BSC020N03LSG

BSC020N03LSG MOSFET OptiMOSª3Power-MOSFET,30V SuperSO8 8 Features •FastswitchingMOSFETforSMPS •OptimizedtechnologyforDC/DCconverters •QualifiedaccordingtoJEDEC1)fortargetapplications •N-channel;Logiclevel •ExcellentgatechargexRDS(on)product(FOM) •Verylowon-resistanceRDS(on) •Superiorthermalresistance •Avalancherated •Pb-freeplating;RoHScompliant •Halogen-freeaccordingtoIEC61249-2-21 7 5 6 4 1 2 Table1KeyPerformanceParameters 3 6 5 3 2 4 7 8 1 S1 8D S2 7D Parameter Value Unit S3 6D VDS 30 V G4 5D RDS(on),max 2 mΩ ID 176 A Type/OrderingCode Package BSC020N03LS G PG-TDSON-8 1) Marking 020N03LS RelatedLinks - J-STD20 and JESD22 Final Data Sheet 1 Rev.2.0,2020-08-10 OptiMOSª3Power-MOSFET,30V BSC020N03LSG TableofContents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Final Data Sheet 2 Rev.2.0,2020-08-10 OptiMOSª3Power-MOSFET,30V BSC020N03LSG 1Maximumratings atTA=25°C,unlessotherwisespecified Table2Maximumratings Parameter Symbol Values Unit Note/TestCondition 176 111 146 93 28 A VGS=10V,TC=25°C VGS=10V,TC=100°C VGS=4.5V,TC=25°C VGS=4.5V,TC=100°C VGS=10V,TA=25°C,RthJA=50K/W2) - 704 A TC=25°C - - 50 A TC=25°C EAS - - 180 mJ ID=50A,RGS=25Ω Reversediodedv/dt dv/dt - - 6 kV/µs ID=50A,VDS=24V,di/dt=200A/µs, Tj,max=150°C Gate source voltage VGS -20 - 20 V - Power dissipation Ptot - - 96 2.5 - TC=25°C TA=25°C,RthJA=50K/W2) Operating and storage temperature Tj,Tstg -55 - 150 °C IEC climatic category; DIN IEC 68-1: 55/150/56 Unit Note/TestCondition Min. Typ. Max. ID - - ID,pulse - Avalanche current, single pulse IAS Avalanche energy, single pulse Continuous drain current1) Pulsed drain current3) 4) 2Thermalcharacteristics Table3Thermalcharacteristics Parameter Symbol Thermal resistance, junction - case, bottom Values Min. Typ. Max. RthJC - - 1.3 K/W - Thermal resistance, junction - case, top RthJC - - 18 K/W - Device on PCB, 6 cm2 cooling area2) RthJA - - 50 K/W - 1) Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperature at 25°C. For higher case temperature please refer to Diagram 2. De-rating will be required based on the actual environmental conditions. 2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 3) See Diagram 3 for more detailed information 4) See Diagram 13 for more detailed information Final Data Sheet 3 Rev.2.0,2020-08-10 OptiMOSª3Power-MOSFET,30V BSC020N03LSG 3Electricalcharacteristics atTj=25°C,unlessotherwisespecified Table4Staticcharacteristics Parameter Symbol Drain-source breakdown voltage Values Unit Note/TestCondition - V VGS=0V,ID=1mA - 2.2 V VDS=VGS,ID=250µA - 0.1 10 1 100 µA VDS=30V,VGS=0V,Tj=25°C VDS=30V,VGS=0V,Tj=125°C IGSS - 10 100 