BAP63-03

Silicon PIN diode FEATURES · High speed switching for RF signals · Low diode capacitance · Low diode forward resistance · Very low series inductance · For applications up to 3 GHz. APPLICATIONS · RF attenuators and switches. DESCRIPTION Planar PIN diode in a SOD323 small SMD plastic package. BAP63 – 03 1 2 SOD523 SC-79 1 CATHODE 2 ANODE LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL I VR IF P tot T stg Tj PARAMETER continuous reverse voltage continuous forward current total power dissipation storage temperature junction temperature T s < 90°C CONDITIONS MIN. – – – -65 -65 MAX. 50 100 500 +150 +150 UNIT V mA mW °C °C ELECTRICAL CHARACTERISTICS T j = 25°C unless otherwise specified. SYMBOL VF IR Cd PARAMETER forward voltage reverse current diode capacitance CONDITIONS I F =50 mA V R =35 V V R = 0; f = 1 MHz V R = 1 V; f = 1 MHz V R = 20 V; f = 1 MHz I F = 0.5 mA; f = 100 MHz; note 1 I F = 1 mA; f = 100 MHz; note 1 I F = 10 mA; f = 100 MHz; note 1 |s 21| 2 TYP. 0.95 – 0.4 0.35 0.27 2.5 1.95 1.17 0.9 15.4 10.1 7.8 0.21 0.28 0.38 0.18 0.26 0.35 0.13 0.20 0.30 0.10 0.18 0.28 MAX. 1.1 10 – – 0.32 3.5 3 1.8 1.5 – – – – – – – – – – – – – – – UNIT V nA pF pF pF Ω Ω Ω Ω dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB rD diode forward resistance isolation I F = 100 mA; f = 100 MHz; note 1 V R = 0; f = 900 MHz V R = 0; f = 1800 MHz V R = 0; f = 2450 MHz |s 21| 2 insertion loss I F = 0.5 mA; f = 900 MHz I F = 0.5 mA; f = 1800 MHz I F = 0.5 mA; f = 2450 MHz I F = 1 mA; f = 900 MHz I F = 1 mA; f = 1800 MHz I F = 1 mA; f = 2450 MHz |s 21| 2 insertion loss |s 21| 2 insertion loss I F = 10 mA; f = 900 MHz I F = 10 mA; f = 1800 MHz I F = 10 mA; f = 2450 MHz I F = 100 mA; f = 900 MHz I F = 100mA; f = 1800 MHz I F = 100 mA; f = 2450 MHz |s 21| 2 insertion loss S25–1/2 BAP63-03 ELECTRICAL CHARACTERISTICS T j = 25°C unless otherwise specified. (Continue) SYMBOL τL PARAMETER charge carrier life time CONDITIONS when switched from I F =10 mA to I R = 6 mA; R L = 100 Ω; measured at I R =3 mA L S TYP. 310 MAX. – UNIT ns series inductance 1.5 – nH Note 1. Guaranteed on AQL basis: inspection level S4, AQL 1.0. THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER thermal resistance from junction to soldering-point VALUE 120 UNIT K/W 10 f = 100 MHz; T j =25°C 500 400 1 C d (pF) r D( Ω) 300 200 100 10 -1 f = 1 MHz; T j =25°C 10 -1 1 10 10 2 0 0 4 8 12 16 20 I F (mA ) VR(V) Fig.1 Forward resistance as a function of forward current; typical values. Fig.2 Diode capacitance as a function of reverse voltage; typical values. 0 0 (1) (2) (3) (4) I F =100 mA. I F =10 mA. I F = 1 mA. I F = 0.5 mA. -0.1 - 10 |s 21| 2(dB) -0.2 |s 21| 2(dB) Diode inserted in series with a 50 Ω s tripline circuit and biased via the analyzer Tee network. Tamb =25°C. - 20 -0.3 - 30 -0.4 Diode zero biased and inserted in series with a 50 Ω s tripline circuit. Tamb =25°C. -0.5 0 1 2 3 - 40 0 1 2 3 f (GHz ) f (GHz ) Fig.3 Insertion loss ( |s 21| 2 )of the diode in on-state as a function of frequency; typical values. Fig.4 Isolation ( |s 21| 2 ) of the diode in off-state as a function of frequency; typical values. S25–2/2