticity Coordinate (λD) 0.13 0.11 0.09 1mA(473nm) 5mA(472nm) 20mA(470nm) 50mA(468nm) 100mA(467nm) ! Spectrum Relative Emission Intensity (a.u.) 1.2 1 0.8 0.6 0.4 0.2 0 350 400 450 500 550 600 650 Wavelength λ (nm) Ta=25°C IF=20mA Ta=25°C y 0.07 0.05 x ! Forward Current vs. Dominant Wavelength Dominant Wavelength λD (nm) 0.03 0.10 0.12 0.14 0.16 0.18 0.20 ! Ambient Temperature vs. Dominant Wavelength Dominant Wavelength λD (nm) ! Directivity (NSCB100A) 1 Relative Luminosity (a.u.) 474 473 472 471 470 469 468 467 466 1 5 10 20 50 100 Forward Current IFP (mA) Ta=25°C 476 474 472 470 468 466 464 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) IFP=20mA 0° 10° 20° Y 30° 40° X X Y -9- 50° 0.5 Ta=25°C IF=20mA X-X Y-Y 0 90° 60° 30° Radiation Angle 0° 0.5 60° 70° 80° 1 90° Nichia Model NSCB100A STSE-CC2008A NICHIA CORPORATION Title TYP.CHARACTERISTICS No. 011003105332 2+0.3 - 0.2 1.3 1.2 ± 0.15 1.7 Anode A 1.6 3 2 LED chip Cathode mark -10- K 0.5 Cathode ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES MATERIALS Ceramics Silicone Resin Au Plating Nichia STSE-CC2008A Model NSCB100A Unit mm 10/1 Scale Allow ±0.2 NICHIA CORPORATION Title No. OUTLINE DIMENSIONS 011004105342 Taping part φ 1.5+0.1 -0 4±0.1 2±0.05 1.75±0.1 0.2±0.05 Reel part φ 180+0 -3 110 Min.105 11.4±1 9±0.3 Cathode 3.5±0.05 8±0.2 φ2 3.5±0.2 1 ±0.8 ±0.2 φ 13 4±0.1 φ 1+0.25 -0 2.5 ±0.2 2 MAX Label XXXX LED TYPE NSCx100AT LOT XXXXXX-!! QTY pcs Reel End of tape No LEDs LEDs mounting part No LEDs φ 60+1 -0 -11Pull direction Top cover tape Embossed carrier tape Reel Lead Min.40mm (No LEDs) Reel Lead Min.160mm (No LEDs is more than 40) Reel Lead Min.400mm Nichia STSE-CC2008A 2,500pcs/Reel Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. Model NSCx100AT Unit mm Scale Allow NICHIA CORPORATION Title No. TAPING DIMENSIONS 011004105352 Nichia STSE-CC2008A The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label Seal NICHIA XXXX LED TYPE LOT QTY NSCx100AT xxxxxx-!" PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture absorbent material Moisture proof foil bag Empty space in the box is filled with cushion material. Label NICHIA Nichia LED TYPE QTY XXXX LED NSCx100AT PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 2,500 MAX. Reel/box 4reel MAX. 10reel MAX. 16reel MAX. Quantity/box (pcs) 10,000 MAX. 25,000 MAX. 40,000 MAX. Dimensions (mm) 270!280!100!4t 270!280!200!4t 270!280!300!4t Model NSCx100AT NICHIA CORPORATION Title No. PACKING 011004105362 -12-