nA VGS=20V,VDS=0V Drain-source on-state resistance RDS(on) - 2.3 1.7 2.9 2 mΩ VGS=4.5V,ID=30A VGS=10V,ID=30A Gate resistance RG 0.9 1.9 3.3 Ω - Transconductance gfs 65 130 - S |VDS|>2|ID|RDS(on)max,ID=30A Unit Note/TestCondition Min. Typ. Max. V(BR)DSS 30 - Gate threshold voltage VGS(th) 1 Zero gate voltage drain current IDSS Gate-source leakage current Table5Dynamiccharacteristics Parameter Symbol Input capacitance1) Values Min. Typ. Max. Ciss - 5400 7200 pF VGS=0V,VDS=15V,f=1MHz Output capacitance1) Coss - 1900 2500 pF VGS=0V,VDS=15V,f=1MHz Reverse transfer capacitance Crss - 110 - pF VGS=0V,VDS=15V,f=1MHz Turn-on delay time td(on) - 11 - ns VDD=15V,VGS=10V,ID=30A, RG=1.6Ω Rise time tr - 7.0 - ns VDD=15V,VGS=10V,ID=30A, RG=1.6Ω Turn-off delay time td(off) - 42 - ns VDD=15V,VGS=10V,ID=30A, RG=1.6Ω Fall time tf - 7.0 - ns VDD=15V,VGS=10V,ID=30A, RG=1.6Ω Unit Note/TestCondition Table6Gatechargecharacteristics2) Parameter Symbol Gate to source charge Values Min. Typ. Max. Qgs - 15 20 nC VDD=15V,ID=30A,VGS=0to4.5V Gate charge at threshold Qg(th) - 9 12 nC VDD=15V,ID=30A,VGS=0to4.5V Gate to drain charge Qgd - 7 12 nC VDD=15V,ID=30A,VGS=0to4.5V Switching charge Qsw - 14 21 nC VDD=15V,ID=30A,VGS=0to4.5V Gate charge total Qg - 34 45 nC VDD=15V,ID=30A,VGS=0to4.5V Gate plateau voltage Vplateau - 2.8 - V VDD=15V,ID=30A,VGS=0to4.5V Gate charge total Qg - 70 93 - VDD=15V,ID=30A,VGS=0to10V Gate charge total, sync. FET Qg(sync) - 29 39 nC VDS=0.1V,VGS=0to4.5V Output charge Qoss - 49 66 - VDD=15V,VGS=0V 1) 2) Defined by design. Not subject to production test See ″Gate charge waveforms″ for parameter definition. Defined by design, not subject to production test Final Data Sheet 4 Rev.2.0,2020-08-10 OptiMOSª3Power-MOSFET,30V BSC020N03LSG Table7Reversediode Parameter Symbol Diode continuous forward current Diode pulse current Diode forward voltage 1) Reverse recovery charge 1) Values Unit Note/TestCondition 87 A TC=25°C - 704 A TC=25°C - 0.8 1.1 V VGS=0V,IF=30A,Tj=25°C - - 25 nC VR=15V,IF=IS,diF/dt=400A/µs Min. Typ. Max. IS - - IS,pulse - VSD Qrr Defined by design. Not subject to production test Final Data Sheet 5 Rev.2.0,2020-08-10 OptiMOSª3Power-MOSFET,30V BSC020N03LSG 4Electricalcharacteristicsdiagrams Diagram1:Powerdissipation Diagram2:Draincurrent 100 200 175 80 150 125 ID[A] Ptot[W] 60 40 100 75 50 20 25 0 0 40 80 120 0 160 0 20 40 60 TC[°C] 80 100 120 140 160 TC[°C] Ptot=f(TC) ID=f(TC);VGS≥10V Diagram3:Safeoperatingarea Diagram4:Max.transientthermalimpedance 3 101 10 100 µs 10 µs 1 µs 102 100 101 DC 0.5 ZthJC[K/W] ID[A] 1 ms 10 ms 0.2 10-1 0.1 0.05 100 0.02 0.01 10-1 10-1 100 101 102 single pulse 10-2 10-6 10-5 10-4 VDS[V] 10-2 10-1 100 tp[s] ID=f(VDS);TC=25°C;D=0;parameter:tp Final Data Sheet 10-3 ZthJC=f(tp);parameter:D=tp/T 6 Rev.2.0,2020-08-10 OptiMOSª3Power-MOSFET,30V BSC020N03LSG Diagram5:Typ.outputcharacteristics Diagram6:Typ.drain-sourceonresistance 300 5 10 V 3.2 V 4.5 V 5V 4V 250 4 3.5 V 150 RDS(on)[mΩ] ID[A] 200 3.5 V 3 4V 4.5 V 2 5V 100 10 V 3.2 V 1 50 3V 2.8 V 0 0 1 2 0 3 0 10 20 VDS[V] 30 40 50 ID[A] ID=f(VDS);Tj=25°C;parameter:VGS RDS(on)=f(ID);Tj=25°C;parameter:VGS Diagram7:Typ.transfercharacteristics Diagram8:Typ.forwardtransconductance 200 300 250 160 200 ID[A] gfs[S] 120 150 80 100 40 50 150 °C 0 0 1 25 °C 2 3 4 5 0 0 VGS[V] 80 120 160 ID[A] ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj Final Data Sheet 40 gfs=f(ID);Tj=25°C 7 Rev.2.0,2020-08-10 OptiMOSª3Power-MOSFET,30V BSC020N03LSG Diagram9:Drain-sourceon-stateresistance Diagram10:Typ.gatethresholdvoltage 4 2.5 2.0 3 VGS(th)[V] RDS(on)[mΩ] 1.5 98 % 2 typ 1.0 1 0.5 0 -60 -20 20 60 100 140 0.0 -60 180 -20 20 Tj[°C] 60 100 140 180 Tj[°C] RDS(on)=f(Tj);ID=30A;VGS=10V VGS(th)=f(Tj);VGS=VDS;ID=250µA Diagram11:Typ.capacitances Diagram12:Forwardcharacteristicsofreversediode 4 103 10 25 °C 25 °C, max 150 °C 150 °C, max Ciss Coss 102 IF[A] C[pF] 103 Crss 102 101 0 10 101 20 30 100 0.0 0.5 VDS[V] C=f(VDS);VGS=0V;f=1MHz Final Data Sheet 1.0 1.5 2.0 VSD[V] IF=f(VSD);parameter:Tj 8 Rev.2.0,2020-08-10 OptiMOSª3Power-MOSFET,30V BSC020N03LSG Diagram13:Avalanchecharacteristics Diagram14:Typ.gatecharge 2 10 12 15 V 10 6V 24 V 25 °C 100 °C 8 VGS[V] IAV[A] 125 °C 101 6 4 2 100 100 101 102 103 tAV[µs] 0 0 20 40 60 80 Qgate[nC] IAS=f(tAV);RGS=25Ω;parameter:Tj(start) VGS=f(Qgate);ID=30Apulsed;parameter:VDD Diagram15:Drain-sourcebreakdownvoltage Diagram Gate charge waveforms 34 32 VBR(DSS)[V] 30 28 26 24 22 20 -60 -20 20 60 100 140 180 Tj[°C] VBR(DSS)=f(Tj);ID=1mA Final Data Sheet 9 Rev.2.0,2020-08-10 OptiMOSª3Power-MOSFET,30V BSC020N03LSG 5PackageOutlines Figure1OutlinePG-TDSON-8,dimensionsinmm/inches Final Data Sheet 10 Rev.2.0,2020-08-10 OptiMOSª3Power-MOSFET,30V BSC020N03LSG Figure2OutlineTape(PG-TDSON-8),dimensionsinmm Final Data Sheet 11 Rev.2.0,2020-08-10 OptiMOSª3Power-MOSFET,30V BSC020N03LSG RevisionHistory BSC020N03LS G Revision:2020-08-10,Rev.2.0 Previous Revision Revision Date Subjects (major changes since last revision) 2.0 2020-08-10 Update current rating and footnotes Trademarks Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners. 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TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered. Final Data Sheet 12 Rev.2.0,2020-08-10